EP3769323B1 - Composant inductif et dispositif de filtrage à haute fréquence - Google Patents

Composant inductif et dispositif de filtrage à haute fréquence Download PDF

Info

Publication number
EP3769323B1
EP3769323B1 EP19708835.4A EP19708835A EP3769323B1 EP 3769323 B1 EP3769323 B1 EP 3769323B1 EP 19708835 A EP19708835 A EP 19708835A EP 3769323 B1 EP3769323 B1 EP 3769323B1
Authority
EP
European Patent Office
Prior art keywords
planar
inductive component
upper side
ferromagnetic core
underside
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP19708835.4A
Other languages
German (de)
English (en)
Other versions
EP3769323A1 (fr
Inventor
Johann W. Kolar
Dominik Bortis
Jannik Robin SCHAEFER
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of EP3769323A1 publication Critical patent/EP3769323A1/fr
Application granted granted Critical
Publication of EP3769323B1 publication Critical patent/EP3769323B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/34—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites
    • H01F1/342—Oxides
    • H01F1/344—Ferrites, e.g. having a cubic spinel structure (X2+O)(Y23+O3), e.g. magnetite Fe3O4
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F2017/0066—Printed inductances with a magnetic layer

Definitions

  • the present invention relates to an inductive component. Furthermore, the present invention relates to a high-frequency filter device with such an inductive component.
  • inductances that are designed for high currents and high frequencies are often implemented as discrete components and then soldered onto a printed circuit board.
  • the pamphlet WO 2004/030001 A1 discloses a high-frequency choke for printed circuit boards with an inductor and an ohmic resistor connected in parallel.
  • the inductance can be realized from a conductor track that is routed in a meandering manner.
  • the present invention discloses an inductive component with the
  • An inductive component with a planar conductor track structure and a ferromagnetic core The planar interconnect structure has an upper side and an underside opposite the upper side.
  • the ferromagnetic core is arranged around the planar conductor track structure.
  • the ferromagnetic core has at least one gap in the area of the top and/or bottom of the planar interconnect structure, so that a virtual line running perpendicular to the top or bottom of the planar interconnect structure also runs through such a gap
  • the magnetic core comprises a material with ferromagnetic powder particles in said area of the upper side and/or the lower side of the planar conductor track structure.
  • the planar conductor track structure preferably has a longitudinal extent which is aligned in the direction of a desired current flow through the planar conductor track structure.
  • the planar conductor track structure preferably has a transverse extension which is oriented perpendicularly to the direction of the desired current flow through the planar conductor track structure.
  • a diagonal of the cross section of the ferromagnetic core is oriented perpendicular to the direction of desired current flow.
  • the ferromagnetic core which is preferably tubular or ring-shaped, is arranged at least partially along the longitudinal extent of the planar interconnect structure around the planar interconnect structure.
  • the term tubular or ring-shaped preferably also includes round or oval cross-sections in addition to rectangular or polygonal cross-sections.
  • the present invention is based on the knowledge that in the case of high-frequency electrical currents through an electrical conductor, due to the skin effect, the current flow increasingly only takes place in the outer region of the electrical conductor.
  • the present invention is based on the finding that magnetic cores with an air gap can also cause partial current displacement within an electrical conductor due to the inhomogeneous distribution of a magnetic field caused by the air gap.
  • the present invention is therefore based on the idea of taking this knowledge into account and creating an arrangement for an inductive component which also has a high current-carrying capacity for high-frequency electrical currents.
  • an arrangement is created from a planar electrical conductor and a ferromagnetic core surrounding the electrical conductor, with the current displacement effects due to a gap in the ferromagnetic core counteracting the current displacement effects due to the skin effect.
  • This makes it possible to distribute the electrical current flow over a large area of the cross section of the electrical conductor, particularly in the case of planar conductor track structures. In this way, the current-carrying capacity of the planar electrical conductor can be increased.
  • any type of conductor track structure that has a cross-sectional area perpendicular to the intended direction of current flow, in which the extent in one direction is significantly greater than the extent in another direction perpendicular thereto, can be understood as a planar conductor track structure.
  • the difference between the two dimensions can be at least one order of magnitude or more.
  • Printed conductor structures on a printed circuit board substrate can be understood as planar conductor structures.
  • an electrically conductive material such as copper or the like, can be applied to the printed circuit board substrate, which material runs in accordance with a desired conductor track structure.
