EP3799440A1 - Sound transducer unit for generating and / or detecting sound waves in the audible wavelength range and / or in the ultrasonic range - Google Patents

Abstract

The invention relates to a sound transducer unit (1), in particular for in-ear headphones, for generating and / or recording sound waves in the audible wavelength range and / or in the ultrasonic range with a circuit board (2) and at least one MEMS sound transducer (3) arranged on it ), at least one connection element (4) of the printed circuit board (2) being connected in an electrically conductive manner to at least one contact element (5) of the MEMS sound transducer (3). According to the invention, the MEMS sound transducer (3) is designed as a surface-mountable component which is connected to the printed circuit board (2) by means of surface mounting. The invention also relates to a method for producing a sound transducer unit (1) and a sound generating unit (41).

Description

The present invention relates to a sound transducer unit, in particular for in-ear headphones, for generating and / or detecting sound waves in the audible wavelength range and / or in the ultrasonic range with a circuit board and at least one MEMS sound transducer arranged thereon, with at least one connection element of the carrier element is electrically conductively connected to at least one contact element of the MEMS sound transducer.

From the DE 10 2014 016 753 A1 a sound transducer unit is known which is arranged in a guide plate. The disadvantage of this is that the production of such a sound transducer unit is complex.

The object of the present invention is therefore to create a sound transducer unit, the manufacturing method of which is simplified.

The object is achieved by a sound transducer unit, its manufacturing method and a mobile device with the features of the independent claims.

A sound transducer unit is proposed for generating and / or detecting sound waves in the audible wavelength range and / or in the ultrasonic range. The sound transducer unit can thus be operated as a loudspeaker and / or as a microphone. In the ultrasonic range, the sound waves can be used as distance or proximity sensors, for example. The sound transducer unit can also be used, for example, for in-ear headphones which are at least partially arranged in an auditory canal will. The sound transducer unit can also be used for other sound generation units, such as smartphones, radios, televisions, PCs, etc.

The sound transducer unit comprises a printed circuit board and at least one MEMS sound transducer arranged thereon. The circuit board can have electrical lines or conductor tracks in order to carry electrical voltages, electrical currents and / or electrical signals. The MEMS sound transducer is also used to generate and / or record sound waves in the audible wavelength range and / or in the ultrasonic range. The circuit board is a carrier for the MEMS sound transducer.

Furthermore, the circuit board has at least one connection element and the MEMS sound transducer has at least one contact element. Furthermore, the at least one connection element is electrically conductively connected to the at least one contact element. A connection element is connected to a contact element if there are several of the two.

According to the invention, the MEMS sound transducer is designed as a surface-mountable component which is connected to the circuit board by means of surface mounting. Since the MEMS sound transducer is designed as a surface-mountable component, it can be arranged on the circuit board by means of surface mounting. This is an assembly process that can be easily automated. The production of the sound transducer unit is thereby simplified and accelerated.

It is advantageous if the connection element and the contact element are electrically connected to one another by means of an integral connection. The connection element and the contact element can also be soldered to one another, so that a soldered connection is formed. This creates a stable, electrically conductive connection. Furthermore, the material connection keep the MEMS transducer independently or alone on the circuit board.

It is advantageous if the MEMS sound transducer has a membrane unit which is coupled to a transducer element of the MEMS sound transducer. With the aid of the transducer element, which can include a piezo actuator and / or a piezoelectric layer, for example, deflections can be generated and / or detected. These deflections are transmitted to the membrane unit through the coupling, for example through a coupling element. The membrane unit then generates sound. The membrane unit can, however, also convert sound waves into deflections, which are transmitted to the transducer element. The transducer element can generate the deflections from an electrical signal and / or the electrical signals from deflections.

The membrane unit or a membrane of the membrane unit is advantageously formed from a heat-resistant membrane material. Polyimides, polyamides or silicones, for example, can be used as the heat-resistant membrane material. If the MEMS sound transducer is soldered onto the circuit board, the MEMS sound transducer and thus also the membrane or the membrane unit can heat up to or even more than 300 ° C. Damage can be prevented with the aid of the heat-resistant membrane material.

It is advantageous if the MEMS sound transducer comprises a transducer support, the MEMS sound transducer being arranged on the circuit board by means of the transducer support. The transducer carrier can be a carrier substrate. The converter element, in particular the piezo actuator and / or the piezoelectric layer, can also be arranged on the converter carrier. Additionally or alternatively, the membrane unit can be arranged on the transducer carrier.

Additionally or alternatively, it is advantageous if the transducer carrier has a first through channel. A pressure that arises when the membrane unit moves or when it is deflected can be compensated for by the first through-channel.

