Classifications

• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
  • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
  • G01R1/02—General constructional details
  • G01R1/06—Measuring leads; Measuring probes
  • G01R1/067—Measuring probes
  • G01R1/07—Non contact-making probes
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
  • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
  • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
  • G01R31/302—Contactless testing
  • G01R31/312—Contactless testing by capacitive methods
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
  • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
  • G01R1/02—General constructional details
  • G01R1/06—Measuring leads; Measuring probes
  • G01R1/067—Measuring probes
  • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
  • G01R1/06733—Geometry aspects
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
  • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
  • G01B21/22—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring angles or tapers; for testing the alignment of axes
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
  • G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
  • G01L5/0057—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes measuring forces due to spring-shaped elements
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
  • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
  • G01R1/02—General constructional details
  • G01R1/06—Measuring leads; Measuring probes
  • G01R1/067—Measuring probes
  • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
  • G01R1/06716—Elastic
  • G01R1/06722—Spring-loaded
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
  • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
  • G01R1/02—General constructional details
  • G01R1/06—Measuring leads; Measuring probes
  • G01R1/067—Measuring probes
  • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
  • G01R1/06733—Geometry aspects
  • G01R1/06738—Geometry aspects related to tip portion
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
  • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
  • G01R1/02—General constructional details
  • G01R1/06—Measuring leads; Measuring probes
  • G01R1/067—Measuring probes
  • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
  • G01R1/06755—Material aspects
  • G01R1/06761—Material aspects related to layers
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
  • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
  • G01R1/02—General constructional details
  • G01R1/06—Measuring leads; Measuring probes
  • G01R1/067—Measuring probes
  • G01R1/073—Multiple probes
  • G01R1/07392—Multiple probes manipulating each probe element or tip individually
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
  • G01R23/00—Arrangements for measuring frequencies; Arrangements for analysing frequency spectra
  • G01R23/02—Arrangements for measuring frequency, e.g. pulse repetition rate; Arrangements for measuring period of current or voltage
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
  • G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
  • G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
  • G01R27/26—Measuring inductance or capacitance; Measuring quality factor, e.g. by using the resonance method; Measuring loss factor; Measuring dielectric constants ; Measuring impedance or related variables
  • G01R27/2605—Measuring capacitance
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
  • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
  • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
  • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
  • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
  • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
  • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
  • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
  • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
  • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
  • G01R31/2813—Checking the presence, location, orientation or value, e.g. resistance, of components or conductors
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
  • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
  • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
  • G01R31/2851—Testing of integrated circuits [IC]
  • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks

Definitions

• the present invention relates to a test needle for measuring electrically conductive layers in holes of printed circuit boards, as well as a test probe with such a test needle and a finger tester for testing printed circuit boards with such a test needle or with such a test probe.
• the printed circuit boards are often first produced with so-called coupons.
• the coupons are areas of the printed circuit board which have predetermined conductor tracks for making measurements thereon. After performing the measurements to test that the circuit board has been properly made, the coupons are separated from the rest of the circuit board. The rest of the circuit board forms one or more so-called benefits, which are equipped with electrical components and used in electrical's products.
• the coupons have special tracks, from which it can be easily determined whether the production process is e.g. meets the requirements for producing high frequency suitable tracks. Furthermore, stress tests can be performed on the tracks of the coupon, which can also destroy individual tracks on the coupons. Since the tracks of the coupons are not used in later products, they may be specially optimized for certain test operations.
• US 2015/047892 A1 discloses a method in which a drill is used at the same time as a probe to measure the electrical contact with the track during back-drilling and thus control the drill accordingly.
• the capacitance of the capacitive probe is measured. Any remaining electrically conductive material in the drilled hole is identified by its capacity. This can be used to detect errors during reverse drilling.
• the present invention has for its object to provide a test needle for measuring electrically conductive layers in holes of printed circuit boards and a corresponding test probe and a finger tester, with which simple, reliable and very accurate a drilled hole of a printed circuit board according to the in US 9,341,670 B2 described method can be measured.
