ES2052269T3 - Metodos para depositar recubrimientos de acabado sobre sustratos de metales anodizables y sus productos. - Google Patents

Metodos para depositar recubrimientos de acabado sobre sustratos de metales anodizables y sus productos.

Info

Publication number
ES2052269T3
ES2052269T3 ES90912713T ES90912713T ES2052269T3 ES 2052269 T3 ES2052269 T3 ES 2052269T3 ES 90912713 T ES90912713 T ES 90912713T ES 90912713 T ES90912713 T ES 90912713T ES 2052269 T3 ES2052269 T3 ES 2052269T3
Authority
ES
Spain
Prior art keywords
metal
deposited
pores
electrolytically
electrolytic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES90912713T
Other languages
English (en)
Inventor
Dan Fern
Christopher James Hanthorn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rio Tinto Alcan International Ltd
Original Assignee
Alcan International Ltd Canada
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcan International Ltd Canada filed Critical Alcan International Ltd Canada
Application granted granted Critical
Publication of ES2052269T3 publication Critical patent/ES2052269T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
    • C23C28/345—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1848—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by electrochemical pretreatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
    • C23C28/322—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer only coatings of metal elements only
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/06—Anodisation of aluminium or alloys based thereon characterised by the electrolytes used
    • C25D11/08—Anodisation of aluminium or alloys based thereon characterised by the electrolytes used containing inorganic acids
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/18—After-treatment, e.g. pore-sealing
    • C25D11/20—Electrolytic after-treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/18—After-treatment, e.g. pore-sealing
    • C25D11/24—Chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/18—After-treatment, e.g. pore-sealing
    • C25D11/24—Chemical after-treatment
    • C25D11/246—Chemical after-treatment for sealing layers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)

Abstract

SE DESCRIBEN NUEVOS PROCESOS PARA DEPOSITAR RECUBRIMIENTOS METALICOS EN SUSTRATOS DE METALES ANODIZABLES, TALES COMO ALUMINIO Y SUS ALEACIONES, APLICANDOSE LOS RECUBRIMIENTOS DIRECTAMENTE EN UNA CAPA POROSA ANODIZADA QUE SE HA PRODUCIDO EN LA SUPERFICIE DEL SUSTRATO. EL METAL QUE RELLENA EL PORO SE DEPOSITA ELECTROLITICAMENTE PRIMERO EN LOS POROS, DEPOSITANDOSE EL METAL INICIALMENTE EN LAS PAREDES DEL FONDO Y EN LAS PARTES INFERIORES DE LAS PAREDES LATERALES; USUALMENTE, HASTA QUE LOS POROS ESTAN LLENOS DEL 3% AL 30%. DESPUES, SE CONTINUA LA DEPOSICION DE METAL UTILIZANDO UN PROCESO NO ELECTROLITICO HASTA QUE LOS POROS ESTEN LLENOS EN LA EXTENSION DESEADA, USUALMENTE HASTA QUE SE HA APLICADO UN REVESTIMIENTO DE SOPORTE SOBRE TODA LA CAPA ANODIZADA. DESPUES, SE PUEDEN APLICAR OTROS REVESTIMIENTOS METALICOS SOBRE LA CAPA DE SOPORTE, BIEN POR METODOS ELECTROLITICOS O NO ELECTROLITICOS. SE PUEDEN APLICAR CON EXITO UNOS REVESTIMIENTOS NO ELECTROLITICOS DE UN GROSOR CONSIDERABLE (HASTA DE 75 MICROMETROS). LOS NUEVOS PRODUCTOS DE TALES PROCESOS COMPRENDEN UN SUSTRATO DE METAL ANODIZABLE TENIENDO EN UNA SUPERFICIE UNA CAPA ANODIZADA DE UN GROSOR DE 0.5 A 50 MICROMETROS; LOS POROS DE LA CAPA ANODIZADA TIENEN METAL RELLENADOR DE POROS DEPOSITADOS EN ELLOS ELECTROLITICAMENTE, Y METAL RELLENADOR DE POROS DEPOSITADO NO ELECTROLITICAMENTE EN EL METAL DEPOSITADO ELECTROLITICAMENTE. EL METAL NO ELECTROLITICO PUEDE CONSTITUIR LA CAPA FINAL O SE PUEDEN DEPOSITAR OTRAS CAPAS SOBRE EL PARA DAR EL PRODUCTO FINAL. EL METAL DEPOSITADO ELECTROLITICAMENTE INTERPUESTO PROPORCIONA UNA ADHESION MEJORADA EN EL MATERIAL ANODIZADO COMPARANDOLO CON METAL DEPOSITADO NO ELECTROLITICAMENTE DIRECTO.
ES90912713T 1989-09-05 1990-09-05 Metodos para depositar recubrimientos de acabado sobre sustratos de metales anodizables y sus productos. Expired - Lifetime ES2052269T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CA000610259A CA1341327C (en) 1989-09-05 1989-09-05 Methods for depositing finish coatings on substrates of anodisable metals and the products thereof