It is advantageous if the at least one contact element is designed as a contact surface. This allows the MEMS transducer to be constructed more easily.

Additionally or alternatively, it is advantageous if the at least one contact element is arranged on the converter carrier. This means that further components are dispensed with, so that the MEMS sound transducer or the sound transducer unit has a compact design. For example, the converter carrier can have the at least one contact surface, which is preferably arranged on an outer or peripheral side of the converter carrier.

Additionally or alternatively, it is advantageous if the converter support has electrical lines for the converter element. With the aid of these electrical lines, the electrical signals can be routed to the transducer element or be routed away from it. The electrical lines can run on an outer surface and / or in an interior of the transducer carrier.

It is advantageous if the circuit board has a second through channel. This second through-channel can be coaxial and / or congruent with the first through-channel of the MEMS sound transducer. The pressure that is formed when the membrane unit is deflected can thus be equalized through the first and second through-channels. The first and second through-channels together form a compensation channel. The first and second through-channels together also form a connection to a rear volume of the sound transducer unit, the acoustic properties of the sound transducer unit being determined with the aid of the rear volume.

It is advantageous if the circuit board has a component side facing the MEMS sound transducer, on which the MEMS sound transducer is placed in a contact area, so that the contact elements make contact with the connection elements. The circuit board can already have the contact areas, so that it is very easy to manufacture the sound transducer unit in large numbers. The contact area has the contact elements.

It is advantageous if the sound transducer unit has a circuit board on which the circuit board with the MEMS sound transducer is arranged. The circuit board can be made larger than the circuit board. The unit of printed circuit board and MEMS sound transducer is arranged on the board. The circuit board also includes further electrical components that are required for the operation of the sound transducer unit. For example, the circuit board can comprise a control unit, an, in particular wireless, interface, an energy unit, a storage unit, sensors and / or an energy interface.

Like the printed circuit board, the circuit board can have conductor tracks.

The circuit board can advantageously be arranged on the board by means of spacers. A single spacer can also suffice. The at least one spacer is thus arranged between the circuit board and the circuit board.

It is advantageous if at least one electrical plug connection is arranged between the printed circuit board and the circuit board, so that electrical signals can be routed to the MEMS sound transducer and / or can be routed away from it.

Additionally or alternatively, at least one spacer can also electrically connect the printed circuit board and the circuit board for the exchange of electrical signals. The spacer or spacers can be electrically conductive. Additionally or alternatively, conductor tracks can also be arranged in at least one spacer, so that a plurality of conductors are passed through one spacer.

It is advantageous if the sound transducer unit has a transducer housing in which at least the MEMS sound transducer and / or the circuit board are arranged. With the help of the transducer housing, at least the MEMS sound transducer can be protected from dirt and damage.

It is advantageous if the converter housing has a first coupling area for coupling an ear element to the converter housing. The ear element can be made of a flexible material, for example rubber. The ear element can be provided so that it is at least partially pushed into an auditory canal when the sound transducer unit is used for in-ear headphones. The ear element or also earplugs can adapt to the auditory canal.

Additionally or alternatively, it is advantageous if the converter housing has a second coupling area for coupling a headphone unit to the converter housing. The headphone unit can have a battery or an accumulator, for example.

It is advantageous if the converter housing has an exit opening for sound waves. If the converter housing or the sound converter unit for When using in-ear headphones, the outlet opening is directed in the direction of the auditory canal or the eardrum. The sound waves are thus guided directly to the ear.

In order to adapt the acoustic properties of the sound transducer unit, it is advantageous if the transducer housing has a front volume which is arranged between the outlet opening and the MEMS sound transducer.

It is advantageous if the converter housing has a dust protection and / or a moisture protection. The dust protection can be arranged in the area of the outlet opening and / or the moisture protection in the area between the front volume and the MEMS sound transducer. This can prevent the ingress of dust and / or moisture.

Furthermore, the dust and / or moisture protection can be glued to the converter housing.

It is advantageous if the sound transducer unit has at least one second MEMS sound transducer, one of the two MEMS sound transducers being operable as a loudspeaker and the other MEMS sound transducer being operable as a microphone. As a result, sound waves can be generated and, in particular, recorded at the same time.

It is advantageous if both MEMS sound transducers are arranged next to one another on the circuit board. As a result, the two MEMS sound transducers can be arranged in a space-saving manner.

Alternatively, one of the two MEMS sound transducers can be arranged on the other MEMS sound transducer. For example, the MEMS sound transducer, which is operated as a microphone, is arranged on the MEMS sound transducer, which is operated as a loudspeaker.

