EP3794639A1 - Contact arrangement, electronics assembly comprising the contact arrangement and method for forming the contact arrangement - Google Patents

Contact arrangement, electronics assembly comprising the contact arrangement and method for forming the contact arrangement

Info

Publication number
EP3794639A1
EP3794639A1 EP19724407.2A EP19724407A EP3794639A1 EP 3794639 A1 EP3794639 A1 EP 3794639A1 EP 19724407 A EP19724407 A EP 19724407A EP 3794639 A1 EP3794639 A1 EP 3794639A1
Authority
EP
European Patent Office
Prior art keywords
solder
contact arrangement
partner
joining partner
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP19724407.2A
Other languages
German (de)
French (fr)
Inventor
Thomas Suenner
Juergen ZIPPRICH
Christian Schiele
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of EP3794639A1 publication Critical patent/EP3794639A1/en
Withdrawn legal-status Critical Current

Links

Classifications

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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492—Bases or plates or solder therefor
    • H01L23/4922—Bases or plates or solder therefor having a heterogeneous or anisotropic structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
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    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8312—Aligning
    • H01L2224/83143—Passive alignment, i.e. self alignment, e.g. using surface energy, chemical reactions, thermal equilibrium
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    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
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    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83193—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
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Abstract

A contact arrangement (100) has a layer stack of three assembly partners (10, 20, 30) provided one above the other, each central assembly partner (20) being integrally bonded to its respective assembly partners (30, 10) lying above and below by a layer of solidified solder (40). Each of the respective assembly partners (30, 10) lying above and/or below has a level solderable side surface (30.1, 10.2) facing the central assembly partner (20). In addition, a sub-region with a smaller surface area is formed within each side surface (30.1, 10.2) and acts as a connection surface (21, 23) for the solder layer (40), wherein, when the solder (40) has fused, in order to centrally position the central assembly partner (20) at least within one of the two side surfaces (30.1, 10.2), spaced apart from the outer edges (60.32, 60.33, 60.34) of the respective surface, at least one delimiting element (60, 60.3a, 60.3b) (an elevation, a depression or a cavity, in particular in the form of a slotted hole, or an outer edge (60.34, 60.32, 60.33) of the side surface (30.1)) for delimiting a solder meniscus of the solder layer (40) is formed and surrounds, in this position, the connection surface (21, 23) of the solder layer (40) in a clearly defined manner, by means of at least one outer contour portion. In a method for forming a contact arrangement (100) of this type, the assembly partners (30, 10) lying above and below are secured in a fixed position and the arrangement is heat-treated (100), wherein the solder (40) starts to fuse and the central assembly partner (20) is floatingly carried by the fused solder (40); the central assembly partner (20) then assumes a defined preferential position relative to the assembly partners (30, 10) lying above and below, by the delimitation of the solder meniscus of the solder layer (40) by at least the one delimiting element (60, 60.3a, 60.3b) formed within at least one of the side surfaces (30.1, 10.2), and the connection surface (21, 23) of the solder layer (40) is surrounded in this position, in a clearly defined manner, by means of at least one outer contour portion. The central assembly partner (20) is, for example, an electric and/or electronic component (70), in particular a power semiconductor, the assembly partner (10) lying below is, for example, a circuit carrier (80) and the assembly partner (30) lying above is a metal clip (90). Alternatively, the central assembly partner (20) is provided in the form of a heat sink, for example a metal element, or an unpopulated ceramic substrate element.

