EP3799440A1 - Schallwandlereinheit zum erzeugen und/oder erfassen von schallwellen im hörbaren wellenlängenbereich und/oder im ultraschallbereich - Google Patents

Schallwandlereinheit zum erzeugen und/oder erfassen von schallwellen im hörbaren wellenlängenbereich und/oder im ultraschallbereich Download PDF

Info

Publication number
EP3799440A1
EP3799440A1 EP20197821.0A EP20197821A EP3799440A1 EP 3799440 A1 EP3799440 A1 EP 3799440A1 EP 20197821 A EP20197821 A EP 20197821A EP 3799440 A1 EP3799440 A1 EP 3799440A1
Authority
EP
European Patent Office
Prior art keywords
sound transducer
circuit board
transducer
mems
sound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP20197821.0A
Other languages
German (de)
English (en)
French (fr)
Inventor
Andrea Rusconi Clerici Beltrami
Ferruccio Bottoni
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
USound GmbH
Original Assignee
USound GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by USound GmbH filed Critical USound GmbH
Publication of EP3799440A1 publication Critical patent/EP3799440A1/de
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1091—Details not provided for in groups H04R1/1008 - H04R1/1083
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1016—Earpieces of the intra-aural type
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1058—Manufacture or assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1058—Manufacture or assembly
    • H04R1/1075—Mountings of transducers in earphones or headphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/10—Details of earpieces, attachments therefor, earphones or monophonic headphones covered by H04R1/10 but not provided for in any of its subgroups
    • H04R2201/107—Monophonic and stereophonic headphones with microphone for two-way hands free communication
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2217/00—Details of magnetostrictive, piezoelectric, or electrostrictive transducers covered by H04R15/00 or H04R17/00 but not provided for in any of their subgroups
    • H04R2217/03—Parametric transducers where sound is generated or captured by the acoustic demodulation of amplitude modulated ultrasonic waves
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2400/00—Loudspeakers
    • H04R2400/01—Transducers used as a loudspeaker to generate sound aswell as a microphone to detect sound
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2420/00—Details of connection covered by H04R, not provided for in its groups

