EP3796358A1 - Commutateur dépendant de la température - Google Patents

Commutateur dépendant de la température Download PDF

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Publication number
EP3796358A1
EP3796358A1 EP20196416.0A EP20196416A EP3796358A1 EP 3796358 A1 EP3796358 A1 EP 3796358A1 EP 20196416 A EP20196416 A EP 20196416A EP 3796358 A1 EP3796358 A1 EP 3796358A1
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EP
European Patent Office
Prior art keywords
temperature
switch
dependent
switching mechanism
medium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP20196416.0A
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German (de)
English (en)
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EP3796358B1 (fr
Inventor
Marcel P. Hofsaess
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Individual
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Individual
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00—Thermally-actuated switches
    • H01H37/02—Details
    • H01H37/32—Thermally-sensitive members
    • H01H37/52—Thermally-sensitive members actuated due to deflection of bimetallic element
    • H01H37/54—Thermally-sensitive members actuated due to deflection of bimetallic element wherein the bimetallic element is inherently snap acting
    • H01H37/5409—Bistable switches; Resetting means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00—Thermally-actuated switches
    • H01H37/002—Thermally-actuated switches combined with protective means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00—Thermally-actuated switches
    • H01H37/02—Details
    • H01H37/04—Bases; Housings; Mountings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00—Thermally-actuated switches
    • H01H37/02—Details
    • H01H37/32—Thermally-sensitive members
    • H01H37/52—Thermally-sensitive members actuated due to deflection of bimetallic element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00—Thermally-actuated switches
    • H01H37/02—Details
    • H01H37/60—Means for producing snap action
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00—Thermally-actuated switches
    • H01H37/02—Details
    • H01H37/64—Contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00—Thermally-actuated switches
    • H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H9/00—Details of switching devices, not covered by groups H01H1/00 - H01H7/00
    • H01H9/10—Adaptation for built-in fuses
    • H01H9/104—Adaptation for built-in fuses with interlocking mechanism between switch and fuse
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
    • H01H11/0006—Apparatus or processes specially adapted for the manufacture of electric switches for converting electric switches
    • H01H2011/0043—Apparatus or processes specially adapted for the manufacture of electric switches for converting electric switches for modifying the number or type of operating positions, e.g. momentary and stable
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00—Thermally-actuated switches
    • H01H37/02—Details
    • H01H37/32—Thermally-sensitive members
    • H01H37/52—Thermally-sensitive members actuated due to deflection of bimetallic element
    • H01H37/54—Thermally-sensitive members actuated due to deflection of bimetallic element wherein the bimetallic element is inherently snap acting
    • H01H37/5427—Thermally-sensitive members actuated due to deflection of bimetallic element wherein the bimetallic element is inherently snap acting encapsulated in sealed miniaturised housing

Definitions

  • the present invention relates to a temperature-dependent switch which has a first and a second stationary contact and a temperature-dependent switching mechanism with a movable contact member.
  • the switching mechanism presses the contact element against the first contact and, via the contact element, establishes an electrically conductive connection between the two contacts.
  • the switching mechanism keeps the contact member at a distance from the first contact and thus interrupts the electrically conductive connection between the two contacts.
  • the temperature-dependent switching mechanism has a temperature-dependent snap part which, when a switching temperature is exceeded, snaps from its geometric low-temperature configuration to its geometric high-temperature configuration and, when the switch-back temperature is subsequently fallen below, snaps back from its geometric high-temperature configuration to its geometric low-temperature configuration.
  • a locking lock is also provided, which prevents the switch, which has been opened, from being closed again by holding the switching mechanism in its second switching position.
  • Such temperature-dependent switches are used in a known manner to protect electrical devices from overheating.
  • the switch is electrically connected in series with the device to be protected and its supply voltage and is mechanically arranged on the device in such a way that it is in thermal connection with it.
  • a temperature-dependent switching mechanism ensures that the two stationary contacts of the switch are electrically connected to one another below the response temperature of the switching mechanism are connected. Thus, the circuit is closed below the response temperature and the load current of the device to be protected can flow through the switch.
