EP1543532A1 - Hf-reactor - Google Patents

Hf-reactor

Info

Publication number
EP1543532A1
EP1543532A1 EP03753304A EP03753304A EP1543532A1 EP 1543532 A1 EP1543532 A1 EP 1543532A1 EP 03753304 A EP03753304 A EP 03753304A EP 03753304 A EP03753304 A EP 03753304A EP 1543532 A1 EP1543532 A1 EP 1543532A1
Authority
EP
European Patent Office
Prior art keywords
conductor track
resistance layer
meandering
choke
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP03753304A
Other languages
German (de)
French (fr)
Inventor
Christian Dirks
Nils Dirks
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ILFA Industrieelektronik und Leiterplattenfertigung aller Art GmbH
Original Assignee
ILFA Industrieelektronik und Leiterplattenfertigung aller Art GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ILFA Industrieelektronik und Leiterplattenfertigung aller Art GmbH filed Critical ILFA Industrieelektronik und Leiterplattenfertigung aller Art GmbH
Publication of EP1543532A1 publication Critical patent/EP1543532A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
    • H03H1/0007—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network of radio frequency interference filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233—Filters, inductors or a magnetic substance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09263—Meander
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]

Definitions

  • the invention relates to an RF choke for printed circuit boards according to the preamble of claim 1.
  • CMOS circuits The cross currents on the switching edges in CMOS circuits are known to be a significant EMC problem.
  • the insertion of resistors or chokes between the support structure and the Vcc connection of the integrated circuit in question has proven to be an effective countermeasure.
  • the circuit which consists of the supporting structure and the connected circuit, is provided with damping, which on the one hand limits the strength of the undesired cross-current and, secondly, eliminates interference power directly at the point of origin.
  • resistors are particularly inexpensive, but not all integrated circuits can tolerate this resistance. Whenever there are significant DC components in the operating current of the circuit, the resulting voltage drop can lead to malfunction.
  • Suitable ferrite chokes are available as long as the frequency range does not significantly exceed 1000 MHz.
  • the invention has for its object to provide an RF choke for printed circuit boards which can be integrated on the printed circuit board and can also be dimensioned for frequencies higher than 1000 MHz.
  • the invention provides an RF choke, the inductance and the parallel-connected ohmic resistance of which, owing to its layer formation, enables implementation as an integral part of a printed circuit board. Since no materials have to be remagnetized, there is no limitation at high frequencies. At the same time, the solution according to the invention is space-saving and inexpensive in terms of construction height.
  • the resistance layer preferably consists of carbon mass.
  • This material has electrical ohmic properties and can be reproducibly controlled using known techniques in the manufacture of printed circuit boards.
  • the resistance layer is arranged on the meandering conductor track.
  • the area occupied by the meandering conductor track is also used and a spatially intimate arrangement of inductance and ohmic resistance is achieved.
  • the resistance layer preferably extends over the entire length of the meandering conductor track and is connected to it.
  • the capacitive partial impedances present between adjacent meandering sections of the conductor track are larger in magnitude than the partial impedances of the resistance layer between the same sections of the conductor track.
  • 1 is a circuit board layout for an integrated circuit with an RF choke according to the invention
  • Fig. 2 shows a frequency spectrum of the radiation of an undamped system
  • Fig. 3 shows a frequency spectrum of the radiation of a damped system equipped with the RF choke according to the invention.
  • connection 12 for supply potential
  • connection 14 for reference potential being relevant in connection with the invention.
  • connection 14 of the integrated circuit 10 is connected to a line 26 of the printed circuit board carrying reference potential GND and the connection 12 of the integrated circuit 10 is connected via an HF choke 16, 18 to a line 24 of the printed circuit board carrying supply potential Vcc.
  • a support structure comprising two capacitors 20, 22, here 0.1 ⁇ F and 3.9 nF, connected in parallel is arranged between the connection 14 of the integrated circuit and the connection of the RF choke 16, 18, which is connected to the line 24 of the printed circuit board carrying supply potential Vcc ,
  • the RF choke consists on the one hand of an inductance of a meandering conductor track 16 of the circuit board and a resistance layer 18 made of carbon mass.
  • the meandering conductor track 16 runs from the connection 12 of the integrated circuit 10 in the space between its further connections.
  • the resistance layer 18 made of carbon mass is applied to the entire area of this meandering conductor track 16.
  • the structure can also be realized in double-sided printed circuit boards.
  • the meandering track 16 practically represents a short circuit. With increasing frequency, the meandering track 16 forms a growing inductive impedance. As a result, the current is increasingly forced into the shunt provided by the resistance layer 18.
  • the overall impedance of the RF choke becomes increasingly ohmic, as is desirable for the present application.
  • the design of the RF choke can also be made smaller without being less effective.
  • the undesired shunt capacitance increases.
  • An increase in the width of the conductor track or a decrease in the distance also has an effect.
  • the impedance of this capacitive shunt should in any case be greater than the desired ohmic shunt through the resistance layer. Otherwise the upper limit frequency of the choke would be exceeded.
  • this upper limit frequency can be higher than is the case with ferrite chokes because ferrite is not as fast as desired can be remagnetized.
  • the carbon mass is not subject to such a limit. In view of the fact that modern digital systems often work with clock frequencies of over 2000 MHz, this is a particularly interesting aspect. Despite some progress with ferrites, they will be less and less able to solve EMC problems in the future.
  • Fig. 2 shows a frequency spectrum of the radiation of an undamped system
  • Fig. 3 shows a frequency spectrum of the radiation of a damped system equipped with the RF choke according to the invention.
  • the systems are otherwise completely identical.
  • the two frequency spectra allow a comparison of the total radiation from two double-sided boards, which are equipped with integrated circuits of the 74HC series. There are broadband improvements to lOdB.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