Definitions

  • the present invention relates to a sound transducer unit, in particular for in-ear headphones, for generating and / or detecting sound waves in the audible wavelength range and / or in the ultrasonic range with a circuit board and at least one MEMS sound transducer arranged thereon, with at least one connection element of the carrier element is electrically conductively connected to at least one contact element of the MEMS sound transducer.
  • the object of the present invention is therefore to create a sound transducer unit, the manufacturing method of which is simplified.
  • a sound transducer unit is proposed for generating and / or detecting sound waves in the audible wavelength range and / or in the ultrasonic range.
  • the sound transducer unit can thus be operated as a loudspeaker and / or as a microphone.
  • the sound waves can be used as distance or proximity sensors, for example.
  • the sound transducer unit can also be used, for example, for in-ear headphones which are at least partially arranged in an auditory canal will.
  • the sound transducer unit can also be used for other sound generation units, such as smartphones, radios, televisions, PCs, etc.
  • the sound transducer unit comprises a printed circuit board and at least one MEMS sound transducer arranged thereon.
  • the circuit board can have electrical lines or conductor tracks in order to carry electrical voltages, electrical currents and / or electrical signals.
  • the MEMS sound transducer is also used to generate and / or record sound waves in the audible wavelength range and / or in the ultrasonic range.
  • the circuit board is a carrier for the MEMS sound transducer.
  • the circuit board has at least one connection element and the MEMS sound transducer has at least one contact element. Furthermore, the at least one connection element is electrically conductively connected to the at least one contact element. A connection element is connected to a contact element if there are several of the two.
  • the MEMS sound transducer is designed as a surface-mountable component which is connected to the circuit board by means of surface mounting. Since the MEMS sound transducer is designed as a surface-mountable component, it can be arranged on the circuit board by means of surface mounting. This is an assembly process that can be easily automated. The production of the sound transducer unit is thereby simplified and accelerated.
  • connection element and the contact element are electrically connected to one another by means of an integral connection.
  • the connection element and the contact element can also be soldered to one another, so that a soldered connection is formed. This creates a stable, electrically conductive connection.
  • the material connection keep the MEMS transducer independently or alone on the circuit board.
  • the MEMS sound transducer has a membrane unit which is coupled to a transducer element of the MEMS sound transducer.
  • a transducer element which can include a piezo actuator and / or a piezoelectric layer, for example.
  • deflections can be generated and / or detected. These deflections are transmitted to the membrane unit through the coupling, for example through a coupling element.
  • the membrane unit then generates sound.
  • the membrane unit can, however, also convert sound waves into deflections, which are transmitted to the transducer element.
  • the transducer element can generate the deflections from an electrical signal and / or the electrical signals from deflections.
  • the membrane unit or a membrane of the membrane unit is advantageously formed from a heat-resistant membrane material.
  • Polyimides, polyamides or silicones, for example, can be used as the heat-resistant membrane material. If the MEMS sound transducer is soldered onto the circuit board, the MEMS sound transducer and thus also the membrane or the membrane unit can heat up to or even more than 300 ° C. Damage can be prevented with the aid of the heat-resistant membrane material.
  • the MEMS sound transducer comprises a transducer support, the MEMS sound transducer being arranged on the circuit board by means of the transducer support.
  • the transducer carrier can be a carrier substrate.
  • the converter element, in particular the piezo actuator and / or the piezoelectric layer, can also be arranged on the converter carrier. Additionally or alternatively, the membrane unit can be arranged on the transducer carrier.
  • the transducer carrier has a first through channel. A pressure that arises when the membrane unit moves or when it is deflected can be compensated for by the first through-channel.
  • the at least one contact element is designed as a contact surface. This allows the MEMS transducer to be constructed more easily.
  • the at least one contact element is arranged on the converter carrier. This means that further components are dispensed with, so that the MEMS sound transducer or the sound transducer unit has a compact design.
  • the converter carrier can have the at least one contact surface, which is preferably arranged on an outer or peripheral side of the converter carrier.
  • the converter support has electrical lines for the converter element.
  • the electrical signals can be routed to the transducer element or be routed away from it.
  • the electrical lines can run on an outer surface and / or in an interior of the transducer carrier.
  • the circuit board has a second through channel.
  • This second through-channel can be coaxial and / or congruent with the first through-channel of the MEMS sound transducer.
  • the pressure that is formed when the membrane unit is deflected can thus be equalized through the first and second through-channels.
  • the first and second through-channels together form a compensation channel.
  • the first and second through-channels together also form a connection to a rear volume of the sound transducer unit, the acoustic properties of the sound transducer unit being determined with the aid of the rear volume.