Description

Titel  title
KONTAKTANORDNUNG, ELEKTRONIKBAUGRUPPE UMFASSEND DIE KONTAKTANORDNUNG UND  CONTACT ARRANGEMENT, ELECTRONIC MODULE COMPRISING THE CONTACT ARRANGEMENT AND
VERFAHREN ZUR AUSBILDUNG DER KONTAKTANORDNUNG  PROCESS FOR DEVELOPING THE CONTACT ARRANGEMENT
Die Erfindung betrifft eine Kontaktanordnung, eine die Kontaktanordnung The invention relates to a contact arrangement, a contact arrangement
5 umfassende Elektronikbaugruppe sowie ein Verfahren zur Ausbildung der  5 comprehensive electronic assembly and a method for training the
Kontaktanordnung gemäß dem Oberbegriff der unabhängigen Ansprüche.  Contact arrangement according to the preamble of the independent claims.
Stand der Technik State of the art
10 Elektrische und/oder elektronische Bauelemente werden in vielen 10 Electrical and / or electronic components are available in many
Elektronikausführungen durch einen Reflow-Lötprozess thermisch und elektrisch mit beispielsweise einem Schaltungsträger unter Ausbildung einer elektronischen Schaltung verbunden. Um komplexe Aufbauten mit mehreren Bauelementen und Lötstellen kostengünstig hersteilen zu können, werden sämtliche  Electronics versions by a reflow soldering process thermally and electrically connected to, for example, a circuit substrate to form an electronic circuit. In order to produce complex structures with multiple components and solder joints cost-effective, all
15 Verbindungsstellen bevorzugt in einem Schritt gelötet. Im schmelzflüssigen 15 joints preferably soldered in one step. In the molten one
Zustand des Lotmittels wirken auf Grund der guten Benetzung von lötbaren Oberflächen starke Kapillarkräfte. Nicht fixierte Fügepartner, wie beispielsweise zu verlötende Chipbauelemente, schwimmen sich dabei auf eine relative Position zur lötbaren Oberfläche des Fügepartners ein, an weicher ein Minimum der freien 20 Oberflächenenergie erreicht wird. Durch das unkontrollierte Verschwimmen ergibt  Condition of the solder act due to the good wetting of solderable surfaces strong capillary forces. Non-fixed joining partners, such as chip components to be soldered, thereby float in a relative position to the solderable surface of the joining partner, at which a minimum of the free surface energy is reached. Due to the uncontrolled blurring results
sich dabei eine Verbindungsposition, die in der Regel von der Bestückposition beispielsweise des Chipbauelementes abweicht. Dies ist auch der Fall bei bestimmten Leistungsmodulen, bei welchen ein Leistungshalbleiterelement zwischen Kontaktflächen zweier elektrischer Leitelemente verlötet ist.  In this case, a connection position, which differs from the placement position, for example, the chip component usually. This is also the case with certain power modules, in which a power semiconductor element is soldered between contact surfaces of two electrical guide elements.
25 Auf Grund der guten Benetzbarkeit der Kontaktflächen bildet sich ein kleiner  Due to the good wettability of the contact surfaces, a smaller one forms
Kontaktwinkel zwischen dem oberen und unteren Leitelement und dem  Contact angle between the upper and lower guide element and the
benetzenden geschmolzenen Lotmittel aus. Ein Verschwimmen in der Ebene der Kontaktflächen ist aufgrund der geometrischen Randbedingungen möglich, da keine energetische Vorzugsposition ausgewiesen ist. Insofern ist eine lötbare 30 Oberfläche der Leitelemente auf eine Flächengröße unwesentlich größer als die  wetting molten solder from. Blurring in the plane of the contact surfaces is possible due to the geometric boundary conditions, since no energetic preferred position is identified. In this respect, a solderable surface 30 of the guide elements to an area size is insignificantly larger than that
erforderliche Verbindungsfläche mit dem Anschlusskontakt des  required connection area with the connection contact of the
Leistungshalbleiters zu beschränken. Durch die angrenzend angeordnete äußere Berandung der Kontaktoberflächen des oberen bzw. unteren Leitelementes kann eine Vorzugsposition definiert eingehalten werden, indem das  Power semiconductor. By the adjacently arranged outer boundary of the contact surfaces of the upper and lower guide element, a preferred position can be defined defined by the
35 Leistungshalbleiterelement sich in Abhängigkeit der Benetzungsfähigkeit der 35 power semiconductor element depending on the wetting ability of the
Kontaktoberfläche relativ zur deren Berandung einschwimmt. Offenbarung der Erfindung Contact surface floats relative to the boundary. Disclosure of the invention
Vorteile advantages
Der Erfindung liegt die Aufgabe zu Grunde, in einer gestapelten The invention is based on the object, in a stacked
Kontaktanordnung von drei miteinander zu verlötenden Fügepartner die Contact arrangement of three join partners to be soldered together
Lageposition des mittleren Fügepartners relativ zu den beiden anderen Position of the middle joining partner relative to the other two
Fügepartnern definiert festzulegen ohne eine Begrenzung deren lötbaren Oberflächengrößen. Defined joining partners defined without a limit on their solderable surface sizes.
Diese Aufgabe wird durch eine Kontaktanordnung, eine die Kontaktanordnung umfassende Elektronikbaugruppe sowie ein Verfahren zur Ausbildung der Kontaktanordnung gemäß den unabhängigen Ansprüchen gelöst. This object is achieved by a contact arrangement, an electronic assembly comprising the contact arrangement and a method for forming the contact arrangement according to the independent claims.
Ausgegangen wird von einer Kontaktanordnung als Schichtstapel von drei übereinander angeordneten Fügepartnern, wobei der mittlere Fügepartner mit jeweils einer Schicht aus einem verfestigten Lotmittel mit dem darüberliegenden und mit dem darunterliegenden Fügepartner stoffverbunden ist. Dabei weist der darüberliegende und/oder der darunterliegende Fügepartner jeweils eine dem mittleren Fügepartner zugwandte ebene und lötbare Seitenoberfläche auf. Ferner ist innerhalb dieser jeweiligen Seitenoberfläche ein flächenkleinerer Teilbereich als Verbindungsfläche der Lotschicht ausgebildet, wobei zur Zentrierung des mittleren Fügepartners während eines geschmolzenem Zustands des Lotmittels zumindest innerhalb einer der beiden Seitenoberflächen und in einem Abstand zu deren jeweiligen Außenkanten zumindest ein Begrenzungselement für einen Lötmeniskus der Lotschicht ausgebildet ist und dort die Verbindungsfläche der Lotschicht über zumindest einen Außenkonturabschnitt definiert abschließt. Vorteilhaft wird innerhalb einer ansonsten beliebigen Größe einer lötbaren Seitenoberfläche der Lötmeniskus innerhalb der Seitenoberfläche wirkungsvoll unterbrochen. Auf diese Weise kann ein Verschwimmen des mittleren The starting point is a contact arrangement as a layer stack of three joining partners arranged one above the other, wherein the middle joining partner is material-bonded with one layer each of a solidified solder to the overlying and to the underlying joining partner. In this case, the overlying and / or the underlying joining partner each have a planar and solderable side surface zugrewte the middle joining partner. Furthermore, within this respective side surface, a smaller area than the joining surface of the solder layer is formed, wherein at least one delimiting element for a solder meniscus of the solder layer is formed for centering the middle joining partner during a molten state of the solder at least within one of the two side surfaces and at a distance from their respective outer edges is there and closes the connection surface of the solder layer defines at least one outer contour portion defined. Advantageously, within an otherwise arbitrary size of a solderable side surface, the solder meniscus within the side surface is effectively interrupted. In this way, a blurring of the middle