It is advantageous if the circuit board has a pressure compensation opening. The pressure compensation opening can be arranged next to the at least one MEMS sound transducer. The front and rear volumes are also connected to one another with the aid of the pressure equalization opening. A pressure between the front and rear volume is thereby equalized.

It is advantageous if a dam arrangement is arranged around the pressure equalization opening. As a result, it can be prevented that adhesive, which is used, for example, to glue the printed circuit board to the converter housing, can get into the pressure compensation opening and thereby close it.

Furthermore, a method is proposed for producing a sound transducer unit, in particular for in-ear headphones, for generating and / or detecting sound waves in the audible wavelength range and / or in the ultrasonic range.

The sound transducer unit can be designed in accordance with at least one feature of the preceding and / or following description.

In the method, at least one MEMS sound transducer is arranged on a printed circuit board.

Furthermore, in the method, at least one connection element of the MEMS sound transducer is electrically connected to at least one contact element of the circuit board. This creates an electrical connection between the printed circuit board and the MEMS sound transducer.

According to the invention, the at least one MEMS sound transducer is a surface-mountable component which is connected to the circuit board by means of surface mounting. The MEMS sound transducer can be automatically placed on the circuit board by means of surface mounting. The electrical connection of the circuit board with the MEMS sound transducer can also be carried out in an automated manner. As a result, the manufacturing process can be simplified.

A sound generating unit with a sound transducer unit for generating and / or detecting sound waves in the audible wavelength range and / or in the ultrasonic range is also proposed. The sound unit can be, for example, in-ear headphones, a smartphone, a telephone and / or a music system. The sound generating unit can also be another mobile device.

According to the invention, the sound transducer unit is designed according to at least one feature of the preceding and / or following description. Additionally or alternatively, the sound transducer unit can be designed in accordance with at least one feature of the preceding and / or following description.

It is also advantageous if the sound generating unit has an ear element which is arranged in a first coupling area of the sound transducer unit. The ear element is, for example, an earplug. The ear element is designed to be flexible, for example it is also rubber, so that it can adapt to an auditory canal when it is inserted into it. In this case, the sound generating unit is an in-ear headphone.

Additionally or alternatively, the sound generating unit has a headphone unit which is arranged in a second coupling area of the sound transducer unit. The headphone unit can, for example, be a battery and / or have an accumulator. The sound generation unit here is also an in-ear headphone.

Figur 1

eine perspektivische, schematische Ansicht einer Schallwandlereinheit mit einer Leiterplatte und einem MEMS-Schallwandler,

Figur 2

eine perspektivische, schematische Ansicht einer Schallwandlereinheit mit einer Leiterplatte und einem MEMS-Schallwandler auf einer Platine,

Figur 3a

eine seitliche Schnittansicht einer Schallwandlereinheit mit Wandlergehäuse,

Figur 3b

eine perspektivische Schnittansicht der Figur 3a,

Figur 4

eine seitliche Schnittansicht einer Schallwandlereinheit mit einer Druckausgleichsöffnung,

Figur 5

eine seitliche Schnittansicht des MEMS-Schallwandlers mit einem Ausschnitt der Leiterplatte,

Figur 6a, b

zwei seitliche Schnittansichten einer Schallwandlereinheit mit jeweils einem zweiten MEMS-Schallwandler und

Figur 7

eine seitliche Schnittansicht eines In-Ohr-Kopfhörers.

Further advantages of the invention are described in the following exemplary embodiments. Show it:

Figure 1

a perspective, schematic view of a sound transducer unit with a circuit board and a MEMS sound transducer,

Figure 2

a perspective, schematic view of a sound transducer unit with a circuit board and a MEMS sound transducer on a circuit board,

Figure 3a

a side sectional view of a sound transducer unit with transducer housing,

Figure 3b

a perspective sectional view of FIG Figure 3a ,

Figure 4

a side sectional view of a sound transducer unit with a pressure compensation opening,

Figure 5

a side sectional view of the MEMS sound transducer with a section of the circuit board,

Figure 6a, b

two side sectional views of a sound transducer unit, each with a second MEMS sound transducer and

Figure 7

a side sectional view of an in-ear headphone.

Figure 1 shows a perspective, schematic view of a sound transducer unit 1 with a printed circuit board 2 and a MEMS sound transducer 3. With the aid of the MEMS sound transducer 3, sound waves can be generated and / or recorded. When the sound waves are generated, the MEMS sound transducer 3 or the sound transducer unit 1 is operated as a loudspeaker. Additionally or alternatively, the MEMS sound transducer 3 or the sound transducer unit 1 can also be operated as a microphone, so that the sound waves are recorded.

