EP3763477A4 - FLUX, BRAZING PULP, BRAZING PROCESS, PROCESS FOR PRODUCING A BRAZING PRODUCT AND PROCESS FOR PRODUCING A BGA BOX - Google Patents
FLUX, BRAZING PULP, BRAZING PROCESS, PROCESS FOR PRODUCING A BRAZING PRODUCT AND PROCESS FOR PRODUCING A BGA BOX Download PDFInfo
- Publication number
- EP3763477A4 EP3763477A4 EP19764429.7A EP19764429A EP3763477A4 EP 3763477 A4 EP3763477 A4 EP 3763477A4 EP 19764429 A EP19764429 A EP 19764429A EP 3763477 A4 EP3763477 A4 EP 3763477A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- producing
- soldering
- flux
- solder paste
- bga package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title 2
- 238000005476 soldering Methods 0.000 title 2
- 230000004907 flux Effects 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 229910000679 solder Inorganic materials 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/203—Fluxing, i.e. applying flux onto surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3615—N-compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3618—Carboxylic acids or salts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018043396 | 2018-03-09 | ||
PCT/JP2019/009284 WO2019172410A1 (ja) | 2018-03-09 | 2019-03-08 | フラックス、ソルダペースト、はんだ付けプロセス、はんだ付け製品の製造方法、bgaパッケージの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3763477A1 EP3763477A1 (en) | 2021-01-13 |
EP3763477A4 true EP3763477A4 (en) | 2021-11-17 |
Family
ID=67847170
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP19764429.7A Pending EP3763477A4 (en) | 2018-03-09 | 2019-03-08 | FLUX, BRAZING PULP, BRAZING PROCESS, PROCESS FOR PRODUCING A BRAZING PRODUCT AND PROCESS FOR PRODUCING A BGA BOX |
Country Status (7)
Country | Link |
---|---|
US (1) | US20200398383A1 (ja) |
EP (1) | EP3763477A4 (ja) |
JP (2) | JP7356112B2 (ja) |
KR (1) | KR20200125651A (ja) |
CN (1) | CN111836695B (ja) |
TW (1) | TWI806984B (ja) |
WO (1) | WO2019172410A1 (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11581239B2 (en) * | 2019-01-18 | 2023-02-14 | Indium Corporation | Lead-free solder paste as thermal interface material |
JP2020116611A (ja) * | 2019-01-24 | 2020-08-06 | 株式会社弘輝 | フラックス及びソルダペースト |
JP6706000B1 (ja) * | 2019-12-12 | 2020-06-03 | 千住金属工業株式会社 | フラックス、はんだペーストおよびはんだ付け製品の製造方法 |
TWI733301B (zh) * | 2020-01-09 | 2021-07-11 | 廣化科技股份有限公司 | 焊料膏組成物及包含其之焊接方法 |
JP6836090B1 (ja) * | 2020-04-02 | 2021-02-24 | 千住金属工業株式会社 | フラックス組成物、及びそれを用いたはんだペースト |
EP4213600A4 (en) * | 2020-11-12 | 2024-05-29 | Senju Metal Industry Co., Ltd. | SOLDERING DEVICE |
JP6947998B1 (ja) * | 2020-11-18 | 2021-10-13 | 千住金属工業株式会社 | フラックス及びソルダペースト |
CN116529021B (zh) * | 2020-11-18 | 2024-03-08 | 千住金属工业株式会社 | 助焊剂及焊膏 |
TWI800987B (zh) | 2020-11-18 | 2023-05-01 | 日商千住金屬工業股份有限公司 | 助焊劑及焊膏 |
CN113523469A (zh) * | 2021-06-15 | 2021-10-22 | 芜湖市零一精密工具制造有限公司 | 一种刀具加工用真空焊接工艺 |
CN115519276B (zh) * | 2022-01-10 | 2024-08-09 | 上海华庆焊材技术股份有限公司 | 一种焊膏用粘结剂及其制备方法和应用 |
CN115555759B (zh) * | 2022-01-18 | 2024-07-16 | 上海华庆焊材技术股份有限公司 | 一种含有垫高球的无残留焊膏及其制备方法 |
CN118805249A (zh) * | 2022-04-08 | 2024-10-18 | 库利克和索夫工业公司 | 焊合系统以及在焊合系统上提供还原气体的方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017064777A (ja) * | 2015-10-02 | 2017-04-06 | 三菱マテリアル株式会社 | ハンダペースト用水溶性フラックス及びハンダペースト |
JP6160788B1 (ja) * | 2017-01-13 | 2017-07-12 | 千住金属工業株式会社 | フラックス |
JP2017192987A (ja) * | 2016-04-18 | 2017-10-26 | オリジン電気株式会社 | 半田組成物及び半田付け製品の製造方法 |