Fügepartners auf eine Lageposition auf der lötbaren Seitenoberfläche außerhalb des dort lokal angeordneten Begrenzungselementes unterbunden werden. Joining partners are suppressed to a position on the solderable side surface outside of there locally arranged limiting element.
Insgesamt eröffnen sich dadurch nun neue Möglichkeiten der Gestaltung und des Einsatzes von Fügepartnern, bei denen beispielsweise einstückig ausgebildete lötbare Oberflächen vorliegen, deren Flächengröße dabei aber weit über der Größe einer ansonsten erforderlichen Verbindungsfläche mit dem mittleren Fügepartner liegt. On the whole, this opens up new possibilities for the design and use of joining partners, in which, for example, integrally formed solderable surfaces are present whose surface area, however, far exceeds the Size of an otherwise required connection surface with the middle joint partner is.
In einer vorteilhaften Ausführung der Kontaktanordnung ist das In an advantageous embodiment of the contact arrangement is the
Begrenzungselement eine durchgehende Begrenzungskante. Charakteristisch für eine solche Kante ist dabei eine dort ausgebildete eindeutige Limiting element a continuous boundary edge. Characteristic of such an edge is a unique formed there
Richtungsänderung einer Flächenorientierung, wobei die Änderung über einen lokal kleinbegrenzten Flächenbereich erfolgt (umgangssprachig„scharfkantig“). Insbesondere ändert sich dabei die Flächenorientierung mit einer Change in direction of a surface orientation, whereby the change takes place over a locally small area (colloquially "sharp-edged"). In particular, the surface orientation changes with a
Winkelabweichung von bevorzugt 90° oder mehr gegenüber der ursprünglichen Flächenorientierung. Insgesamt bietet die Begrenzungskante damit einen einfachen Wirkeingriff auf den Lötmeniskus als begrenzende Barriere für eine laterale Weiterbewegung. Weiter bevorzugt ist die Begrenzungskante geradlinig ausgebildet. Alternativ kann die Begrenzungskante partiell einfach oder mehrfach unterbrochen sein, solange der genannte Wirkeingriff auf den Lötmeniskus erhalten bleibt. Angular deviation of preferably 90 ° or more compared to the original surface orientation. Overall, the boundary edge thus provides a simple action to act on the solder meniscus as a limiting barrier for lateral movement. More preferably, the boundary edge is formed in a straight line. Alternatively, the boundary edge may be partially interrupted one or more times, as long as said action on the solder meniscus is maintained.
Die Formausprägung der Begrenzungskante kann dabei durch verschiedene Ausführungen begründet sein. Eine günstige Ausführung zeigt sich darin, dass die Begrenzungskante eine von der Seitenoberfläche abstehende Formerhöhung abschließt, insbesondere in Form eines Steges. In einer alternativen vorteilhaften Ausführung schließt die Begrenzungskante eine in der Ebene der The shape of the boundary edge can be justified by various designs. A favorable embodiment is shown in that the boundary edge terminates a protruding from the side surface mold elevation, in particular in the form of a web. In an alternative advantageous embodiment, the boundary edge closes one in the plane of the
Seitenoberfläche ausgebildete Form Vertiefung oder Formaussparung ab, insbesondere in Form eines Langloches. Side surface formed form recess or mold recess from, in particular in the form of a long hole.
In Hinblick auf eine einfache und günstige Herstellung ist das In terms of a simple and inexpensive production is the
Begrenzungselement als Formausprägung, als Formausstanzung oder als Formabbiegung innerhalb des darüberliegenden und/oder des darunterliegenden Fügepartners ausgebildet. Defining element formed as a form of expression, as a punched out or as a form deflection within the overlying and / or the underlying joining partner.
Weitere Vorteile ergeben sich bei einer Ausführungsform, bei welcher das Begrenzungselement parallel oder senkrecht zu mindestens einer Außenkante der Seitenoberfläche ausgebildet ist. Auf diese Weise kann in der Regel eine kompaktere Kontaktanordnung erreicht werden. Um die Lagepositionierung des mittleren Fügepartners zumindest in noch einer weiteren Raumrichtung in der Ebene der Seitenoberfläche zu definieren, bietet sich eine Ausführungsform der Kontaktanordnung an, bei welcher durch zumindest eine Außenkante der Seitenoberfläche ein weiteres, andersartiges Begrenzungselement für den Lötmeniskus der Lotschicht ausgebildet ist. Dies bietet sich insbesondere dann an, wenn der Fügepartner anwendungsspezifisch an der Seite einer solchen Außenkante nicht weiter über den mittleren Further advantages result in an embodiment in which the limiting element is formed parallel or perpendicular to at least one outer edge of the side surface. In this way, a more compact contact arrangement can be achieved in the rule. In order to define the positional positioning of the middle joining partner in at least one further spatial direction in the plane of the side surface, an embodiment of the contact arrangement is suitable in which a further different boundary element for the solder meniscus of the solder layer is formed by at least one outer edge of the side surface. This is particularly useful when the joining partner application-specific on the side of such an outer edge not over the middle
Fügepartner überstehen muss. Auf diese Weise kann die Ausbildung zumindest eines Begrenzungselementes innerhalb einer der Seitenoberflächen entfallen, so dass die Herstellung kostengünstig erfolgen kann. Must withstand joint partner. In this way, the formation of at least one delimiting element within one of the side surfaces can be dispensed with, so that the production can be carried out inexpensively.
Grundsätzlich können vorteilhaft ein Begrenzungselement innerhalb einer der Seitenoberflächen gepaart werden mit zumindest einem weiteren gleichartigen Begrenzungselement und/oder mit zumindest einer Außenkante einer der Seitenoberflächen als weiteres Begrenzungselement. Dabei sind dann zumindest zwei nächstbenachbarte zuvor genannte Begrenzungselemente senkrecht oder parallel zueinander ausgebildet, um den Wirkeingriff auf den Lötmeniskus in zumindest zwei Raumrichtungen sicherzustellen. Eine Erweiterung auf drei Raumrichtungen ergibt sich durch eine U-förmige Anordnung der zuvor genannten Begrenzungselemente, wogegen eine Anordnung von vier zuvor genannten Begrenzungselemente in jeweils eine Raumrichtung keinen In principle, a limiting element can be advantageously paired within one of the side surfaces with at least one further identical limiting element and / or with at least one outer edge of one of the side surfaces as a further limiting element. In this case, then at least two next adjacent previously mentioned boundary elements are formed perpendicular or parallel to each other to ensure the operative engagement with the solder meniscus in at least two spatial directions. An extension to three spatial directions results from a U-shaped arrangement of the aforementioned boundary elements, whereas an arrangement of four aforementioned boundary elements in each one spatial direction no