The sound transducer unit 1 can also be used for a sound generation unit 41, which is shown in FIG Figure 7 is designed as in-ear headphones 41, for example.

The printed circuit board 2 also has at least one connection element 4 in the present exemplary embodiment. In the one shown here Figure 1 For the sake of clarity, only one connection element 4 is provided with a reference number, although the printed circuit board 2 has several connection elements 4 here. The connection element 4 can, as shown here, be designed as a connection surface. The connection element 4, in particular the connection surface, is arranged on and / or on a component side 7. The printed circuit board 2 also has an underside 8 opposite the component side 7.

The MEMS sound transducer 3 also has at least one contact element 5, which is designed here as a contact foot. For the sake of clarity, only one contact element 5 is again provided with a reference number, although the MEMS sound transducer 3 has several contact elements 5. The contact elements 5 are arranged in such a way that in each case a contact element 5 lies on a connection element 4 when the MEMS sound transducer 3 is arranged on the component side 7. According to the invention, the MEMS sound transducer 3 is designed as a surface-mountable component which is connected to the printed circuit board 2 by means of surface mounting. As a result, a connection element 4 is assigned to each contact element 5, so that these two can form an electrical connection.

According to the present exemplary embodiment, a contact element 5 is connected to the associated connection element 4 by means of a soldered connection 6, so that the electrical connection is established. Here too, for the sake of clarity, the soldered connection 6 is only shown between a contact element 5 and a connection element 4. Of course, a soldered connection 6 can exist between all contact elements 5 and the respective associated connection element 4. Instead of the soldered connection 6, another material connection can also be formed between the connection element 4 and the contact element 5. The connection is an electrical connection.

With the aid of surface mounting, the MEMS sound transducer 3 can be connected to the circuit board 2 in an automated manner and quickly.

The circuit board 2 also has a plurality of conductor tracks 9, again only one conductor track 9 being provided with a reference symbol for the sake of clarity. The conductor tracks 9 are electrically connected to the connection elements 4. The conductor tracks 9 are also shown only schematically. The conductor tracks 9 can converge and / or run parallel. Furthermore, the conductor tracks 9 can run through the circuit board 2 onto the underside 8.

The circuit board 2 also has a contact area 48 in which the MEMS sound transducer 3 is or can be arranged. The connection elements 4 are preferably arranged in the contact area.

Figure 2 shows a perspective, schematic view of a sound transducer unit 1 with a circuit board 2 and a MEMS sound transducer 3 on a circuit board 10.

Furthermore, for the sake of simplicity, features and their effects, which have already been described in the preceding figures, are not explained again. Furthermore, in comparison to the preceding and / or following figures, the same features or at least similarly acting features have the same reference symbols. For example, for the sake of clarity, features can also only be described in the following figures.

The circuit board 2 and the MEMS sound transducer 3 arranged thereon are arranged here on the circuit board 10. The circuit board 10 is larger than the circuit board 2. Further components which are required for the operation of the sound transducer unit 1 can thus be arranged on the circuit board 10. The platinum 10 is also a motherboard.

According to the present exemplary embodiment, the circuit board 2 is arranged on the circuit board 10 by means of spacers 11. These space the printed circuit board 2 from the circuit board 10.

The board 10 has a board top 14 and an opposite board bottom 15. The circuit board 2 is arranged on the upper side 14 of the circuit board. Electronic components 12 are also arranged on the upper side 14 of the circuit board, although for the sake of clarity not all electronic components 12 are provided with a reference number. The electronic components 12 can be, for example, control units, memory units, resistors, coils, capacitors, radio modules and / or sensors. Furthermore, the circuit board 10 has conductor tracks 13 shown by way of example. With the aid of the conductor tracks 13, all components are electrically connected to one another. Additionally or alternatively, an electronic component 12, which is shown here schematically is shown, be arranged on the underside of the circuit board 15. The circuit board 10 can also be a PCB (printed circuit board or printed circuit board).

According to the present embodiment, the circuit board 2 and the circuit board 10 are round and arranged coaxially to one another.

In order to be able to exchange electrical signals between the printed circuit board 2 and the circuit board 10, the present exemplary embodiment has a plug connection 47.

Additionally or alternatively, the electrical signals can also be passed through the spacers 11. For example, at least one electrical supply voltage can be fed to the MEMS sound transducer 3 or other components through the spacers.

Figures 3a and 3b show the sound transducer unit 1 with a transducer housing 16 in a side sectional view ( Fig. 3a ) and in a perspective view ( Figure 3b ). In the sectional view of the Figure 3a the cut surfaces are not shown hatched.