  • any other planar conductor track structures are also to be understood as planar conductor track structures.
  • planar Conductor structures are not applied to a full-surface carrier substrate.
  • the planar conductor track structures can be carried only partially, for example at support points.
  • the planar interconnect structure can consist, for example, of a planar electrically conductive element running in a linear manner.
  • the planar conductor track structure can also be formed by a coil-like conductor track structure with any number of two or more turns.
  • the individual windings can, for example, run next to one another or one above the other. A combination of these is also possible.
  • the upper side and underside of the planar conductor track structure are to be understood here in particular as those sides of the conductor track structure which have the greater, in particular the greatest, extent perpendicular to the desired electric current flow.
  • the upper side of the conductor track structure is arranged opposite the lower side of the conductor track structure.
  • the upper side and the lower side of the conductor track structure can each be connected to one another by means of two side surfaces in the case of a, for example, rectangular cross section of the conductor track structure.
  • the planar wiring structure is surrounded with the ferromagnetic core along a predetermined portion.
  • the ferromagnetic core can at least approximately completely enclose the planar conductor track structure.
  • the ferromagnetic core has one or more gaps in its circulation. According to the invention, this gap or these gaps are arranged in the region of the upper side and/or the lower side of the planar interconnect structure.
  • the expression "in the region" of the upper side or the lower side is to be understood as meaning that a virtual line, which can run perpendicular to the upper side or the lower side, also runs through such a gap.
  • a gap in the area of the upper side or the lower side of the planar interconnect structure clearly differs from gaps that are arranged laterally on a planar interconnect structure.
  • a ferromagnetic core of an inductive component according to the present invention preferably no such lateral gaps in the area of the side faces of the planar interconnect structure.
  • the ferromagnetic core can be formed from any ferromagnetic material. Such ferromagnetic materials are known and are therefore not explained in more detail here.
  • the gap in the ferromagnetic core can be an air gap or a gap that is at least partially filled with a dielectric material.
  • the ferromagnetic core can have gaps both in the area of the upper side and in the area of the underside of the planar interconnect structure.
  • the arrangement of one or more gaps in the area of the upper side of the planar interconnect structure and in the area of the underside of the interconnect structure can be identical or at least approximately identical.
  • fundamentally different designs with one or more gaps in the area of the upper side or the lower side of the planar conductor track structure are also possible.
  • the ferromagnetic core includes multiple gaps.
  • several gaps can be provided both in the area of the upper side and in the area of the underside.
  • the individual gaps can each have the same gap width, for example.
  • the gap width of individual gaps can also be varied depending on other requirements.
  • the planar conductor track structure can comprise a plurality of conductor tracks running in parallel.
  • Each of these individual interconnects running parallel can also have a planar structure, with the cross section of such an interconnect structure in one spatial direction being significantly larger than the cross section in a direction perpendicular thereto spatial direction.
  • the planar conductor track structure comprises a plurality of conductor tracks arranged one above the other.
  • the expression "on top of one another" is to be understood here as meaning that the bottom side of a conductor track and the top side of an adjacent conductor track are opposite one another at a distance.
  • the individual conductor tracks can be spaced apart from one another, for example by means of an electrically insulating substrate. In this way, a coil arrangement with multiple turns can be implemented.
  • the planar interconnect structure may include multiple coplanar interconnects. In such a coplanar arrangement, a plurality of conductor tracks, in particular a plurality of parallel conductor tracks, are arranged in a common plane.
  • the individual conductor tracks can be arranged on a common carrier substrate. It goes without saying that the arrangement of a plurality of interconnects arranged in a coplanar manner and the arrangement of a plurality of interconnects arranged one above the other, as already described above, can also be combined with one another.
  • At least one gap is arranged in the region of the upper side and/or the underside of each conductor track, in particular in the case of a coplanar arrangement of a plurality of conductor tracks. In this way, a current distribution that is as homogeneous as possible within the respective conductor track can be achieved for each conductor track of the conductor track structure.
