Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
  • B23K26/36—Removing material
  • B23K26/362—Laser etching
  • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
  • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
  • B23K26/03—Observing, e.g. monitoring, the workpiece
  • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
  • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
  • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
  • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
  • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
  • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
  • B23K26/08—Devices involving relative movement between laser beam and workpiece
  • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
  • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
  • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
  • B23K26/359—Working by laser beam, e.g. welding, cutting or boring for surface treatment by providing a line or line pattern, e.g. a dotted break initiation line
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
  • B23K26/36—Removing material
  • B23K26/38—Removing material by boring or cutting
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
  • B23K26/36—Removing material
  • B23K26/40—Removing material taking account of the properties of the material involved
  • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
  • B23Q7/00—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting
  • B23Q7/02—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting by means of drums or rotating tables or discs
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
  • G01B11/00—Measuring arrangements characterised by the use of optical techniques
  • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
  • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
  • G01B11/00—Measuring arrangements characterised by the use of optical techniques
  • G01B11/22—Measuring arrangements characterised by the use of optical techniques for measuring depth
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K2101/00—Articles made by soldering, welding or cutting
  • B23K2101/36—Electric or electronic devices
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K2103/00—Materials to be soldered, welded or cut
  • B23K2103/16—Composite materials, e.g. fibre reinforced
  • B23K2103/166—Multilayered materials
  • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K2103/00—Materials to be soldered, welded or cut
  • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
  • B23K2103/52—Ceramics

Definitions

• the present invention relates to a method for processing a metal-ceramic substrate, a system for carrying out the method and a method for processing a metal-ceramic substrate, system for carrying out the method and metal-ceramic substrate produced by the method Metal-ceramic substrate made with the same process
• Metal-ceramic substrates are well known, for example, as printed circuit boards or circuit boards from the prior art.
• connection surfaces for electrical components and conductor tracks are arranged on a component side of the metal-ceramic substrate, the electrical or electronic components and the conductor tracks being interconnectable to form electrical circuits.
• Essential components of the metal-ceramic substrates are an insulation layer, which is generally made from a ceramic, and one or more metal layers bonded to the insulation layer. Because of their comparatively high insulation strengths, insulation layers made of ceramic have proven to be particularly advantageous. By structuring the metal layer, conductor tracks and / or connection areas for the electrical components can be realized.
• DCB direct copper bond
• the ceramic layer and the metal layer are provided as a pre-composite, which when passing through an oven, in particular through a continuous furnace is subjected to the connection process, for example the DCB process.
• the connection process for example the DCB process.
• ABSM active metal brazing
• the manufactured metal-ceramic substrates are usually manufactured as large plates and then divided into individual metal-ceramic substrate sections by being separated or separated from one another by breaking or cutting.
• the present invention makes it its task to further improve the methods for processing metal-ceramic substrates, in particular with regard to process reliability when breaking and a manufacturing process when generating structures by means of laser light, which serve as a predetermined breaking point.
• a method for processing a metal-ceramic substrate comprising: Processing the metal-ceramic substrate by irradiating the metal-ceramic substrate with laser light, in particular to form a predetermined breaking point;
• a surface topography of the metal-ceramic substrate is measured at least in regions.
• the surface-topography of the metal-ceramic substrate is advantageously examined before the irradiation by means of the first measurement step and / or after the irradiation by means of the second measurement step.
• determining the time before the irradiation it is advantageously possible to determine a position of the ceramic layer as precisely as possible. This position or position of the ceramic layer can then advantageously be used to selectively set a focus for the irradiation on a desired level.
• the reduced scatter relates to parameters such as a structure or scribe depth and a position of the structure between two metal-ceramic sections that are still to be separated. For example, tolerances of less than 20 pm (with a structure depth of 60 pm) can be achieved. Furthermore, the measured depth of the structure, for example, can already be used to determine whether breaking is successful and, under certain circumstances, it is possible here to dispense with breaking that already destroys the metal-ceramic substrate.
• the surface topography is to be understood as a profile profile of the metal-ceramic substrate along its main extension plane, ie
• the first measurement step and / or the second measurement step collect and provide information about the outside profile of the metal-ceramic substrate, for example via a display device, the outside profile being determined, for example, by the metallization on the ceramic layer or a structure generated by the irradiation becomes.
• the first measurement step is preferably carried out immediately before the irradiation and / or the second measurement step immediately after the irradiation.
• “immediately before and after” is to be understood to mean that between the first measurement step and the irradiation or the irradiation and the second measurement step, the metal-ceramic substrate is preferably transported, preferably less than 2 m, particularly preferably less than 1 m and particularly preferably less than 0.5 m, but no further treatment steps.
