DK0556864T3 - Loddemetalpulver overtrukket med parylen - Google Patents
Loddemetalpulver overtrukket med parylenInfo
- Publication number
- DK0556864T3 DK0556864T3 DK93102754.4T DK93102754T DK0556864T3 DK 0556864 T3 DK0556864 T3 DK 0556864T3 DK 93102754 T DK93102754 T DK 93102754T DK 0556864 T3 DK0556864 T3 DK 0556864T3
- Authority
- DK
- Denmark
- Prior art keywords
- solder
- parylene
- coated
- solder powder
- powder coated
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/34—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material comprising compounds which yield metals when heated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
- Y10T428/2991—Coated
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
- Y10T428/2991—Coated
- Y10T428/2998—Coated including synthetic resin or polymer
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Dental Preparations (AREA)
- Powder Metallurgy (AREA)
- Nonmetallic Welding Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/839,581 US5272007A (en) | 1992-02-21 | 1992-02-21 | Solder powder coated with parylene |
Publications (1)
Publication Number | Publication Date |
---|---|
DK0556864T3 true DK0556864T3 (da) | 1995-09-25 |
Family
ID=25280134
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK93102754.4T DK0556864T3 (da) | 1992-02-21 | 1993-02-22 | Loddemetalpulver overtrukket med parylen |
Country Status (13)
Country | Link |
---|---|
US (2) | US5272007A (da) |
EP (1) | EP0556864B1 (da) |
JP (1) | JP3110582B2 (da) |
KR (1) | KR930017663A (da) |
CN (1) | CN1035363C (da) |
AT (1) | ATE126114T1 (da) |
CA (1) | CA2090072A1 (da) |
DE (1) | DE69300337T2 (da) |
DK (1) | DK0556864T3 (da) |
ES (1) | ES2075729T3 (da) |
GR (1) | GR3017675T3 (da) |
MX (1) | MX9300914A (da) |
TW (1) | TW279844B (da) |
Families Citing this family (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB9312328D0 (en) * | 1993-06-15 | 1993-07-28 | Lexor Technology Limited | A method of brazing |
DE4402042A1 (de) * | 1994-01-25 | 1994-06-09 | Kunststoff Maschinen Handelsge | Mikropartikulierte Reflow-Lötmittel und Verfahren zu deren Herstellung |
US5674326A (en) * | 1994-09-21 | 1997-10-07 | Motorola, Inc. | Solder paste |
US5593504A (en) * | 1995-04-26 | 1997-01-14 | Church & Dwight Co., Inc. | Method of cleaning solder pastes from a substrate with an aqueous cleaner |
US5789068A (en) * | 1995-06-29 | 1998-08-04 | Fry's Metals, Inc. | Preformed solder parts coated with parylene in a thickness effective to exhibit predetermined interference colors |
WO1997012718A1 (en) | 1995-10-06 | 1997-04-10 | Brown University Research Foundation | Soldering methods and compositions |
JP3220635B2 (ja) * | 1996-02-09 | 2001-10-22 | 松下電器産業株式会社 | はんだ合金及びクリームはんだ |
US5778638A (en) * | 1996-03-06 | 1998-07-14 | Mitsubishi Gas Chemical Company, Inc. | Process for preserving solder paste |
JP3493101B2 (ja) * | 1996-08-15 | 2004-02-03 | 三井金属鉱業株式会社 | 半田粉及びその製造方法、及びその半田粉を用いた半田ペースト |
DE19731151C1 (de) * | 1997-07-21 | 1999-01-21 | Degussa | Lotpaste zum Hartlöten und Beschichten von Aluminium und Aluminiumlegierungen |
DE19826756C2 (de) * | 1998-06-15 | 2002-04-18 | Juergen Schulze | Verfahren zum Verkapseln von feinen Lotmetallpulvern und danach hergestellte Lotmetallpulver |
JP4138965B2 (ja) * | 1998-10-01 | 2008-08-27 | 三井金属鉱業株式会社 | 無鉛ハンダ粉及びその製造方法 |