Furthermore, for the sake of simplicity, features and their effects, which have already been described in the preceding figures, are not explained again. Furthermore, in comparison to the preceding and / or following figures, the same features or at least similarly acting features have the same reference symbols. For example, for the sake of clarity, features can also only be described in the following figures.

At least the MEMS sound transducer 3 and / or the printed circuit board 2 are arranged in the transducer housing 16, so that at least the MEMS sound transducer 3 is protected from dirt and damage.

Furthermore, the circuit board 10 is also shown, the circuit board 2 with the spacers 11 shown in FIG. 2, but not shown here, being arranged on the circuit board 10.

The converter housing 16 has an outlet opening 21 through which the sound waves can exit from the converter housing 16 and / or enter the converter housing 16. If the sound transducer unit 1 is used for in-ear headphones, the outlet opening 21 faces the ear when the in-ear headphones are worn by a wearer.

On the side of the transducer housing 16 opposite to the outlet opening 21 there is an insertion opening 26 through which the MEMS sound transducer 3 and / or the circuit board 2 can be inserted into the transducer housing 16 or an interior 27 of the transducer housing 16.

The interior space 27 is delimited by the converter housing 16 and the outlet opening 21 and the insertion opening 26.

According to the present exemplary embodiment, the circuit board 10 is designed to be larger than the insertion opening 26. The circuit board 10 closes the insertion opening 26.

The converter housing 16 also has a first base arrangement 22 on which the circuit board 10 can be placed. The first base arrangement 22 borders the insertion opening 26.

The converter housing 16 also has a second base arrangement 23 which is arranged in the area of the interior space 27 and on which the printed circuit board 2 can be placed.

The converter housing 16 also has a third base arrangement 24 which is arranged in the area of the interior space 27 and on which a Moisture protection 18 can be put on. The moisture protection 18 is arranged here between the outlet opening 21 and the MEMS sound transducer 3, so that the MEMS sound transducer 3 is protected from moisture that can enter through the outlet opening 21. The moisture protection 18 can, for example, be a membrane which retains moisture but allows sound waves to pass through.

The converter housing 16 also has a fourth base arrangement 25 on which a dust cover 17 can be placed. With the aid of the dust protector 17, dust and / or dirt can be prevented from getting into the interior space 27 of the converter housing 16.

If the MEMS sound transducer 3 and / or the circuit board 2 are arranged in the transducer housing 16, they divide the interior space 27 into a front volume 19 and a rear volume 20. The front volume 19 is arranged between the outlet opening 21 and the MEMS sound transducer 3. The rear volume 20 is arranged between the MEMS sound transducer 3 and the insertion opening 26 or the circuit board 10. The spacers 11, not shown here, are at least partially arranged in the rear volume 20.

According to the in Figure 3b It can be seen that the converter housing 16 is designed to be rotationally symmetrical. Accordingly, the outlet opening 21, the dust protection 17, the circuit board 10, the circuit board 2 and / or the four base arrangements 22-25 are round. The interior 27 is also rotationally symmetrical.

The converter housing 16 also has a first coupling area 28. An ear element 42, described later, can be arranged in the first coupling region 28. The ear element 42 is advantageously flexible and / or made of rubber, so that it can be inserted into an auditory canal of the wearer, adapting to the inner contour of the auditory canal. With help of the ear element 42, wearing comfort of the in-ear headphones 41 is improved if the sound transducer unit 1 is used for this.

The converter housing 16 also has a first projection 30, with which it is prevented that the ear element 42 arranged in the first coupling region 28 can slip from the converter housing 16. The first projection 30 is adjacent to the first coupling region 28.

The converter housing 16 also has a second coupling area 29. A headphone unit 43, which will be described later, can be arranged in the second coupling area 29. The headphone unit 43 comprises the elements that are still required in addition to the sound transducer unit 1 when the sound transducer unit 1 is used in in-ear headphones 41. Such elements are, for example, an energy store 44, a charging socket for charging the energy store 44 and / or additional sensors 45.

The converter housing 16 also has a second projection 31, with which it is prevented that the headphone unit 43 arranged in the second coupling area 29 can slip from the converter housing 16. The second projection 31 is adjacent to the second coupling region 29.

The first and / or the second coupling area 28, 29 is also cylindrical.

Figure 4 shows a side sectional view of a sound transducer unit 1 with a pressure compensation opening 32. The cut surfaces are again not shown hatched.

Furthermore, for the sake of simplicity, features and their effects, which have already been described in the preceding figures, are not explained again. Furthermore show in comparison to the preceding and / or following Figures have the same features or at least similarly acting features have the same reference symbols. For example, for the sake of clarity, features can also only be described in the following figures. In addition, the features already known from the preceding figures are not provided with a reference number again.