  • At least one gap in the ferromagnetic core can be at least partially filled with a dielectric filling material.
  • all of the gaps in the ferromagnetic core can also be filled with the same filling material. But different filling materials for the individual columns are also possible.
  • the magnetic flux can be influenced and the current distribution within the planar interconnect structure can thereby be controlled.
  • the magnetic core are mechanically stabilized.
  • the ferromagnetic core comprises rounded edges in the transition to the gap.
  • the magnetic core comprises a material with ferromagnetic powder particles in the area of the upper side and/or the lower side of the planar conductor track structure.
  • the magnetic flux can also be influenced by the partial use of such ferromagnetic powder particles.
  • magnetic cores with such ferromagnetic particles are also known as powder cores or cores with a so-called distributed air gap.
  • the inductive component includes a carrier substrate.
  • the bottom side and/or the top side of the planar interconnect structure can be connected to a dielectric carrier substrate.
  • the dielectric carrier substrate can be a circuit board substrate for printed circuits.
  • a planar conductor track structure can be implemented in a particularly simple manner.
  • multilayer structures with a number of carrier substrates and/or a number of planar conductor track structures are also possible.
  • figure 6 shows a cross section through an arrangement for an inductive component.
  • an electrically conductive Conductor structure 110 applied on a carrier substrate 130 .
  • this can be a printed conductor track on a printed circuit board substrate.
  • the height h of the conductor track structure 110 is significantly less than the width b of the conductor track structure 110.
  • the conductor track structure 110 is surrounded by two half-shells 120, which are intended to form a magnetic core. Because of the continuous carrier substrate 130 , the core formed by the two half-shells 120 is interrupted at positions 121 .
  • the magnetic core therefore has a gap at positions 121, which increases the magnetic field strength in this area.
  • the electrical conductor 110 is traversed by a high-frequency electrical current, the current flow is also shifted to the edge regions of the electrical conductor 110. This significantly reduces the maximum current-carrying capacity.
  • FIG 1 shows a schematic representation of a cross section through an inductive component 1 according to one embodiment.
  • the inductive component 1 comprises a planar conductor track structure 10 and a ferromagnetic core 20.
  • the cross section of the planar conductor track structure 10 has a height h that is significantly less than the width b of the planar conductor track structure.
  • the width b points in the direction of the transverse extent of the planar interconnect structure 10. In particular, the width b can be greater than the height h by more than an order of magnitude, ie by a factor of 10.
  • the planar conductor structure 10 is surrounded by a ferromagnetic core 20 along a predetermined section in the direction of the longitudinal extension of the conductor structure 10 .
  • the ferromagnetic core 20 can be formed from any ferromagnetic material.
  • the planar interconnect structure 10 has in particular an upper side 11 and an underside 12 opposite the upper side 11 .
  • the top 11 and those Underside 12 are formed by those sides which have the larger dimensions, in this case consequently the width b, which is significantly larger than the height h.
  • the conductor track structure 10 can, for example, be formed from any electrically conductive material, eg copper.
  • the planar trace structure 10 may be implemented as a printed circuit trace structure. In addition, however, any other planar interconnect structures are possible.
  • the gap or gaps 21 are arranged in a region A of the upper side 11 and/or the lower side 12 .
  • a virtual imaginary line V which is perpendicular to the upper side 11 or the lower side 12, runs through the corresponding gap 21.
  • such a virtual line is shown as a dashed line V.
  • the inductive component 1 expressly has no gap in the area B of the side surfaces, ie in the area of the surfaces which connect the upper side 11 and the lower side 12 to one another.
  • the gaps 21 in area A of the upper side 11 and the lower side 12 of the planar interconnect structure 10 result in inhomogeneities in the course of the magnetic field, which can influence the flow of current through the planar interconnect structure 10 .
  • the current flow is at least partially pushed away from the edge in the direction of the center of the planar interconnect structure 10 .
  • this counteracts any skin effect that may occur, as a result of which the electric current flow would be pushed to the outside.
  • an electrical current flow can be achieved in the planar conductor track structure 10 , which also occurs in the inner area of the planar conductor track structure 10 .
  • the electric current can flow away from the edge area into the inner area of the planar conductor track structure 10 be moved. In this way, the current-carrying capacity of the planar interconnect structure 10 can be increased.
  • the gap 21 of the ferromagnetic core 20 can be filled with a dielectric filling material 22 .