Freiheitsgrad der Bewegung innerhalb der Ebene der Seitenoberfläche mehr offenhält. Dies schließt auch eine Ausführung mit ein, bei welcher keine Freedom of movement within the plane of the side surface more open. This also includes an embodiment in which no
Außenkante der jeweiligen Seitenoberfläche als ein Begrenzungselement verwendet ist. Abschließend ist zu erwähnen, dass eine gewisse Kongruenz der Ausführung erreichbar ist, in dem zumindest eine der zuvor genannten Outside edge of the respective side surface is used as a limiting element. Finally, it should be mentioned that a certain congruence of the execution is achievable, in which at least one of the aforementioned
Begrenzungselemente aus der vorgesehenen Anordnung auf die Limiting elements of the arrangement provided on the
Seitenoberfläche des jeweils anderen äußeren Fügepartners gegenüberliegend versetzt ist. Side surface of the other outer joint partner is offset from each other.
In einer vorteilhaften Weiterbildung der Kontaktanordnung entspricht die In an advantageous embodiment of the contact arrangement corresponds to
Verbindungsfläche im Wesentlichen einer rechteckigen oder quadratischen Querschnittsfläche, wobei zumindest dann zwei senkrecht und/oder zwei parallel zueinanderstehende Querschnittskonturabschnitte durch die zuvor genannten Begrenzungselemente definiert sind. In einer besonderen Ausführungsform der Kontaktanordnung ist/sind der Connecting surface substantially a rectangular or square cross-sectional area, wherein at least two perpendicular and / or two mutually parallel cross-sectional contour sections are defined by the aforementioned boundary elements. In a particular embodiment of the contact arrangement is / are the
darüberliegende Fügepartner und/oder der darunterliegende Fügepartner ein elektrischer und/oder thermischer Leiter, insbesondere als Teil eines Metallclips. Overlying joining partners and / or the underlying joining partner an electrical and / or thermal conductor, in particular as part of a metal clip.
Vorteilhafterweise kann dabei ein Fügepartner einstückig aus einem gleichen Advantageously, a joining partner can be made in one piece from one and the same
Material vorgesehen werden oder zumindest eine gleichbleibende Oberfläche als die lötbare Seitenoberfläche beibehalten werden. Material are provided or at least a consistent surface to be maintained as the solderable side surface.
In einer weiteren oder weitergebildeten Ausführungsform der Kontaktanordnung ist der mittlere Fügepartner ein elektrisches und/oder elektronisches Bauelement, beispielsweise ein Leistungshalbleiter oder ein Logikbauelement. Alternativ ist der mittlere Fügepartner eine Wärmesenke, beispielsweise ein Metallelement oder ein unbestücktes Keramiksubstratelement. In dieser oder anderen In a further or further developed embodiment of the contact arrangement, the middle joining partner is an electrical and / or electronic component, for example a power semiconductor or a logic component. Alternatively, the middle joining partner is a heat sink, for example a metal element or an unpopulated ceramic substrate element. In this or another
Ausführungen sind unterschiedlichste Elektronikbaugruppen umsetzbar, Versions can be implemented in a wide variety of electronic assemblies,
umfassend zumindest eine Kontaktanordnung in einer der beschriebenen comprising at least one contact arrangement in one of the described
Ausführungsformen. Die Elektronikbaugruppe ist insbesondere ein Embodiments. The electronic module is in particular a
Leistungsmodul, beispielsweise umfassend eine B2- oder B6-Brücke. Power module, for example comprising a B2 or B6 bridge.
Die Erfindung führt auch noch zu einem Verfahren zur Ausbildung einer The invention also leads to a method for forming a
Kontaktanordnung in einer der zuvor beschriebenen Ausführungsformen, mit den nachfolgenden Verfahrensschritten: Contact arrangement in one of the previously described embodiments, with the following method steps:
a) Anordnen der drei Fügepartner in einem Stapelaufbau, wobei vor oder während des Anordnens zwischen dem mittleren Fügepartner und dem darüberliegenden Fügepartner und dem darunterliegenden Fügepartner jeweils ein Lotmittel angeordnet wird,  a) arranging the three joining partners in a stack construction, wherein before or during the placing between the middle joining partner and the overlying joining partner and the underlying joining partner in each case a solder is arranged,
b) Fixieren vor oder nach dem Anordnen der Fügepartner gemäß Verfahrensschritt a) des darüberliegenden und des darunterliegenden Fügepartners in einer festen Lageposition,  b) fixing before or after arranging the joining partners according to method step a) of the overlying and the underlying joining partner in a fixed position,
c) Temperaturbehandlung der Anordnung, bei welcher das Lotmittel in einen  c) temperature treatment of the arrangement in which the solder in a
geschmolzenen Zustand gebracht wird und der mittlere Fügepartner schwimmend mittels des geschmolzenen Lotmittels getragen wird, wobei dann eine definierte Vorzugsposition des mittleren Fügepartners relativ zum darüberliegenden und darunterliegende Fügepartner eingenommen wird, indem ein Lötminiskus der Lotschicht durch mindestens das eine innerhalb zumindest einer der  molten state is brought and the middle joining partner is floatingly supported by the molten solder, in which case a defined preferred position of the middle joining partner is occupied relative to the overlying and underlying joining partner by a solder mottle of the solder layer by at least one within at least one of
Seitenoberflächen ausgebildete Begrenzungselement begrenzt wird und dort die Verbindungsfläche der Lotschicht über zumindest einen Außenkonturabschnitt definiert abgeschlossen wird, Side surfaces trained limiting element is limited and there the Connecting surface of the solder layer is completed defined over at least one outer contour portion,
d) Abkühlen der Anordnung, wobei die Vorzugsposition des mittleren Fügepartners durch das dann verfestigte Lotmittel dauerhaft erhalten wird.  d) cooling the arrangement, wherein the preferred position of the middle joining partner is permanently obtained by the then solidified solder.
Insgesamt kann die Vorzugsposition in allen Raumrichtungen innerhalb der Overall, the preferred position in all spatial directions within the
Ebene einer der Seitenoberflächen der Fügepartner durch die bereits Level of one of the side surfaces of the joining partners through the already
beschriebenen Ausführungsformen der Kontaktanordnung festgelegt werden. described embodiments of the contact arrangement are defined.
Kurze Beschreibung der Zeichnungen Brief description of the drawings
Weitere Vorteile, Merkmale und Einzelheiten der Erfindung ergeben sich aus der nachfolgenden Beschreibung bevorzugter Ausführungsbeispiele sowie anhand der Zeichnung. Diese zeigt in: Further advantages, features and details of the invention will become apparent from the following description of preferred embodiments and from the drawing. This shows in:
Fig. 1 : ein Ausführungsbeispiel einer Elektronikbaugruppe, umfassend Fig. 1: an embodiment of an electronic assembly, comprising
eine beispielhafte Kontaktanordnung als Stapelaufbau von drei Fügepartnern in einer seitlichen Schnittdarstellung, an exemplary contact arrangement as a stack construction of three joining partners in a lateral sectional view,
Fig. 2: die Elektronikbaugruppe aus Fig. 1 in einer Draufsicht. Fig. 2: the electronics assembly of Fig. 1 in a plan view.
Ausführungsformen der Erfindung Embodiments of the invention
In den Figuren sind funktional gleiche Bauelemente jeweils mit gleichen In the figures, functionally identical components are each the same
Bezugszeichen gekennzeichnet. Reference number marked.
Die Fig. 1 zeigt eine beispielhaft ausgeführte Kontaktanordnung 100 in einer seitlichen Schnittdarstellung, insbesondere als Teil einer Elektronikbaugruppe 200. Die Kontaktanordnung 100 ist dabei als Stapelaufbau von drei, zumindest in einem Stapelbereich S, übereinander angeordneten drei Fügepartnern 10, 20, 30 ausgebildet. Der mittlere Fügepartner 20 ist mit jeweils einer Schicht aus einem verfestigten Lotmittel 40 mit dem dann darüberliegenden und dem 1 shows an exemplary embodiment of a contact arrangement 100 in a lateral sectional representation, in particular as part of an electronic assembly 200. The contact arrangement 100 is designed as a stack construction of three joining partners 10, 20, 30 arranged one above the other, at least in one stacking area S. The middle joining partner 20 is each with a layer of a solidified solder 40 with the then overlying and
darunterliegenden Fügepartner 30, 10 stoffverbunden. Hierbei weisen der darüberliegende und der darunterliegende Fügepartner 30, 10 jeweils ebene und lötbare Seitenoberflächen 30.1 , 10.2 auf. Diese sind entsprechenden lötbaren Kontaktoberflächen 20.2, 20.1 des mittleren Fügepartners 20 zugewandt. Auf Seiten des darüberliegenden und darunterliegenden Fügepartners 30, 10 ist dabei aufgrund des Stoffverbundes mit dem Lotmittel 40 jeweils eine underlying joining partners 30, 10 fabric-connected. Here, the overlying and the underlying joint partners 30, 10 each have flat and solderable side surfaces 30.1, 10.2. These are corresponding solderable Contact surfaces 20.2, 20.1 of the middle joining partner 20 facing. On the side of the overlying and underlying joining partner 30, 10 is due to the substance composite with the solder 40 each one
Verbindungsfläche 21 , 23 als Teilfläche der einzelnen lötbaren Seitenoberflächen 30.1 , 10.2 begrenzt. Insofern ragt über die so belegte Teilfläche 21 , 23 noch eine ebene Restfläche der jeweiligen lötbaren Seitenoberfläche 30.1 , 10.2 hinaus, die grundsätzlich ebenso durch das Lotmittel 40 in einem geschmolzenen Zustand benetzbar ist. Die oberseitige sowie die unterseitigen Kontaktflächen 20.2, 20.1 sind beispielsweise vollständig von der Schicht des Lotmittels 40 überdeckt. Connecting surface 21, 23 limited as a partial surface of the individual solderable side surfaces 30.1, 10.2. In this respect, a flat residual surface of the respective solderable side surface 30.1, 10.2 projects beyond the partial surface 21, 23 which is thus occupied, and which is basically also wettable by the solder 40 in a molten state. The upper side and the lower side contact surfaces 20.2, 20.1 are completely covered, for example, by the layer of the solder 40.
Das Lotmittel 40 wird beispielsweise vor der Ausbildung der Kontaktanordnung 100 über einen Lostpastendruck auf den Kontaktoberflächen 20.1 , 20.2 des mittleren Kontaktpartners 20 und/oder auf den Teilflächen 21 , 23 des The solder 40 is, for example, before the formation of the contact arrangement 100 via a Lostpastendruck on the contact surfaces 20.1, 20.2 of the middle contact partner 20 and / or on the faces 21, 23 of the
darüberliegenden und/oder darunterliegenden Fügepartners 30, 10 aufgebracht und anschließend durch ein entsprechend gestapeltes Anordnen aller drei Fügepartner 10, 20, 30 zwischen diesen angeordnet. Für einen Lötvorgang werden die äußeren Fügepartner 30, 10 dann bevorzugt in eine feste overlying and / or underlying joining partners 30, 10 applied and then arranged by an appropriately stacked arranging all three joining partners 10, 20, 30 between them. For a soldering process, the outer joining partners 30, 10 then preferably in a fixed
Lageposition gebracht, beispielsweise mittels einer mit diesen jeweils Position position brought, for example by means of one with each of these
verbundenen Haltevorrichtung 50. Daraufhin wird durch eine connected holding device 50. Then is by a
Temperaturbehandlung der Kontaktanordnung 100 das Lotmittel 40 in einen geschmolzenen Zustand gebracht, so dass eine ungehinderte Benetzung der lötbaren Kontaktoberflächen 20.1 , 20.2 bzw. Seitenoberflächen 30.1 , 10.2 erfolgen kann. In diesem Zustand wird der mittlere Fügepartner 20 schwimmend vom geschmolzenen Lotmittel 40 getragen. Um dabei ein unkontrolliertes Verschwimmen und das Einnehmen einer Undefinierten Lageposition des mittleren Fügepartners 20 relativ zu den äußeren Fügpartnern 30, 10 zu verhindern, wird in der vorliegenden Kontaktanordnung 100 eine Vorzugsposition des mittleren Fügepartners 20 erzwungen. Hierzu weist zumindest einer der äußeren Fügepartner 30, 10 innerhalb dessen dem mittleren Fügepartner 20 zugewandten Seitenoberfläche 30.1 , 10.2 zumindest ein Begrenzungselement 60 für einen Lötmeniskus der Lotschicht auf. Das Begrenzungselement 60 wird derart angeordnet, dass der Lötmeniskus in einer Ebene der jeweiligen Temperature treatment of the contact arrangement 100, the solder 40 brought into a molten state, so that an unobstructed wetting of the solderable contact surfaces 20.1, 20.2 or side surfaces 30.1, 10.2 can be done. In this state, the middle joining partner 20 is floatingly carried by the molten solder 40. In order to prevent uncontrolled blurring and the assumption of an undefined positional position of the middle joining partner 20 relative to the outer joining partners 30, 10, a preferred position of the middle joining partner 20 is enforced in the present contact arrangement 100. For this purpose, at least one of the outer joining partners 30, 10 within the side surface 30.1, 10.2 facing the middle joining partner 20 has at least one delimiting element 60 for a solder meniscus of the solder layer. The limiting element 60 is arranged such that the solder meniscus in a plane of the respective
Seitenoberfläche 30.1 , 10.2 in dessen lateralen Oberflächenbenetzung in einer definierten Raumrichtung (beispielsweise +/-x und oder +/- y) unterbrochen wird.Side surface 30.1, 10.2 is interrupted in the lateral surface wetting in a defined spatial direction (for example, +/- x and or +/- y).