• a test needle according to the invention for measuring electrically conductive layers in bores of printed circuit boards comprises an electrical conductor, which is surrounded by a shield, wherein the test needle has a terminal end, to which it can be electrically connected to a capacitive measuring device, and Measuring end, which is insertable during a measurement in a bore.
• This test needle is characterized in that a capacitive measuring body connected to the electrical conductor is arranged outside the shielding at the measuring end, which can form a capacitive coupling with an electrically conductive layer in the bore.
• the position of the capacitive measuring body can be determined very precisely with the test needle by reference to the measured capacitance an electrically conductive layer are detected.
• the measuring body is preferably surrounded by an electrical insulation layer, so that no electrical contact between the measuring body and another electrically conductive body can take place.
• the measuring body may be in the form of a hollow cylinder.
• the measuring body may also be formed by one or more windings of the electrical conductor, wherein these windings are outside the shield.
• the measuring body preferably has a maximum diameter of 1.5 mm, in particular a maximum diameter of 1 mm, and preferably a maximum diameter of 0.75 mm.
• the measuring body preferably has a maximum length of 0.5 mm, preferably a maximum length of 0.25 mm and in particular a maximum length of 0.15 mm in the axial direction of the test needle.
• the test needle may comprise an electrically conductive tube which forms the shield in which a cable comprising the electrical conductor and an electrical insulation layer is guided.
• the cable may protrude slightly out of the tube at the terminal end for connection to the capacitive measuring device.
• the cable can protrude slightly to be arranged around the tube for forming the measuring body in one or more windings.
• the cable with two, three, four or more turns is wound around the electrically conductive tube to form the measuring body.
• a test probe for measuring electrically conductive layers in bores of printed circuit boards can be provided with a test needle explained above and has a touch sensor with which it can be determined whether the test needle touches another body.
• the depth of a blind hole can be measured by the test probe once touches the surface of the circuit board to be tested and another time a bottom of the blind hole and detects the respective touch, thereby detecting the position of the probe. The difference between the two positions gives the depth of the blind hole.
• the actual capacitive measurement should be as non-contact as possible, which is why with the touch sensor can also be tried to determine whether a contact with another body is present, and then if necessary to move the test needle so that it no longer touches the body.
• the touch sensor may include a resilient mount for holding the test needle and a sensor for detecting a deflection of the resilient mount.
• the sensor for detecting a deflection of the resilient mount may be an optical sensor.
• This optical sensor can be designed in different ways.
• a light source can, for example, be arranged directly or indirectly via a light guide on the spring-elastic mount, the light exit being detected by means of an optical sensor.
• the light cone is moved away from the optical sensor, which can be detected by a different brightness.
• a stop may be formed, on which the test needle and / or the spring-elastic holder rests in the non-deflected state.
• the positi on the test needle in undeflected state is clearly defined with respect to the test probe. If the position of the test probe is known, then the position of the test needle and thus the position of the measuring body can be derived therefrom.
• a finger tester for testing printed circuit boards in particular for testing bare printed circuit boards, preferably has a test finger, which is freely movable in a predetermined test area, to be movable in the vicinity of a predetermined contact point of the printed circuit board.
• the test finger can be provided with a test needle explained above or with a test probe explained above.
• the finger tester can have a plurality of test fingers, wherein one or more of the further test fingers are formed with a test needle for electrically contacting predetermined contact points of the printed circuit board.
• the invention relates to a method for measuring electrically conductive layers in holes of printed circuit boards.
• a test probe explained above or a test probe explained above or the finger tester explained above are used.
• the test needle is inserted with the capacitive measuring body in a bore.
• the location of the capacitive measuring body is detected here and at the same time the electrical capacitance of the capacitive measuring body is measured to its surroundings. Based on the measured capacitance, it is determined whether an electrical conductor is located in the vicinity of the detected location.
• This capacitive measuring body can also be introduced into small holes, so in that electrically conductive layers formed on the inner surface can be reliably detected.