  • the switching mechanism lifts the movable contact element from the mating contact, whereby the switch is opened and the load current of the device to be protected is interrupted.
  • the now de-energized device can then cool down again.
  • the switch that is thermally coupled to the device also cools down again and would then actually close again automatically.
  • a locking mechanism ensures that this switching back does not take place in the cooling position, so that the device to be protected cannot switch itself on again automatically after it has been switched off.
  • the locking device locks the switching mechanism mechanically so that the switching mechanism cannot close again after it has been opened once, even if there are strong vibrations or temperature fluctuations.
  • switches of this type which do not close again after being opened once, are also referred to as single-use switches.
  • opening the switch is understood to mean the interruption of the electrically conductive connection between the two contacts of the switch and not an opening of the switch housing in the mechanical sense.
  • Another switch of this type is from the DE 10 2013 101 392 A1 known.
  • This switch has a temperature-dependent switching mechanism with a temperature-dependent bimetal snap-action disk and a bistable spring disk which carries a movable contact or a current transmission element.
  • the bimetal snap disk When the bimetal snap disk is on a temperature above its response temperature is heated, it lifts the contact or the current transmission element against the force of the spring washer from the mating contact or contacts and thereby pushes the spring washer into its second stable configuration in which the switching mechanism is in its high-temperature position.
  • the snap-action disk is a bistable snap-action disk which, depending on the temperature, assumes either a high-temperature configuration or a low-temperature configuration.
  • the spring washer is a circular spring snap-action disk to which the contact member is attached in the middle.
  • the contact member is, for example, a movable contact part which is pressed by the spring snap-action disk against the first stationary contact which is arranged on the inside on a cover of the housing of the known switch. With its edge, the spring snap-action disk is pressed against an inner base of a lower part of the housing, which acts as a second contact. In this way, the self-electrically conductive spring snap-action disk creates an electrically conductive connection between the two mating contacts.
  • the bimetal snap disk In its low-temperature position, the bimetal snap disk lies loosely on the contact part. If the temperature of the bimetal snap disk increases, it jumps to its high temperature position, in which it presses with its edge on the inside of the upper part of the housing and with its center presses on the spring snap disk so that it moves from its first into their second stable configuration jumps, whereby the movable contact part is lifted from the stationary contact and the switch is opened.
  • the bimetal snap-action disk jumps back to its low-temperature position. It comes with its edge in contact with the edge of the spring snap disk and with its center in contact with the upper part of the housing. However, the actuating force of the bimetal snap disk is not sufficient to allow the spring snap disk to jump back into its first configuration.
  • the one from the DE 10 2007 042 188 B3 Known switch remains open after a single opening until it has cooled to a temperature below room temperature, for which purpose a cold spray can be used, for example.
  • the spring snap disk is fixed with its edge on the lower part of the housing, while the bimetallic snap disk is provided between the spring snap disk and the inner bottom of the lower part.
  • contact plates are Spring snap disk and bimetal snap disk are captively connected to one another by a centrally running rivet.
  • this switch Due to its design, this switch therefore has a self-holding function. In the event of strong mechanical vibrations, however, in rare cases, the spring snap-action disk can also spring back unintentionally.
  • a temperature-dependent switch with a current transmission element designed as a contact bridge in which the contact bridge is pressed against two stationary mating contacts via a closing spring.
  • the contact bridge is in contact with a temperature-dependent switching mechanism via an actuating bolt, which consists of a bimetallic snap disk and a spring washer, both of which are clamped at their edge.
  • the spring washer and the bimetal snap disk are both bistable in this switch, the bimetal snap disk in a temperature-dependent manner and the spring washer in a temperature-independent manner.
  • the bimetal snap disk presses the spring washer into its second configuration, in which it presses the actuating bolt against the contact bridge and lifts it against the force of the closing spring from the stationary mating contacts.
  • this switch has the disadvantage that, in the open state, the spring washer lifts the contact bridge against the force of the closing spring from the mating contacts, so that the spring washer in its second configuration must reliably overcome the force of the closing spring.
