EP3696847A4 - Dispositif d'ouverture de conteneur - Google Patents

Dispositif d'ouverture de conteneur Download PDF

Info

Publication number
EP3696847A4
EP3696847A4 EP18865737.3A EP18865737A EP3696847A4 EP 3696847 A4 EP3696847 A4 EP 3696847A4 EP 18865737 A EP18865737 A EP 18865737A EP 3696847 A4 EP3696847 A4 EP 3696847A4
Authority
EP
European Patent Office
Prior art keywords
pod opener
opener
pod
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP18865737.3A
Other languages
German (de)
English (en)
Other versions
EP3696847A1 (fr
EP3696847C0 (fr
EP3696847B1 (fr
Inventor
Katsunori Sakata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rorze Corp
Original Assignee
Rorze Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rorze Corp filed Critical Rorze Corp
Publication of EP3696847A1 publication Critical patent/EP3696847A1/fr
Publication of EP3696847A4 publication Critical patent/EP3696847A4/fr
Application granted granted Critical
Publication of EP3696847C0 publication Critical patent/EP3696847C0/fr
Publication of EP3696847B1 publication Critical patent/EP3696847B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B67—OPENING, CLOSING OR CLEANING BOTTLES, JARS OR SIMILAR CONTAINERS; LIQUID HANDLING
    • B67B—APPLYING CLOSURE MEMBERS TO BOTTLES JARS, OR SIMILAR CONTAINERS; OPENING CLOSED CONTAINERS
    • B67B7/00—Hand- or power-operated devices for opening closed containers
    • B67B7/12—Hand- or power-operated devices for opening closed containers for removing disc-closures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B67—OPENING, CLOSING OR CLEANING BOTTLES, JARS OR SIMILAR CONTAINERS; LIQUID HANDLING
    • B67B—APPLYING CLOSURE MEMBERS TO BOTTLES JARS, OR SIMILAR CONTAINERS; OPENING CLOSED CONTAINERS
    • B67B7/00—Hand- or power-operated devices for opening closed containers
    • B67B7/20—Hand- or power-operated devices for opening closed containers for breaking vacuum seals between lids or covers and bodies of preserving jars, e.g. by wedge action
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Ladders (AREA)
  • Devices For Opening Bottles Or Cans (AREA)
  • Glass Compositions (AREA)
EP18865737.3A 2017-10-11 2018-09-28 Dispositif d'ouverture de conteneur Active EP3696847B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017197918 2017-10-11
PCT/JP2018/036321 WO2019073823A1 (fr) 2017-10-11 2018-09-28 Dispositif d'ouverture de conteneur

Publications (4)

Publication Number Publication Date
EP3696847A1 EP3696847A1 (fr) 2020-08-19
EP3696847A4 true EP3696847A4 (fr) 2021-07-07
EP3696847C0 EP3696847C0 (fr) 2023-06-07
EP3696847B1 EP3696847B1 (fr) 2023-06-07

Family

ID=66100715

Family Applications (1)

Application Number Title Priority Date Filing Date
EP18865737.3A Active EP3696847B1 (fr) 2017-10-11 2018-09-28 Dispositif d'ouverture de conteneur

Country Status (7)

Country Link
US (1) US11232964B2 (fr)
EP (1) EP3696847B1 (fr)
JP (1) JP7321095B2 (fr)
KR (1) KR102581283B1 (fr)
CN (1) CN111164745B (fr)
TW (1) TWI789436B (fr)
WO (1) WO2019073823A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7384132B2 (ja) * 2020-09-04 2023-11-21 村田機械株式会社 物品収容装置
TWI832287B (zh) * 2022-06-10 2024-02-11 樂華科技股份有限公司 晶圓儲存裝置及其方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4983097A (en) * 1988-09-29 1991-01-08 Matsushita Electric Industrial Co., Ltd. Tray tier stacking apparatus
US20020018703A1 (en) * 2000-02-16 2002-02-14 Nec Corporation Semiconductor manufacturing apparatus with an improved wafer cassette
JP2006310709A (ja) * 2005-05-02 2006-11-09 Hitachi Plant Technologies Ltd 半導体ウェハ保持装置及び方法
US20090196714A1 (en) * 2006-06-09 2009-08-06 Raphael Sylvestre Device for the transport, storage, and transfer of substrates
WO2013021645A1 (fr) * 2011-08-10 2013-02-14 川崎重工業株式会社 Dispositif à effecteur terminal et robot de transport de substrat comportant ledit dispositif à effecteur terminal