Publications (1)

Publication Number Publication Date
ES2052269T3 true ES2052269T3 (es) 1994-07-01

Family

ID=4140553

Family Applications (1)

Application Number Title Priority Date Filing Date
ES90912713T Expired - Lifetime ES2052269T3 (es) 1989-09-05 1990-09-05 Metodos para depositar recubrimientos de acabado sobre sustratos de metales anodizables y sus productos.

Country Status (7)

Country Link
EP (1) EP0490914B1 (es)
JP (1) JP2945472B2 (es)
AU (1) AU6287090A (es)
CA (1) CA1341327C (es)
DE (1) DE69008359T2 (es)
ES (1) ES2052269T3 (es)
WO (1) WO1991003583A1 (es)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4238242C2 (de) * 1992-09-17 2003-04-24 Rieger Franz Metallveredelung Verfahren zur Vorbehandlung von Leichtmetallen nach Patent DE 4231052 C2
US6217737B1 (en) 1997-10-03 2001-04-17 Hirel Connectors Inc. Method for forming a corrosion-resistant conductive connector shell
DE19807823A1 (de) * 1998-02-26 1999-09-09 Fraunhofer Ges Forschung Verfahren zur Herstellung einer korrosionsschützenden Beschichtung und Schichtsystem für Substrate aus Leichtmetall
DE19831370A1 (de) * 1998-07-13 2000-01-27 Fraunhofer Ges Forschung Verfahren zur Beschichtung von Körpern aus Leichtmetallen oder Leichtmetallegierungen mittels Plasmaunterstützung
EP1688683A1 (en) * 2005-01-06 2006-08-09 Fenis Teknik Ürünler A.S. Light weight high effeciency collector made of aluminum foil having selective surface
EP1914330A4 (en) * 2005-06-17 2010-03-03 Univ Tohoku PROTECTION FILM STRUCTURE OF METAL ELEMENT, METAL COMPONENT WITH PROTECTIVE FILM STRUCTURE AND DEVICE FOR PRODUCING A SEMICONDUCTOR OR A FLAT DISPLAY WITH PROTECTIVE FILM STRUCTURE
US8309237B2 (en) 2007-08-28 2012-11-13 Alcoa Inc. Corrosion resistant aluminum alloy substrates and methods of producing the same
US7732068B2 (en) 2007-08-28 2010-06-08 Alcoa Inc. Corrosion resistant aluminum alloy substrates and methods of producing the same
US8927392B2 (en) 2007-11-02 2015-01-06 Siva Power, Inc. Methods for forming crystalline thin-film photovoltaic structures
KR101100858B1 (ko) * 2009-09-28 2012-01-02 포항공과대학교 산학협력단 연료 전지용 세퍼레이터와 이의 제조 방법 및 이를 포함하는 연료 전지 스택
DE102015105449B4 (de) * 2015-04-09 2019-01-17 Rieger Metallveredlung GmbH & Co. KG Verfahren zum Aufbringen einer Schutzschicht auf Aluminiumteile
JP2019525011A (ja) * 2016-08-17 2019-09-05 シーラス マテリアルズ サイエンス リミティド 軽合金上に薄い機能性コーティングを生成する方法
CN115341169B (zh) * 2021-05-14 2024-12-03 北京小米移动软件有限公司 表面处理方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4525247A (en) * 1982-07-12 1985-06-25 Rogers Corporation Microwave circuit boards and method of manufacture thereof
DE3671764D1 (de) * 1985-02-06 1990-07-12 Fujitsu Ltd Verfahren zur bildung eines komposit-aluminium-filmes.

Also Published As

Publication number Publication date
AU6287090A (en) 1991-04-08
EP0490914B1 (en) 1994-04-20
EP0490914A1 (en) 1992-06-24
DE69008359D1 (de) 1994-05-26
WO1991003583A1 (en) 1991-03-21
DE69008359T2 (de) 1994-08-04
JP2945472B2 (ja) 1999-09-06
CA1341327C (en) 2001-12-18
JPH05503316A (ja) 1993-06-03

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