  • the closing spring ensures that the contact bridge rests securely on the mating contacts in the closed state, a spring washer with very high stability is required in the second configuration.
  • Another switch with three switch positions is from the DE 86 25 999 U1 known.
  • a spring tongue clamped in on one side is provided, which at its free end carries a movable contact part which cooperates with a fixed counter-contact.
  • a dome is formed on this spring tongue, which is pressed into its second configuration by a bimetal plate also fastened to the spring tongue, in which it spaces the movable contact part from the stationary mating contact.
  • the dome must hold the movable contact part at a distance from the fixed mating contact against the closing force of the spring tongue clamped in on one side, so that the dome in its second configuration has to apply a high actuating force.
  • the known switch thus has the disadvantages already discussed above, namely that high actuating forces have to be overcome, which leads to high production costs and an unsafe state in the cooling position.
  • the present invention is based on the object of developing the switch mentioned at the beginning in such a way that it is simpler and therefore more cost-effective to manufacture and yet a reliable interruption of the circuit is ensured even in the cool-down position of the switch and in the event of strong vibrations.
  • this object is achieved in a switch of the type mentioned in that the locking device has a fusible medium which is designed to melt when a temperature of the switch exceeds a melting temperature of the medium, in the molten state with part of the switching mechanism in To make contact when it is in its second switch position, and then to solidify again and thereby lock the switching mechanism in its second switch position when the temperature of the switch falls below the melting temperature of the medium again.
  • the locking mechanism of the rear derailleur is similar to that of the DE 10 2018 100 890 B3 known switch locked, it cannot close again after opening it once, even if strong mechanical vibrations occur.
  • the switch is consequently also locked, which is used synonymously in the context of the present invention.
  • the switch according to the invention is thus prevented from switching back.
  • the switching mechanism according to the present invention is not mechanically locked by locking. Instead, the switching mechanism is locked using a fusible medium that comes into contact with the switching mechanism in its second switching position (open position) and solidifies when the switch cools below the melting temperature of the medium.
  • the solidification of the medium preferably creates an adhesive connection, particularly preferably a material connection, between part of the switching mechanism and part of the switch housing in which the switching mechanism is arranged.
  • the switching mechanism thus adheres to part of the switch housing as soon as the medium solidifies. The rear derailleur can then no longer be moved.
  • the temperature-dependent snap part tries to snap back into its geometric low-temperature configuration when it reaches or falls below its switch-back temperature and press the movable contact member against the first contact again in order to establish an electrically conductive connection between the two contacts.
  • This renewed closing of the is, however, prevented by the adhesive or cohesive connection which is brought about by the solidified medium between part of the switching mechanism and part of the switch housing.
  • the locking device generated in this way is very easy to manufacture in terms of manufacturing technology.
  • a fusible medium only needs to be arranged at a suitable point, which medium comes into contact with a part of the switching mechanism when it is in its second switch position.
  • the fusible medium should be capable of producing an adhesive connection between this part of the switching mechanism and a part of the switch housing through its solidification.
  • the fusible medium is set up to come into contact in the molten state with the movable contact member of the switching mechanism when the switching mechanism is in its second switching position.
  • the fusible medium is particularly preferably set up to establish an adhesive or material connection between the movable contact element of the switching mechanism and part of the housing as soon as the temperature of the switch falls below the melting temperature of the medium and the medium solidifies.
  • the movable contact member is usually designed as a solid component, so that it is very well suited to being connected to a part of the housing by means of the initially melted and then solidified medium. Since the movable contact member, especially on its underside, usually offers a very large contact surface for such an adhesive or material connection with the housing, a mechanically very stable locking lock can be generated by the adhesive or material connection.
  • the meltable medium is stored in a reservoir which is arranged in the housing.
  • the fusible medium is stored in a reservoir with which the movable contact member comes into contact when the temperature-dependent snap part snaps from its geometric low-temperature configuration to its geometric high-temperature configuration and moves the switching mechanism from its first switch position to its second switch position .