The invention relates to a HF-reactor for printed circuit boards. Said HF-reactor comprises an inductor and an ohmic resistor which is mounted in a parallel manner thereto. The inductor is made of a meandering-type conductor (16) belonging to the printed circuit-board (16). The ohmic resistor is made of a resistance layer (18) which has a higher specific resistance than the meandering-type guided conductor.

Description

HF-Drossel RF choke
Die Erfindung betrifft eine HF-Drossel für Leiterplatten nach dem Oberbegriff des Anspruchs 1.The invention relates to an RF choke for printed circuit boards according to the preamble of claim 1.
Die Querströme auf den Schaltflanken in CMOS-Schaltungen sind als erhebliches EMV-Problem bekannt. Als wirksame Gegenmaßnahme hat sich das Einfügen von Widerständen oder Drosseln zwischen Stützkonstruktion und Vcc-Anschluss der betreffenden integrierten Schaltung erwiesen. Hierdurch wird der Stromkreis, der aus Stützkonstruktion und der angeschlossenen Schaltung besteht, mit Dämpfung versehen, was einerseits den unerwünschten Querstrom in seiner Stärke begrenzt und zweitens Störleistung unmittelbar am Ort der Entstehung vernichtet.The cross currents on the switching edges in CMOS circuits are known to be a significant EMC problem. The insertion of resistors or chokes between the support structure and the Vcc connection of the integrated circuit in question has proven to be an effective countermeasure. As a result, the circuit, which consists of the supporting structure and the connected circuit, is provided with damping, which on the one hand limits the strength of the undesired cross-current and, secondly, eliminates interference power directly at the point of origin.
Der Einbau von Widerständen ist zwar besonders preisgünstig, aber nicht alle integrierten Schaltungen vertragen diesen Widerstand. Immer wenn nennenswerte Gleichstromanteile im Betriebsstrom der Schaltung vorliegen, kann der entstehende Spannungsabfall zur Fehlfunktion führen.The installation of resistors is particularly inexpensive, but not all integrated circuits can tolerate this resistance. Whenever there are significant DC components in the operating current of the circuit, the resulting voltage drop can lead to malfunction.
Drosseln verursachen keinen Spannungsabfall bei Gleichstrom, sind aber im allgemeinen recht teuer. Ferner sind nur solche Breitbanddrosseln verwendbar, die im interessiernden Frequenzbereich im wesentlichen ohmsche Anteile aufweisen.Chokes do not cause DC voltage drop, but are generally quite expensive. Furthermore, only those broadband chokes can be used which have essentially ohmic components in the frequency range of interest.
Solange der Frequenzbereich nicht wesentlich über 1000 MHz hinausreicht, sind geeignete Ferritdrosseln erhältlich. Der Erfindung liegt die Aufgabe zugrunde, eine HF-Drossel für Leiterplatten zu schaffen, die auf der Leiterplatte integrierbar ist und auch für höhere Frequenzen als 1000 MHz dimensionierbar ist.Suitable ferrite chokes are available as long as the frequency range does not significantly exceed 1000 MHz. The invention has for its object to provide an RF choke for printed circuit boards which can be integrated on the printed circuit board and can also be dimensioned for frequencies higher than 1000 MHz.
Diese Aufgabe wird bei einer HF-Drossel nach dem Oberbegriff des Anspruchs 1 durch die Merkmale des Anspruchs 1 gelöst .This object is achieved in an RF choke according to the preamble of claim 1 by the features of claim 1.
Weiterbildungen und vorteilhafte Ausgestaltungen ergeben sich aus den Unteransprüchen.Further developments and advantageous refinements result from the subclaims.
Durch die Erfindung wird eine HF-Drossel geschaffen, deren Induktivität und deren parallel geschalteter ohmscher Widerstand aufgrund seiner Schichtausbildung eine Realisierung als integraler Bestandteil einer Leiterplatte ermöglicht. Da keine Materialien ummagnetisiert werden müssen, besteht auch keine Beschränkung bei hohen Frequenzen. Gleichzeitig ist die erfindungsgemäße Lösung in der Aufbauhöhe Platz sparend und kostengünstig.The invention provides an RF choke, the inductance and the parallel-connected ohmic resistance of which, owing to its layer formation, enables implementation as an integral part of a printed circuit board. Since no materials have to be remagnetized, there is no limitation at high frequencies. At the same time, the solution according to the invention is space-saving and inexpensive in terms of construction height.
Vorzugsweise besteht die Widerstandsschicht aus Carbonmasse.The resistance layer preferably consists of carbon mass.
Dieses Material besitzt elektrisch ohmsche Eigenschaften und lässt sich bei der Herstellung von Leiterplatten mit bekannten Techniken reproduzierbar beherrschen.This material has electrical ohmic properties and can be reproducibly controlled using known techniques in the manufacture of printed circuit boards.
