ES2028872T3 - Procedimiento para la fabricacion de moldes y matrices de metal. - Google Patents

Procedimiento para la fabricacion de moldes y matrices de metal.

Info

Publication number
ES2028872T3
ES2028872T3 ES198787306390T ES87306390T ES2028872T3 ES 2028872 T3 ES2028872 T3 ES 2028872T3 ES 198787306390 T ES198787306390 T ES 198787306390T ES 87306390 T ES87306390 T ES 87306390T ES 2028872 T3 ES2028872 T3 ES 2028872T3
Authority
ES
Spain
Prior art keywords
template
workpiece
etchant
mold
matrices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES198787306390T
Other languages
English (en)
Inventor
James J. Rossetti
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Tool Technologies Inc
Original Assignee
Advanced Tool Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Tool Technologies Inc filed Critical Advanced Tool Technologies Inc
Application granted granted Critical
Publication of ES2028872T3 publication Critical patent/ES2028872T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • C23F1/04—Chemical milling

Landscapes

  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Mounting, Exchange, And Manufacturing Of Dies (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Materials For Medical Uses (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)

Abstract

METODO PARA CONFORMAR UN MOLDE O MATRIZ METALICO A PARTIR DE UN MODELO DEL CONTORNO DEL MOLDE. LA PIEZA DE LA QUE SE VA A MECANIZAR EL MOLDE, SE RECUBRE CON UN MATERIAL RESISTENTE AL ATAQUE ACIDO Y DESPUES SE SUMERGE EN UN ACIDO DE ATAQUE Y SE PONE EN CONTACTO CON UNA PLANTILLA DEL MOLDE O MATRIZ. LAS ZONAS RECUBIERTAS QUE SE PONEN EN CONTACTO CON LA PLANTILLA SON DESPLAZADAS HASTA QUE LA SUPERFICIE DE LA PIEZA DE TRABAJO SE PONE EN CONTACTO CON LA PLANTILLA. ENTONCES SE QUITA LA PLANTILLA Y EL ACIDO ATACA LAS ZONAS DE LA PIEZAS DE LAS QUE SE HA QUITADO EN RECUBRIMIENTO. EL PROCESO SE REPITE DE FORMA PROGRESIVA HASTA QUE LA SUPERFICIE DE LA PIEZA DE TRABAJO SE ADAPTA COMPLETAMENTE AL CONTORNO DE LA PLANTILLA. LEYENDA DE LA FIGURA 1- MUESTRA, PIEZA PARA HACER EL MOLDE 2- NEGATIVO DEL MOLDE 3- PLANTILLA 4- PIEZA DE TRABAJO RECUBIERTA CON UN RECUBRIMIENTO INERTE 5- PRENSA ALTERNATIVA CON LA PLANTILLA Y LA PIEZA A TRABAJAR EN BAÑO ACIDO 6- PIEZA A TRABAJAR CALENTADA 7- LA PLANTILLA SE PONEREPETIDAMENTE EN CONTACTO CON LA PIEZA DE TRABAJO PARA CONFORMAR PROGRESIVAMENTE EL MOLDE 8- MOLDE ACABADO.
ES198787306390T 1987-02-24 1987-07-20 Procedimiento para la fabricacion de moldes y matrices de metal. Expired - Lifetime ES2028872T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/017,916 US4832790A (en) 1986-04-11 1987-02-24 Method of making metal molds and dies

Publications (1)

Publication Number Publication Date
ES2028872T3 true ES2028872T3 (es) 1992-07-16

Family

ID=21785259

Family Applications (1)

Application Number Title Priority Date Filing Date
ES198787306390T Expired - Lifetime ES2028872T3 (es) 1987-02-24 1987-07-20 Procedimiento para la fabricacion de moldes y matrices de metal.

Country Status (6)

Country Link
US (1) US4832790A (es)
EP (1) EP0280804B1 (es)
AT (1) ATE70090T1 (es)
DE (1) DE3775038D1 (es)
ES (1) ES2028872T3 (es)
GR (1) GR3003957T3 (es)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5575962A (en) * 1994-12-02 1996-11-19 Lucent Technologies Inc. Method for fabricating optical quality molds with precision microfeatures
US5820769A (en) * 1995-05-24 1998-10-13 Regents Of The University Of Minnesota Method for making magnetic storage having discrete elements with quantized magnetic moments
US7758794B2 (en) * 2001-10-29 2010-07-20 Princeton University Method of making an article comprising nanoscale patterns with reduced edge roughness
US20040137734A1 (en) * 1995-11-15 2004-07-15 Princeton University Compositions and processes for nanoimprinting
US6309580B1 (en) * 1995-11-15 2001-10-30 Regents Of The University Of Minnesota Release surfaces, particularly for use in nanoimprint lithography
US5772905A (en) * 1995-11-15 1998-06-30 Regents Of The University Of Minnesota Nanoimprint lithography
US6780001B2 (en) * 1999-07-30 2004-08-24 Formfactor, Inc. Forming tool for forming a contoured microelectronic spring mold
US20050037143A1 (en) * 2000-07-18 2005-02-17 Chou Stephen Y. Imprint lithography with improved monitoring and control and apparatus therefor

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE107526C (es) * 1899-02-13
US2662002A (en) * 1951-02-14 1953-12-08 Frederick A Sunderhauf Method of embossing rolls
US3048512A (en) * 1957-06-27 1962-08-07 Modern Engraving And Machine C Method of making matched embossing rolls
US3226255A (en) * 1961-10-31 1965-12-28 Western Electric Co Masking method for semiconductor
US3290192A (en) * 1965-07-09 1966-12-06 Motorola Inc Method of etching semiconductors
US4035226A (en) * 1975-04-14 1977-07-12 Rca Corporation Method of preparing portions of a semiconductor wafer surface for further processing
US4108716A (en) * 1976-12-22 1978-08-22 Bell Telephone Laboratories, Incorporated Polishing of CdS crystals
US4325779A (en) * 1979-04-17 1982-04-20 Beatrice Foods Co. Method for shaping and finishing a workpiece
DE3273637D1 (en) * 1982-04-19 1986-11-13 Lovejoy Ind Inc Method for shaping and finishing a workpiece
US4563238A (en) * 1984-09-05 1986-01-07 Extrude Hone Corporation Chemical deburring system with a soluble mask
US4556449A (en) * 1984-10-15 1985-12-03 Psi Star Nickel etching process and solution

Also Published As

Publication number Publication date
ATE70090T1 (de) 1991-12-15
EP0280804A1 (en) 1988-09-07
EP0280804B1 (en) 1991-12-04
DE3775038D1 (de) 1992-01-16
GR3003957T3 (es) 1993-03-16
US4832790A (en) 1989-05-23

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