• the depth of a blind hole to be measured can also be determined by means of the contact sensor explained above. This determination of the depth can be carried out before, during or after the capacitive measurement.
• an electrical signal having a frequency of at least 1 kHz is applied. It is also possible to use higher frequencies of, for example, at least 2 kHz or at least 4 kHz.
• the measuring signal can be applied to the conductor of the test needle and thus to the capacitive measuring body.
• the measurement signal induced thereon is sampled.
• the measurement signal is applied to a conductor track, which is to be connected to the electrical conductor, which is scanned with the capacitive measuring body.
• the measuring signal is induced by this electrical conductor on the capacitive measuring body and can be detected and evaluated by the measuring device accordingly. This is particularly useful when the electrical conductor is connected to many electrically conductive sections, which are located in different holes. Then a single test finger has to be placed on this electrical conductor and the test probe can successively scan the electrical conductors therein in several holes.
• a "properly executed bore” is a bore in which desired areas of the inner surface are provided with an electrically conductive layer connected to the electrical conductor to which the measurement signal is applied and other areas of the inner surface of the bore are not
• the arrangement of the electrically conductive layer on the inner surface of the bore can thus be determined by comparison, and if the measured capacitance profile coincides with the predetermined capacitance profile, then the bore is formed correctly, ie However, if there are deviations, this means that either an electrically conductive layer is missing at a certain point or an electrically conductive layer is provided at a certain point the per se no electrically conductive layer should be ordered.
• test needle is held with this method whenever possible perpendicular to the surface of the circuit board to be tested, since the holes are usually introduced perpendicular to the surface of the circuit board. As a result, the test needle is aligned axially relative to the respective bore and the risk of a collision with the inner surface of a bore is low.
• FIG. 2a-2c a test probe with a test needle according to the invention in perspective
• FIG. 4 shows schematically a measuring arrangement for measuring an electrically conductive
• FIG. 5 shows schematically a measuring arrangement for measuring an electrically conductive
• FIGS. 4 and 5 shows an equivalent circuit diagram of the measuring arrangements for non-contact measurement of the conductive layer in a plated-through hole according to FIGS. 4 and 5.
• the invention can be carried out by means of a finger tester 1, which has a plurality of test fingers 2, each of which is provided with a test probe 3 with which a printed circuit board 4 to be tested can be electrically contacted in order to feed or pick off a corresponding measurement signal in the conductor tracks ( Figure 1).
• Such probes 3 are z. As described in WO 03/048787 Al, to which reference is made in this respect.
• the finger tester has two truss units 5, on which a plurality of guide rails 6 are arranged, which extend over a test area extend, in which the printed circuit board to be tested 4 can be accommodated.
• Each truss unit 5 forms a frame with an elongate passage opening.
• the two truss units 5 are perpendicular to a holder 7, so that their passage openings are aligned.
• each truss unit has four guide rails 6, wherein in each case two are arranged on each side of the truss unit 5.
• one of the guide rails 6 is located above and the other of the guide rails below the through opening 8.
• each guide rail 6 On each guide rail 6, at least one slide 9 is arranged displaceably, which carries one of the test fingers 2.
• two slides 9 are provided on a guide rail 6. In principle, however, more than two slides 9 can be arranged on a guide rail 6.
• test fingers 2 are pivotally attached to the carriage 9 at one end.
• a finger tester is apparent, for example, from WO 2014/140029 A1. In this regard, reference is made to this document in its entirety.
• test probes 3 are arranged at the ends remote from the carriages 9, the free ends of the test fingers 2 and each have a test needle 10, which is directed with a contact tip 11 in the direction of the circuit board 4 to be contacted.
• the test fingers 2 can be moved with the test probes 3 in the direction of the printed circuit board 4 and away from the printed circuit board 4 in order to arrange the contact tip 11 either on the surface of the printed circuit board or into a bore in the printed circuit board 4.