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4813222A (en) * 1987-04-09 1989-03-21 Kabushiki Kaisha Toyoda Jidoshokki Seisakusho System for transferring full and empty bobbins from and to a textile machine such as a ring spinning frame
US5825470A (en) * 1995-03-14 1998-10-20 Nikon Corporation Exposure apparatus
JPH11217121A (ja) * 1998-02-04 1999-08-10 Matsushita Electric Ind Co Ltd トレイ分離規正装置
JP4087527B2 (ja) 1999-03-19 2008-05-21 株式会社テセック 電子部品の搬送装置
JP2004071730A (ja) * 2002-08-05 2004-03-04 Sendai Nikon:Kk レチクルハンドリング方法、レチクルハンドリング装置及び露光装置
JP2004140278A (ja) 2002-10-21 2004-05-13 Ulvac Japan Ltd 移動式収納装置及び基板搬入装置
TW200502070A (en) * 2003-07-04 2005-01-16 Rorze Corp Carrying apparatus and carrying control method for sheet-like objects
US7114908B1 (en) * 2003-12-02 2006-10-03 National Semiconductor Corporation Method and apparatus for stacking semiconductor wafers
TWI399823B (zh) * 2005-07-09 2013-06-21 Tec Sem Ag 用以存放基板之裝置
TWM289767U (en) * 2005-11-03 2006-04-21 Fu-Wen Chen Improved structure of frame type loading machine for conveying circuit board
JP4215079B2 (ja) * 2006-07-31 2009-01-28 村田機械株式会社 クリーンストッカと物品の保管方法
RU60270U1 (ru) * 2006-09-18 2007-01-10 Открытое акционерное общество "Научно-исследовательский институт полупроводникового машиностроения" ОАО "НИИПМ" Кассета для транспортирования плоских изделий, преимущественно жидкокристаллических экранов
JP4816545B2 (ja) 2007-03-30 2011-11-16 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP2009170726A (ja) * 2008-01-17 2009-07-30 Rorze Corp ロードポートおよびカセット位置調整方法
JP5499021B2 (ja) * 2009-03-19 2014-05-21 芝浦メカトロニクス株式会社 基板搬送装置及び基板搬送方法
CN101934998B (zh) * 2010-10-19 2012-06-27 中国人民解放军65547部队装备部 伴随型自装卸电动叉车
JP2012110992A (ja) * 2010-11-24 2012-06-14 Toyota Industries Corp 荷搬送アームおよび荷搬送アームを備えた荷搬送ロボット
JP5687575B2 (ja) * 2011-07-11 2015-03-18 株式会社東芝 ウェハ搬送容器保護ケース
KR102091892B1 (ko) * 2012-04-16 2020-03-20 로제 가부시키가이샤 수납 용기, 수납 용기의 셔터 개폐 유닛 및 이들을 사용한 웨이퍼 스토커
JP6375186B2 (ja) * 2014-09-05 2018-08-15 株式会社Ｓｃｒｅｅｎホールディングス 基板収納容器、ロードポート装置および基板処理装置
CN105178653A (zh) * 2015-08-13 2015-12-23 郑俭余 单立柱立体停车库
US10515835B2 (en) * 2016-10-24 2019-12-24 Murata Machinery, Ltd. High density Tec-Cell carrier
CN107175679A (zh) * 2017-04-28 2017-09-19 防城港市海洋局 送料机器人

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4983097A (en) * 1988-09-29 1991-01-08 Matsushita Electric Industrial Co., Ltd. Tray tier stacking apparatus
US20020018703A1 (en) * 2000-02-16 2002-02-14 Nec Corporation Semiconductor manufacturing apparatus with an improved wafer cassette
JP2006310709A (ja) * 2005-05-02 2006-11-09 Hitachi Plant Technologies Ltd 半導体ウェハ保持装置及び方法
US20090196714A1 (en) * 2006-06-09 2009-08-06 Raphael Sylvestre Device for the transport, storage, and transfer of substrates
WO2013021645A1 (fr) * 2011-08-10 2013-02-14 川崎重工業株式会社 Dispositif à effecteur terminal et robot de transport de substrat comportant ledit dispositif à effecteur terminal

Also Published As

Publication number Publication date
US20200234987A1 (en) 2020-07-23
CN111164745A (zh) 2020-05-15
WO2019073823A1 (fr) 2019-04-18
KR20200058548A (ko) 2020-05-27
CN111164745B (zh) 2023-09-12
EP3696847A1 (fr) 2020-08-19
EP3696847C0 (fr) 2023-06-07
JPWO2019073823A1 (ja) 2020-11-19
EP3696847B1 (fr) 2023-06-07
KR102581283B1 (ko) 2023-09-20
JP7321095B2 (ja) 2023-08-04
TW201923945A (zh) 2019-06-16
TWI789436B (zh) 2023-01-11
US11232964B2 (en) 2022-01-25

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