The circuit board 2 and / or the MEMS sound transducer 3 subdivide the interior space 27 into the front volume 19 and the rear volume 20. The front volume 19 extends from the circuit board 2 and / or the MEMS sound transducer 3 to the outlet opening 21, i.e. preferably also through the moisture protection 18. With the aid of the pressure equalization opening 32, a pressure difference between the front and rear volume 19, 20 can be equalized, which occurs when the MEMS sound transducer 3 is operated. The pressure compensation opening 32 can have a diameter which is smaller than 0.5 mm. With such an order of magnitude, the pressure equalization opening 32 is essentially impermeable to sound waves. However, the pressure difference can even out. The pressure compensation opening 32 is arranged here in the circuit board 2, several pressure compensation openings 32 also being conceivable.

The pressure equalization openings 32 are surrounded by a dam arrangement 33. With the aid of the dam arrangement 33, it is possible to prevent adhesive from getting into the pressure equalization openings 32 when the printed circuit board 2 is glued to the converter housing 16.

Figure 5 shows a sectional view of the MEMS sound transducer 3 with a section of the circuit board 2. Here, the MEMS sound transducer 3 is shown in more detail.

Furthermore, for the sake of simplicity, features and their effects, which have already been described in the preceding figures, are not explained again. Furthermore, in comparison to the preceding and / or following figures, the same features or at least similarly acting features have the same reference symbols. For example, for the sake of clarity, features can also only be described in the following figures. In addition, the features already known from the preceding figures are not provided with a reference number again.

The MEMS sound transducer 3 comprises a transducer carrier 34, which can be designed as a transducer substrate. The MEMS sound transducer 3 sits on the circuit board 2 by means of the transducer carrier 34.

A converter element 35 is arranged on the converter support 34 by means of foot elements 38. The transducer element 35 can comprise at least one piezo actuator and / or at least one piezoelectric layer, so that the transducer element 35 can convert electrical signals into deflections and / or deflections into electrical signals. When the electrical signals are converted into deflections, the MEMS sound transducer 3 is operated as a loudspeaker. When the deflections are converted into electrical signals, the MEMS sound transducer 3 is operated as a microphone. The electrical signals can be audio signals.

The MEMS sound transducer 3 further comprises a membrane unit 37, which is coupled to the transducer element 35 by means of a coupling element 36. Deflections can thus be exchanged between the membrane unit 37 and the transducer element.

With the aid of the membrane unit 37, the air arranged above it can be caused to vibrate by the deflections, so that sound waves are generated. The MEMS sound transducer 3 is therefore operated as a loudspeaker. On the other hand, however, sound waves can also set the membrane unit 37 in vibration, which result in deflections of the membrane unit 37. The deflections are converted into electrical signals by the transducer element 35. The MEMS sound transducer 3 is consequently operated as a microphone. With the aid of the printed circuit board 2 and / or the circuit board 10, the audio signals can be routed to the MEMS sound transducer 3 and / or routed away from it.

The said deflections have a direction along a stroke axis H. The transducer element 35 and the membrane unit 37 are also deflected along the stroke axis H.

A first through channel 39 is also arranged in the transducer carrier 34. A second through channel 40 is arranged in the printed circuit board 2. Both through channels 39, 40 are arranged coaxially and congruently with one another. Both through channels 39, 40 form a compensation channel. When the membrane unit 37, which is preferably closed, deflects along the stroke axis H, an alternating negative and positive pressure arises on the circuit board 2 facing in the area of the transducer element 35 and / or the membrane unit 37. However, this hinders the movement of the membrane unit 37. With the aid of the first and second through channels 39, 40 a connection to the rear volume 20 can be established so that the negative and positive pressure are weakened and the membrane unit 37 can be deflected better. The two through channels 39, 40 serve to improve the acoustics of the MEMS sound transducer 3.

Furthermore, the at least one contact element 5 can be arranged on the transducer carrier 34, which can preferably also be designed as a contact surface. The at least one contact element 5 can be arranged on an outer or circumferential side of the MEMS sound transducer 3 or of the transducer carrier 34. The MEMS sound transducer 3 can be soldered directly onto the circuit board 2 through the at least one contact surface. The MEMS sound transducer 3 or the transducer carrier 34 preferably has several Contact surfaces which are arranged to match the connection elements 4.

The Figures 6a and 6b show a sound transducer unit 1, each with a second MEMS sound transducer 3b in two different configurations.

Furthermore, for the sake of simplicity, features and their effects, which have already been described in the preceding figures, are not explained again. Furthermore, in comparison to the preceding and / or following figures, the same features or at least similarly acting features have the same reference symbols. For example, for the sake of clarity, features can also only be described in the following figures. In addition, the features already known from the preceding figures are not provided with a reference number again.