• the first measurement step and / or the second measurement step is carried out by means of a non-destructive optical measurement method.
• a distance from the sensor to a surface area of the metal-ceramic substrate detected by the sensor is determined by means of a first or second sensor, for example using interferometric methods.
• a distance between the first sensor / second sensor and a substrate carrier on which the metal-ceramic substrate is positioned and a distance between the first sonor / second sensor and one of the substrate carriers can be turned away - use the position or position of the ceramic layer for the optimized focusing during the irradiation.
• the surface topography of the metal-ceramic substrate can then be recorded successively between the metal-ceramic substrate and the first or wide sensor along a scanning direction, which runs in particular parallel to the main extension plane, and repeated recording of distances.
• first sensor and the second sensor are identical in construction.
• An example for a first sensor and / or second sensor is the Cono Point10-HD sensor from Optimet®.
• a lens for example with a focal length between 40 and 70 mm, is preferably arranged between the first sensor and the second sensor in order to optimize the imaging properties for the application.
• the metal-ceramic substrate for the first or second measurement step is preferably arranged in a direction perpendicular to the main extension plane below the first sensor and / or second sensor, so that the first sensor and / or the second sensor the metal-ceramic to be measured Substrate captured with a top view. It is also conceivable that a confocal microscopy method is used to carry out the first measurement step and / or the second measurement step.
• the metal-ceramic substrate for the transfer to the first method step, the irradiation and / or the second method step is conveyed along a conveying path, the metal-ceramic substrate during the Conveying is positioned along the conveyor path on a rotating carrier, in particular a rotary table.
• the first method step, the irradiation and the second method step can share a common reference system. It is also possible during the irradiation of the metal-ceramic substrate to subject further metal-ceramic substrates, which are also mounted on the rotating support, to the first or the second process step.
• the first measurement step and / or the second measurement step is carried out on one or more further metal ceramic substrates during the irradiation of the metal ceramic substrate.
• the service life that results from the steeling can advantageously be used to carry out the first measurement step and / or the second measurement step.
• the first and / or the second measurement step can be realized in a correspondingly time-saving manner.
• the respective treatments or measurements are carried out in such a way that scattered light generated, eg. B. when irradiating to create the structure, which does not interfere with other processes.
• potential steel channels for stray light are specifically blocked for this purpose or the wavelengths of the individual processes are coordinated with one another in such a way that the stray light of one process does not interfere with another.
• the first measurement step comprises image processing recognition and / or a focus position measurement and / or a substrate thickness determination.
• an edge region of the metal-ceramic substrate which preferably has a metal-free ceramic layer section, is recorded with the first measurement step.
• a scratch depth measurement and / or • includes a determination of the center of a structure created by the steeling.
• a depth of the structure created by the illumination can be determined by means of the scratch depth measurement, while the position of the generated structure between two adjacent metal-ceramic substrate sections can be determined by means of the centering determination.
• an iso-trench region or isolation trench region is provided between the two adjacent metal-ceramic substrate sections, i. H. an area that is free of metal, for example, by etching the metal layer.
• the etching flanks that delimit the isograve region or isolation trench region are preferably measured.
• the isograve region or isolation trench region with the etching flanks adjoining the isogrench region or isolation trench region on both sides in the scanning direction is measured more precisely than other regions of the metal-ceramic substrate.
• an ultra-short pulse laser source is used.
• the ultrashort pulse laser source generates pulses with a pulse duration of 0.1 ps to 100 ps, the pulses being emitted at a frequency of 350 to 650 kHz.
• pulses with a wavelength from the infrared range are used and the size of a laser light diameter measured parallel to the main extension plane on the ceramic layer is 20 to 80 ⁇ m, preferably less than 50 pm.
• the pulse energy of the pulses used is between 100 pJ and 300 pJ.
• a tapering, in particular v-shaped or wedge-shaped, predetermined breaking point is generated. It is conceivable that the position can be targeted by appropriate beam guidance, for example by lenses and dimensioning of the focusing is set in order to generate a wedge-shaped predetermined breaking point, which has a positive effect from the later breaking process when the metal-ceramic substrate sections are separated.
• Another object of the present invention is a plant for carrying out the method according to the invention, comprising
• a first sensor for performing the first measurement step and / or a second sensor for performing the second measurement step wherein the first sensor seen along the conveying path is arranged in front of the light source and / or the second sensor along the conveying path is arranged behind the light source.