  • Such a reservoir can be implemented, for example, by a recess, an essentially cup-shaped receptacle or a simple container which is arranged in the interior of the switch.
  • the storage of the fusible medium within such a reservoir has the advantage that the medium does not distribute itself within the switch after it has melted and could thereby impair other components of the switch. Furthermore, such a reservoir has the advantage that the position of the fusible medium can be precisely aligned relative to the switching mechanism, so that it can be guaranteed that the movable contact member is in the second switching position of the switching mechanism with the reservoir or the one located therein fusible medium comes into contact.
  • the housing has a lower part closed by an upper part, the first stationary contact or each of the two stationary contacts being arranged on an inner side of the upper part, and the reservoir being arranged in the lower part in such a way that that the movable contact member comes into contact with the medium with its underside facing away from the upper part when the temperature-dependent snap part snaps from its geometric low-temperature configuration into its geometric high-temperature configuration and brings the switching mechanism from its first switch position to its second switch position.
  • the reservoir is particularly preferably arranged on an inner bottom surface of the lower part below the movable contact member.
  • the reservoir is integrated directly into the inner bottom surface of the lower part.
  • a closed contour that serves as a receiving basin for the fusible medium can be introduced into the inner bottom surface.
  • the reservoir can also be formed by a bead protruding from the inner bottom surface be formed, which forms a closed, for example circular contour that surrounds the fusible medium.
  • the reservoir has a container which is connected to the lower part with a force fit, form fit and / or material fit.
  • the container can, for example, be a type of inlay that is inserted into the lower part of the housing and welded, soldered or glued to the inner bottom surface.
  • the container can be crimped to the inner bottom surface of the lower part or fastened to it in a clamping manner.
  • the fusible medium is preferably a solder.
  • the fusible medium is particularly preferably a soft solder. In principle, however, a hard solder can be used.
  • solder has the particular advantage that it creates a mechanically extremely stable, cohesive connection between the part of the switching mechanism and the part of the housing, which are connected to one another by the solder.
  • the melting temperature of the medium or solder is higher than the reset temperature of the temperature-dependent snap part.
  • the material connection produced by the solidified medium which holds the switching mechanism in its second switch position, prevents the temperature-dependent snap part from snapping over from its high-temperature configuration back to its low-temperature configuration.
  • the melting temperature of the meltable medium or solder is lower than the switching temperature of the temperature-dependent snap part.
  • the melting temperature of the medium or solder does not necessarily have to be lower than the switching temperature of the temperature-dependent snap part. It can also be slightly higher than the switching temperature of the temperature-dependent snap-in part and, for example, be in the range of the overshoot temperature of the switch.
  • the "overshoot temperature” is typically the temperature or the temperature range to which the switch typically increases to a maximum after it has been switched off. Normally, after the switch has been switched off, the temperature will still overshoot a bit if it is already open, as the switch continues to heat up due to the residual heat of the device to be protected.
  • the melting temperature of the medium or solder is in the range of this overshoot temperature, the medium or solder has not yet melted when the switching mechanism comes into contact with it when it snaps into its second switching position. However, the medium or solder then melts subsequently, so that the aforementioned material connection can also be established when the switch and thus the medium or solder later cool down again to a temperature below the melting temperature of the medium or solder.
  • the switching mechanism has a temperature-independent spring part which is connected to the movable contact member, the temperature-dependent snap part when the switching temperature is exceeded acts on the spring part and thereby lifts the movable contact member from the first contact.
  • the spring part is a bistable spring part with two temperature-independent, stable geometric configurations.
  • the spring part is designed as a bistable spring washer, it is preferred that the spring washer presses the movable contact member against the first contact in its first stable configuration and keeps the movable contact member spaced apart from the first contact in its second stable configuration.
  • This has the advantage that in the closed state of the switch (in the first switching position of the switching mechanism) the spring washer produces the closing force and thus the contact pressure between the movable contact member and the first contact. This relieves the mechanical load on the temperature-dependent snap-in part, which has a positive effect on its service life and the long-term stability of its response temperature (switching temperature).