US6592943B2 (en) | 1998-12-01 | 2003-07-15 | Fujitsu Limited | Stencil and method for depositing solder |
US6054761A (en) | 1998-12-01 | 2000-04-25 | Fujitsu Limited | Multi-layer circuit substrates and electrical assemblies having conductive composition connectors |
US6326555B1 (en) | 1999-02-26 | 2001-12-04 | Fujitsu Limited | Method and structure of z-connected laminated substrate for high density electronic packaging |
EP1232524A1 (en) * | 1999-06-01 | 2002-08-21 | Alpha Metals, Inc. | Method of protective coating bga solder alloy spheres |
US6506448B1 (en) | 1999-06-01 | 2003-01-14 | Fry's Metals, Inc. | Method of protective coating BGA solder alloy spheres |
US6488992B1 (en) | 1999-08-18 | 2002-12-03 | University Of Cincinnati | Product having a thin film polymer coating and method of making |
JP3910878B2 (ja) * | 2002-05-13 | 2007-04-25 | 新光電気工業株式会社 | 導電性粉末付着装置及び導電性粉末付着方法 |
US8002905B2 (en) | 2003-06-25 | 2011-08-23 | Behr Gmbh & Co. Kg | Fluxing agent for soldering metal components |
EP1660243A4 (en) * | 2003-07-09 | 2011-11-16 | Fry Metals Inc | ÜBERZUGSMETALLTEILCHEN |
US20050056365A1 (en) * | 2003-09-15 | 2005-03-17 | Albert Chan | Thermal interface adhesive |
DE10343655B4 (de) * | 2003-09-20 | 2005-09-29 | Elringklinger Ag | Verfahren zum Herstellen einer Lötverbindung zwischen einem Substrat und einem Kontaktelement einer Brennstoffzelleneinheit sowie Brennstoffzelleneinheit |
DE10343652B4 (de) * | 2003-09-20 | 2005-09-29 | Elringklinger Ag | Verfahren zum Herstellen einer Lötverbindung zwischen einem Substrat und einem Kontaktelement einer Brennstoffzelleneinheit sowie Brennstoffzelleneinheit |
US7163586B2 (en) * | 2003-11-12 | 2007-01-16 | Specialty Coating Systems, Inc. | Vapor deposition apparatus |
US20050239947A1 (en) * | 2004-02-27 | 2005-10-27 | Greenhill David A | Polymeric silver layer |
DE102004034815A1 (de) * | 2004-07-19 | 2006-03-16 | Behr Gmbh & Co. Kg | Verfahren zur Herstellung von gefügten Werkstücken |
US7455106B2 (en) * | 2005-09-07 | 2008-11-25 | Schlumberger Technology Corporation | Polymer protective coated polymeric components for oilfield applications |
US8388724B2 (en) * | 2006-04-26 | 2013-03-05 | Senju Metal Industry Co., Ltd. | Solder paste |
JP5546551B2 (ja) * | 2008-11-21 | 2014-07-09 | ヘンケル コーポレイション | 熱分解性ポリマー被覆金属粉末 |
US9682447B2 (en) * | 2010-08-20 | 2017-06-20 | Henkel IP & Holding GmbH | Organic acid- or latent organic acid-functionalized polymer-coated metal powders for solder pastes |
WO2013036347A1 (en) | 2011-09-06 | 2013-03-14 | Henkel Corporation | Di-or poly-functional electron deficient olefins coated metal powders for solder pastes |
US8816371B2 (en) | 2011-11-30 | 2014-08-26 | Micron Technology, Inc. | Coated color-converting particles and associated devices, systems, and methods |
EP2886244A1 (de) * | 2013-12-17 | 2015-06-24 | Heraeus Deutschland GmbH & Co. KG | Verfahren zur Befestigung eines Bauteils auf einem Substrat |
EP3124166B1 (en) * | 2014-03-25 | 2019-10-23 | Sumitomo Metal Mining Co., Ltd. | Coated solder material and method for producing same |
JP5790862B1 (ja) * | 2014-12-25 | 2015-10-07 | 千住金属工業株式会社 | やに入りはんだ用フラックス、フラックスコートはんだ用フラックス、やに入りはんだ及びフラックスコートはんだ |