• test probe 12 (FIGS. 2 a - 2 c) which is designed for contactless, capacitive scanning of bores and in particular blind bores of the printed circuit board 4.
• a test probe 12 has a base plate 13, which is designed as a printed circuit board.
• a locking body 14 is arranged, which has two latching arms 15, with which the test probe 12 can be fixed to one of the test finger 2 latching.
• two spring arms 16, 17 are attached. One of the two spring arms rests directly on the base plate 13 and is clamped between the base plate 13 and the detent body 14.
• the other spring arm 17 is attached to the remote from the base plate 13 surface of the detent body 14 by means of two screws.
• the spring arms 16, 17 are arranged parallel to each other. Starting from the latching body 14, the base plate 13 and the spring arms 16, 17 taper in plan view to a free end 18, on which the two spring arms 16, 17 protrude in each case a piece. At these ends of the Spring arms 16, 17 each have a test needle 19 is attached, so that the elastic spring arms 16, 17, the locking body 14 and the two spring arms 16, 17 connecting portion of the test needle 19 form a parallelogram.
• the two spring arms 16, 17 can be pivoted away from the base plate 13 with their free ends, so that the test needle is elastically mounted on the test probe 12.
• the spring arm 16 resting directly on the base plate is referred to below as the base spring arm 16 and the spring arm 17 remote from the base plate 13 as the free spring arm 17.
• the base plate 13 thus forms a stop for the base spring arm 16 and thus for the movement of the test needle 19 relative to the rest of the body of the test needle 12th
• Both spring arms 16, 17 form an approximately triangular frame in plan view.
• a light barrier arrangement 21 which forms a light barrier with a light source and a light sensor, in which the measuring lug 20 engages when the spring arms 16, 17 are not deflected.
• the measuring lug 20 is moved out of the light barrier, so that the light sensor detects a greater brightness.
• This light barrier assembly 21 thus forms together with the measuring lug 20, a touch sensor which detects when by touching the test needle 19 with another body, the spring arms 16, 17 are deflected.
• the test needle has a connection end 22 and a measuring end 23. In the region of the connection end 22, the free spring arm 17 is connected to the test needle 19.
• the test needle 19 is connected to the Basisfederarm 16 so that in the non-deflected state of the spring arms 16, 17, so when the Basisfederarm 16 rests on the base plate 13, the test needle 19 is arranged perpendicular to the plane of the base plate 13.
• test probe 12 and the corresponding test finger 2 are designed in such a way that, in the state mounted on the test finger 2, the test needle is arranged in the non-deflected state perpendicular to the test area or to a printed circuit board 4 located in the test area.
• the test needle 19 is at the test probe 12 a piece relative to the base plate 13 before.
• the test needle 19 has a metal tube which is electrically conductive and has an outside diameter of preferably not more than 0.2 mm and in particular not more than 0.18 mm.
• a cable 25 is guided, which has an electrical conductor which is surrounded by an insulating layer.
• the cable 25 is connected to a conductor track formed on the base plate 13, which is electrically connected to a capacitive measuring device (not shown).
• the conductor of the cable 25 is connected to a capacitive measuring body 26.
• the Capacitive measuring body is a metallic ring body which is arranged around the tube and is electrically insulated from it.
• the capacitive measuring body 26 may be a metal ring provided with an insulating layer, which is electrically connected to the conductor of the cable 25. However, the capacitive measuring body 26 may also be formed from one or more windings of the cable 25.
• the metal tube 24 serves to shield the cable 25, so that only the capacitive measuring body 26 can enter into a capacitive coupling with a nearby electrical conductor and its capacitive coupling to this further electrical conductor alone can be scanned by means of the cable 25 ,
• a measuring tip 27 is formed. This measuring tip is only for the mechanical contact of another body.
• the measuring tip can be formed from a non-electrically conductive material or provided with an insulating layer. In the present embodiment, it does not serve for electrical contacting of a contact point of a printed circuit board.