  • the circuit board has a component side facing the MEMS sound transducer, on which the MEMS sound transducer is placed in a contact area, so that the contact elements make contact with the connection elements.
  • the circuit board can already have the contact areas, so that it is very easy to manufacture the sound transducer unit in large numbers.
  • the contact area has the contact elements.
  • the sound transducer unit has a circuit board on which the circuit board with the MEMS sound transducer is arranged.
  • the circuit board can be made larger than the circuit board.
  • the unit of printed circuit board and MEMS sound transducer is arranged on the board.
  • the circuit board also includes further electrical components that are required for the operation of the sound transducer unit.
  • the circuit board can comprise a control unit, an, in particular wireless, interface, an energy unit, a storage unit, sensors and / or an energy interface.
  • the circuit board can have conductor tracks.
  • the circuit board can advantageously be arranged on the board by means of spacers.
  • a single spacer can also suffice.
  • the at least one spacer is thus arranged between the circuit board and the circuit board.
  • At least one electrical plug connection is arranged between the printed circuit board and the circuit board, so that electrical signals can be routed to the MEMS sound transducer and / or can be routed away from it.
  • At least one spacer can also electrically connect the printed circuit board and the circuit board for the exchange of electrical signals.
  • the spacer or spacers can be electrically conductive.
  • conductor tracks can also be arranged in at least one spacer, so that a plurality of conductors are passed through one spacer.
  • the sound transducer unit has a transducer housing in which at least the MEMS sound transducer and / or the circuit board are arranged. With the help of the transducer housing, at least the MEMS sound transducer can be protected from dirt and damage.
  • the converter housing has a first coupling area for coupling an ear element to the converter housing.
  • the ear element can be made of a flexible material, for example rubber.
  • the ear element can be provided so that it is at least partially pushed into an auditory canal when the sound transducer unit is used for in-ear headphones.
  • the ear element or also earplugs can adapt to the auditory canal.
  • the converter housing has a second coupling area for coupling a headphone unit to the converter housing.
  • the headphone unit can have a battery or an accumulator, for example.
  • the converter housing has an exit opening for sound waves. If the converter housing or the sound converter unit for When using in-ear headphones, the outlet opening is directed in the direction of the auditory canal or the eardrum. The sound waves are thus guided directly to the ear.
  • the transducer housing has a front volume which is arranged between the outlet opening and the MEMS sound transducer.
  • the converter housing has a dust protection and / or a moisture protection.
  • the dust protection can be arranged in the area of the outlet opening and / or the moisture protection in the area between the front volume and the MEMS sound transducer. This can prevent the ingress of dust and / or moisture.
  • the dust and / or moisture protection can be glued to the converter housing.
  • the sound transducer unit has at least one second MEMS sound transducer, one of the two MEMS sound transducers being operable as a loudspeaker and the other MEMS sound transducer being operable as a microphone.
  • the two MEMS sound transducers being operable as a loudspeaker
  • the other MEMS sound transducer being operable as a microphone.
  • both MEMS sound transducers are arranged next to one another on the circuit board.
  • the two MEMS sound transducers can be arranged in a space-saving manner.
  • one of the two MEMS sound transducers can be arranged on the other MEMS sound transducer.
  • the MEMS sound transducer which is operated as a microphone
  • the MEMS sound transducer which is operated as a loudspeaker.
  • the circuit board has a pressure compensation opening.
  • the pressure compensation opening can be arranged next to the at least one MEMS sound transducer.
  • the front and rear volumes are also connected to one another with the aid of the pressure equalization opening. A pressure between the front and rear volume is thereby equalized.
  • a dam arrangement is arranged around the pressure equalization opening. As a result, it can be prevented that adhesive, which is used, for example, to glue the printed circuit board to the converter housing, can get into the pressure compensation opening and thereby close it.
  • a method for producing a sound transducer unit, in particular for in-ear headphones, for generating and / or detecting sound waves in the audible wavelength range and / or in the ultrasonic range.
  • the sound transducer unit can be designed in accordance with at least one feature of the preceding and / or following description.
  • At least one MEMS sound transducer is arranged on a printed circuit board.
  • At least one connection element of the MEMS sound transducer is electrically connected to at least one contact element of the circuit board. This creates an electrical connection between the printed circuit board and the MEMS sound transducer.
  • the at least one MEMS sound transducer is a surface-mountable component which is connected to the circuit board by means of surface mounting.
  • the MEMS sound transducer can be automatically placed on the circuit board by means of surface mounting.
  • the electrical connection of the circuit board with the MEMS sound transducer can also be carried out in an automated manner. As a result, the manufacturing process can be simplified.
  • a sound generating unit with a sound transducer unit for generating and / or detecting sound waves in the audible wavelength range and / or in the ultrasonic range is also proposed.