  • a dielectric filling material 22 By choosing a suitable dielectric filling material 22, the course of the magnetic field lines and thus the current distribution within the planar interconnect structure 10 can also be influenced. If there are several gaps 21 in the ferromagnetic core 20, the individual gaps 21 can either be filled with the same filling material 22, or different dielectric filling materials 22 can optionally also be used for the individual gaps 21.
  • edges of the ferromagnetic core 20 can be rounded off in the area of the transition to the gaps 21 .
  • figure 2 shows a schematic representation of a cross section through an inductive component 1 according to a further embodiment.
  • the embodiment shown differs from the embodiment described above in particular in that instead of a single gap 21 in area A of the upper side 11 or the lower side 12 of the planar interconnect structure 10 there are now several gaps 21 .
  • the number of four columns shown here is just an arbitrary example.
  • any other number of columns 21 on the top and/or bottom of the planar interconnect structure 10 is also possible.
  • gaps 21, as shown here can be attached both in the area of the upper side 11 and in the area of the underside 12. In principle, however, it is also possible to provide the gaps 21 only in the area of the upper side 11 or, alternatively, only in the area of the underside 12 .
  • FIG. 1 shows a schematic illustration of a cross section through an inductive component 1 according to yet another specific embodiment.
  • the embodiment shown here differs from the embodiment described above in particular in that the planar Conductor track structure 10 is arranged on an electrically insulating carrier substrate 30 .
  • one side of the planar interconnect structure 10, here in particular the underside 12 of the planar interconnect structure 10 is connected to one side of the carrier substrate 30.
  • planar conductor tracks can be arranged on two opposite sides of the carrier substrate 30 in each case.
  • a layer structure with a plurality of carrier substrates 30 and possibly a plurality of planar conductor tracks is also possible. If appropriate, a plurality of conductor tracks can also be arranged next to one another as a planar conductor track structure 10 on the carrier substrate 30 .
  • FIG. 1 shows a schematic representation of part of an inductive component 1 according to a further embodiment.
  • the planar interconnect structure 10 can include a plurality of individual interconnects 10-i. These individual conductor tracks 10-i can be arranged one above the other, for example. In this context, one above the other means, for example, that the bottom side of a conductor track 10-1 points to a top side of an adjacent conductor track 10-1.
  • the individual conductor tracks 10-i of the conductor track structure 10 can also have different dimensions. For example, the upper two conductor tracks 10-1 and 10-2 have a smaller width than the conductor tracks 10-3 and 10-4 arranged underneath.
  • the width d1, d2 of the column 21 can vary.
  • the width d1, d2 of the column 21 can be adapted depending on the respective conductor track structure 10.
  • a larger gap width d1 can be selected for a higher number of conductor tracks 10-i or conductor tracks 10-i, for which a higher current density is to be expected, while for a smaller number of Conductor tracks 10-i or a lower current density to be expected, a smaller gap width d2 can be set.
  • the number of columns 21 can also be varied over the width according to the configuration of the conductor track structure 10 . In this way, depending on the properties of the planar interconnect structure 10, the density of the gaps 21 in the ferromagnetic core 20 can be varied.
  • FIG. 5a and 5b show a perspective view of an inductive component 1 according to an embodiment.
  • the planar interconnect structure 10 is shown in partial image 5a.
  • the planar conductor track structure 10 has a plurality of turns.
  • Partial image 5b also shows how the planar interconnect structure 10 can be surrounded by a ferromagnetic core 20.
  • This ferromagnetic core 20 can, for example, have one or more gaps 21 corresponding to the course of the planar conductor track structure 10 . In this way, the course of the current flow within the planar interconnect structure 10 can be influenced in a targeted manner.
  • the gap 21 of the ferromagnetic core 20 is therefore also ring-shaped in accordance with the ring-shaped profile of the conductor track structure 10 in this exemplary embodiment.
  • the inductive component 1 described above is used according to the invention as an inductive filter element for a high-frequency filter device. If necessary, the previously described inductive component 1 can be combined with other components, such as an ohmic resistor and/or a capacitive component.
  • the present invention relates to an inductive component with a planar interconnect structure.
  • the planar trace structure is encapsulated along a predetermined portion with a ferromagnetic core.
  • At least one gap is specifically provided in the ferromagnetic core for the targeted control of the current flow within the planar conductor track structure and in particular the current density in the cross section of the planar conductor track structure.
  • the gaps in the ferromagnetic core are arranged in areas above and/or below the planar interconnect structure.