EP3636382A1 (en) * | 2017-08-28 | 2020-04-15 | Koki Company Limited | Flux, solder paste, and method for producing electronic circuit board |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04220192A (ja) * | 1990-12-14 | 1992-08-11 | Senju Metal Ind Co Ltd | 低残渣はんだペースト |
KR100254927B1 (ko) * | 1994-12-07 | 2000-05-01 | 오까베 히로시 | 납땜용 플럭스, 땜납 페이스트 및 이것을 사용한 납땜 방법 |
CA2212554A1 (en) * | 1997-09-22 | 1999-03-22 | David Wai-Yin Leung | Non-cfcs solder flux composition |
US6103549A (en) * | 1998-03-17 | 2000-08-15 | Advanced Micro Devices, Inc. | No clean flux for flip chip assembly |
US6217671B1 (en) * | 1999-12-14 | 2001-04-17 | International Business Machines Corporation | Composition for increasing activity of a no-clean flux |
JP4042418B2 (ja) * | 2002-01-30 | 2008-02-06 | 昭和電工株式会社 | ハンダ付けフラックス |
US6887319B2 (en) * | 2002-04-16 | 2005-05-03 | Senju Metal Industry Co., Ltd. | Residue-free solder paste |
US7767032B2 (en) * | 2006-06-30 | 2010-08-03 | W.C. Heraeus Holding GmbH | No-clean low-residue solder paste for semiconductor device applications |
JP4859717B2 (ja) | 2007-03-14 | 2012-01-25 | 株式会社タムラ製作所 | はんだ組成物 |
US20130333806A1 (en) * | 2011-03-02 | 2013-12-19 | Senju Metal Industry Co., Ltd. | Flux |
JP5971500B2 (ja) * | 2012-08-13 | 2016-08-17 | 千住金属工業株式会社 | インジウムボールおよびその製造方法 |
JP6513950B2 (ja) * | 2015-01-07 | 2019-05-15 | ナミックス株式会社 | 無洗浄フラックス、および半導体パッケージの製造方法 |
JP5816947B1 (ja) * | 2015-02-05 | 2015-11-18 | 株式会社弘輝 | フラックス用活性剤、フラックス及びはんだ |
JP6042956B1 (ja) * | 2015-09-30 | 2016-12-14 | オリジン電気株式会社 | 半田付け製品の製造方法 |
WO2017057651A1 (ja) | 2015-09-30 | 2017-04-06 | オリジン電気株式会社 | 還元ガス用ソルダペースト、半田付け製品の製造方法 |
KR102369319B1 (ko) | 2015-11-17 | 2022-03-03 | 삼성전자주식회사 | 전자 장치 및 전자 장치의 핸드오프 기능 제공 방법 |
JP2018043396A (ja) | 2016-09-14 | 2018-03-22 | 住友ゴム工業株式会社 | タイヤの製造方法 |
-
2019
- 2019-03-08 CN CN201980018200.0A patent/CN111836695B/zh active Active
- 2019-03-08 EP EP19764429.7A patent/EP3763477A4/en active Pending
- 2019-03-08 US US16/979,165 patent/US20200398383A1/en active Pending
- 2019-03-08 KR KR1020207027293A patent/KR20200125651A/ko active IP Right Grant
- 2019-03-08 TW TW108107858A patent/TWI806984B/zh active
- 2019-03-08 JP JP2020505127A patent/JP7356112B2/ja active Active
- 2019-03-08 WO PCT/JP2019/009284 patent/WO2019172410A1/ja active Application Filing
-
2023
- 2023-09-13 JP JP2023148834A patent/JP2023169277A/ja active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017064777A (ja) * | 2015-10-02 | 2017-04-06 | 三菱マテリアル株式会社 | ハンダペースト用水溶性フラックス及びハンダペースト |
JP2017192987A (ja) * | 2016-04-18 | 2017-10-26 | オリジン電気株式会社 | 半田組成物及び半田付け製品の製造方法 |
JP6160788B1 (ja) * | 2017-01-13 | 2017-07-12 | 千住金属工業株式会社 | フラックス |
EP3636382A1 (en) * | 2017-08-28 | 2020-04-15 | Koki Company Limited | Flux, solder paste, and method for producing electronic circuit board |
Also Published As
Publication number | Publication date |
---|---|
EP3763477A1 (en) | 2021-01-13 |
KR20200125651A (ko) | 2020-11-04 |
JP7356112B2 (ja) | 2023-10-04 |
TW201940276A (zh) | 2019-10-16 |
JPWO2019172410A1 (ja) | 2021-03-25 |
CN111836695A (zh) | 2020-10-27 |
US20200398383A1 (en) | 2020-12-24 |
WO2019172410A1 (ja) | 2019-09-12 |
CN111836695B (zh) | 2022-06-24 |
JP2023169277A (ja) | 2023-11-29 |
TWI806984B (zh) | 2023-07-01 |
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