Gemäß einer Weiterbildung ist die Widerstandsschicht auf der mäanderartig geführten Leiterbahn angeordnet. Dadurch wird die von der mäanderartig geführten Leiterbahn belegte Fläche mit genutzt und eine räumlich innige Anordnung von Induktivität und ohmschem Widerstand erzielt .According to a development, the resistance layer is arranged on the meandering conductor track. As a result, the area occupied by the meandering conductor track is also used and a spatially intimate arrangement of inductance and ohmic resistance is achieved.
Vorzugsweise erstreckt sich die Widerstandsschicht über der gesamten Länge der mäanderartig geführten Leiterbahn und ist mit dieser verbunden.The resistance layer preferably extends over the entire length of the meandering conductor track and is connected to it.
Dadurch lässt sich der Widerstand der Widerstandsschicht präzise einstellen und ein Nebenschluss zu jedem Mäander der Leiterbahn herstellen.This allows the resistance of the resistance layer to be set precisely and a shunt to be made to each meander of the conductor track.
Weiterhin sind die zwischen benachbarten mäandernden Abschnitten der Leiterbahn vorhanden kapazitiven Teilimpedanzen betragsmäßig größer als die TeilImpedanzen der Widerstandsschicht zwischen denselben Abschnitten der Leiterbahn.Furthermore, the capacitive partial impedances present between adjacent meandering sections of the conductor track are larger in magnitude than the partial impedances of the resistance layer between the same sections of the conductor track.
Diese Bemessungsregel vermeidet einen unerwünschten kapazitiven Nebenschluß, der zu einer Verringerung der Impedanz bei höheren Frequenzen würde .This design rule avoids an undesirable capacitive shunt, which would lead to a reduction in impedance at higher frequencies.
Nachfolgend wird die Erfindung anhand eines Ausführungsbei- spiels erläutert, das in der Zeichnung dargestellt ist. In der Zeichnung zeigen:The invention is explained below on the basis of an exemplary embodiment which is illustrated in the drawing. The drawing shows:
Fig. 1 ein Platinen-Layout für eine integrierte Schaltung mit einer HF-Drossel nach der Erfindung,1 is a circuit board layout for an integrated circuit with an RF choke according to the invention,
Fig. 2 ein Frequenzspektrum der Abstrahlung eines ungedämpften Systems und Fig. 3 ein Frequenzspektrum der Abstrahlung eines mit der erfindungsgemäßen HF-Drossel bestückten gedämpften Systems .Fig. 2 shows a frequency spectrum of the radiation of an undamped system and Fig. 3 shows a frequency spectrum of the radiation of a damped system equipped with the RF choke according to the invention.
Fig. 1 zeigt ein Platinen-Layout für eine integrierte Schaltung 10, wobei im Zusammenhang mit der Erfindung nur ein Anschluss 12 für Versorgungspotential und ein Anschluss 14 für Bezugspotential relevant sind.1 shows a circuit board layout for an integrated circuit 10, only one connection 12 for supply potential and one connection 14 for reference potential being relevant in connection with the invention.
Der Anschluss 14 der integrierten Schaltung 10 ist mit einer Bezugspotential GND führenden Leitung 26 der Leiterplatte verbunden und der Anschluss 12 der integrierten Schaltung 10 ist über eine HF-Drossel 16, 18 an eine Versorgungspotential Vcc führende Leitung 24 der Leiterplatte angeschlossen. Zusätzlich ist eine Stützkonstruktion aus zwei parallel geschalteten Kondensatoren 20, 22, hier 0.1 μF und 3.9 nF zwischen dem Anschluss 14 der integrierten Schaltung und dem Anschluss der HF-Drossel 16, 18 angeordnet, der an die Versorgungspotential Vcc führende Leitung 24 der Leiterplatte angeschlossen ist.The connection 14 of the integrated circuit 10 is connected to a line 26 of the printed circuit board carrying reference potential GND and the connection 12 of the integrated circuit 10 is connected via an HF choke 16, 18 to a line 24 of the printed circuit board carrying supply potential Vcc. In addition, a support structure comprising two capacitors 20, 22, here 0.1 μF and 3.9 nF, connected in parallel is arranged between the connection 14 of the integrated circuit and the connection of the RF choke 16, 18, which is connected to the line 24 of the printed circuit board carrying supply potential Vcc ,
