EP4122005A4 - Substratschalentransfersystem für eine substratverarbeitungsausrüstung - Google Patents

Substratschalentransfersystem für eine substratverarbeitungsausrüstung Download PDF

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Publication number
EP4122005A4
EP4122005A4 EP20925671.8A EP20925671A EP4122005A4 EP 4122005 A4 EP4122005 A4 EP 4122005A4 EP 20925671 A EP20925671 A EP 20925671A EP 4122005 A4 EP4122005 A4 EP 4122005A4
Authority
EP
European Patent Office
Prior art keywords
substrate
processing equipment
transfer system
tray transfer
substrate processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP20925671.8A
Other languages
English (en)
French (fr)
Other versions
EP4122005A1 (de
Inventor
Shinichi Kurita
Shinobu Abe
Chang Hee Shin
Masahiko Kowaka
Yong Kee Chae
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of EP4122005A1 publication Critical patent/EP4122005A1/de
Publication of EP4122005A4 publication Critical patent/EP4122005A4/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0608—Gripping heads and other end effectors with vacuum or magnetic holding means with magnetic holding means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Non-Mechanical Conveyors (AREA)
EP20925671.8A 2020-03-20 2020-03-26 Substratschalentransfersystem für eine substratverarbeitungsausrüstung Pending EP4122005A4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202062992690P 2020-03-20 2020-03-20
PCT/US2020/024947 WO2021188122A1 (en) 2020-03-20 2020-03-26 Substrate tray transfer system for substrate process equipment

Publications (2)

Publication Number Publication Date
EP4122005A1 EP4122005A1 (de) 2023-01-25
EP4122005A4 true EP4122005A4 (de) 2024-05-29

Family

ID=77771473

Family Applications (1)

Application Number Title Priority Date Filing Date
EP20925671.8A Pending EP4122005A4 (de) 2020-03-20 2020-03-26 Substratschalentransfersystem für eine substratverarbeitungsausrüstung

Country Status (6)

Country Link
EP (1) EP4122005A4 (de)
JP (1) JP7539993B2 (de)
KR (1) KR102863993B1 (de)
CN (1) CN115335977A (de)
TW (1) TWI878497B (de)
WO (1) WO2021188122A1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7767189B2 (ja) * 2022-03-11 2025-11-11 キオクシア株式会社 プラズマ処理装置、プラズマ処理方法、および原版の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5882165A (en) * 1986-12-19 1999-03-16 Applied Materials, Inc. Multiple chamber integrated process system
US6106631A (en) * 1997-10-16 2000-08-22 Sharp Kabushiki Kaisha Plasma processing apparatus
US20100087028A1 (en) * 2008-10-07 2010-04-08 Applied Materials, Inc. Advanced platform for processing crystalline silicon solar cells
KR20120053155A (ko) * 2010-11-17 2012-05-25 주성엔지니어링(주) 트레이와 이를 이용한 기판 처리 장치, 및 트레이의 제조 방법

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100223349B1 (ko) 1994-08-26 1999-10-15 가나이 쓰도무 반송장치, 반송처리장치, 피처리물 반송처리방법 및 자세전환장치
JP4084293B2 (ja) * 2002-12-05 2008-04-30 株式会社アドヴァンスド・ディスプレイ・プロセス・エンジニアリング Ｆｐｄ製造装置
US8668422B2 (en) * 2004-08-17 2014-03-11 Mattson Technology, Inc. Low cost high throughput processing platform
KR100707390B1 (ko) * 2005-12-19 2007-04-13 주식회사 아바코 기판 이송장치
KR101288599B1 (ko) * 2007-05-29 2013-07-22 엘지디스플레이 주식회사 기판 이송 장치
US20100108708A1 (en) 2008-10-30 2010-05-06 Wawzynski Michael C High volume, high pressure, refillable, continuous batter dispenser system and method
KR101167947B1 (ko) * 2010-03-19 2012-07-23 (주) 엔피홀딩스 스퍼터링 시스템
JP5688838B2 (ja) * 2010-10-29 2015-03-25 株式会社アルバック 基板処理装置
KR101277070B1 (ko) * 2011-05-17 2013-06-20 주식회사 에스에프에이 기판 이송장치
JP6018379B2 (ja) 2011-12-27 2016-11-02 川崎重工業株式会社 基板保持装置
JP6231078B2 (ja) * 2012-04-26 2017-11-15 インテヴァック インコーポレイテッド 真空プロセスのためのシステム構成
KR101328574B1 (ko) * 2012-09-24 2013-11-13 주식회사 선익시스템 기판이송장치
KR101531656B1 (ko) * 2013-10-16 2015-06-25 한국전기연구원 자기 부상 이송 장치
JP6719567B2 (ja) * 2017-08-25 2020-07-08 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ キャリアを搬送するための装置、基板を真空処理するためのシステム、及び真空チャンバ内でキャリアを搬送するための方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5882165A (en) * 1986-12-19 1999-03-16 Applied Materials, Inc. Multiple chamber integrated process system
US6106631A (en) * 1997-10-16 2000-08-22 Sharp Kabushiki Kaisha Plasma processing apparatus
US20100087028A1 (en) * 2008-10-07 2010-04-08 Applied Materials, Inc. Advanced platform for processing crystalline silicon solar cells
KR20120053155A (ko) * 2010-11-17 2012-05-25 주성엔지니어링(주) 트레이와 이를 이용한 기판 처리 장치, 및 트레이의 제조 방법

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2021188122A1 *

Also Published As

Publication number Publication date
TWI878497B (zh) 2025-04-01
KR102863993B1 (ko) 2025-09-23
WO2021188122A1 (en) 2021-09-23
JP2023517711A (ja) 2023-04-26
TW202141676A (zh) 2021-11-01
KR20220154807A (ko) 2022-11-22
CN115335977A (zh) 2022-11-11
EP4122005A1 (de) 2023-01-25
JP7539993B2 (ja) 2024-08-26

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A4 Supplementary search report drawn up and despatched

Effective date: 20240425

RIC1 Information provided on ipc code assigned before grant

Ipc: H01L 21/687 20060101ALI20240419BHEP

Ipc: H01L 21/673 20060101ALI20240419BHEP

Ipc: H01L 21/677 20060101ALI20240419BHEP

Ipc: H01L 21/67 20060101AFI20240419BHEP