  • the spring part is designed as a bistable spring washer with two temperature-independent stable geometric configurations, this has the additional advantage that the bistable spring washer keeps the switch in its open state after opening. Even if the temperature-dependent snap part then wants to snap back into its low-temperature configuration after the switch has cooled to the reset temperature, the spring washer keeps the switch in its open position in addition to the locking device described above.
  • the melting temperature of the medium or solder is lower than the reset temperature of the temperature-dependent snap part. If the switch that is already open (switching mechanism in the second switch position) cools down to the switch-back temperature, then the locking lock is not yet activated because the medium or solder has not yet solidified. However, the bistable spring part still holds the switch in its open position. If the switch then cools down even further down to the melting temperature of the medium or solder, the locking device is ultimately also activated.
  • the temperature-dependent snap part is fixed on the movable contact member, but is otherwise freely suspended in its geometric low-temperature configuration in the interior of the housing without being supported on the housing or any other part of the switch.
  • the temperature-dependent snap part in its low-temperature configuration cannot be supported on the housing or on any other part of the switch, the temperature-dependent snap part can then not generate any closing force which presses the movable contact member against the first contact.
  • the closing force is generated by the temperature-independent spring part. If the temperature of the switch and thus also the temperature of the temperature-dependent snap part increases above its switching temperature, the temperature-dependent snap part snaps into its high-temperature configuration, in which, however, it can be supported on the temperature-independent spring part or another part of the switch and thus open the switch can.
  • the temperature-dependent snap part snaps back into its low-temperature configuration when the switch has cooled below the switch-back temperature, the temperature-dependent snap part virtually snaps "into the void" so that the switch is not closed again as a result.
  • the bistable spring part then holds the switch in its open position.
  • the locking mechanism works as soon as the medium or solder has solidified when it has reached its melting temperature.
  • the temperature-dependent snap part is preferably designed as a bistable bi- or tri-metal snap disk.
  • the movable contact member comprises a movable contact part cooperating with the first contact, and that the spring part cooperates with the second contact, wherein it is further preferred that the spring part is electrically at least in its first geometric configuration over its edge is in communication with the second contact.
  • This configuration is basically from the DE 10 2018 100 890 B3 , of the DE 10 2007 042 188 B3 or the DE 10 2013 101 392 A1 known. It causes the temperature dependent Snap part is not temperature-loaded in any position of the switch, but that the load current of the electrical device to be protected flows through the spring part.
  • the movable contact member comprises a current transmission member that interacts with both contacts.
  • the advantage here is that the switch can carry considerably higher currents than that from the DE 10 2007 042 188 B3 known switches.
  • the current transfer element arranged on the contact element ensures the electrical short circuit between the two contacts when the switch is closed, so that not only the temperature-dependent snap part, but also the temperature-independent spring part are no longer traversed by the load current, as in principle already from the DE 10 2013 101 392 A1 is known.
  • Fig. 1 is shown in a schematic, sectional side view of a switch 10, which is rotationally symmetrical in plan view and preferably has a circular shape.
  • the switch 10 has a housing 12 in which a temperature-dependent switching mechanism 14 is arranged.
  • the housing 12 comprises a pot-like lower part 16 and an upper part 18 which is held on the lower part 16 by a bent or flanged edge 20.
  • the first embodiment shown is both the lower part 16 and the upper part 18 made of an electrically conductive material, preferably made of metal. Between the lower part 16 and the upper part 18, a spacer ring 22 is arranged, which carries the upper part 18 with an insulating film 24 in between and keeps the upper part 18 at a distance from the lower part 16.
  • the insulating film 24 ensures electrical insulation of the upper part 18 from the lower part 16.
  • the insulating film 24 also provides a mechanical seal that prevents liquids or contaminants from entering the interior of the housing from the outside.
  • the lower part 16 and the upper part 18 in this exemplary embodiment are each made of electrically conductive material, thermal contact with an electrical device to be protected can be established via their outer surfaces.