  • the sound unit can be, for example, in-ear headphones, a smartphone, a telephone and / or a music system.
  • the sound generating unit can also be another mobile device.
  • the sound transducer unit is designed according to at least one feature of the preceding and / or following description. Additionally or alternatively, the sound transducer unit can be designed in accordance with at least one feature of the preceding and / or following description.
  • the sound generating unit has an ear element which is arranged in a first coupling area of the sound transducer unit.
  • the ear element is, for example, an earplug.
  • the ear element is designed to be flexible, for example it is also rubber, so that it can adapt to an auditory canal when it is inserted into it.
  • the sound generating unit is an in-ear headphone.
  • the sound generating unit has a headphone unit which is arranged in a second coupling area of the sound transducer unit.
  • the headphone unit can, for example, be a battery and / or have an accumulator.
  • the sound generation unit here is also an in-ear headphone.
  • Figure 1 shows a perspective, schematic view of a sound transducer unit 1 with a printed circuit board 2 and a MEMS sound transducer 3.
  • MEMS sound transducer 3 With the aid of the MEMS sound transducer 3, sound waves can be generated and / or recorded.
  • the MEMS sound transducer 3 or the sound transducer unit 1 is operated as a loudspeaker. Additionally or alternatively, the MEMS sound transducer 3 or the sound transducer unit 1 can also be operated as a microphone, so that the sound waves are recorded.
  • the sound transducer unit 1 can also be used for a sound generation unit 41, which is shown in FIG Figure 7 is designed as in-ear headphones 41, for example.
  • the printed circuit board 2 also has at least one connection element 4 in the present exemplary embodiment.
  • connection element 4 can, as shown here, be designed as a connection surface.
  • the connection element 4, in particular the connection surface, is arranged on and / or on a component side 7.
  • the printed circuit board 2 also has an underside 8 opposite the component side 7.
  • the MEMS sound transducer 3 also has at least one contact element 5, which is designed here as a contact foot.
  • the contact elements 5 are arranged in such a way that in each case a contact element 5 lies on a connection element 4 when the MEMS sound transducer 3 is arranged on the component side 7.
  • the MEMS sound transducer 3 is designed as a surface-mountable component which is connected to the printed circuit board 2 by means of surface mounting.
  • a connection element 4 is assigned to each contact element 5, so that these two can form an electrical connection.
  • a contact element 5 is connected to the associated connection element 4 by means of a soldered connection 6, so that the electrical connection is established.
  • soldered connection 6 is only shown between a contact element 5 and a connection element 4.
  • a soldered connection 6 can exist between all contact elements 5 and the respective associated connection element 4.
  • another material connection can also be formed between the connection element 4 and the contact element 5.
  • the connection is an electrical connection.
  • the MEMS sound transducer 3 can be connected to the circuit board 2 in an automated manner and quickly.
  • the circuit board 2 also has a plurality of conductor tracks 9, again only one conductor track 9 being provided with a reference symbol for the sake of clarity.
  • the conductor tracks 9 are electrically connected to the connection elements 4.
  • the conductor tracks 9 are also shown only schematically.
  • the conductor tracks 9 can converge and / or run parallel. Furthermore, the conductor tracks 9 can run through the circuit board 2 onto the underside 8.
  • the circuit board 2 also has a contact area 48 in which the MEMS sound transducer 3 is or can be arranged.
  • the connection elements 4 are preferably arranged in the contact area.
  • Figure 2 shows a perspective, schematic view of a sound transducer unit 1 with a circuit board 2 and a MEMS sound transducer 3 on a circuit board 10.
  • the circuit board 2 and the MEMS sound transducer 3 arranged thereon are arranged here on the circuit board 10.
  • the circuit board 10 is larger than the circuit board 2. Further components which are required for the operation of the sound transducer unit 1 can thus be arranged on the circuit board 10.
  • the platinum 10 is also a motherboard.
  • the circuit board 2 is arranged on the circuit board 10 by means of spacers 11. These space the printed circuit board 2 from the circuit board 10.
  • the board 10 has a board top 14 and an opposite board bottom 15.
  • the circuit board 2 is arranged on the upper side 14 of the circuit board.
  • Electronic components 12 are also arranged on the upper side 14 of the circuit board, although for the sake of clarity not all electronic components 12 are provided with a reference number.
  • the electronic components 12 can be, for example, control units, memory units, resistors, coils, capacitors, radio modules and / or sensors.
  • the circuit board 10 has conductor tracks 13 shown by way of example. With the aid of the conductor tracks 13, all components are electrically connected to one another. Additionally or alternatively, an electronic component 12, which is shown here schematically is shown, be arranged on the underside of the circuit board 15.
  • the circuit board 10 can also be a PCB (printed circuit board or printed circuit board).
  • the circuit board 2 and the circuit board 10 are round and arranged coaxially to one another.
  • the present exemplary embodiment has a plug connection 47.
  • the electrical signals can also be passed through the spacers 11.
  • at least one electrical supply voltage can be fed to the MEMS sound transducer 3 or other components through the spacers.