In dem vorliegenden Ausführungsbeispiel ist das Begrenzungselement 60 als eine Formaussparung 60.3a in den darüber liegenden Fügepartner 30 eingebracht, beispielsweise in Form eines Langloches. Diese ist zwischen zwei Außenkanten 60.34, 60.32 des darüberliegenden Fügepartners 30 angeordnet. Die Formaussparung 60.3a weist dabei in der Ebene der Seitenoberfläche 30.1 eine durchgehende geradlinige Langlochkante auf, an welcher der Lötmeniskus unterbrochen wird. Damit schließt die Verbindungsfläche 23 der Lotschicht dort dann über einen definierten Konturabschnitt ab. Bevorzugt ist die In the present exemplary embodiment, the delimiting element 60 is in the overlying joining partner 30 as a shaped recess 60.3a introduced, for example in the form of a long hole. This is arranged between two outer edges 60.34, 60.32 of the overlying joining partner 30. The mold recess 60.3a has in the plane of the side surface 30.1 on a continuous rectilinear slot edge at which the solder meniscus is interrupted. This completes the connection surface 23 of the solder layer then over a defined contour section. Preferably, the
Formaussparung 60.3a senkrecht zu den beiden äußeren Außenkanten 60.34, 60.32 des mittleren Fügepartners 20 orientiert, zusätzlich bevorzugt parallel zu einer weiteren beabstandeten dritten Außenkante 60.33. In diesem Fall ist der Lötmeniskus in +x-Richtung begrenzt. Dies ist in der Fig. 2 nochmals deutlicher ersichtlich. Dort ist die Kontaktanordnung 100 in einer Draufsicht gezeigt. Mold recess 60.3a oriented perpendicular to the two outer outer edges 60.34, 60.32 of the middle joint partner 20, additionally preferably parallel to a further spaced third outer edge 60.33. In this case, the solder meniscus is limited in the + x direction. This is shown more clearly in FIG. There, the contact arrangement 100 is shown in a plan view.
Zusätzlich ist in diesem Ausführungsbeispiel ein gleichartiges In addition, in this embodiment, a similar
Begrenzungselement 60 in Form einer weiteren Formausprägung 60.3b, beispielsweise in Form eines Langloches, im darüberliegenden Fügepartner 30 ausgebildet. Bevorzugt ist die weitere Formaussparung 60.3b senkrecht zur ersten Formaussparung 60.3a angeordnet, zusätzlich bevorzugt parallel zur ersten Außenkante 60.34 des mittleren Fügepartners 20, so dass darüber eine Begrenzung des Lötmeniskus in +y-Richtung erfolgt. Zur Begrenzung des Lötmeniskus in -x-Richtung und/oder -y-Richtung werden die entsprechenden beiden Außenkante 60.32, 60.33 als ein jeweils andersartiges Limiting element 60 in the form of a further form of expression 60.3b, for example in the form of a slot, formed in the overlying joining partner 30. Preferably, the further mold recess 60.3b is arranged perpendicular to the first mold recess 60.3a, additionally preferably parallel to the first outer edge 60.34 of the middle joining partner 20, so that there is a limitation of the solder meniscus in the + y direction. In order to limit the solder meniscus in the -x direction and / or -y direction, the corresponding two outer edges 60.32, 60.33 become different
Begrenzungselement 60.33 bzw. 60.34 des mittleren Fügepartners 20 genutzt. Alternativ kann anstelle einer oder beider Außenkanten 60.33, 60.34 auch jeweils eine weitere Formaussparung (beispielsweise 60.3c gestrichelt dargestellt) als Begrenzungselement 60 genutzt werden. Ebenso können bis auf eine Limiting element 60.33 or 60.34 of the middle joint partner 20 used. Alternatively, instead of one or both outer edges 60.33, 60.34, a further mold recess (for example, 60.3c in dashed lines) can also be used as the limiting element 60. Likewise, except for one
Formaussparung 60.3a, 60.3b alle anderen Begrenzungselemente 60 durch eine Außenkante 60.32, 60.33, 60.34 des mittleren Fügepartners 20 gestellt sein. Ferner ist es ermöglicht auch eine oder alle im Ausführungsbeispiel gezeigten Begrenzungselemente als entsprechende Projektion in der Draufsicht im darunterliegenden Fügepartner 10 vorzusehen. Neben einer Formaussparung ist auch die Ausbildung eines oder mehrerer Begrenzungselemente 60 als lediglich eine Formvertiefung oder alternativ als eine Formerhöhung denkbar, welche von der jeweiligen Seitenoberfläche 30.1 , 10.2 absteht. Die Formaussparung, Formvertiefung oder Formerhöhung sind beispielsweise als Formausprägung, als Formausstanzung oder als Formabbiegung in die Fügepartner 20, 10 Form cut 60.3a, 60.3b all other limiting elements 60 by an outer edge 60.32, 60.33, 60.34 of the middle joining partner 20 may be provided. Furthermore, it is also possible to provide one or all of the limiting elements shown in the exemplary embodiment as a corresponding projection in plan view in the joining partner 10 underneath. In addition to a mold recess, it is also conceivable to form one or more delimiting elements 60 as merely a mold cavity or, alternatively, as a mold cavity, which protrudes from the respective side surface 30.1, 10.2. The mold recess, mold recess or mold elevation are, for example, in the form of a stamped shape, as a punched out punch or as a shaped bend in the joining partners 20, 10
eingebracht. Die jeweilige Verbindungsfläche 23, 21 ist beispielsweise rechteckig oder quadratisch und entspricht bevorzugt der entsprechenden Kontaktoberfläche 20.1 , 20.2 des mittleren Fügepartners 20 oder ist unwesentlich größer als diese. Dadurch werden die Lötmenisken sehr steil ausgeführt - siehe beispielhaft in der Fig.1 dargestellt - wodurch die Lageposition in den brought in. The respective connecting surface 23, 21 is, for example, rectangular or square and preferably corresponds to the corresponding one Contact surface 20.1, 20.2 of the middle joint partner 20 or is slightly larger than this. As a result, the Lötmenisken are made very steep - see example shown in Figure 1 - whereby the position position in the
verschiedenen Raumrichtungen mit sehr geringen Toleranzen sichergestellt werden kann. Die Lageposition des mittleren Fügepartners 20 relativ zu den äußeren Fügepartnern 30, 10 wird nach einem Verfestigen des Lotmittels 40 durch eine Abkühlung der Kontaktanordnung 100 dauerhaft in der erzwungenen Vorzugsposition erhalten. Der mittlere Fügepartner 20 ist beispielsweise ein elektrisches und/oder elektronisches Bauelement 70, insbesondere ein Leistungshalbleiter. Der darunterliegende Fügepartner 10 ist beispielsweise ein Schaltungsträger 80 und der darüberliegende Fügepartner 30 ist ein Metallclips 90. Die Kontaktanordnung 100 ist dabei beispielsweise Teil einer B2- oder B6-Brücke der different spatial directions can be ensured with very low tolerances. The positional position of the middle joining partner 20 relative to the outer joining partners 30, 10 is obtained after solidification of the soldering agent 40 by cooling the contact arrangement 100 permanently in the forced preferential position. The middle joining partner 20 is, for example, an electrical and / or electronic component 70, in particular a power semiconductor. The underlying joining partner 10, for example, a circuit substrate 80 and the overlying joining partner 30 is a metal clip 90. The contact assembly 100 is for example part of a B2 or B6 bridge of
Elektronikbaugruppe 200. Insgesamt kann der Lötvorgang als ein Electronics assembly 200. Overall, the soldering process as a
Selektivlötprozess erfolgen, bei welchem alle elektrischen und/oder  Selektivlötprozess done in which all electrical and / or
elektronischen Bauelemente 70 zeitgleich verlötet werden. Alternativ ist der mittlere Fügepartner 20 als Wärmesenke vorgesehen, beispielsweise ein Metallelement oder ein unbestücktes Keramiksubstratelement. electronic components 70 are soldered at the same time. Alternatively, the middle joining partner 20 is provided as a heat sink, for example a metal element or an unpopulated ceramic substrate element.