• Another object of the present invention is a metal-ceramic substrate produced using the method according to the invention. All the features described for the process and their advantages can be transferred analogously to the metal-ceramic substrate and vice versa.
• the metal-ceramic substrate produced has a predetermined breaking point between two adjacent metal-ceramic substrate sections.
• FIG. 2 method for processing metal-ceramic substrates according to a preferred embodiment of the present invention
• FIG. 3 shows a schematic illustration of an exemplary first measurement step for the method according to a further preferred embodiment of the present invention
• FIG. 4 shows a schematic illustration of an exemplary second measurement step for the method according to a further preferred embodiment of the present invention
• FIG. 1 schematically shows part of a plant for the production and processing of metal-ceramic substrates 1.
• Such metal-ceramic substrates 1 preferably serve as carriers for electronic or electrical components which can be connected to the metal-ceramic substrate 1.
• the essential components of such a metal-ceramic substrate 1 are a ceramic layer 11 extending along a main extension plane HSE and a metal layer 12 bonded to the ceramic layer 11.
• the ceramic layer 11 is made from at least one material comprising a ceramic .
• the metal layer 12 and the ceramic layer 11 are arranged one above the other along a stacking direction perpendicular to the main extension plane HSE and, in a manufactured state, are cohesively connected to one another via a connection surface.
• the metal layer 12 is then preferably structured to form conductor tracks or connection points for the electrical components. This structuring is etched into the metal layer 12, for example. In advance however, a permanent bond, in particular a material bond, is formed between the metal layer 12 and the ceramic layer 11.
• the system for producing the metal-ceramic substrate 1 comprises a furnace in which a pre-composite of metal and ceramic is heated and the bond is thus achieved.
• the metal layer 12 is a metal layer 12 made of copper, the metal layer 12 and the ceramic layer 11 being connected to one another by means of a DCB (Direct Copper Bonding) connection method.
• the ceramic layer 11 and the metal layer 12 can also be connected to one another by means of an active soldering process (ABM).
• FIG. 1 shows in particular a part of a plant for the production and processing of metal-ceramic substrates 1, which is identified in more detail in FIGS. 3 and 4, which is located downstream of the connection of the metal layer 12 to the ceramic layer 11.
• a plurality of metal-ceramic substrate sections 20 are separated from one another by separation.
• a predetermined breaking point 5 is realized in the metal-ceramic substrate 1 for separation into the several metal-ceramic substrate sections 20 which are separated from one another.
• the metal-ceramic substrate 1 is irradiated with a laser light source.
• a structure, in particular a recess, emergency or a crack or groove, is produced in the ceramic layer 11 by means of the laser light source.
• the cutout preferably forms a groove, in particular a V-shaped groove, the longitudinal extent of which defines a predetermined breaking point course.
• the course of the predetermined breaking point is also conceivable for the course of the predetermined breaking point to be formed by the formation of a plurality of holes or slots arranged one behind the other.
• a pulse laser source in particular an ultra-short pulse laser source, is preferably used as the light source for processing the metal-ceramic substrate 1.
• the ultrashort pulse laser source generates pulses with a pulse duration of 0.1 ps to 100 ps, the pulses being emitted with a frequency of 350 to 650 kHz.
• the predetermined breaking point 5 is generated in an iso-trench region or isolation trench region 40 between two metal-ceramic substrate sections 20, ie in a region on a first side 31 of the ceramic layer 11 facing the light source, which is preferably free of metallization or Is metallization layer 12. It is preferably provided that a metal layer 12 is provided on the second side 32 opposite the first side 31, which is preferably continuous, that is to say is free of structuring.
• the individual metal-ceramic substrate sections 20 can be broken off at the respective predetermined breaking point 5, ie. H. along the predetermined breaking line, separate or separate from each other.
• metal-ceramic substrate 1 In order to reduce the scrap on metal-ceramic substrates 1 or metal-ceramic substrate sections 20, which are destroyed or damaged, for example, during breaking, it has proven to be advantageous to metal-ceramic substrate 1 before breaking or separating, to undergo a first measurement step and / or a second measurement step.
• the metal-ceramic substrate 1 is conveyed along a conveying path F and the metal-ceramic substrate 1 in time before the irradiation with the laser light source, the first measurement step and in time after the irradiation is subjected to the second measurement step.
• the first measurement step is preferably carried out immediately before and / or the second measurement step is carried out immediately after the irradiation.
• first and / or second measurement step is preferably a non-destructive optical measurement method with which the surface topography of the metal-ceramic substrate 1 can be determined.
• the individual metal-ceramic substrates 1 in the system are fed to a central area ZB via an insertion area EB and removed again from the central area ZB via a removal area AB.