The functions of the two MEMS sound transducers 3a, 3b are shown in FIG Figure 5 described.

If the sound transducer unit 1 has two MEMS sound transducers 3a, 3b, one MEMS sound transducer 3a, 3b can be operated as a loudspeaker and the other MEMS sound transducer 3a, 3b can be operated as a microphone. As a result, the sound transducer unit 1 can be operated, in particular simultaneously, as a loudspeaker and as a microphone.

In the Figure 6a a MEMS sound transducer 3b is arranged on the other MEMS sound transducer 3a. This is advantageous when there is hardly any space on the circuit board 2.

In Figure 6b Both MEMS sound transducers 3a, 3b are arranged next to one another on the circuit board 2. This is advantageous when a height is to be limited.

Figure 7 shows a side sectional view of at least partially shown in-ear headphones 41. As in-ear headphones 41, the sound transducer unit 1 is mainly used as a loudspeaker. The in-ear headphones 41 shown here are an example of a sound generating unit 41. The sound transducer unit 1 can, for example, also be arranged in another device, such as a smartphone, PC, etc., for example.

Furthermore, for the sake of simplicity, features and their effects, which have already been described in the preceding figures, are not explained again. Furthermore, in comparison to the preceding and / or following figures, the same features or at least similarly acting features have the same reference symbols. For example, for the sake of clarity, features can also only be described in the following figures. In addition, the features already known from the preceding figures are not provided with a reference number again.

In this Figure 7 it is better shown that electronic components 12a, 12b can be arranged on both sides of the circuit board 10.

According to the present exemplary embodiment, the ear element 42 is arranged in the first coupling region 28 of the converter housing 16. The ear element 42 forms a form-fitting connection with the first coupling region 28 and the first projection 30, so that the ear element 42 cannot slip off the converter housing 16.

The ear element 42 also has an ear element opening 46 which, according to the present exemplary embodiment, is coaxial with the outlet opening 21.

In the second coupling area 29, the headphone unit 43 is coupled to the converter housing 16. The headphone unit 43 forms a form-fitting connection with the second coupling area 29 and the second projection 31, so that the headphone unit 43 cannot slip off the converter housing 16.

According to the present exemplary embodiment, the headphone unit 43 has, for example, an energy store 44 and a further sensor 45. Of course, the headphone unit 43 can also have further components for the in-ear headphones 41.

Even if the sound transducer unit 1 is described here in connection with the in-ear headphones 41, so that the sound transducer unit 1 can also be used for another mobile device. The sound transducer unit 1 can also be used for a smartphone, a radio, a television, etc. The in-ear headphone 41 is an example of a mobile device.

The present invention is not limited to the illustrated and described exemplary embodiments. Modifications within the scope of the patent claims are just as possible as a combination of the features, even if these are shown and described in different exemplary embodiments.

List of reference symbols

1

Transducer unit

2

Circuit board

3

MEMS transducer

4th

Connection element

5

Contact element

6th

Solder connection

7th

Component side

8th

bottom

9

Track

10

circuit board

11

Spacers

12th

Electronic component

13th

Track

14th

PCB top

15th

Underside of the circuit board

16

Converter housing

17th

Dust protection

18th

Moisture protection

19th

Front volume

20th

Rear volume

21

Outlet opening

22nd

first socket arrangement

23

second socket arrangement

24

third socket arrangement

25th

fourth socket arrangement

26th

Insertion opening

27

inner space

28

first coupling area

29

second coupling area

30th

first lead

31

second lead

32

Pressure equalization opening

33

Dam arrangement

34

Converter carrier

35

Transducer element

36

Coupling element

37

Membrane unit

38

Foot element

39

first through channel

40

second through channel

41

In-ear headphones

42

Ear element

43

Headphone unit

44

Energy storage

45

sensor

46

Ear element opening

47

Plug connection

48

Contact area

H

Lifting axis

Claims (15)