• the measuring tip can also be designed to be electrically conductive, so that it can be used for establishing an electrical connection with a contact point of the printed circuit board. If such an electrically conductive contact tip is electrically connected to the capacitive measuring body 26, the contact tip can be taken into account in the case of a capacitive coupling, which the capacitive measuring body 26 forms with an electrically conductive object to be measured.
• An embodiment of the measuring tip 27 is formed from a cannula tube 28 which is connected at one end by means of a solder joint 29 to the tube or shield 24 electrically conductive and mechanically.
• the cannula tube has a diameter of, for example, 0.3 mm in the region of the solder joint 29.
• the cannula tube is formed axially in the direction of the measuring tip 27 and has a diameter of 0.2 mm or less in the region of the measuring tip 27.
• the cannula tube 28 is cut obliquely in the region of the measuring tip, so that an obliquely extending outlet opening 30 results.
• the cable 25 is passed through the tube 24 and the cannula tube 28 and exits the cannula tube 28 at the outlet opening 30.
• the measuring tip TI itself is electrically conductive and electrically conductively connected to the tube 24.
• Such an electrically conductive measuring tip has the advantage that the test needle 19 can, for example, come into contact with a calibrating surface which has electrically conductive and non-electrically conductive surface sections, so that the position of the test needle 19 and thus the position of a test finger 2, in FIG the test needle 19 is attached, can be calibrated.
• the test needle 19 shown in FIG. 3 is easy to manufacture and has a very small measuring body 26, so that the spatial resolution is correspondingly precise.
• a typical measuring procedure for measuring the electrically conductive coating in a blind hole bore of a printed circuit board by means of the finger tester 1 is as follows:
• the surface of the printed circuit board 4 to be tested is first mechanically contacted in order to determine its height.
• the test probe is inserted with the test needle into a blind hole of the printed circuit board 4 to be measured until the measuring tip 27 touches the bottom of the blind bore of the printed circuit board 4.
• the location of the test probe 12 at the time when the bottom of the blind bore touches is detected by means of the touch sensor, so that the height difference between this location and the location at which the test probe or with its probe tip 27 the surface of the circuit board has been touched, the depth of the blind hole is determined.
• a capacitive measurement of the capacitance between the capacitive measuring body 26 and an electrical conductor located in the blind hole is carried out by contacting it with a further test finger 2 which contacts a contact point of the printed circuit board electrical conductor is connected to this electrical conductor a predetermined measurement signal is applied.
• the measuring signal preferably has a frequency of at least 1 kHz and in particular a frequency of at least 4 kHz or at least 10 kHz.
• the signal thus induced on the capacitive measuring body 26 is picked up by means of the cable 25 from the capacitive measuring body 26 and forwarded to the measuring device.
• the capacitance formed between the capacitive measuring body 26 and the adjacent thereto arranged electrical conductor be determined.
• the location of the capacitive measuring body 26 is detected, which is predetermined by the location of the test probe 12, which is set by the movement of the corresponding test finger 2 and is known on the finger tester 1.
• the capacitance which the capacitive measuring body 26 forms with its surroundings can be determined as a function of location.
• a profile of the capacitance is generated, from which the coating of the inner surface of the blind hole bore can be derived with an electrical conductor.
• the finger tester 1 has a plurality of test fingers 2, which are each provided with a test probe 12 according to the invention.
• a plurality of blind bores or through bores can be measured simultaneously.
• measurement signals are used which differ in their frequency.
• cross-talk from one measurement to another measurement can then be prevented with corresponding bandpass filters.
• each guide rail 6 at least one test finger 2 with a
• Test probe 3 with a conventional test needle 10 for electrically contacting a contact point of the circuit board and another test finger 2 provided with a test probe 12 according to the invention. It may also be expedient to provide two test fingers 2 with conventional test probes 3 and a further test finger 2 with a test probe 12 according to the invention on a guide rail 6.
• the invention can also be applied to a conventional finger tester which has a plurality of separate traverses which are not arranged on a common truss unit 5.
• a conventional finger tester which has a plurality of separate traverses which are not arranged on a common truss unit 5.
