EP3695692A1 - Procédé pour la mise en contact mécanique d'un cadre d'enrobage sur une carte de circuit imprimé - Google Patents

Procédé pour la mise en contact mécanique d'un cadre d'enrobage sur une carte de circuit imprimé

Info

Publication number
EP3695692A1
EP3695692A1 EP18772773.0A EP18772773A EP3695692A1 EP 3695692 A1 EP3695692 A1 EP 3695692A1 EP 18772773 A EP18772773 A EP 18772773A EP 3695692 A1 EP3695692 A1 EP 3695692A1
Authority
EP
European Patent Office
Prior art keywords
circuit board
contact surface
soldering
base
mechanical component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP18772773.0A
Other languages
German (de)
English (en)
Inventor
Bernd Strütt
Simon Gerwig
Max Bauer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Endress and Hauser SE and Co KG
Original Assignee
Endress and Hauser SE and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Endress and Hauser SE and Co KG filed Critical Endress and Hauser SE and Co KG
Publication of EP3695692A1 publication Critical patent/EP3695692A1/fr
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H01L2224/81815—Reflow soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10257—Hollow pieces of metal, e.g. used in connection between component and PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10606—Permanent holder for component or auxiliary PCB mounted on a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components

Definitions

  • the invention relates to a method for the mechanical contacting of a mechanical component, in particular a Vergussrahmens on a printed circuit board of an electronic module, and a field device with a corresponding assembly.
  • field devices are often used for detecting or influencing
  • Process variables are used. To capture process variables
  • field devices which are used close to the process and supply or process the process-relevant information. Therefore, in the context of the invention, field devices additionally also mean remote I / Os, radio adapters or generally electronic components, which are arranged on the field level. A large number of these field devices are manufactured and sold by Endress + Hauser. Specifically, the electronic assemblies in field devices must be encapsulated due to their particular operating conditions. On the one hand, this serves to protect the electronic assemblies from process-specific
  • explosion protection class "m” in the context of the EN 60079-18 standard; in the case of explosion-proof encapsulation according to explosion protection type "d", the standard EN 60079-1 applies.
  • the electronic assembly so the circuit board together with the electrical components arranged there, completely encapsulate as such.
  • the circuit board Depending on the one-sided or two-sided placement of the printed circuit board, at least the corresponding side of the printed circuit board is provided over its entire area with, for example, a plastic-based potting frame (for example by gluing the potting frame).
  • a plastic-based potting frame for example by gluing the potting frame.
  • the resulting interior is potted between the lid and the printed circuit board.
  • an elastomer for example Silgel ® is used.
  • the invention is therefore based on the object to provide a secure enclosure for electronic assemblies, which can be mounted efficiently.
  • the invention solves this problem by a method for the mechanical contacting of a mechanical component on a circuit board of an electronic module.
  • the term "mechanical component” refers in the context of the invention generally to any component that has no electrical function.
  • the component has according to the invention at least one metallic contact surface.
  • the printed circuit board comprises a base surface which is structured in a metal manner corresponding to the contact surface.
  • the method comprises the following method steps:
  • Soldering method for soldering the contact surface to the base an automated soldering method, such as a reflow soldering be used. If the mechanical component is designed to serve as Vergussrahmen for potting placed within the base electrical components, comes as an additional process step, the subsequent encapsulation of the electrical components within the
  • the inventive method offers the advantage that a material-saving encapsulation for electronic assemblies in
  • the potting based on the method according to the invention can be designed so that the potted electrical components explosion-proof on the liter plate, for example according to the
  • Interconnected Device in particular by means of the method of direct laser structuring, whereby it is possible by means of MID to design the shape of the potting frame very individually, for example square with rounded edges, especially on the basis of laser direct - Structuring it is also possible to manufacture a Vergussrahmen with an uneven contact surface, if the circuit board or the
  • Base surface is correspondingly curved or curved (also known under the term “three-dimensional circuit carrier”) .
  • the invention will be explained with reference to the following figures.
  • FIG. 1 shows an electronic assembly with a Vergussrahmen soldered according to the invention
  • Fig. 2 shows a detailed view of a possible embodiment of the invention
  • an electronic module 2 is shown schematically in Fig. 1. It is based on a printed circuit board 20, which is equipped in the embodiment shown, at least on its upper side with electrical components 3.
  • the critical components 3 are encapsulated in terms of explosion protection.
  • the Vergussrahmen 1 is mounted according to the invention by soldering on the circuit board 1.
  • the potting frame 1 has a solderable, metallic contact surface 11 for solder bonding, which corresponds to a corresponding base surface 21 of the printed circuit board 20.
  • the contact surface 11 in accordance with the shape of the Vergussrahmens 1 in the embodiment shown a square shape with rounded edges.
  • soldering the Vergussrahmen 1 must not necessarily completely made of a metallic
  • Vergussrahmen 1 is made of a plastic, offers the integrated manufacturing of Vergussrahmens 1 together with metallic contact surface 11 preferably the method of
  • Injection-molded circuit carriers especially known by the term "MID, Molded Interconnected Device"
  • MID Molded Interconnected Device
  • a particularly suitable variant for this is the method of laser direct structuring.
  • the intended for placement of the Vergussrahmens 1 base 21 on the circuit board 20 is also designed metallic for solderability.
  • the base 21 must be realized, for example, in the form of a conductor track structure with a corresponding shape to the base 21 of the Vergussrahmens 1.
  • the base 21 apart from the per se required steps to create the conductor tracks on the circuit board 20, no additional
  • the printed circuit board 20 is planar in the area of the base 21. It would be particularly under
  • the type of Vergusskapselung shown in Fig. 1 thus offers the overall advantage that the mechanical contacting of the Vergussrahmens 1 can be carried out in a process step together with the soldering of the electrical components 3 on the circuit board 1 1. Especially when using a soldering process such as reflow soldering, in which the electrical components 3 are soldered at the same time, this results in comparison to any additional soldering process such as reflow soldering, in which the electrical components 3 are soldered at the same time, this results in comparison to any additional
  • electrical components 3 are cast within the Vergussrahmens 1, preferably by means of an elastomer.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Casings For Electric Apparatus (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