Die HF-Drossel besteht einerseits aus einer Induktivität aus einer mäanderartig geführten Leiterbahn 16 der Leiterplatte und einer Widerstandsschicht 18 aus Carbonmasse. Die mäanderartig geführte Leiterbahn 16 verläuft vom Anschluss 12 der integrierten Schaltung 10 in deren Zwischenraum zwischen ihren weiteren Anschlüssen. Die Widerstandsschicht 18 aus Carbonmasse ist auf den gesamten Bereich dieser mäanderartig geführten Leiterbahn 16 aufgebracht. Der Aufbau kann auch in doppelseitigen Leiterplatten realisiert werden. Für niedrige Frequenzen stellt die mäanderartig geführte Leiterbahn 16 praktisch einen Kurzschluss dar. Mit wachsender Frequenz bildet die mäanderartig geführte Leiterbahn 16 eine wachsende induktive Impedanz. Hierdurch wird der Strom zunehmend in den Nebenschluss gedrängt, der durch die Widerstands- schicht 18 bereitgestellt wird. Die gesamte Impedanz der HF- Drossel wird zunehmend ohmsch, wie dies für die vorliegende Anwendung wünschenswert ist.The RF choke consists on the one hand of an inductance of a meandering conductor track 16 of the circuit board and a resistance layer 18 made of carbon mass. The meandering conductor track 16 runs from the connection 12 of the integrated circuit 10 in the space between its further connections. The resistance layer 18 made of carbon mass is applied to the entire area of this meandering conductor track 16. The structure can also be realized in double-sided printed circuit boards. For low frequencies, the meandering track 16 practically represents a short circuit. With increasing frequency, the meandering track 16 forms a growing inductive impedance. As a result, the current is increasingly forced into the shunt provided by the resistance layer 18. The overall impedance of the RF choke becomes increasingly ohmic, as is desirable for the present application.
Die Konstruktion der HF-Drossel kann auch kleiner gestaltet werden, ohne weniger wirksam zu sein. Je dünner die Leiterbahn und je kleiner die Abstände werden, umso höher werden die Impedanzen. Es kann also für eine gegebene Impedanz eine kleine Fläche verwendet werden, wenn man die o. g. Regel anwendet. Dennoch sind die möglichen Konstruktionen nicht ganz beliebig.The design of the RF choke can also be made smaller without being less effective. The thinner the conductor track and the smaller the distances, the higher the impedances. A small area can therefore be used for a given impedance if the above-mentioned. Rule applies. Nevertheless, the possible constructions are not entirely arbitrary.
Mit wachsender Länge der einzelnen Windung der mäanderartig geführten Leiterbahn 16 wird die unerwünschte Nebenschlusskapazität größer. Ebenso wirkt sich eine Vergrößerung der Breite der Leiterbahn aus oder eine Verringerung des Abstandes . Die Impedanz dieses kapazitiven Nebenschlusses sollte auf jeden Fall größer sein als der erwünschte ohmsche Nebenschluss durch die Widerstandsschicht . Andernfalls wäre die obere Grenzfrequenz der Drossel überschritten.As the length of the individual turn of the meandering conductor track 16 increases, the undesired shunt capacitance increases. An increase in the width of the conductor track or a decrease in the distance also has an effect. The impedance of this capacitive shunt should in any case be greater than the desired ohmic shunt through the resistance layer. Otherwise the upper limit frequency of the choke would be exceeded.
Diese obere Grenzfrequenz kann bei richtiger Konstruktion der HF-Drossel nach der Erfindung höher liegen, als dies bei Ferritdrosseln der Fall ist, weil Ferrit nicht beliebig schnell ummagnetisiert werden kann. Die Carbonmasse unterliegt einer solchen Grenze nicht. Vor dem Hintergrund, dass moderne Digitalsysteme häufig schon mit Taktfrequenzen von über 2000 MHz arbeiten, ist dies ein besonders interessanter Aspekt. Trotz gewisser Fortschritte mit Ferriten werden diese aber in Zukunft EMV-Probleme immer weniger lösen können.If the HF choke according to the invention is constructed correctly, this upper limit frequency can be higher than is the case with ferrite chokes because ferrite is not as fast as desired can be remagnetized. The carbon mass is not subject to such a limit. In view of the fact that modern digital systems often work with clock frequencies of over 2000 MHz, this is a particularly interesting aspect. Despite some progress with ferrites, they will be less and less able to solve EMC problems in the future.
Fig. 2 zeigt ein Frequenzspektrum der Abstrahlung eines ungedämpften Systems und Fig. 3 ein Frequen spektrum der Abstrahlung eines mit der erfindungsgemäßen HF-Drossel bestückten gedämpften Systems. Die Systeme sind ansonsten völlig gleichartig aufgebaut.Fig. 2 shows a frequency spectrum of the radiation of an undamped system and Fig. 3 shows a frequency spectrum of the radiation of a damped system equipped with the RF choke according to the invention. The systems are otherwise completely identical.
Die beiden FrequenzSpektren ermöglichen einen Vergleich der Gesamtabstrahlung aus zwei doppelseitigen Platinen, die mit integrierten Schaltungen der Serie 74HC bestückt sind. Man findet breitbandig Verbesserungen um lOdB. The two frequency spectra allow a comparison of the total radiation from two double-sided boards, which are equipped with integrated circuits of the 74HC series. There are broadband improvements to lOdB.