• the geometry of a blind hole or through hole can thus be determined very simply and precisely, and, on the other hand, the coating can be established with an electrical conductor of the inner surface of the blind hole or through hole.
• test probe 12 according to the invention can be used in conventional finger testers (English: Flying Probe Tester). There are no further mechanical conversions necessary. Only the finger tester must be provided with a suitable control program which processes the measurement signals generated by the test probe 12 according to the invention. and can apply suitable measuring signals and can control the movement of a test finger 2 with the test probe 12 according to the invention.
• the through-connection 31 is an electrically conductive coating on the inner surface of the bore.
• the entire bore is first coated.
• the hole is drilled a second time a bit deep, so that in a predetermined section, the coating of the bore 37 tion is removed again.
• errors can occur if the re-drilling has either not been carried out sufficiently deep or too deep, so that the edge of the coating in the bore is offset a bit from its desired position.
• the second bore may also be offset a bit from the first bore, so that the two holes are not concentric.
• the printed circuit board 38 has a plurality of layers 32, between which printed conductors 33 are formed. There are larger and smaller tracks. In general, the so-called Mas- seleiterbahn is the largest conductor track of a printed circuit board and can often extend over several layers 32 away. In the measuring method explained below, the ground conductor track is connected to the electrical earth 34 (FIG. 4). Instead of the individual ground conductor tracks, it is also possible to use a plurality of individual smaller conductor tracks, which are connected to the electrical ground 34 at the same time.
• ground conductor track is used to describe one or more tracks, which are simultaneously connectable to electrical ground and branch over a larger area of the circuit board 38, in particular over several layers by applying a movable contact finger of the finger tester to the conductor track, this contact finger having an electrical conductive contact tip, which is connected to the electrical ground.
• the capacitive measuring body 26 When introducing the test probe 3 into the bore, the capacitive measuring body 26 forms an electrical capacitance with the surrounding electrical conductors.
• the aim of this method is to measure this capacity or its change during insertion of the capacitive measuring body into the bore.
• a vibration signal is applied to the through-hole 31 with respect to the electrical earth with a signal generator 35.
• This measurement signal flows along the transit Takt ist 31, via a capacitance CI between the via 31 and the capacitive measuring body 26 in the capacitive measuring body 26 and from there via the cable 25 to a current measuring device 36, with which the voltage and thus the capacity CI or its capacitance change when the capacitive measuring body 26 comes close to the via 31, be measured.
• a parasitic capacitance C2 is formed between the via 31 and the adjacent tracks. This is especially relevant when it forms between the feedthrough and the ground conductor track. If the ground conductor track were not grounded, then the parasitic capacitance would transmit the measurement signal to further conductor tracks via their capacitive coupling (capacitance C3) to the ground track. As a result, the capacitive measuring body would be used to see the measuring signal via further capacitive couplings (capacitance C4) between the capacitive measuring body 26 and the interconnects arranged outside the plated-through hole (FIG. 5). As a result, it would not be possible to determine exactly whether the electrical capacitance CI between the measuring body 26 and the through-connection 31 or the capacitance C4 between the measuring body 26 and one of the further conductor tracks is measured.
• FIG. 6 This equivalent circuit diagram comprises the following elements:
• the capacitor CI represents the coupling between the via 31 and the measuring body 26.
• the capacitor C2 is located between the via 31 and the ground rail in the sense of the above description.
• the capacitor C3 is the coupling between the ground rail and the other tracks.
• the capacitor C4 represents the coupling of the conductor tracks to the measuring body 26.
• the coupling of the conductor tracks to the measuring body 26 can be effected directly by the ground conductor track or by further conductor tracks coupled via the capacitance C3 to the ground conductor track. If the coupling is directly between the ground strip and the measuring body 26, then eliminates the capacitor C3, which is why it is shorted to a dashed line in the equivalent circuit diagram and would not be considered in the further consideration.