• the lead-in area EB, the central area ZB and / or the lead-out area AB preferably each comprise a housing 25.
• the housing 25 is particularly advantageous for the central area ZB, since this can prevent stray light from leaving the central area ZB or can get into the central area ZB.
• the first measurement step, the second measurement step and the irradiation preferably take place in the central area ZB. Furthermore, it is provided that a user 3 of the system receives information about the first measurement step, the second measurement step and / or the irradiation via a display device 4 or a display.
• FIG. 2 shows a schematic representation of the method for processing metal-ceramic substrates 1.
• a rotating carrier 55 in particular a rotary table, is used here to convey the metal-ceramic substrate 1.
• a first processing region 61 for the first measurement step a second processing region 62 for irradiation and a third processing region 63 for the second method step are arranged in succession along the circumference of the carrier 55.
• the carrier 55 rotates, the metal-ceramic substrates 1 are thus successively transported from the loading area 65 to the first processing area 61, from the first processing area 62 to the second processing area 63 and from the second processing area 63 to the unloading area 65.
• the transport along the conveying path F by means of the rotating carrier 55 does not take place continuously, but sequentially, ie the rotating carrier 55 is moved further so that with each rotation the next station, ie the next processing area 61, 62, 63, 65, is reached is, and then a pause of the conveying movement for performing the first measurement step, the second measurement step and / or the irradiation is carried out.
• the carrier 55 makes a rotation of 90 ° in each case for the transport between the stations and then the rotary movement is interrupted, so that the first measurement step, the irradiation and / or the second measurement step can be carried out and then carried out at the same time - walked by a further 90 ° rotation, the respective metal-ceramic substrates 1 are fed to the next processing area 61, 62, 63 and 65. Furthermore, it is provided that a plurality of metal-ceramic substrates 1, in particular metal-ceramic substrates 1 arranged next to one another, are processed in each of the processing areas 61, 62, 63 and 65.
• the irradiation, the first method step, the second method step, the unloading and / or loading is carried out.
• the first process step, the second process step, the loading, the unloading and / or the irradiation are preferably carried out at least partially at the same time, ie during the irradiation of the metal-ceramic substrate 1 or of several metal-ceramic substrates 1 in the second processing region 62, the first measurement method and / or the second measurement method are carried out simultaneously on further metal-ceramic substrates 1 in the first processing area 61 and / or in the third processing area 63.
• the loading and / or unloading area 65, the first processing area 61, the second processing area 62 and the third processing area 63 are arranged equidistantly along the circumference of the carrier 55.
• the first processing area 61 and the third processing area 63 lie opposite one another.
• the first measurement step is an IMAGE PROCESSING detection, a focus position measurement and / or a determination of the layer thickness measurement.
• the current position of the metal-ceramic substrate 1 to be irradiated in particular the position of the ceramic layer 11 or the first side 31 of the ceramic layer 11, can advantageously be determined immediately prior to the irradiation, in order to determine this position or orientation subsequent irradiation to take into account in an advantageous manner.
• the focus position measurement is used in particular to identify the level of the ceramic layer 11, so that when the radiation is subsequently irradiated, the light beam can be focused in a desired manner in accordance with this level.
• the surface topography is determined before the irradiation by means of a first sensor 41 and the surface topography after the irradiation is determined by means of a second sensor 42.
• the first sensor 41 and / or the second sensor 42 can be of the same type or identical. To determine the surface topography, it is preferably provided that the first sensor 41 and / or the second sensor 42 each have a distance A between an observed surface area on the metal-ceramic substrate 1 and the first sensor 41 or second sensor 42 certainly.
• the surface topography can be recorded by an offset along a scanning direction SR and repeated recording of the distances A or a wide recording area.
• the first sensor 41 and / or the second sensor 42 can, for example, detect distances A along a projection direction running perpendicular to the main extension plane HSE or obliquely to this projection direction, the obliquely detected distances A preferably by a correction to those along the projection direction certain distances A can be adjusted accordingly.
• the first sensor 41 and / or second sensor 42 is a ConoPoint10-HD sensor from Optimet®.
• a lens 73 in particular with a focal length between 30 and 70 mm, preferably of 40 mm, is used to guide the light used to determine the distances.
• the lens 73 is there arranged between the first sensor 41 and the second sensor 42 and the area to be recorded.
• the focus position measurement and layer thickness measurement as the first measurement method are shown by way of example in FIG. 3.
• the distance A of the ceramic layer 11 relative to a substrate holder 60 is determined by means of a first sensor 41.
