EP1543532A1 - Bobine de reactance haute frequence - Google Patents

Bobine de reactance haute frequence

Info

Publication number
EP1543532A1
EP1543532A1 EP03753304A EP03753304A EP1543532A1 EP 1543532 A1 EP1543532 A1 EP 1543532A1 EP 03753304 A EP03753304 A EP 03753304A EP 03753304 A EP03753304 A EP 03753304A EP 1543532 A1 EP1543532 A1 EP 1543532A1
Authority
EP
European Patent Office
Prior art keywords
conductor track
resistance layer
meandering
choke
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP03753304A
Other languages
German (de)
English (en)
Inventor
Christian Dirks
Nils Dirks
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ILFA Industrieelektronik und Leiterplattenfertigung aller Art GmbH
Original Assignee
ILFA Industrieelektronik und Leiterplattenfertigung aller Art GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ILFA Industrieelektronik und Leiterplattenfertigung aller Art GmbH filed Critical ILFA Industrieelektronik und Leiterplattenfertigung aller Art GmbH
Publication of EP1543532A1 publication Critical patent/EP1543532A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
    • H03H1/0007—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network of radio frequency interference filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233—Filters, inductors or a magnetic substance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09263—Meander
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]

Definitions

  • the invention relates to an RF choke for printed circuit boards according to the preamble of claim 1.
  • CMOS circuits The cross currents on the switching edges in CMOS circuits are known to be a significant EMC problem.
  • the insertion of resistors or chokes between the support structure and the Vcc connection of the integrated circuit in question has proven to be an effective countermeasure.
  • the circuit which consists of the supporting structure and the connected circuit, is provided with damping, which on the one hand limits the strength of the undesired cross-current and, secondly, eliminates interference power directly at the point of origin.
  • resistors are particularly inexpensive, but not all integrated circuits can tolerate this resistance. Whenever there are significant DC components in the operating current of the circuit, the resulting voltage drop can lead to malfunction.
  • Suitable ferrite chokes are available as long as the frequency range does not significantly exceed 1000 MHz.
  • the invention has for its object to provide an RF choke for printed circuit boards which can be integrated on the printed circuit board and can also be dimensioned for frequencies higher than 1000 MHz.
  • the invention provides an RF choke, the inductance and the parallel-connected ohmic resistance of which, owing to its layer formation, enables implementation as an integral part of a printed circuit board. Since no materials have to be remagnetized, there is no limitation at high frequencies. At the same time, the solution according to the invention is space-saving and inexpensive in terms of construction height.
  • the resistance layer preferably consists of carbon mass.
  • This material has electrical ohmic properties and can be reproducibly controlled using known techniques in the manufacture of printed circuit boards.
  • the resistance layer is arranged on the meandering conductor track.
  • the area occupied by the meandering conductor track is also used and a spatially intimate arrangement of inductance and ohmic resistance is achieved.
  • the resistance layer preferably extends over the entire length of the meandering conductor track and is connected to it.
  • the capacitive partial impedances present between adjacent meandering sections of the conductor track are larger in magnitude than the partial impedances of the resistance layer between the same sections of the conductor track.
  • 1 is a circuit board layout for an integrated circuit with an RF choke according to the invention
  • Fig. 2 shows a frequency spectrum of the radiation of an undamped system
  • Fig. 3 shows a frequency spectrum of the radiation of a damped system equipped with the RF choke according to the invention.
  • connection 12 for supply potential
  • connection 14 for reference potential being relevant in connection with the invention.
  • connection 14 of the integrated circuit 10 is connected to a line 26 of the printed circuit board carrying reference potential GND and the connection 12 of the integrated circuit 10 is connected via an HF choke 16, 18 to a line 24 of the printed circuit board carrying supply potential Vcc.
  • a support structure comprising two capacitors 20, 22, here 0.1 ⁇ F and 3.9 nF, connected in parallel is arranged between the connection 14 of the integrated circuit and the connection of the RF choke 16, 18, which is connected to the line 24 of the printed circuit board carrying supply potential Vcc ,
  • the RF choke consists on the one hand of an inductance of a meandering conductor track 16 of the circuit board and a resistance layer 18 made of carbon mass.
  • the meandering conductor track 16 runs from the connection 12 of the integrated circuit 10 in the space between its further connections.
  • the resistance layer 18 made of carbon mass is applied to the entire area of this meandering conductor track 16.
  • the structure can also be realized in double-sided printed circuit boards.
  • the meandering track 16 practically represents a short circuit. With increasing frequency, the meandering track 16 forms a growing inductive impedance. As a result, the current is increasingly forced into the shunt provided by the resistance layer 18.
  • the overall impedance of the RF choke becomes increasingly ohmic, as is desirable for the present application.
  • the design of the RF choke can also be made smaller without being less effective.
  • the undesired shunt capacitance increases.
  • An increase in the width of the conductor track or a decrease in the distance also has an effect.
  • the impedance of this capacitive shunt should in any case be greater than the desired ohmic shunt through the resistance layer. Otherwise the upper limit frequency of the choke would be exceeded.
  • this upper limit frequency can be higher than is the case with ferrite chokes because ferrite is not as fast as desired can be remagnetized.
  • the carbon mass is not subject to such a limit. In view of the fact that modern digital systems often work with clock frequencies of over 2000 MHz, this is a particularly interesting aspect. Despite some progress with ferrites, they will be less and less able to solve EMC problems in the future.
  • Fig. 2 shows a frequency spectrum of the radiation of an undamped system
  • Fig. 3 shows a frequency spectrum of the radiation of a damped system equipped with the RF choke according to the invention.
  • the systems are otherwise completely identical.
  • the two frequency spectra allow a comparison of the total radiation from two double-sided boards, which are equipped with integrated circuits of the 74HC series. There are broadband improvements to lOdB.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

