EP4061109A4 - Dispositif de montage de composants - Google Patents

Dispositif de montage de composants Download PDF

Info

Publication number
EP4061109A4
EP4061109A4 EP19952628.6A EP19952628A EP4061109A4 EP 4061109 A4 EP4061109 A4 EP 4061109A4 EP 19952628 A EP19952628 A EP 19952628A EP 4061109 A4 EP4061109 A4 EP 4061109A4
Authority
EP
European Patent Office
Prior art keywords
component mounter
mounter
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP19952628.6A
Other languages
German (de)
English (en)
Other versions
EP4061109A1 (fr
Inventor
Kazuya Kotani
Keiichi Ono
Tomoya Fujimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Corp
Original Assignee
Fuji Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Corp filed Critical Fuji Corp
Publication of EP4061109A1 publication Critical patent/EP4061109A1/fr
Publication of EP4061109A4 publication Critical patent/EP4061109A4/fr
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0015—Orientation; Alignment; Positioning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H05K13/0076—Straightening or aligning terminal leads of pins mounted on boards, during transport of the boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/022—Feeding of components with orientation of the elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/043—Feeding one by one by other means than belts

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
EP19952628.6A 2019-11-14 2019-11-14 Dispositif de montage de composants Pending EP4061109A4 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/044792 WO2021095221A1 (fr) 2019-11-14 2019-11-14 Dispositif de montage de composants

Publications (2)

Publication Number Publication Date
EP4061109A1 EP4061109A1 (fr) 2022-09-21
EP4061109A4 true EP4061109A4 (fr) 2022-11-16

Family

ID=75912595

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19952628.6A Pending EP4061109A4 (fr) 2019-11-14 2019-11-14 Dispositif de montage de composants

Country Status (5)

Country Link
US (1) US20220400588A1 (fr)
EP (1) EP4061109A4 (fr)
JP (1) JP7261314B2 (fr)
CN (1) CN114642090B (fr)
WO (1) WO2021095221A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7439129B2 (ja) * 2019-12-16 2024-02-27 株式会社Fuji 部品装着機
WO2023238407A1 (fr) * 2022-06-10 2023-12-14 株式会社Fuji Dispositif d'alimentation en vrac et élément d'alignement de dispositif d'alimentation en vrac
WO2024209547A1 (fr) * 2023-04-04 2024-10-10 株式会社Fuji Dispositif d'aide au montage
WO2024209546A1 (fr) * 2023-04-04 2024-10-10 株式会社Fuji Dispositif d'aide au montage
WO2024209709A1 (fr) * 2023-04-04 2024-10-10 株式会社Fuji Dispositif d'aide au montage

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005159177A (ja) * 2003-11-27 2005-06-16 Fuji Mach Mfg Co Ltd 電子部品供給装置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5493565A (en) * 1978-01-06 1979-07-24 Hitachi Ltd Parts arranging feeder
US6868603B2 (en) * 1996-08-27 2005-03-22 Matsushita Electric Industrial Co., Ltd. Method of mounting component on circuit board
JP2005167235A (ja) * 1996-12-13 2005-06-23 Matsushita Electric Ind Co Ltd 電子部品とその実装方法
JPH11123681A (ja) * 1997-10-24 1999-05-11 Mitsubishi Electric Corp ピッキング装置およびピッキング方法
JP3744179B2 (ja) * 1998-02-19 2006-02-08 松下電器産業株式会社 電子部品実装方法
DE60024375T2 (de) * 1999-09-03 2006-06-14 Matsushita Electric Ind Co Ltd Bauteilen-bestückungsverfahren und Einrichtung
JP2006093317A (ja) * 2004-09-22 2006-04-06 Alps Electric Co Ltd テンプレートおよびそれを用いたチップ部品装着装置
US20080230562A1 (en) * 2007-03-21 2008-09-25 Multi-Fill, Inc. Bulk feeding system and method
JP2008311430A (ja) * 2007-06-14 2008-12-25 Nec Electronics Corp 半導体チップ検出装置及びこれを用いた半導体チップ検出方法
JP5133123B2 (ja) * 2008-04-30 2013-01-30 太陽誘電株式会社 バルクフィーダ用の部品収納ケース
JP4788759B2 (ja) * 2008-11-20 2011-10-05 パナソニック株式会社 部品実装装置
JP5507169B2 (ja) * 2009-09-16 2014-05-28 Ｊｕｋｉ株式会社 電子部品実装装置
JP5463585B2 (ja) * 2009-09-17 2014-04-09 日東工業株式会社 部品供給装置
JP5406682B2 (ja) 2009-11-25 2014-02-05 日東工業株式会社 電子部品供給装置
KR101339847B1 (ko) * 2010-04-27 2013-12-10 다이요 유덴 가부시키가이샤 벌크 피더용 부품 수납 케이스
JP2013243273A (ja) * 2012-05-22 2013-12-05 Fuji Mach Mfg Co Ltd 部品吸着動作監視装置及び部品有無検出装置
JP6542641B2 (ja) * 2015-11-06 2019-07-10 ヤマハ発動機株式会社 部品実装機、部品認識方法
EP3468330B1 (fr) * 2016-05-31 2021-09-22 Fuji Corporation Système de fourniture de composants

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005159177A (ja) * 2003-11-27 2005-06-16 Fuji Mach Mfg Co Ltd 電子部品供給装置

Also Published As

Publication number Publication date
JP7261314B2 (ja) 2023-04-19
EP4061109A1 (fr) 2022-09-21
US20220400588A1 (en) 2022-12-15
CN114642090A (zh) 2022-06-17
WO2021095221A1 (fr) 2021-05-20
JPWO2021095221A1 (fr) 2021-05-20
CN114642090B (zh) 2023-09-19

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