US10730150B2 (en) * | 2017-08-07 | 2020-08-04 | Honeywell International Inc. | Flowable brazing compositions and methods of brazing metal articles together using the same |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE449016C (de) * | 1927-09-03 | Duplex Printing Press Company | Maschine zum Giessen von Stereotypplatten | |
DE448016C (de) * | 1925-02-05 | 1927-08-02 | Pathe Cinema Anciens Etablisse | Aufwickelvorrichtung fuer Kinematographenfilme |
US3300332A (en) * | 1966-02-07 | 1967-01-24 | Union Carbide Corp | Coated particulate material and method for producing same |
US4225647B1 (en) * | 1977-12-02 | 1995-05-09 | Richard A Parent | Articles having thin, continuous, impervious coatings |
US4298407A (en) * | 1980-08-04 | 1981-11-03 | E. I. Du Pont De Nemours And Company | Flux treated solder powder composition |
US4419279A (en) * | 1980-09-15 | 1983-12-06 | Potters Industries, Inc. | Conductive paste, electroconductive body and fabrication of same |
US4380518A (en) * | 1982-01-04 | 1983-04-19 | Western Electric Company, Inc. | Method of producing solder spheres |
US4818614A (en) * | 1985-07-29 | 1989-04-04 | Shiseido Company Ltd. | Modified powder |
US4758288A (en) * | 1987-06-08 | 1988-07-19 | Ronald T. Dodge Co. | Encapsulated lithium granules and method of manufacture |
JP2564152B2 (ja) * | 1987-10-27 | 1996-12-18 | タムラ化研株式会社 | はんだペースト |
US5069972A (en) * | 1988-09-12 | 1991-12-03 | Versic Ronald J | Moldable microcapsule that contains a high percentage of solid core material, and method of manufacture thereof |
CA2038488A1 (en) * | 1990-03-19 | 1991-09-20 | Roger A. Olson | Process for optimizing corrosion protection of coated substrates |
-
1992
- 1992-02-21 US US07/839,581 patent/US5272007A/en not_active Expired - Lifetime
-
1993
- 1993-02-19 MX MX9300914A patent/MX9300914A/es not_active IP Right Cessation
- 1993-02-22 KR KR1019930002427A patent/KR930017663A/ko not_active Application Discontinuation
- 1993-02-22 CN CN93103095A patent/CN1035363C/zh not_active Expired - Fee Related
- 1993-02-22 EP EP93102754A patent/EP0556864B1/en not_active Expired - Lifetime
- 1993-02-22 AT AT93102754T patent/ATE126114T1/de not_active IP Right Cessation
- 1993-02-22 DE DE69300337T patent/DE69300337T2/de not_active Expired - Fee Related
- 1993-02-22 DK DK93102754.4T patent/DK0556864T3/da active
- 1993-02-22 JP JP05054590A patent/JP3110582B2/ja not_active Expired - Fee Related
- 1993-02-22 ES ES93102754T patent/ES2075729T3/es not_active Expired - Lifetime
- 1993-02-22 CA CA002090072A patent/CA2090072A1/en not_active Abandoned
- 1993-03-10 TW TW082101777A patent/TW279844B/zh active
- 1993-12-02 US US08/161,873 patent/US5328522A/en not_active Expired - Lifetime
-
1995
- 1995-10-06 GR GR950402779T patent/GR3017675T3/el unknown
Also Published As
Publication number | Publication date |
---|---|
ES2075729T3 (es) | 1995-10-01 |
EP0556864A1 (en) | 1993-08-25 |
GR3017675T3 (en) | 1996-01-31 |
CA2090072A1 (en) | 1993-08-22 |
DE69300337D1 (de) | 1995-09-14 |
CN1035363C (zh) | 1997-07-09 |
ATE126114T1 (de) | 1995-08-15 |
US5328522A (en) | 1994-07-12 |
DE69300337T2 (de) | 1996-02-01 |
CN1079929A (zh) | 1993-12-29 |
MX9300914A (es) | 1993-09-01 |
JP3110582B2 (ja) | 2000-11-20 |
TW279844B (da) | 1996-07-01 |
JPH067993A (ja) | 1994-01-18 |
KR930017663A (ko) | 1993-09-20 |
US5272007A (en) | 1993-12-21 |
EP0556864B1 (en) | 1995-08-09 |
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