Claims

Ansprüche claims
1.) Kontaktanordnung (100) als Schichtstapel von drei übereinander 1.) contact arrangement (100) as a layer stack of three superimposed
angeordneten Fügepartnern (10, 20, 30), wobei der mittlere Fügepartner (20) mit jeweils einer Schicht aus einem verfestigten Lotmittel (40) mit dem darüberliegenden und mit dem darunterliegenden Fügepartner (30, 10) stoffverbunden ist,  arranged joining partners (10, 20, 30), wherein the middle joining partner (20), in each case a layer of a solidified solder (40) with the overlying and with the underlying joining partner (30, 10) is material-connected,
dadurch gekennzeichnet, dass  characterized in that
der darüberliegende und/oder der darunterliegende Fügepartner (30, 10) jeweils eine dem mittleren Fügepartner (20) zugwandte ebene und lötbare Seitenoberfläche (30.1 , 10.2) aufweist, innerhalb welcher jeweils ein flächenkleinerer Teilbereich als  the overlying and / or the underlying joining partner (30, 10) in each case has a flat and solderable side surface (30.1, 10.2) facing the middle joining partner (20), within which in each case a smaller area than
Verbindungsfläche (21 , 23) der Lotschicht ausgebildet ist, wobei zur Zentrierung des mittleren Fügepartners (20) während eines geschmolzenem Zustands des Lotmittels (40) zumindest innerhalb einer der Seitenoberflächen (30.1 , 10.2) und in einem Abstand zu deren Außenkanten (60.32, 60.33, 60.34) zumindest ein  Connecting surface (21, 23) of the solder layer is formed, wherein for centering the middle joining partner (20) during a molten state of the solder (40) at least within one of the side surfaces (30.1, 10.2) and at a distance to the outer edges (60.32, 60.33 , 60.34) at least one
Begrenzungselement (60, 60.3a, 60.3b) für einen Lötmeniskus der Lotschicht ausgebildet ist und dort die Verbindungsfläche (21 , 23) der Lotschicht über zumindest einen Außenkonturabschnitt definiert abschließt.  Limiting element (60, 60.3a, 60.3b) is formed for a solder meniscus of the solder layer and there terminates the connecting surface (21, 23) of the solder layer defined over at least one outer contour portion.
2.) Kontaktanordnung (100) nach Anspruch 1 , 2.) Contact arrangement (100) according to claim 1,
dadurch gekennzeichnet, dass  characterized in that
das Begrenzungselement (60, 60.3a, 60.3b) eine durchgehende oder eine partiell einfach oder mehrfach unterbrochene Begrenzungskante ist.  the limiting element (60, 60.3a, 60.3b) is a continuous or a partially single or multiple interrupted boundary edge.
3.) Kontaktanordnung (100) nach Anspruch 2, 3.) Contact arrangement (100) according to claim 2,
dadurch gekennzeichnet, dass  characterized in that
die Begrenzungskante eine von der Seitenoberfläche abstehende Formerhöhung abschließt.  the boundary edge terminates a protruding from the side surface mold elevation.
4.) Kontaktanordnung (100) nach Anspruch 2, 4.) Contact arrangement (100) according to claim 2,
dadurch gekennzeichnet, dass  characterized in that
die Begrenzungskante eine in der Ebene der Seitenoberfläche (30.1 , 10.2) ausgebildete Formvertiefung oder Formaussparung (60.3a, 60.3b) abschließt, insbesondere in Form eines Langloches.  the boundary edge terminates a recess or recess (60.3a, 60.3b) formed in the plane of the side surface (30.1, 10.2), in particular in the form of an oblong hole.
5.) Kontaktanordnung (100) nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass 5.) Contact arrangement (100) according to one of the preceding claims, characterized in that
das Begrenzungselement (60, 60.3a, 60.3b) als Formausprägung, als the limiting element (60, 60.3a, 60.3b) as a form of expression, as
Formausstanzung oder als Formabbiegung ausgebildet ist. Form punched or formed as a shape bend.
6.) Kontaktanordnung (100) nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass 6.) Contact arrangement (100) according to one of the preceding claims, characterized in that
das Begrenzungselement (60, 60.3a, 60.3b) parallel oder senkrecht zu mindestens einer Außenkante (60.34, 60.32, 60.33) der Seitenoberfläche (30.1 ) ausgebildet ist. the limiting element (60, 60.3a, 60.3b) is formed parallel or perpendicular to at least one outer edge (60.34, 60.32, 60.33) of the side surface (30.1).
7.) Kontaktanordnung (100) nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass 7.) Contact arrangement (100) according to one of the preceding claims, characterized in that
durch zumindest eine Außenkante (60.34, 60.32, 60.33) der Seitenoberfläche (30.1 ) ein weiteres Begrenzungselement (60) für den Lötmeniskus der Lotschicht ausgebildet ist. is formed by at least one outer edge (60.34, 60.32, 60.33) of the side surface (30.1), a further delimiting element (60) for the solder meniscus of the solder layer.
8.) Kontaktanordnung (100) nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass 8.) Contact arrangement (100) according to one of the preceding claims, characterized in that
zumindest zwei Begrenzungselemente (60) innerhalb einer der Seitenoberflächen (30.1 , 10.2) in einem Abstand zu deren Außenkanten (30.34, 60.32, 60.33) ausgebildet sind, wobei zumindest zwei nächstbenachbarte Begrenzungselemente (60) senkrecht zueinander ausgebildet sind. at least two boundary elements (60) within one of the side surfaces (30.1, 10.2) are formed at a distance from their outer edges (30.34, 60.32, 60.33), wherein at least two next adjacent boundary elements (60) are formed perpendicular to each other.
9.) Kontaktanordnung (100) nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass 9.) Contact arrangement (100) according to one of the preceding claims, characterized in that
die Verbindungsfläche (21 , 23) im Wesentlichen einer rechteckigen oder the connecting surface (21, 23) is substantially a rectangular or