  • Figures 3a and 3b show the sound transducer unit 1 with a transducer housing 16 in a side sectional view ( Fig. 3a ) and in a perspective view ( Figure 3b ). In the sectional view of the Figure 3a the cut surfaces are not shown hatched.
  • At least the MEMS sound transducer 3 and / or the printed circuit board 2 are arranged in the transducer housing 16, so that at least the MEMS sound transducer 3 is protected from dirt and damage.
  • circuit board 10 is also shown, the circuit board 2 with the spacers 11 shown in FIG. 2, but not shown here, being arranged on the circuit board 10.
  • the converter housing 16 has an outlet opening 21 through which the sound waves can exit from the converter housing 16 and / or enter the converter housing 16. If the sound transducer unit 1 is used for in-ear headphones, the outlet opening 21 faces the ear when the in-ear headphones are worn by a wearer.
  • the transducer housing 16 On the side of the transducer housing 16 opposite to the outlet opening 21 there is an insertion opening 26 through which the MEMS sound transducer 3 and / or the circuit board 2 can be inserted into the transducer housing 16 or an interior 27 of the transducer housing 16.
  • the interior space 27 is delimited by the converter housing 16 and the outlet opening 21 and the insertion opening 26.
  • the circuit board 10 is designed to be larger than the insertion opening 26.
  • the circuit board 10 closes the insertion opening 26.
  • the converter housing 16 also has a first base arrangement 22 on which the circuit board 10 can be placed.
  • the first base arrangement 22 borders the insertion opening 26.
  • the converter housing 16 also has a second base arrangement 23 which is arranged in the area of the interior space 27 and on which the printed circuit board 2 can be placed.
  • the converter housing 16 also has a third base arrangement 24 which is arranged in the area of the interior space 27 and on which a Moisture protection 18 can be put on.
  • the moisture protection 18 is arranged here between the outlet opening 21 and the MEMS sound transducer 3, so that the MEMS sound transducer 3 is protected from moisture that can enter through the outlet opening 21.
  • the moisture protection 18 can, for example, be a membrane which retains moisture but allows sound waves to pass through.
  • the converter housing 16 also has a fourth base arrangement 25 on which a dust cover 17 can be placed. With the aid of the dust protector 17, dust and / or dirt can be prevented from getting into the interior space 27 of the converter housing 16.
  • the MEMS sound transducer 3 and / or the circuit board 2 are arranged in the transducer housing 16, they divide the interior space 27 into a front volume 19 and a rear volume 20.
  • the front volume 19 is arranged between the outlet opening 21 and the MEMS sound transducer 3.
  • the rear volume 20 is arranged between the MEMS sound transducer 3 and the insertion opening 26 or the circuit board 10.
  • the spacers 11, not shown here, are at least partially arranged in the rear volume 20.
  • the converter housing 16 is designed to be rotationally symmetrical. Accordingly, the outlet opening 21, the dust protection 17, the circuit board 10, the circuit board 2 and / or the four base arrangements 22-25 are round. The interior 27 is also rotationally symmetrical.
  • the converter housing 16 also has a first coupling area 28.
  • An ear element 42 described later, can be arranged in the first coupling region 28.
  • the ear element 42 is advantageously flexible and / or made of rubber, so that it can be inserted into an auditory canal of the wearer, adapting to the inner contour of the auditory canal. With help of the ear element 42, wearing comfort of the in-ear headphones 41 is improved if the sound transducer unit 1 is used for this.
  • the converter housing 16 also has a first projection 30, with which it is prevented that the ear element 42 arranged in the first coupling region 28 can slip from the converter housing 16.
  • the first projection 30 is adjacent to the first coupling region 28.
  • the converter housing 16 also has a second coupling area 29.
  • a headphone unit 43 which will be described later, can be arranged in the second coupling area 29.
  • the headphone unit 43 comprises the elements that are still required in addition to the sound transducer unit 1 when the sound transducer unit 1 is used in in-ear headphones 41.
  • Such elements are, for example, an energy store 44, a charging socket for charging the energy store 44 and / or additional sensors 45.
  • the converter housing 16 also has a second projection 31, with which it is prevented that the headphone unit 43 arranged in the second coupling area 29 can slip from the converter housing 16.
  • the second projection 31 is adjacent to the second coupling region 29.
  • the first and / or the second coupling area 28, 29 is also cylindrical.
  • Figure 4 shows a side sectional view of a sound transducer unit 1 with a pressure compensation opening 32. The cut surfaces are again not shown hatched.
  • the circuit board 2 and / or the MEMS sound transducer 3 subdivide the interior space 27 into the front volume 19 and the rear volume 20.
  • the front volume 19 extends from the circuit board 2 and / or the MEMS sound transducer 3 to the outlet opening 21, i.e. preferably also through the moisture protection 18.
  • the pressure compensation opening 32 can have a diameter which is smaller than 0.5 mm. With such an order of magnitude, the pressure equalization opening 32 is essentially impermeable to sound waves. However, the pressure difference can even out.
  • the pressure compensation opening 32 is arranged here in the circuit board 2, several pressure compensation openings 32 also being conceivable.
  • the pressure equalization openings 32 are surrounded by a dam arrangement 33. With the aid of the dam arrangement 33, it is possible to prevent adhesive from getting into the pressure equalization openings 32 when the printed circuit board 2 is glued to the converter housing 16.