L'invention concerne un procédé pour la mise en contact mécanique d'un cadre d'enrobage (1) sur une carte de circuit imprimé (20) d'un module électronique (2). Le cadre d'enrobage (1) comprend une surface de contact (11) métallique ; la carte de circuit imprimé (20) comprend une surface de base (21) qui est composée d'une structure métallique correspondant à la surface de contact (11). Le procédé comprend les étapes suivantes : positionnement du composant mécanique (1) avec orientation de la surface de contact (11) vers la surface de base (21) correspondante, et soudage du composant mécanique (1) à la carte de circuit imprimé (20) par la surface de contact (11) et la surface de base (21). Le procédé selon l'invention offre ainsi d'une part l'avantage de pouvoir fournir un encapsulage économe en matériau pour des modules électroniques (2) dans des zones explosibles. Il est en même temps possible de renoncer à une étape de processus supplémentaire pour la mise en contact mécanique de l'encapsulage sur la carte de circuit imprimé (20), vu que la mise en contact mécanique du cadre d'enrobage (1) peut être effectuée avec le soudage des autres composants électriques (3) sur la carte de circuit imprimé (20) en une étape de processus.
EP18772773.0A 2017-10-10 2018-09-11 Procédé pour la mise en contact mécanique d'un cadre d'enrobage sur une carte de circuit imprimé Pending EP3695692A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102017123530.2A DE102017123530A1 (de) 2017-10-10 2017-10-10 Verfahren zur mechanischen Kontaktierung eines Vergussrahmens auf einer Leiterplatte
PCT/EP2018/074489 WO2019072475A1 (fr) 2017-10-10 2018-09-11 Procédé pour la mise en contact mécanique d'un cadre d'enrobage sur une carte de circuit imprimé

Publications (1)

Publication Number Publication Date
EP3695692A1 true EP3695692A1 (fr) 2020-08-19

Family

ID=63637879

Family Applications (1)

Application Number Title Priority Date Filing Date
EP18772773.0A Pending EP3695692A1 (fr) 2017-10-10 2018-09-11 Procédé pour la mise en contact mécanique d'un cadre d'enrobage sur une carte de circuit imprimé

Country Status (5)

Country Link
US (1) US11277920B2 (fr)
EP (1) EP3695692A1 (fr)
CN (1) CN111247878A (fr)
DE (1) DE102017123530A1 (fr)
WO (1) WO2019072475A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102020105180A1 (de) 2020-02-27 2021-09-02 Endress+Hauser SE+Co. KG Verfahren zur Herstellung einer Lotverbindung, Verfahren zum Trennen zumindest eines Bauelements von einer Kontaktfläche, Leiterplatte und Feldgerät
DE102020108456A1 (de) 2020-03-27 2021-09-30 Endress+Hauser SE+Co. KG Verfahren zur Herstellung einer Elektronikeinheit für ein Feldgerät der Automatisierungstechnik

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DE102010038294A1 (de) * 2010-07-22 2012-01-26 Endress + Hauser Gmbh + Co. Kg Elektronische Baugruppe mit einem von einer Vergussmasse umschlossenen Bauteil und Verfahren zu deren Herstellung
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Also Published As

Publication number Publication date
WO2019072475A1 (fr) 2019-04-18
US20200245470A1 (en) 2020-07-30
US11277920B2 (en) 2022-03-15
DE102017123530A1 (de) 2019-04-11
CN111247878A (zh) 2020-06-05

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