Claims (9)

  1. Composant inductif (1) comprenant :
    une structure de pistes conductrices plane (10) qui comprend un côté supérieur (11) et un côté inférieur (12), le côté supérieur (11) étant disposé à l'opposé du côté inférieur (12), et
    un noyau ferromagnétique (20) qui enferme la structure de pistes conductrices plane (10) le long d'une portion spécifiée,
    le noyau ferromagnétique (20) comportant au moins un intervalle (21) dans une zone (A) du côté supérieur (11) et/ou du côté inférieur (12) de la structure de pistes conductrices plane (10) de sorte qu'une ligne virtuelle, qui s'étend perpendiculairement au côté supérieur (11) ou côté inférieur (12), s'étende également à travers un tel intervalle (21),
    le noyau ferromagnétique (20) comprenant dans cette zone (A) du côté supérieur (11) et/ou du côté inférieur (12) de la structure de pistes conductrices plane (10) un matériau pourvu de particules de poudre ferromagnétiques.
  2. Composant inductif (1) selon la revendication 1, le noyau ferromagnétique (20) comprenant une pluralité d'intervalles (21) qui sont ménagés dans la zone (A) du côté supérieur (11) et/ou du côté inférieur (12) de la structure de pistes conductrices plane (10).
  3. Composant inductif (1) selon la revendication 1 ou 2, la structure de pistes conductrices plane (10) comprenant une pluralité de pistes conductrices (10-i) qui s'étendent en parallèle.
  4. Composant inductif (1) selon l'une des revendications 1 à 3, la structure de pistes conductrices plane (10) comprenant une pluralité de pistes conductrices (10-i) disposées les unes au-dessus des autres.
  5. Composant inductif (1) selon l'une des revendications 1 à 4, la structure de pistes conductrices plane (10) comprenant une pluralité de pistes conductrices coplanaires (10-i), une pluralité de pistes conductrices (10-i) étant disposés dans un plan commun, et au moins un intervalle (21) étant ménagé dans la zone (A) du côté supérieur (11) et/ou du côté inférieur (12) de chaque piste conductrice (10-i).
  6. Composant inductif (1) selon l'une des revendications 1 à 5, l'au moins un intervalle (21) du noyau ferromagnétique (20) étant au moins partiellement rempli d'un matériau de remplissage diélectrique (22).
  7. Composant inductif (1) selon l'une des revendications 1 à 6, le noyau ferromagnétique (20) comprenant des bords arrondis à la transition vers l'intervalle (21).
  8. Composant inductif (1) selon l'une des revendications 1 à 7, comprenant un substrat porteur (30) électriquement isolant,
    le côté inférieur (11) ou le côté supérieur (12) de la structure de pistes conductrices plane (10) étant disposé sur l'au moins un substrat porteur (30).
  9. Dispositif de filtrage à haute fréquence comprenant un composant inductif (1) selon l'une des revendications 1 à 8.
EP19708835.4A 2018-03-22 2019-03-01 Composant inductif et dispositif de filtrage à haute fréquence Active EP3769323B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102018204366.3A DE102018204366A1 (de) 2018-03-22 2018-03-22 Induktives Bauelement und Hochfrequenz-Filtervorrichtung
PCT/EP2019/055145 WO2019179749A1 (fr) 2018-03-22 2019-03-01 Composant inductif et dispositif de filtrage à haute fréquence

Publications (2)

Publication Number Publication Date
EP3769323A1 EP3769323A1 (fr) 2021-01-27
EP3769323B1 true EP3769323B1 (fr) 2023-08-30

Family

ID=65657467

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19708835.4A Active EP3769323B1 (fr) 2018-03-22 2019-03-01 Composant inductif et dispositif de filtrage à haute fréquence

Country Status (5)

Country Link
US (1) US11817243B2 (fr)
EP (1) EP3769323B1 (fr)
CN (1) CN111886661B (fr)
DE (1) DE102018204366A1 (fr)
WO (1) WO2019179749A1 (fr)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2750769B1 (fr) * 1996-07-05 1998-11-13 Thomson Csf Capteur de champ magnetique en couche mince
DE19854234C1 (de) * 1998-11-24 2000-06-21 Bosch Gmbh Robert Induktives Bauelement mit planarer Leitungsstruktur und Verfahren zur Herstellung desselben
EP1543532A1 (fr) 2002-09-19 2005-06-22 ILFA Industrieelektronik und Leiterplattenfertigung aller Art GmbH Bobine de reactance haute frequence
DE102006022785A1 (de) * 2006-05-16 2007-11-22 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Induktives Bauelement und Verfahren zum Herstellen eines induktiven Bau-elements
US7612553B2 (en) * 2007-07-26 2009-11-03 Honeywell International Inc. Current sensor having sandwiched magnetic permeability layer
US8149080B2 (en) * 2007-09-25 2012-04-03 Infineon Technologies Ag Integrated circuit including inductive device and ferromagnetic material
US9947450B1 (en) * 2012-07-19 2018-04-17 The Boeing Company Magnetic core signal modulation
US20140159499A1 (en) * 2012-12-06 2014-06-12 Analogic Corporation Shielded power coupling device
JP2016207966A (ja) * 2015-04-28 2016-12-08 北川工業株式会社 磁性体コア
WO2017197550A1 (fr) * 2016-05-16 2017-11-23 博立多媒体控股有限公司 Dispositif d'induction électromagnétique et son procédé de fabrication
US20190219458A1 (en) * 2016-08-30 2019-07-18 Torque And More Gmbh Force Measurement Device