quadratischen Querschnittsfläche entspricht, wobei zumindest zwei senkrecht und/oder zwei parallel zueinanderstehende Querschnittskonturabschnitte durch Begrenzungselemente (60) definiert sind. square cross-sectional area corresponds, wherein at least two perpendicular and / or two mutually parallel cross-sectional contour sections are defined by delimiting elements (60).
10.) Kontaktanordnung (100) nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass 10.) Contact arrangement (100) according to one of the preceding claims, characterized in that
der darüberliegende Fügepartner und/oder der darunterliegende Fügepartner (30, 10) ein elektrischer und/oder thermischer Leiter ist/sind, insbesondere als Teil eines Metallclips (90). the overlying joining partner and / or the underlying joining partner (30, 10) is / are an electrical and / or thermal conductor, in particular as part of a metal clip (90).
1 1.) Kontaktanordnung (100) nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass 1 1.) Contact arrangement (100) according to one of the preceding claims, characterized in that
der mittlere Fügepartner (20) ein elektrisches und/oder elektronisches Bauelement (70) ist, beispielsweise ein Leistungshalbleiter oder ein Logikbauelement, oder eine Wärmesenke ist, beispielsweise ein Metallelement oder ein unbestücktes the middle joining partner (20) is an electrical and / or electronic component (70), for example a power semiconductor or a logic component, or a heat sink, for example a metal element or an unpopulated one
Keramiksubstratelement. Ceramic substrate member.
12.) Elektronikbaugruppe umfassend zumindest eine Kontaktanordnung (100) nach einem der Ansprüche 1 bis 1 1 , insbesondere ein Leistungsmodul, 12.) Electronic assembly comprising at least one contact arrangement (100) according to one of claims 1 to 1 1, in particular a power module,
beispielsweise eine B2- oder B6-Brücke. for example, a B2 or B6 bridge.
13.) Verfahren zur Ausbildung einer Kontaktanordnung (100) nach einem der13.) A method for forming a contact arrangement (100) according to one of
Ansprüche 1 bis 11 , mit den nachfolgenden Verfahrensschritten: e) Anordnen der drei Fügepartner (10, 20, 30) in einem Stapelaufbau, wobei vor oder während des Anordnens zwischen dem mittleren Fügepartner (20) und dem darüberliegenden Fügepartner (30) und dem darunterliegenden Fügepartner (10) jeweils ein Lotmittel (40) angeordnet wird, Claims 1 to 11, with the following method steps: e) arranging the three joining partners (10, 20, 30) in a stack construction, wherein before or during the placing between the middle joint partner (20) and the overlying joining partner (30) and the underlying Joining partner (10) each a solder (40) is arranged,
f) Fixieren vor oder nach dem Anordnen der Fügepartner (10, 20, 30) gemäß f) fixing before or after arranging the joining partners (10, 20, 30) according to
Verfahrensschritt a) des darüberliegenden und des darunterliegenden  Process step a) of the overlying and the underlying
Fügepartners (30, 10) in einer festen Lageposition,  Joining partners (30, 10) in a fixed position position,
g) Temperaturbehandlung der Anordnung (100), bei welcher das Lotmittel (40) in einen geschmolzenen Zustand gebracht wird und der mittlere Fügepartner (20) schwimmend mittels des geschmolzenen Lotmittels (40) getragen wird, wobei dann eine definierte Vorzugsposition des mittleren Fügepartners (20) relativ zum darüberliegenden und darunterliegende Fügepartner (30, 10) eingenommen wird, indem ein Lötminiskus der Lotschicht durch mindestens das eine innerhalb zumindest einer der Seitenoberflächen (30.1 , 10.2) ausgebildete g) temperature treatment of the assembly (100), wherein the solder (40) is brought into a molten state and the central joining partner (20) is floatingly supported by the molten solder (40), in which case a defined preferred position of the middle joining partner (20 ) is occupied relative to the overlying and underlying joining partner (30, 10) by a Lotminiskus the solder layer formed by at least one within at least one of the side surfaces (30.1, 10.2)
Begrenzungselement (60) begrenzt wird und dort die Verbindungsfläche (21 , 23) der Lotschicht über zumindest einen Außenkonturabschnitt definiert  Limiting element (60) is limited and there defines the connecting surface (21, 23) of the solder layer over at least one outer contour portion
abgeschlossen wird,  is completed,
h) Abkühlen der Anordnung (100), wobei die Vorzugsposition des mittleren h) cooling the assembly (100), wherein the preferred position of the middle
Fügepartners (20) durch das dann verfestigte Lotmittel (40) dauerhaft erhalten wird.  Joining partner (20) by the then solidified solder (40) is obtained permanently.
EP19724407.2A 2018-05-15 2019-05-10 Contact arrangement, electronics assembly comprising the contact arrangement and method for forming the contact arrangement Withdrawn EP3794639A1 (en)

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DE102018207537.9A DE102018207537A1 (en) 2018-05-15 2018-05-15 Composite arrangement of three stacked joining partners
PCT/EP2019/062063 WO2019219536A1 (en) 2018-05-15 2019-05-10 Contact arrangement, electronics assembly comprising the contact arrangement and method for forming the contact arrangement

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EP19724407.2A Withdrawn EP3794639A1 (en) 2018-05-15 2019-05-10 Contact arrangement, electronics assembly comprising the contact arrangement and method for forming the contact arrangement
EP19724406.4A Pending EP3794641A1 (en) 2018-05-15 2019-05-10 Heat extraction assembly for a semiconductor power module

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EP3794640B1 (en) 2022-07-06
WO2019219533A1 (en) 2019-11-21
CN112106194A (en) 2020-12-18
EP3794641A1 (en) 2021-03-24
CN112136210A (en) 2020-12-25
DE102018207537A1 (en) 2019-11-21
US11569151B2 (en) 2023-01-31
WO2019219535A1 (en) 2019-11-21
WO2019219536A1 (en) 2019-11-21
EP3794640A1 (en) 2021-03-24

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