  • FIG. 5 shows a sectional view of the MEMS sound transducer 3 with a section of the circuit board 2.
  • the MEMS sound transducer 3 is shown in more detail.
  • the MEMS sound transducer 3 comprises a transducer carrier 34, which can be designed as a transducer substrate.
  • the MEMS sound transducer 3 sits on the circuit board 2 by means of the transducer carrier 34.
  • a converter element 35 is arranged on the converter support 34 by means of foot elements 38.
  • the transducer element 35 can comprise at least one piezo actuator and / or at least one piezoelectric layer, so that the transducer element 35 can convert electrical signals into deflections and / or deflections into electrical signals.
  • the MEMS sound transducer 3 is operated as a loudspeaker.
  • the MEMS sound transducer 3 is operated as a microphone.
  • the electrical signals can be audio signals.
  • the MEMS sound transducer 3 further comprises a membrane unit 37, which is coupled to the transducer element 35 by means of a coupling element 36. Deflections can thus be exchanged between the membrane unit 37 and the transducer element.
  • the air arranged above it can be caused to vibrate by the deflections, so that sound waves are generated.
  • the MEMS sound transducer 3 is therefore operated as a loudspeaker.
  • sound waves can also set the membrane unit 37 in vibration, which result in deflections of the membrane unit 37.
  • the deflections are converted into electrical signals by the transducer element 35.
  • the MEMS sound transducer 3 is consequently operated as a microphone.
  • the audio signals can be routed to the MEMS sound transducer 3 and / or routed away from it.
  • the said deflections have a direction along a stroke axis H.
  • the transducer element 35 and the membrane unit 37 are also deflected along the stroke axis H.
  • a first through channel 39 is also arranged in the transducer carrier 34.
  • a second through channel 40 is arranged in the printed circuit board 2. Both through channels 39, 40 are arranged coaxially and congruently with one another. Both through channels 39, 40 form a compensation channel.
  • the membrane unit 37 which is preferably closed, deflects along the stroke axis H, an alternating negative and positive pressure arises on the circuit board 2 facing in the area of the transducer element 35 and / or the membrane unit 37. However, this hinders the movement of the membrane unit 37.
  • With the aid of the first and second through channels 39, 40 a connection to the rear volume 20 can be established so that the negative and positive pressure are weakened and the membrane unit 37 can be deflected better.
  • the two through channels 39, 40 serve to improve the acoustics of the MEMS sound transducer 3.
  • the at least one contact element 5 can be arranged on the transducer carrier 34, which can preferably also be designed as a contact surface.
  • the at least one contact element 5 can be arranged on an outer or circumferential side of the MEMS sound transducer 3 or of the transducer carrier 34.
  • the MEMS sound transducer 3 can be soldered directly onto the circuit board 2 through the at least one contact surface.
  • the MEMS sound transducer 3 or the transducer carrier 34 preferably has several Contact surfaces which are arranged to match the connection elements 4.
  • FIGS. 6a and 6b show a sound transducer unit 1, each with a second MEMS sound transducer 3b in two different configurations.
  • the sound transducer unit 1 has two MEMS sound transducers 3a, 3b, one MEMS sound transducer 3a, 3b can be operated as a loudspeaker and the other MEMS sound transducer 3a, 3b can be operated as a microphone. As a result, the sound transducer unit 1 can be operated, in particular simultaneously, as a loudspeaker and as a microphone.
  • a MEMS sound transducer 3b is arranged on the other MEMS sound transducer 3a. This is advantageous when there is hardly any space on the circuit board 2.
  • Figure 7 shows a side sectional view of at least partially shown in-ear headphones 41.
  • the sound transducer unit 1 is mainly used as a loudspeaker.
  • the in-ear headphones 41 shown here are an example of a sound generating unit 41.
  • the sound transducer unit 1 can, for example, also be arranged in another device, such as a smartphone, PC, etc., for example.
  • the ear element 42 is arranged in the first coupling region 28 of the converter housing 16.
  • the ear element 42 forms a form-fitting connection with the first coupling region 28 and the first projection 30, so that the ear element 42 cannot slip off the converter housing 16.
  • the ear element 42 also has an ear element opening 46 which, according to the present exemplary embodiment, is coaxial with the outlet opening 21.
  • the headphone unit 43 is coupled to the converter housing 16.
  • the headphone unit 43 forms a form-fitting connection with the second coupling area 29 and the second projection 31, so that the headphone unit 43 cannot slip off the converter housing 16.
  • the headphone unit 43 has, for example, an energy store 44 and a further sensor 45.
  • the headphone unit 43 can also have further components for the in-ear headphones 41.
  • the sound transducer unit 1 is described here in connection with the in-ear headphones 41, so that the sound transducer unit 1 can also be used for another mobile device.
  • the sound transducer unit 1 can also be used for a smartphone, a radio, a television, etc.
  • the in-ear headphone 41 is an example of a mobile device.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Headphones And Earphones (AREA)
EP20197821.0A 2019-09-25 2020-09-23 Schallwandlereinheit zum erzeugen und/oder erfassen von schallwellen im hörbaren wellenlängenbereich und/oder im ultraschallbereich Pending EP3799440A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102019125815.4A DE102019125815A1 (de) 2019-09-25 2019-09-25 Schallwandlereinheit zum Erzeugen und/oder Erfassen von Schallwellen im hörbaren Wellenlängenbereich und/oder im Ultraschallbereich

