TWI456377B - 殼體結構與應用其之伺服器 - Google Patents

殼體結構與應用其之伺服器 Download PDF

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Publication number
TWI456377B
TWI456377B TW100148312A TW100148312A TWI456377B TW I456377 B TWI456377 B TW I456377B TW 100148312 A TW100148312 A TW 100148312A TW 100148312 A TW100148312 A TW 100148312A TW I456377 B TWI456377 B TW I456377B
Authority
TW
Taiwan
Prior art keywords
bottom case
circuit board
upper cover
locking portions
server
Prior art date
Application number
TW100148312A
Other languages
English (en)
Other versions
TW201327092A (zh
Inventor
Chih Wei Chuang
Kuei Hua Chen
Original Assignee
Inventec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inventec Corp filed Critical Inventec Corp
Priority to TW100148312A priority Critical patent/TWI456377B/zh
Priority to US13/418,708 priority patent/US8724329B2/en
Publication of TW201327092A publication Critical patent/TW201327092A/zh
Application granted granted Critical
Publication of TWI456377B publication Critical patent/TWI456377B/zh

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
    • H05K7/1487—Blade assemblies, e.g. blade cases or inner arrangements within a blade

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Casings For Electric Apparatus (AREA)

Claims (14)

  1. 一種伺服器，包括：一機箱，具有一底殼與一上蓋，且該上蓋可開闔地組裝至該底殼；一電路板，配置在該底殼上；一支架，組裝至該底殼與該上蓋之間，該上蓋與該支架造成該底殼一正向變形；以及多個構件，配置在該電路板上，該些構件的重量造成該電路板與該底殼一負向變形，而該底殼的該正向變形抵消該負向變形而使該底殼與該電路板維持一水平面。
  2. 如申請專利範圍第1項所述的伺服器，其中該機箱還具有一吊鉤，配置在該上蓋朝向該電路板的一側，當該上蓋閉闔於該底殼時，該吊鉤卡扣於該支架。
  3. 如申請專利範圍第2項所述的伺服器，其中該支架具有一本體與從該本體延伸的多個鎖固部，該些鎖固部鎖固至該底殼且位在該電路板與該底殼之間，以使該本體立設在該底殼上，並使該吊鉤卡扣於該本體。
  4. 如申請專利範圍第3項所述的伺服器，其中該本體是一剛體結構。
  5. 如申請專利範圍第3項所述的伺服器，其中該本體與該底殼結合之前，該些鎖固部相對於該水平面的距離彼此相異。
  6. 如申請專利範圍第5項所述的伺服器，該些鎖固部相對於該水平面而呈一拱形輪廓分佈。
  7. 如申請專利範圍第5項所述的伺服器，其中該正向變形包括一第一正向變形與一第二正向變形，該本體藉由該些鎖固部而固定在該底殼上以造成該第一正向變形，該吊鉤卡扣於該本體而使該上蓋對該底殼造成該第二正向變形。
  8. 如申請專利範圍第3項所述的伺服器，其中該些鎖固部在該底殼上的分佈軸向，與該些構件在該電路板上的分佈軸向一致。
  9. 一種殼體結構，包括：一機箱；一電路板，配置在該機箱內；一剛性支架，具有一接觸面，該剛性支架以該接觸面組裝至該機箱內的一平面上，其中該接觸面為非平面，以讓該機箱與該剛性支架結合後，該平面隨著該接觸面而變形；以及多個構件，配置在該電路板上，且該些構件的重量造成該平面變形，其中該些構件與該剛性支架對該平面所造成的變形，其方向彼此相反且大小相等。
  10. 如申請專利範圍第9項所述的殼體結構，其中該接觸面相對於該平面而呈一拱形輪廓。
  11. 如申請專利範圍第9項所述的殼體結構，其中該機箱包括一底殼與一上蓋，該上蓋可開闔地組裝至該底殼，該電路板與該剛性支架分別配置在該底殼上。
  12. 如申請專利範圍第11項所述的殼體結構，其中該 剛性支架具有一本體與從該本體延伸的多個鎖固部，該本體藉由該些鎖固部而固定在該底殼上，且該些鎖固部位在該底殼與該電路板之間。
  13. 如申請專利範圍第12項所述的殼體結構，其中排列在該本體上的該些鎖固部形成該剛性支架的該接觸面，且該些鎖固部相對於該平面距離彼此相異。
  14. 如申請專利範圍第12項所述的殼體結構，還包括：一吊鉤，配置在該上蓋朝向該電路板的一側，當該上蓋閉闔於該底殼時，該吊鉤卡扣於該本體。
TW100148312A 2011-12-23 2011-12-23 殼體結構與應用其之伺服器 TWI456377B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW100148312A TWI456377B (zh) 2011-12-23 2011-12-23 殼體結構與應用其之伺服器
US13/418,708 US8724329B2 (en) 2011-12-23 2012-03-13 Casing structure and server using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW100148312A TWI456377B (zh) 2011-12-23 2011-12-23 殼體結構與應用其之伺服器

Publications (2)

Publication Number Publication Date
TW201327092A TW201327092A (zh) 2013-07-01
TWI456377B true TWI456377B (zh) 2014-10-11

Family

ID=48654321

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100148312A TWI456377B (zh) 2011-12-23 2011-12-23 殼體結構與應用其之伺服器

Country Status (2)

Country Link
US (1) US8724329B2 (zh)
TW (1) TWI456377B (zh)

Cited By (1)

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US11116104B2 (en) 2018-12-07 2021-09-07 Chenbro Micom Co., Ltd. Server chassis

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CN104423428A (zh) * 2013-08-22 2015-03-18 英业达科技有限公司 电子装置
US9179573B1 (en) * 2013-09-27 2015-11-03 Black Rock Hosting Inc. Rack-mounted multiple server module
DE102014118754B4 (de) * 2014-12-16 2018-01-11 Fujitsu Ltd. Herstellungsverfahren für ein Chassis und Chassis für einen Servereinschub
CN108445975A (zh) * 2017-02-16 2018-08-24 光宝电子(广州)有限公司 硬盘支架

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TWM257604U (en) * 2004-03-16 2005-02-21 Quanta Comp Inc Chassis frame
TWM321194U (en) * 2007-04-26 2007-10-21 Inventec Corp Support member
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TWM257604U (en) * 2004-03-16 2005-02-21 Quanta Comp Inc Chassis frame
CN101201668A (zh) * 2006-12-13 2008-06-18 英业达股份有限公司 伺服器机壳的强化机构
TWM321194U (en) * 2007-04-26 2007-10-21 Inventec Corp Support member

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11116104B2 (en) 2018-12-07 2021-09-07 Chenbro Micom Co., Ltd. Server chassis
US11547013B2 (en) 2018-12-07 2023-01-03 Chenbro Micom Co., Ltd. Server chassis

Also Published As

Publication number Publication date
US20130163169A1 (en) 2013-06-27
TW201327092A (zh) 2013-07-01
US8724329B2 (en) 2014-05-13

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