  • the outer surfaces also serve for the electrical external connection of the switch 10 at the same time.
  • a further insulation layer 26 may be attached.
  • the switching mechanism 14 has a temperature-independent spring part 28 and a temperature-dependent snap disk 30.
  • the spring part 28 is preferably designed as a bistable spring washer. This spring washer 28 accordingly has two geometric configurations that are stable, independent of temperature.
  • Fig. 1 its first configuration is shown.
  • the temperature-dependent snap disk 30 is preferably designed as a bimetal snap disk.
  • the bimetal snap disk 30 has two temperature dependent configurations, a high temperature geometric configuration and a low temperature geometric configuration.
  • the first switching position of the switching mechanism 14 shown is the bimetallic snap disk 30 in its geometric low-temperature configuration.
  • the spring washer 28 rests with its edge 32 on a circumferential shoulder 34 formed in the lower part 16, and is clamped between this shoulder 34 and the spacer ring 22.
  • the bimetal snap disk 30 is in its Fig. 1 The low-temperature configuration shown, however, is freely suspended. It hangs freely with its edge 36 and is not supported by it on any part of the housing 12 or on any other part of the switch 10.
  • the spring washer 28 With its center 40, the spring washer 28 is fixed on a movable contact member 42 of the switching mechanism 14.
  • the center 44 of the bimetallic snap disk 30 is also fixed on the movable contact member 42.
  • the movable contact member 42 has a ring 46 which surrounds the movable contact member 42. This ring 46 is preferably pressed onto the movable contact member 42. It has a circumferential shoulder 47 on which the snap disk 30 rests with its center 44.
  • the spring washer 28 is clamped between the ring 40 and the upper widened section of the contact member 42. In this way, the temperature-dependent switching mechanism 14 is a captive unit of contact element 42, spring washer 28 and bimetallic snap disk 30.
  • the switching mechanism 14 can be inserted directly into the lower part 16 as a unit.
  • the movable contact member 42 has a movable contact part 38 on its upper side.
  • the movable contact part 38 works together with a fixed mating contact 48, which is arranged on the inside of the upper part 18.
  • This mating contact 48 is also referred to here as the first stationary contact.
  • the outside of the lower part 16 serves as the second stationary contact 50.
  • the temperature of the device to be protected and thus the temperature of the switch 10 and the bimetallic snap disk 30 arranged therein increases to the switching temperature of the snap disk 30 or above this switching temperature, it snaps from its in Fig. 1 convex low-temperature configuration shown in their concave high-temperature configuration, which is shown in Fig. 1 is shown.
  • the bimetal snap disk 30 is supported with its edge 36 on part of the switch 10, in this case on the edge 32 of the spring washer 28. With its center 44, the bimetal snap disk 30 pulls the movable contact member 42 downwards and downwards lifts the movable contact part 38 from the first stationary contact 48.
  • Fig. 2 shows the high temperature position of the switch 10 in which it is open. The circuit is thus interrupted.
  • the spring washer 30 snaps when it is reached the switch-back temperature back to its low-temperature position, as shown, for example, in Fig. 1 is shown. If the bimetallic snap disk 30 cannot be supported on a part of the switch 10 in this low-temperature position, it snaps into the void, as it were. Because of the bistability of the temperature-independent spring washer 28, the switch 10 would then remain open anyway.
  • a locking device 51 in any case.
  • This closing lock 51 is brought about by a fusible medium 54 which is arranged on the inner bottom surface 56 of the lower part 16.
  • This fusible medium is preferably a solder, particularly preferably a soft solder.
  • This solder 54 is preferably stored in a reservoir or container which is arranged on the inner bottom surface 56 and / or is integrated into it.
  • the fusible medium or solder 54 melts as soon as the temperature of the switch 10 reaches or exceeds a melting temperature of the medium or solder 54. If the solder 54 then comes into contact with part of the switching mechanism 14 in this molten state and then solidifies again when the switch 10 and thus the solder 54 cool down again to a temperature below the melting temperature of the solder 54, the then solidified solder for a cohesive or at least adhesive connection between the part of the switching mechanism 14 with which it comes into contact in the molten state and the lower part 16 of the switch 10.