Publications (1)

Publication Number Publication Date
EP3799440A1 true EP3799440A1 (de) 2021-03-31

Family

ID=72644027

Family Applications (1)

Application Number Title Priority Date Filing Date
EP20197821.0A Pending EP3799440A1 (de) 2019-09-25 2020-09-23 Schallwandlereinheit zum erzeugen und/oder erfassen von schallwellen im hörbaren wellenlängenbereich und/oder im ultraschallbereich

Country Status (5)

Country Link
US (1) US11303993B2 (ko)
EP (1) EP3799440A1 (ko)
KR (1) KR20210036846A (ko)
CN (1) CN112565994A (ko)
DE (1) DE102019125815A1 (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN215499569U (zh) * 2021-05-19 2022-01-11 瑞声声学科技(深圳)有限公司 骨传导麦克风
US11743634B2 (en) * 2021-05-20 2023-08-29 Aac Acoustic Technologies (Shenzhen) Co., Ltd. MEMS microphone
CN114374920A (zh) * 2021-12-29 2022-04-19 瑞声声学科技(深圳)有限公司 骨传导麦克风
JP2024080657A (ja) * 2022-12-02 2024-06-13 ユーサウンド ゲーエムベーハー 音響トランスデューサユニット
JP2024080656A (ja) * 2022-12-02 2024-06-13 ユーサウンド ゲーエムベーハー 音響トランスデューサユニット
DE102023104021A1 (de) 2022-12-02 2024-06-13 USound GmbH Schallwandlereinheit
JP2024080655A (ja) * 2022-12-02 2024-06-13 ユーサウンド ゲーエムベーハー 音響トランスデューサユニット

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090092274A1 (en) * 2006-05-09 2009-04-09 Song Chung-Dam Silicon condenser microphone having additional back chamber and sound hole in pcb
EP2566183A1 (en) * 2011-09-02 2013-03-06 Saati S.p.A. MEMS microphone with a built-in textile material protecting screen
EP2587832A1 (en) * 2010-08-05 2013-05-01 Funai Electric Co., Ltd. Microphone unit
US20130343564A1 (en) * 2011-03-07 2013-12-26 Soundchip Sa Audio Apparatus
DE102014016753A1 (de) 2014-11-12 2016-05-12 Daimler Ag Gleitlager zur Lagerung einer Kraftfahrzeugwelle
EP3209027A1 (en) * 2014-10-16 2017-08-23 Nitto Denko Corporation Sound-passing membrane, sound-passing membrane member having same, microphone, and electronic device

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7434305B2 (en) * 2000-11-28 2008-10-14 Knowles Electronics, Llc. Method of manufacturing a microphone
AT410742B (de) * 2002-02-26 2003-07-25 Akg Acoustics Gmbh Kontaktierung für elektrostatische mikrofonwandler
CN101022684B (zh) * 2007-03-07 2011-06-22 山东共达电声股份有限公司 改进的传声器封装结构
CN201167416Y (zh) * 2008-04-22 2008-12-17 华英伦电子(宁波)有限公司 具有一体式声腔构件的驻极体电容式麦克风
JP4809912B2 (ja) * 2009-07-03 2011-11-09 ホシデン株式会社 コンデンサマイクロホン
CN201509305U (zh) * 2009-10-17 2010-06-16 歌尔声学股份有限公司 微型换能器组件
EP2505000A2 (en) * 2009-11-23 2012-10-03 Incus Laboratories Limited Production of ambient noise-cancelling earphones
CN102917290A (zh) * 2011-08-04 2013-02-06 富泰华工业（深圳）有限公司 耳机及其制造方法
CN102300148B (zh) * 2011-08-10 2015-04-01 美律电子(深圳)有限公司 具感应功能的电声转换器
CN202310061U (zh) * 2011-08-12 2012-07-04 瑞声声学科技(深圳)有限公司 柔性电路板连接式微电机系统麦克风
CN104145484A (zh) * 2011-11-17 2014-11-12 应美盛股份有限公司 具有声管的麦克风模块
US9695040B2 (en) * 2012-10-16 2017-07-04 Invensense, Inc. Microphone system with integrated passive device die
US9628918B2 (en) * 2013-11-25 2017-04-18 Infineon Technologies Ag Semiconductor device and a method for forming a semiconductor device
DE102014106753B4 (de) 2014-05-14 2022-08-11 USound GmbH MEMS-Lautsprecher mit Aktuatorstruktur und davon beabstandeter Membran
DE102015210919A1 (de) * 2015-06-15 2016-12-15 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. MEMS-Wandler zum Interagieren mit einem Volumenstrom eines Fluids und Verfahren zum Herstellen desselben
CN105933831B (zh) * 2016-04-22 2020-05-12 歌尔股份有限公司 振膜及设有该振膜的微型发声器
US10951970B1 (en) * 2019-09-11 2021-03-16 Bose Corporation Open audio device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090092274A1 (en) * 2006-05-09 2009-04-09 Song Chung-Dam Silicon condenser microphone having additional back chamber and sound hole in pcb
EP2587832A1 (en) * 2010-08-05 2013-05-01 Funai Electric Co., Ltd. Microphone unit
US20130343564A1 (en) * 2011-03-07 2013-12-26 Soundchip Sa Audio Apparatus
EP2566183A1 (en) * 2011-09-02 2013-03-06 Saati S.p.A. MEMS microphone with a built-in textile material protecting screen
EP3209027A1 (en) * 2014-10-16 2017-08-23 Nitto Denko Corporation Sound-passing membrane, sound-passing membrane member having same, microphone, and electronic device
DE102014016753A1 (de) 2014-11-12 2016-05-12 Daimler Ag Gleitlager zur Lagerung einer Kraftfahrzeugwelle

