ES2034234T3 - Conjunto termoconductor. - Google Patents

Conjunto termoconductor.

Info

Publication number
ES2034234T3
ES2034234T3 ES198888305793T ES88305793T ES2034234T3 ES 2034234 T3 ES2034234 T3 ES 2034234T3 ES 198888305793 T ES198888305793 T ES 198888305793T ES 88305793 T ES88305793 T ES 88305793T ES 2034234 T3 ES2034234 T3 ES 2034234T3
Authority
ES
Spain
Prior art keywords
thermoconductor
protections
multiplicity
extend
assembly includes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES198888305793T
Other languages
English (en)
Inventor
Mark S. Dentini
Joe. A. Fulton
Sungho Jin
John Joseph Mottine, Jr.
Lloyd Shepherd
Richard Curry Sherwood
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
American Telephone and Telegraph Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Telephone and Telegraph Co Inc filed Critical American Telephone and Telegraph Co Inc
Application granted granted Critical
Publication of ES2034234T3 publication Critical patent/ES2034234T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/256—Heavy metal or aluminum or compound thereof
    • Y10T428/257—Iron oxide or aluminum oxide

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Soft Magnetic Materials (AREA)
  • Conductive Materials (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Hard Magnetic Materials (AREA)
  • Thermistors And Varistors (AREA)

Abstract

UN CONJUNTO CONDUCTOR TERMICO COMPRESIBLE COMPRENDE UN CAMPO POLIMERO CON PARTICULAS ALINEADAS MAGNETICAMENTE, TERMICAMENTE CONDUCTORAS, QUE COMPRENDEN UNA PARTE BASE Y UNA MULTIPLICADAD DE PROTUBERANCIAS QUE SE PROLONGAN DESDE UNA SUPERFICIE POR LO MENOS DE LA PARTE BASICA.
ES198888305793T 1987-07-02 1988-06-24 Conjunto termoconductor. Expired - Lifetime ES2034234T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/069,792 US4838347A (en) 1987-07-02 1987-07-02 Thermal conductor assembly

Publications (1)

Publication Number Publication Date
ES2034234T3 true ES2034234T3 (es) 1993-04-01

Family

ID=22091237

Family Applications (1)

Application Number Title Priority Date Filing Date
ES198888305793T Expired - Lifetime ES2034234T3 (es) 1987-07-02 1988-06-24 Conjunto termoconductor.

Country Status (7)

Country Link
US (1) US4838347A (es)
EP (1) EP0297793B1 (es)
JP (1) JPH0671054B2 (es)
KR (1) KR0127314B1 (es)
CA (1) CA1286793C (es)
DE (1) DE3874244T2 (es)
ES (1) ES2034234T3 (es)