Claims

P a t e n t a n s p r ü c h e Patent claims
1. HF-Drossel für Leiterplatten aus einer Induktivität und einem dazu parallel geschalteten ohmschen Widerstand, wobei die Induktivität aus einer mäanderartig geführten Leiterbahn1. RF choke for printed circuit boards from an inductor and an ohmic resistor connected in parallel with it, the inductor from a meandering conductor track
(16) der Leiterplatte besteht, dadurch gekennzeichnet, dass der ohmsche Widerstand aus einer Widerstandsschicht (18) besteht, die einen höheren spezifischen Widerstand als die mäanderartig geführte Leiterbahn (16) aufweist.(16) of the printed circuit board, characterized in that the ohmic resistance consists of a resistance layer (18) which has a higher specific resistance than the meandering conductor track (16).
2. HF-Drossel nach Anspruch 1, dadurch gekennzeichnet, dass die Widerstandsschicht (18) aus Carbonmasse besteht.2. RF choke according to claim 1, characterized in that the resistance layer (18) consists of carbon mass.
3. HF-Drossel nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass die Widerstandsschicht (18) auf der mäanderartig geführten Leiterbahn (16) angeordnet ist.3. RF choke according to claim 1 or 2, characterized in that the resistance layer (18) is arranged on the meandering conductor track (16).
4. HF-Drossel nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, dass die Widerstandsschicht (18) über der gesamten Länge der mäanderartig geführten Leiterbahn (16) erstreckt ist und mit dieser verbunden ist .4. RF choke according to one of claims 1 to 3, characterized in that the resistance layer (18) extends over the entire length of the meandering conductor track (16) and is connected thereto.
5. HF-Drossel nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, dass die zwischen benachbarten mäandernden Abschnitten der Leiterbahn vorhanden kapazitiven Teilimpedanzen betragsmäßig größer als die Teilimpedanzen der Widerstands- schicht (18) zwischen denselben Abschnitten der Leiterbahn sind. 5. RF choke according to one of claims 1 to 3, characterized in that the capacitive partial impedances present between adjacent meandering sections of the conductor track are greater in magnitude than the partial impedances of the resistance layer (18) between the same sections of the conductor track.
EP03753304A 2002-09-19 2003-09-13 Hf-reactor Withdrawn EP1543532A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10243484 2002-09-19
DE10243484 2002-09-19
PCT/DE2003/003051 WO2004030001A1 (en) 2002-09-19 2003-09-13 Hf-reactor

Publications (1)

Publication Number Publication Date
EP1543532A1 true EP1543532A1 (en) 2005-06-22

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Country Status (4)

Country Link
EP (1) EP1543532A1 (en)
AU (1) AU2003271534A1 (en)
DE (1) DE10393830D2 (en)
WO (1) WO2004030001A1 (en)

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