Also Published As

Publication number Publication date
DE102018204366A1 (de) 2019-09-26
CN111886661B (zh) 2022-10-21
US20200411222A1 (en) 2020-12-31
EP3769323A1 (fr) 2021-01-27
US11817243B2 (en) 2023-11-14
CN111886661A (zh) 2020-11-03
WO2019179749A1 (fr) 2019-09-26

Similar Documents

Publication Publication Date Title
DE102013206900B4 (de) Halbleiterbauelement mit kernlosem Übertrager und Verfahren zum Betrieb eines solchen Halbleiterbauelements
DE10139707A1 (de) Leiterplatte
EP1249025B1 (fr) Bobine et systeme de bobine a integrer dans un circuit micro-electronique et circuit micro-electronique correspondant
DE10340391A1 (de) Induktor mit geringem Energieverlust
WO2020001682A1 (fr) Bobine à refroidissement actif
DE10392479T5 (de) Spiralförmige Induktionsspule und Übertrager
EP3769323B1 (fr) Composant inductif et dispositif de filtrage à haute fréquence
DE4306416A1 (de) Spulenstruktur für eine Leiterplattenanordnung
EP1929522B1 (fr) Circuit integre comprenant au moins une ligne de transmission integree
DE10221442B4 (de) Induktives Element einer integrierten Schaltung
DE602004003717T2 (de) Substrat mit hoher impedanz
EP2284848B1 (fr) Transmetteur
WO2002013271A2 (fr) Circuit electronique integre dote d'au moins une bobine d'induction et son procede de fabrication
DE102012204206A1 (de) Drosselelement, Kern für ein Drosselelement und Verfahren zum Herstellen eines Drosselelements
WO2003096419A2 (fr) Ensemble pistes conductrices integre
EP3729645B1 (fr) Arrangement d'un filtre lc, dispositif electrique ou electronique comprenant un arrangement d'un tel filtre lc
EP1231638B1 (fr) Configuration de lignes d'alimentation pour dispositif semi-conducteur
DE102008051531A1 (de) Vorrichtung zur Unterdrückung der Ausbreitung einer elektromagnetischen Störung in einem elektrischen System und ein elektrisches System mit derselben
DE202015105768U1 (de) Induktives Bauelement für Hochstromanwendungen
EP1348132B1 (fr) Resistance electrique permettant la mesure de preference de courants alternatifs haute frequence
DE19741302A1 (de) Geometrie für planare Induktivitäten
DE102020208904A1 (de) Planare magnetische vorrichtungen mit verbesserter wärmeleistung
DE202023104031U1 (de) Gekoppelte Induktivität mit steuerbarer Streuinduktivität
EP1595432B1 (fr) Dispositif et procede pour attenuer des resonances de cavite dans un ensemble support multicouche
EP3001436B1 (fr) Feuille d'enroulement et enroulement pour un dispositif électrique inductif

Legal Events

Date Code Title Description
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: UNKNOWN

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE

PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20201022

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

DAV Request for validation of the european patent (deleted)
DAX Request for extension of the european patent (deleted)
GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: GRANT OF PATENT IS INTENDED

INTG Intention to grant announced

Effective date: 20230519

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE PATENT HAS BEEN GRANTED

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

Free format text: NOT ENGLISH

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 502019009138

Country of ref document: DE

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

Free format text: LANGUAGE OF EP DOCUMENT: GERMAN

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG9D

REG Reference to a national code

Ref country code: NL

Ref legal event code: MP

Effective date: 20230830

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20231201

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20231230

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

Ref country code: RS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20231130

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20231230

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20231201

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SM

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20240102

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830