  • the movable contact member 42 comes into contact with the solder 54 as soon as the switch 10 is opened when the switching temperature is reached and the switching mechanism 14 is brought into its second switching position with the aid of the bimetal snap disk 30, as shown in FIG Fig. 2 is shown.
  • the underside 55 of the movable contact member 42 comes into contact with the solder 54.
  • the movable contact member 42 preferably dips at least partially with its underside 55 into the reservoir 52 filled with the solder 54 when the second switching position of the switching mechanism 14 is reached.
  • the solder 54 should then have already melted. Accordingly, a solder 54 is preferably selected whose melting temperature is below or in the range of the switching temperature of the bimetal snap disk 30.
  • the melting temperature of the solder 54 can also be slightly higher than the switching temperature of the bimetal snap-action disk 30, since the switch 10 typically continues to heat up a little even after it has been opened and the circuit is interrupted.
  • the switch 10 typically continues to heat up a little even after it has been opened and the circuit is interrupted.
  • the device to be protected After reaching this so-called overshoot temperature at the latest, the device to be protected, and thus also the switch 10, typically cools down again. As soon as the melting temperature of the solder 54 is undershot in this cooling process, it consequently solidifies. The underside 55 of the movable contact member 42 then adheres firmly to the inner bottom surface 56 of the lower part 16. The lock 51 is thus activated.
  • the switch 10 cools down to the reset temperature of the bimetal snap-action disk 30, it tries to snap back into its low-temperature position, but this is then done by the closing lock 51, which the movable contact member 42 in its in Fig. 2 shown position is prevented.
  • the locking lock 51 caused by the solidified solder 54 prevents the switch 10 from switching back, even if the bimetallic snap disk 30 can be supported on the raised inner base 53 or on another part of the switch 10 when it snaps back into its low-temperature position.
  • the melting temperature of the Lot 54 should be selected higher than the reset temperature of the bimetal snap disk 30, since the locking lock must already be activated in such a case (i.e. the solder must have already cooled down) before the bimetal snap disk 30 snaps from its high temperature position back into its low temperature position .
  • the solder 54 used for the locking device 51 can in principle also come into contact with another part of the switching mechanism 14 when this is in its second switching position, for example with the bimetal snap disk 30.
  • the production of a material connection between the movable contact member 42 and the lower part 16 of the housing 12 with the aid of the solder 54 has the advantage that the movable contact member 42 is a relatively large and stable component that provides a large contact surface for such a material connection.
  • enough space for attaching such a reservoir 52 is provided on the inner bottom surface 56 of the lower part 16 anyway.
  • the reservoir 52 in which the solder 54 is preferably stored, can be produced in various ways. It can be a simple recess or hole in the inner bottom surface 56. Likewise, the reservoir 52 can be provided, for example, as a circular bead which is arranged on the upper side of the inner bottom surface 56 or introduced into it and forms a closed contour within which the solder 54 is stored. In principle, however, it is also possible to use a separate vessel or a circumferential wall (for example a ring) as a separate component in the housing 12 of the switch 10 and to connect it to the inner bottom surface 56 in a non-positive, positive or material fit.
  • the medium 54 does not necessarily have to be a solder. It can also be a different fusible material or an adhesive which, in the second switching position of the switching mechanism 14, produces an adhesive connection between part of the switching mechanism 14 and part of the housing 12.
  • Fig. 3 and 4th show a second embodiment of the switch 10 'according to the invention.
  • Fig. 3 shows the closed position of the switch 10 ', in which the switching mechanism 14 'is in its first switch position.
  • Fig. 4 shows the open position of the switch 10 ', in which the switching mechanism 1' is in its second switching position.
  • the second embodiment shown differs from that in FIG Fig. 1 and 2
  • the first exemplary embodiment shown essentially by the structure of the housing 12 'and by the structure of the switching mechanism 14'.