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DE69312411T2 (de) * 1992-09-15 1997-11-27 Texas Instruments Inc Ballkontaktierung für Flip-Chip-Anordnungen
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DE19924289A1 (de) * 1999-05-27 2000-12-07 Siemens Ag Elektronisches Schaltungsmodul mit flexibler Zwischenschicht zwischen elektronischen Bauelementen und einem Kühlkörper
JP2002121404A (ja) * 2000-10-19 2002-04-23 Polymatech Co Ltd 熱伝導性高分子シート
DE10109083B4 (de) * 2001-02-24 2006-07-13 Conti Temic Microelectronic Gmbh Elektronische Baugruppe
US7060747B2 (en) * 2001-03-30 2006-06-13 Intel Corporation Chain extension for thermal materials
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US6597575B1 (en) * 2002-01-04 2003-07-22 Intel Corporation Electronic packages having good reliability comprising low modulus thermal interface materials
DE10221100C1 (de) * 2002-05-03 2003-06-05 Neuhaus Elektronik Gmbh Elektrisch leitfähige Dichtung sowie Verfahren und Vorrichtung zu deren Herstellung
US6919504B2 (en) * 2002-12-19 2005-07-19 3M Innovative Properties Company Flexible heat sink
US6771508B1 (en) * 2003-02-14 2004-08-03 Intel Corporation Method and apparatus for cooling an electronic component
JP3934565B2 (ja) * 2003-02-21 2007-06-20 富士通株式会社 半導体装置
US6915701B1 (en) 2003-07-18 2005-07-12 Cleveland Medical Devices Inc. Composite material for a sensor for measuring shear forces
US6955094B1 (en) 2003-07-18 2005-10-18 Cleveland Medical Devices Inc. Sensor for measuring shear forces
DE10336018A1 (de) * 2003-08-01 2005-02-24 Jan Batal Verfahren zur Verformung eines Polymers sowie daraus hergestellte Produkte, insbesondere Adhäsivum
US7290598B2 (en) * 2004-02-26 2007-11-06 University Of Rochester Heat exchange device
US20060196640A1 (en) * 2004-12-01 2006-09-07 Convergence Technologies Limited Vapor chamber with boiling-enhanced multi-wick structure
KR20060062824A (ko) * 2004-12-06 2006-06-12 주식회사 아이에스시테크놀러지 반도체 패키지 테스트용 실리콘 커넥터
US7246655B2 (en) * 2004-12-17 2007-07-24 Fujikura Ltd. Heat transfer device
JP2007005246A (ja) * 2005-06-27 2007-01-11 Sumitomo Electric Ind Ltd 多孔質樹脂基材及び多層基板
US7593228B2 (en) * 2005-10-26 2009-09-22 Indium Corporation Of America Technique for forming a thermally conductive interface with patterned metal foil
US20090126903A1 (en) * 2006-04-24 2009-05-21 Sumitomo Electric Industries, Ltd. Heat transfer member, convex structural member, electronic apparatus, and electric product
US20080066899A1 (en) * 2006-09-15 2008-03-20 Zhao-Ren Wang Tape-like heat sink
US20080149320A1 (en) * 2006-10-19 2008-06-26 Sony Ericsson Mobile Communications Ab Electronic device with dual function outer surface
KR20090116712A (ko) * 2006-12-20 2009-11-11 바스프 에스이 이방성 셀형 엘라스토머
US7694719B2 (en) * 2007-01-04 2010-04-13 International Business Machines Corporation Patterned metal thermal interface
US20090226696A1 (en) * 2008-02-06 2009-09-10 World Properties, Inc. Conductive Polymer Foams, Method of Manufacture, And Uses Thereof
US8623265B2 (en) * 2007-02-06 2014-01-07 World Properties, Inc. Conductive polymer foams, method of manufacture, and articles thereof
CN101600758B (zh) * 2007-02-06 2012-07-04 环球产权公司 导电聚合物泡沫及其制造方法和用途
US20090109628A1 (en) * 2007-10-30 2009-04-30 International Business Machines Corporation Chip Cooling System with Convex Portion
US7907410B2 (en) * 2007-11-08 2011-03-15 International Business Machines Corporation Universal patterned metal thermal interface
US8356657B2 (en) * 2007-12-19 2013-01-22 Teledyne Scientific & Imaging, Llc Heat pipe system
US20090321416A1 (en) * 2008-06-27 2009-12-31 Christos Sarigiannidis Enhanced energy delivery mechanism for bulk specialty gas supply systems
GB2491505B (en) * 2009-12-29 2014-03-12 Rogers Corp Conductive polymer foams, method of manufacture, and uses therof
EP2420588A1 (en) * 2010-08-16 2012-02-22 Applied Materials, Inc. Thermal management of film deposition processes
US20120211214A1 (en) * 2010-12-09 2012-08-23 Panasonic Avionics Corporation Heatsink Device and Method
KR101368513B1 (ko) * 2011-04-21 2014-02-27 (주)도형아이엠 불량 프리폼 이젝팅 장치 및 이를 이용한 프리폼 검사장치
US8995131B2 (en) * 2011-08-29 2015-03-31 Aerovironment, Inc. Heat transfer system for aircraft structures
US9756764B2 (en) 2011-08-29 2017-09-05 Aerovironment, Inc. Thermal management system for an aircraft avionics bay
WO2013042611A1 (ja) * 2011-09-20 2013-03-28 東海ゴム工業株式会社 ウレタン発泡成形体およびその製造方法
JP2018078272A (ja) * 2016-10-31 2018-05-17 スリーエム イノベイティブ プロパティズ カンパニー 三次元形状熱伝導性成形体、及びその製造方法
WO2018078436A1 (ja) * 2016-10-31 2018-05-03 スリ一エム イノべイティブ プロパティズ カンパニ一 三次元形状熱伝導性成形体、及びその製造方法
US11024449B2 (en) 2017-06-06 2021-06-01 Apple Inc. Multipole elastomeric magnet with magnetic-field shunt
US20230144759A1 (en) * 2019-08-02 2023-05-11 King Abdullah University Of Science And Technology Controlling devices using facial movements
CN113380737B (zh) * 2021-04-28 2024-05-07 西安交通大学 一种y字形浸没式毛细微通道强化散热结构及其制造方法

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US4222434A (en) * 1978-04-27 1980-09-16 Clyde Robert A Ceramic sponge heat-exchanger member
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US4548862A (en) * 1984-09-04 1985-10-22 Minnesota Mining And Manufacturing Company Flexible tape having bridges of electrically conductive particles extending across its pressure-sensitive adhesive layer
US4546037A (en) * 1984-09-04 1985-10-08 Minnesota Mining And Manufacturing Company Flexible tape having stripes of electrically conductive particles for making multiple connections
US4654752A (en) * 1984-12-04 1987-03-31 Kyle James C Terminal assembly and method of making terminal assembly

Also Published As

Publication number Publication date
KR890003272A (ko) 1989-04-13
JPH0671054B2 (ja) 1994-09-07
EP0297793A2 (en) 1989-01-04
KR0127314B1 (ko) 1998-04-06
EP0297793B1 (en) 1992-09-02
CA1286793C (en) 1991-07-23
EP0297793A3 (en) 1989-11-02
DE3874244T2 (de) 1992-12-24
DE3874244D1 (de) 1992-10-08
US4838347A (en) 1989-06-13
JPS6459840A (en) 1989-03-07

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