L'invention concerne une bobine de réactance haute fréquence destinée à des cartes à circuits imprimés. La bobine de réactance haute fréquence comprend une inductance et, montée en parallèle, une résistance ohmique. L'inductance est composée d'une piste conductive (16) en forme de méandre sur la carte de circuits imprimés. La résistance ohmique est composée d'une couche résistive (18) ayant une résistance spécifique supérieure à celle de la piste conductive en forme de méandre.
EP03753304A 2002-09-19 2003-09-13 Bobine de reactance haute frequence Withdrawn EP1543532A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10243484 2002-09-19
DE10243484 2002-09-19
PCT/DE2003/003051 WO2004030001A1 (fr) 2002-09-19 2003-09-13 Bobine de reactance haute frequence

Publications (1)

Publication Number Publication Date
EP1543532A1 true EP1543532A1 (fr) 2005-06-22

Family

ID=32038164

Family Applications (1)

Application Number Title Priority Date Filing Date
EP03753304A Withdrawn EP1543532A1 (fr) 2002-09-19 2003-09-13 Bobine de reactance haute frequence

Country Status (4)

Country Link
EP (1) EP1543532A1 (fr)
AU (1) AU2003271534A1 (fr)
DE (1) DE10393830D2 (fr)
WO (1) WO2004030001A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9078371B2 (en) * 2012-10-15 2015-07-07 Raytheon Company Radiofrequency absorptive filter
DE102018204366A1 (de) * 2018-03-22 2019-09-26 Robert Bosch Gmbh Induktives Bauelement und Hochfrequenz-Filtervorrichtung

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0265267A (ja) * 1988-08-31 1990-03-05 Nec Corp 混成集積回路装置
JP2991136B2 (ja) * 1996-12-02 1999-12-20 日本電気株式会社 多層プリント基板及びその製造方法
DE10042764A1 (de) * 2000-08-31 2002-03-14 Moeller Gmbh Verfahren zur Herstellung eines massereichen ohmschen Widerstands und elektronische Baueinheit

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO2004030001A1 *

Also Published As

Publication number Publication date
DE10393830D2 (de) 2005-08-11
AU2003271534A1 (en) 2004-04-19
WO2004030001A1 (fr) 2004-04-08

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