  • the closing lock 51 is, however, also here brought about by a fusible medium 54, which is preferably arranged in a reservoir 52 on the inner bottom surface 56 of the lower part 16 'and in the second switching position of the switching mechanism 14' for a cohesive or at least adhesive connection between the contact member 42 'and the lower part 16' and thus prevents the switch 10 'from switching back.
  • the lower part 16 ' is in the Fig. 3 and 4th shown, second embodiment again made of electrically conductive material.
  • the flat upper part 18 ′ is here made of electrically insulating material. It is held on the lower part 16 'by a bent edge 20'.
  • a spacer ring 22 ' is provided between the upper part 18' and the lower part 16 ', which keeps the upper part 18' at a distance from the lower part 16 '.
  • the upper part 18 ' On its inside 58, the upper part 18 'has a first stationary contact 48' and a second stationary contact 50 '.
  • the contacts 48 'and 50' are designed as rivets which extend through the upper part 18 'and end on the outside in the heads 60, 62, which are used for the external connection of the switch 10'.
  • the movable contact member 52 ' here comprises a current transmission member 64, which is designed here as a contact plate, the top side of which is coated in an electrically conductive manner, so that it can be used in the case of FIG Fig. 3 system shown on the contacts 48 'and 50' for an electrically conductive connection between the two contacts 48 'and 50'.
  • the current transmission element 64 is connected to the spring washer and the bimetallic snap disk 30 via a rivet 66, which is also to be regarded as part of the contact element 42 ′. In the second switching position of the switching mechanism 14 ', this rivet 66 comes into contact with the fusible medium or solder with its underside 55 (see FIG Fig.
  • FIG. 3 and 4th A major advantage of the in Fig. 3 and 4th
  • the switch structure shown in the figure can be seen in the fact that, in contrast to the in Fig. 1 and 2
  • the illustrated embodiment of the switch here neither through the spring washer 28 nor through the bimetallic snap disk 30 in the closed state of the switch does a current flow. This only flows from the first external connection 60 via the first stationary contact 48 ′, the current transmission element 64 and the second stationary contact 50 ′ to the second external connection 62.

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  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Thermally Actuated Switches (AREA)
EP20196416.0A 2019-09-20 2020-09-16 Commutateur dépendant de la température Active EP3796358B1 (fr)

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Application Number Priority Date Filing Date Title
DE102019125452.3A DE102019125452B4 (de) 2019-09-20 2019-09-20 Temperaturabhängiger Schalter

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EP3796358A1 true EP3796358A1 (fr) 2021-03-24
EP3796358B1 EP3796358B1 (fr) 2024-01-03

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US (1) US11264194B2 (fr)
EP (1) EP3796358B1 (fr)
CN (1) CN112542350B (fr)
DE (1) DE102019125452B4 (fr)
DK (1) DK3796358T3 (fr)

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DE102023104836B3 (de) 2023-02-28 2024-05-16 Marcel P. HOFSAESS Temperaturabhängiges Schaltwerk und temperaturabhängiger Schalter

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Publication number Priority date Publication date Assignee Title
DE102019128367B4 (de) 2019-10-21 2021-06-10 Marcel P. HOFSAESS Temperaturabhängiger schalter

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DE2544201A1 (de) 1975-10-03 1977-04-07 Inter Control Koehler Hermann Rueckstellbarer temperaturbegrenzer
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DE102023104836B3 (de) 2023-02-28 2024-05-16 Marcel P. HOFSAESS Temperaturabhängiges Schaltwerk und temperaturabhängiger Schalter

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Publication number Publication date
US20210090833A1 (en) 2021-03-25
DE102019125452B4 (de) 2021-04-22
CN112542350B (zh) 2023-12-26
DK3796358T3 (da) 2024-04-02
EP3796358B1 (fr) 2024-01-03
US11264194B2 (en) 2022-03-01
CN112542350A (zh) 2021-03-23
DE102019125452A1 (de) 2021-03-25

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