Sound transducer unit (1), in particular for in-ear headphones, for generating and / or recording sound waves in the audible wavelength range and / or in the ultrasonic range with a circuit board (2) and at least one MEMS sound transducer (3) arranged thereon, with at least a connection element (4) of the circuit board (2) is connected in an electrically conductive manner to at least one contact element (5) of the MEMS sound transducer (3),
characterized in that
the MEMS sound transducer (3) is designed as a surface-mountable component which is connected to the printed circuit board (2) by means of surface mounting. Sound transducer unit according to the preceding claim, characterized in that the connection element (4) and the contact element (5) are electrically connected to one another by means of a material connection, in particular a soldered connection (6). Sound transducer unit according to one or more of the preceding claims, characterized in that the MEMS sound transducer (3) has a membrane unit (37) which is coupled to a transducer element (35) of the MEMS sound transducer (3) and which is preferably made of a heat-resistant membrane material is trained. Sound transducer unit according to one or more of the preceding claims, characterized in that the MEMS sound transducer (3) comprises a transducer support (34), the MEMS sound transducer (3) being arranged on the circuit board (2) by means of the transducer support (34) and / or wherein the transducer carrier (34) has a first through channel (39) and / or that the circuit board (2) has a second through-channel (40) which is preferably coaxial and / or congruent with the first through-channel (39). Sound transducer unit according to one or more of the preceding claims, characterized in that the at least one contact element (5) is designed as a contact surface and / or that the at least one contact element (5) is arranged on the transducer support (34) and / or that the transducer support (34 ) has electrical lines for the transducer element (35). Sound transducer unit according to one or more of the preceding claims, characterized in that the circuit board (2) has a component side (7) facing the MEMS sound transducer (3) on which the MEMS sound transducer (3) is placed in a contact area (48) so that the contact elements (5) make contact with the connection elements (4). Sound transducer unit according to one or more of the preceding claims, characterized in that the sound transducer unit (1) has a circuit board (10) on which the circuit board (2) with the MEMS sound transducer (3) is arranged, the circuit board (2) preferably is arranged on the circuit board (10) by means of spacers (11), and / or that at least one electrical plug connection (47) is arranged between the circuit board (2) and the circuit board (10) and / or
that at least one spacer (11) electrically connects the circuit board (2) and board (10) for the exchange of electrical signals .. Sound transducer unit according to one or more of the preceding claims, characterized in that the sound transducer unit (1) has a transducer housing (16) in which at least the MEMS sound transducer (3) and / or the printed circuit board (2) are arranged, the converter housing (16) preferably having a first coupling area (28) for coupling an ear element (42) to the converter housing (16) and / or
the converter housing (16) has a second coupling area (29) for coupling a headphone unit (43) to the converter housing (16). Sound transducer unit according to one or more of the preceding claims, characterized in that the transducer housing (16) has an outlet opening (21) for sound waves and / or that the transducer housing (16) has a front volume (19) which is between the outlet opening (21) and the MEMS sound transducer (3) is arranged. Sound transducer unit according to one or more of the preceding claims, characterized in that the transducer housing (16) comprises a dust protection (17) and / or a moisture protection (18), the dust protection (17) preferably in the area of the outlet opening (21) and / or the moisture protection (18) is arranged in the area between the front volume (19) and the MEMS sound transducer (3) and / or the dust and / or moisture protection (17, 18) are preferably glued to the transducer housing (16). Sound transducer unit according to one or more of the preceding claims, characterized in that the sound transducer unit (1) has at least one second MEMS sound transducer (3a, 3b), one of the two MEMS sound transducers (3a, 3b) as a loudspeaker and the other MEMS sound transducer Sound transducer (3a, 3b) can be operated as a microphone and wherein both MEMS sound transducers (3a, 3b) are preferably arranged next to one another on the circuit board (2) or
wherein one of the two MEMS sound transducers (3a, 3b) is preferably arranged on the other MEMS sound transducer (3a, 3b). Sound transducer unit according to one or more of the preceding claims, characterized in that the printed circuit board (2) has a pressure compensation opening (32), a dam arrangement (33) preferably being arranged around the pressure compensation opening (32). Method for producing a sound transducer unit (1), in particular for in-ear headphones, for generating and / or detecting sound waves in the audible wavelength range and / or in the ultrasonic range, the sound transducer unit being designed in particular according to one or more of the preceding claims,
in which at least one MEMS sound transducer (3) is arranged on a printed circuit board (2)
and
in which at least one connection element (4) of the MEMS sound transducer (3) is electrically connected to at least one contact element (5) of the circuit board (2),
characterized in that
the at least one MEMS sound transducer (3) is a surface-mountable component which is arranged on the printed circuit board (2) by means of surface mounting. Sound generating unit (41), in particular in-ear headphones, with a sound transducer unit (1) for generating and / or detecting sound waves in the audible wavelength range and / or in the ultrasonic range,
characterized in that
the sound transducer unit (1) is designed and / or is designed according to one or more of the preceding claims. Sound generating unit according to the preceding claim, characterized in that the sound generating unit (41) has an ear element (42) which is and / or is arranged in a first coupling area (28) of the sound transducer unit (1)
that the sound generating unit (41) has a headphone unit (43) which is arranged in a second coupling area (29) of the sound transducer unit (1).

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