ES2057723T5 - Chasis de un dispositivo. - Google Patents

Chasis de un dispositivo.

Info

Publication number
ES2057723T5
ES2057723T5 ES91121242T ES91121242T ES2057723T5 ES 2057723 T5 ES2057723 T5 ES 2057723T5 ES 91121242 T ES91121242 T ES 91121242T ES 91121242 T ES91121242 T ES 91121242T ES 2057723 T5 ES2057723 T5 ES 2057723T5
Authority
ES
Spain
Prior art keywords
chassis
components
plastic material
plastic
conformation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES91121242T
Other languages
English (en)
Other versions
ES2057723T3 (es
Inventor
Tim Schwegler
Jurgen Haeberle
Siegfried Kopp
Johannes Mahn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard GmbH Germany
Original Assignee
Hewlett Packard GmbH Germany
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=8207421&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ES2057723(T5) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Hewlett Packard GmbH Germany filed Critical Hewlett Packard GmbH Germany
Publication of ES2057723T3 publication Critical patent/ES2057723T3/es
Application granted granted Critical
Publication of ES2057723T5 publication Critical patent/ES2057723T5/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/005Casings being nesting containers
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/18Packaging or power distribution
    • G06F1/183Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/18Packaging or power distribution
    • G06F1/183Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/184Mounting of motherboards
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/18Packaging or power distribution
    • G06F1/183Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/187Mounting of fixed and removable disk drives
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1422Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427Housings
    • H05K7/1429Housings for circuits carrying a CPU and adapted to receive expansion cards

Abstract

UN CHASIS DE UN DISPOSITIVO, PARA POR EJEMPLO UN DISPOSITIVO ELECTRONICO, QUE CONSTA DE UNA UNIDAD DE SOPORTE (1,2) HECHA DE UN MATERIAL DE PLASTICO QUE LLEVA LOS COMPONENTES DEL DISPOSITIVO TALES COMO TABLEROS DE CIRCUITOS IMPRESOS (26,35), UN DISCO PARA EL ALMACENAMIENTO DE DATOS (28), UN VENTILADOR (31), UN ALTAVOZ (33). LOS COMPONENTES QUEDAN COLOCADOS EN UNA RANURAS CORRESPONDIENTES QUE HAY EN EL CHASIS (1) MEDIANTE UNA CONEXION DE FIJACION POR CONFORMACION AL MATERIAL DE PLASTICO. LOS COMPONENTES SON PORTADOS POR EL CHASIS SIN QUE SE REQUIERA NINGUN ELEMENTO DE CIERRE. PARA EL MONTAJE DEL DISPOSITIVO, LOS COMPONENTES SE INTRODUCEN EN LA PARTE INFERIOR (1) DEL CHASIS Y DESPUES SE COLOCA LA PARTE SUPERIOR (2) SOBRE ELLA. EL CHASIS (1,2) SE PUEDE INTRODUCIR EN UNA CARCASA METALICA. EL CHASIS SE FABRICA PREFERENTEMENTE SEGUN UN PROCESO DE MOLDEO DE PLASTICO. EN EL MATERIAL DE PLASTICO (1,2) SE PUEDEN COLOCAR UNOS CONDUCTOS DE VENTILACION PARA ASEGURAR ASI LA REFRIGERACION DE LOS COMPONENTES.
ES91121242T 1991-12-11 1991-12-11 Chasis de un dispositivo. Expired - Lifetime ES2057723T5 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP91121242A EP0546211B2 (en) 1991-12-11 1991-12-11 Chassis of a device

Publications (2)

Publication Number Publication Date
ES2057723T3 ES2057723T3 (es) 1994-10-16
ES2057723T5 true ES2057723T5 (es) 1999-01-01

Family

ID=8207421

Family Applications (1)

Application Number Title Priority Date Filing Date
ES91121242T Expired - Lifetime ES2057723T5 (es) 1991-12-11 1991-12-11 Chasis de un dispositivo.

Country Status (9)

Country Link
US (2) US5473507A (es)
EP (1) EP0546211B2 (es)
JP (2) JP3362888B2 (es)
KR (1) KR0128263B1 (es)
CA (1) CA2080214C (es)
DE (1) DE69103014T3 (es)
ES (1) ES2057723T5 (es)
HK (1) HK54695A (es)
SG (1) SG31995G (es)

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Also Published As

Publication number Publication date
DE69103014T2 (de) 1994-11-03
CA2080214C (en) 1997-06-03
JP3362888B2 (ja) 2003-01-07
HK54695A (en) 1995-04-21
JP3473905B2 (ja) 2003-12-08
ES2057723T3 (es) 1994-10-16
US5682289A (en) 1997-10-28
JP2003051684A (ja) 2003-02-21
EP0546211A1 (en) 1993-06-16
JPH05251875A (ja) 1993-09-28
KR0128263B1 (ko) 1998-04-06
EP0546211B2 (en) 1998-09-16
DE69103014T3 (de) 1999-04-08
SG31995G (en) 1995-08-18
EP0546211B1 (en) 1994-07-20
KR930021041A (ko) 1993-10-20
CA2080214A1 (en) 1993-06-12
DE69103014D1 (de) 1994-08-25
US5473507A (en) 1995-12-05

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