Also Published As

Publication number Publication date
KR20210036846A (ko) 2021-04-05
DE102019125815A1 (de) 2021-03-25
US11303993B2 (en) 2022-04-12
CN112565994A (zh) 2021-03-26
US20210092509A1 (en) 2021-03-25

Similar Documents

Publication Publication Date Title
EP3799440A1 (de) Schallwandlereinheit zum erzeugen und/oder erfassen von schallwellen im hörbaren wellenlängenbereich und/oder im ultraschallbereich
EP2282558B1 (de) Hörvorrichtung und Verfahren
EP3143778B1 (de) Mems-schallwandler sowie schallwandleranordnung mit stopper-mechanismus
DE60221857T2 (de) Akustischen Miniwandler
DE60005807T3 (de) Mikrofon für ein hörgerät
EP3295683B1 (de) Schallwandleranordnung mit mems-schallwandlern
EP2219392B1 (de) Microfonmodul für eine hörvorrichtung
EP2163120B1 (de) Dynamischer schallwandler und hörer
DE112007000845T5 (de) Wandlermonitorsystem und Herstellverfahren für dieses
WO2015162248A1 (de) Lautsprecheranordnung mit leiterplattenintegriertem asic
DE10343292B3 (de) Hörgerät ohne separates Mikrofongehäuse
DE102021116158A1 (de) Adapter für Mikrofone und Kombinationen dafür
WO2016180841A1 (de) Leiterplattenmodul mit durchgehender aussparung sowie diesbezügliche schallwandleranordnung sowie herstellungsverfahren
DE2909477C2 (de) Anordnung zum Umwandeln akustischer Schwingungen in elektrische Schwingungen und umgekehrt, mit mindestens einem Kondensatorelektretelement, das an eine elektronische Schaltungsanordnung angeschlossen ist
WO2007051606A1 (de) Wandlersystem für eine aktive lärmkompensationsvorrichtung
DE602005004917T2 (de) Piezoelektrisches Keramikelement and Bauteile daraus
DE102019219484B4 (de) Leiterplatte eines Hörgeräts
DE19900969C2 (de) Schlitzmikrofon
DE112016001352T5 (de) Eingebettete Schaltung in einer MEMS-Vorrichtung
EP2911312B1 (de) Antenne mit Schirmvorrichtung und Herstellungsverfahren
EP3646617B1 (de) Schallwandleranordnung mit einer mems-einheit
DE102015226483A1 (de) Mikrofon und Verfahren zum Herstellen desselben
DE102005043690A1 (de) Mikromechanisches Mikrofon
DE102012211277A1 (de) Mikrofonmodul mit einer elektrisch leitenden Elastomerverbindung
DE102007033714A1 (de) Hörvorrichtung mit einer Befestigungseinrichtung zum Anstecken eines Audioschuhs und entsprechender Audioschuh

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION HAS BEEN PUBLISHED

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20210930

RBV Designated contracting states (corrected)

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: EXAMINATION IS IN PROGRESS

17Q First examination report despatched

Effective date: 20230220