• a continuous metal layer 12 is provided on the second side 32 of the ceramic layer 11, which also influences the position of the ceramic layer 11.
• the first sensor 41 is arranged such that a metal-free ceramic layer section 13, in particular at the edge of the metal-ceramic substrate 1, is detected together with the substrate holder 60.
• the position of the first side 31 of the ceramic layer 11 relative to the substrate holder 60 can then be determined in a first measurement by using the substrate holder 60 as a reference and from a distance A between the first sensor 41 and the substrate holder 60 and a distance A between - between the first sensor 41 and the first side 31 of the ceramic layer 11 forms a difference which corresponds to a primary distance A1 between the first side 31 and the substrate holder 60.
• the distance A between the metal layer 12 on the first side 31 of the ceramic layer 11 and the first sensor 41 it is also possible, in an analogous manner, to provide information about a secondary distance A2 between the reference or To obtain zero position serving substrate holder 60 and a side of the metal layer 12 facing away from the ceramic layer 11, which is arranged on the first side 31 of the ceramic layer 11. It is thus possible to determine, in addition to the information about the position of the ceramic layer 11, information about a layer thickness of the metal layer 12 which is bonded to the first side 31 of the ceramic layer 11 and about an entire substrate thickness of the metal-ceramic substrate 1 ,
• a depth of the depth created by the irradiation is determined by means of a scratch depth measurement Structure or by means of determination of the central position determines the position of the structure between two metal-ceramic substrate sections 20 which are separated from one another after breaking.
• it is therefore a measurement of a structure generated within the iso-trench region or isolation trench region 40 by the irradiation, which structure forms the predetermined breaking point 5.
• the second sensor 42 is preferably guided over the metal-ceramic substrate 1 in a scanning direction SR running parallel to the main extension plane HSE and by continuously recording the distances A of the second sensor 42 from the image area detected by the second sensor 42 above the metal surface.
• Ceramic substrate 1 detects the surface topography, preferably of each of the metal-ceramic substrate sections 20. Furthermore, it is preferably provided that the metal-ceramic substrates 1 are measured completely by means of the second method step, or the metal-ceramic substrate section 20 is only scanned in strips. For this purpose, at least one measuring point is recorded from each metal-ceramic substrate section 20 which will later be provided individually.
• FIG. 1 An example of a second measurement step is shown in FIG. It is provided that the surface topography of two metal-ceramic substrate sections 20 arranged side by side in the metal-ceramic substrate 1 is recorded, in particular the iso-trench region or isolation trench region 40 and etching edges 57 in the scanning direction SR that are opposite one another second measurement step are recorded, preferably completely recorded.
• the distance between the mutually opposite metal layers 12 of the adjacent metal-ceramic substrate sections 20 can then be inferred from the course of the etching flanks 57 or the ceramic layer 11 in the isograve region or isolation trench region 40.
• a width 43 of the isograve region or isolation trench region 40 can be determined by this distance.
• FIG. 5 shows a general structure for measuring the distance A between a sensor 41, 42 and a surface 74.
• the first and / or second measurement step can be carried out, for example.
• the first sensor 41 and / or second sensor 42 is arranged over the surface 74 to be examined.
• a lens 73 in particular a lens 73, is used to guide a beam 76, in particular for focusing, between the surface 74 and the first sensor 41 and / or second sensor 42 Microscope lens, arranged.
• a measuring laser beam 75 is coupled into the beam path 76 or a light is coupled out to a camera 71, which can preferably also serve to illuminate the surface 74, by means of a dichroic mirror 72 in each case.

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• Physics & Mathematics (AREA)
• Engineering & Computer Science (AREA)
• Optics & Photonics (AREA)
• Mechanical Engineering (AREA)
• Plasma & Fusion (AREA)
• General Physics & Mathematics (AREA)
• Laser Beam Processing (AREA)
• Length Measuring Devices By Optical Means (AREA)
• Structure Of Printed Boards (AREA)

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• 2018
  • 2018-08-08 DE DE102018119313.0A patent/DE102018119313B4/de active Active
• 2019
  • 2019-07-26 EP EP19746082.7A patent/EP3833504A1/de active Pending
  • 2019-07-26 JP JP2021506405A patent/JP7073578B2/ja active Active
  • 2019-07-26 WO PCT/EP2019/070257 patent/WO2020030450A1/de unknown
  • 2019-07-26 US US17/266,017 patent/US20210379700A1/en active Pending
  • 2019-07-26 CN CN201980052307.7A patent/CN112584961B/zh active Active
  • 2019-07-26 KR KR1020217002544A patent/KR102494448B1/ko active IP Right Grant

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