• the connection 34 of the grounding track to the electrical ground is shown with a switch in the substitute circuit diagram (FIG. 6), the switch being closed according to the measuring arrangement according to FIG. 4 and the switch being open according to the measuring arrangement according to FIG.
• the capacitors C2 (, C3), C4 are connected in parallel with the capacitor CI. If the series circuit of C2 (, C3), C4 is greater than CI, then the total capacitance between the via 31 and the measuring body 26 is determined primarily by the series connection of the capacitors C2 (, C3), C4 and measured by the current measuring device 36 Current is mainly determined by the series connection of C2 (, C3), C4.
• the current measuring device 36 is a current-voltage converter, which has an operational amplifier 39 and a measuring resistor 40.
• the operational amplifier is, for example, of the type AD549.
• U m At the output of the ammeter 36 is a voltage signal U m , which is proportional to the current flowing at the input of the ammeter.
• One input of the operational amplifier is connected to the measuring body 26 and the other input to the electrical ground. By feedback of the input and the output side of the operational amplifier via the measuring resistor 40, both inputs of the operational amplifier 39 are kept at the potential of the electrical ground.
• the capacitors C3 and C4 are thus arranged between two points which are each at the potential of the electrical ground, so that no current flows through them. They are therefore not visible in the measurement.
• the voltage signal of the signal generator 35 is applied and the other side of the capacitor C2 is connected to the electrical ground, so that a current flows through this capacitor.
• This current is not measured by the meter because it flows directly to the electrical ground.
• This current affects the power output by the signal generator 35, but not the voltage supplied by the signal generator 35. Since the voltage applied to the capacitor CI voltage U and the through From this, the capacitance of the capacitor CI can be determined, without the measurement being influenced by the further capacitances C2, C3, C4, when the ground conductor track is connected to the electrical ground.
• the capacitive coupling CI between the measuring body 26 and the via 31 can be measured exactly, wherein the amount of the capacitive coupling CI can be determined and allows a statement about the geometric size of an error at the via.
• This method is so precise that it can also be modified so that the signal of the signal generator can be applied to a single track extending to the through hole, so that based on this signal, the capacitive coupling of the measuring body are detected to this track can. In this way, the position of the measuring body in the through hole can be determined or it can be determined that this conductor path correctly conducts the measuring signal to the area of the plated through hole.
• the location of the test probe is calibrated relative to the location of the circuit board to be tested by bringing the test probe 12 with its contact tip into contact with the surface of the circuit board.
• This mechanical calibration can be replaced by an electrical calibation, wherein in the electrical calibration, a vibration signal is applied to an adjacent to the through hole trace, which is then detected by the probe or its measuring body.
• This method can also be modified such that a plurality of measurement signals having different frequencies are applied to different interconnects and / or through-connection.
• the different frequencies are differentiated during the measurement. This can be done, for example, by connecting a tunable bandpass filter upstream of the ammeter 36, which can in each case be switched to a frequency band which in each case comprises a frequency of one of the signals.
• a plurality of interconnects can be detected in the region of a through-bore, provided they are not shielded by a through-connection.

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• General Engineering & Computer Science (AREA)
• Computer Hardware Design (AREA)
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• Geometry (AREA)
• Measuring Leads Or Probes (AREA)
• Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)

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• 2019
  • 2019-01-17 US US16/960,434 patent/US11774495B2/en active Active
  • 2019-01-17 JP JP2020540268A patent/JP2021510828A/ja active Pending
  • 2019-01-17 WO PCT/EP2019/051148 patent/WO2019141777A1/de unknown
  • 2019-01-17 CN CN201980007361.XA patent/CN111566488A/zh active Pending
  • 2019-01-17 KR KR1020207023032A patent/KR20200110667A/ko not_active Application Discontinuation
  • 2019-01-17 EP EP19701082.0A patent/EP3740767A1/de active Pending
  • 2019-01-18 TW TW108101944A patent/TWI697676B/zh active
• 2023
  • 2023-08-24 US US18/454,906 patent/US20230400509A1/en active Pending

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