EP3675144B1 - Procédé de fabrication de carte de circuit de transformateur et transformateur associé - Google Patents

Procédé de fabrication de carte de circuit de transformateur et transformateur associé Download PDF

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Publication number
EP3675144B1
EP3675144B1 EP18215834.5A EP18215834A EP3675144B1 EP 3675144 B1 EP3675144 B1 EP 3675144B1 EP 18215834 A EP18215834 A EP 18215834A EP 3675144 B1 EP3675144 B1 EP 3675144B1
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Prior art keywords
metal plate
metal
outer insulation
insulation layer
metal plates
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EP18215834.5A
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German (de)
English (en)
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EP3675144A1 (fr
Inventor
Eric Wang
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WANG, WEN-CHIN
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Individual
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections

Definitions

  • the present invention relates to transformers, and more particularly, to a manufacturing method of transformer circuit board and transformer thereof.
  • the manufacturing process of a transformer will set up the copper wire diameter, the amount of wire rounds, and a plurality of windings according to the demands upon performance, voltage, current, inductance, leakage inductance, magnetic saturation efficiency, and layout.
  • a conventional manufacturing method of a transformer circuit board applies a photographing technique for manufacturing the layout.
  • exposing, developing, etching, boring, and electroplating operations are carried out on a copper foil, so as to manufacture the needed layout of each layer structure.
  • the layout of each layer structures are pressed to be combined into a complete printed circuit board, which is then combined with magnetic core.
  • a chemical agent is applied for etching the surface of the copper foil.
  • a lateral etching might be caused during the etching process.
  • the upper layer of the layout is etched for a duration longer than the bottom portion of the layout.
  • the upper layer of the layout becomes narrower than the bottom portion of the layout.
  • the diameter of the copper foil layout varies due to lateral etching effect, thus affecting the property of the transformer.
  • the lateral etching of the copper foil surface easily causes an uneven flow of glue during the combination process.
  • recess is easily produced on the copper foil of different layer structures.
  • bubbles or incomplete adherence might be caused between layer structures, which might even cause the separation of layer structures, leading to the discard of products and failing to achieve a stabilized manufacturing process.
  • the manufacturing of the copper foil layout is complicated with the use of various chemical agents, which might cause danger upon the manufacturing environment. Further, the application of chemical agents is unable to effectively control the manufacturing quality of the layout, and might also cause the lateral etching effect of the copper foil. As a result, the manufacturing efficiency and yield rate of the transformer circuit board is affected.
  • US2017/027061A1 discloses a method for using etched metal plates stamped metal plates which are alternately stacked with insulation layers to be pressed to form a transformer circuit board combination.
  • a manufacturing method of transformer circuit board is disclosed. With the layout on the copper foil being stamping molded without the operations of exposing, developing, and etching, the lateral etching issues is resolved, and the yield rate of the transformer circuit board is improved.
  • the manufacturing method of transformer circuit board comprising steps as claimed in claim 1.
  • a transformer in accordance with the present invention is provided, as claimed in claim 9, comprising the transformer circuit board formed by the manufacturing method aforementioned.
  • the metal plates of the present invention are stamped to be formed with corresponding mold, so as to replace the conventional operations of exposing, developing, and etching by use of chemical agents, thus preventing lateral etching upon copper foil from occurring and improving the yield rate of the manufacturing process of transformer circuit board. Also, consistency of the layouts on each metal plate is enhanced, thus improving the production quality and efficiency.
  • a manufacturing method of transformer circuit board 100 and transformer thereof comprising following steps: plate stamping S1, primary layering S2, primary pressing S3, secondary layering S4, secondary pressing S5, and boring S6.
  • each metal plate 10 is a self-adhesive copper foil, and the stamping mold for stamping each metal plate 10 is manufactured by CNC lathe or laser engraving.
  • each metal plate 10 has an alignment hole 101 disposed at the center of the metal plate 10, respectively, and the alignment holes 101 are arranged in an axial alignment.
  • the inner layout of each metal plate 10 will differ according to different layering orders.
  • a plurality of metal plates 10 of each layer are equidistantly placed in a horizontal alignment, and the metal plate 10 of two neighboring layers are placed in a vertical alignment, so as to manufacture a plurality of transformer circuit boards 100 in a single time. Therefore, the manufacturing efficiency is significantly improved.
  • the embodiment of the present invention is illustrated with a singular transformer circuit board 100. Therein, the primary layering S2 step of the transformer circuit board 100 is illustrated below.
  • a plurality of metal plates 10 are vertically layered between two outer insulation layers 20, and the metal plates 10 are arranged in alignment by the alignment holes 101, with an inner insulation layer 21 disposed between each two neighboring metal plate 10, so as to form a plurality of metal plates 10 and inner insulation layer 21 that are alternately layered.
  • two layers of metal plates 10 are layered between two outer insulation layers 20, with a singular inner insulation layer 21 disposed between the two metal plates 10.
  • the metal plates 10 between the two outer insulation layers 20 are allowed to be layered to more than two layers.
  • the outer insulation layer 20 and the inner insulation layer 21 are glass fiber resin sheets having consistent area and thickness.
  • the corresponding vertical positions of the metal plates 10 on each layer are important, such that any deviation will invalidate the conduction between the layouts. Therefore, the self-adhesive metal plates 10 of each layer are allowed to be manually layered or layered by use of automatic equipment. Therein, regarding to the manually layering manner, the relative positions are projected on two sides of the corresponding inner insulations through infrared rays with a layout patterns in a 1:1 scale. Next, each self-adhesive metal plate 10 is adhered on the target position on each inner insulation layer 21. Finally, the outer insulation layers 20 are placed on each corresponding metal plate 10, such that the metal plate 10 are layered between two outer insulation layers 20.
  • each metal plate 10 is grabbed by mechanical arm of the automatic equipment, so as to be placed on the relative position corresponding to each inner insulation layer 21. Therefore, two metal plate 10 are accurately layered, and the outer insulation layers 20 are then placed on each metal plate 10 by the mechanical arm.
  • the neighboring outer insulation layers 20 and the inner insulation layer 21 are hot-pressed by a hot press machine 40, so as to fill the gap between the outer insulation layer 20 and the inner insulation layer 21 by thermal melting. Therefore, the metal plate 10 is fixed between the two outer insulation layers 20, and the thermally melted combination between the outer insulation layer 20 and the inner insulation layer 21 is evenly distributed.
  • the secondary layering S4 step as shown by Fig. 1 , Fig. 7, and Fig. 8 , after the primary pressing S3, the aforementioned manually or automatically layering process is repeated, so as to layer another metal plate 10 on the outer side of each outer insulation layer 20 with the alignment holes 101 of each metal plate 10 being arranged in alignment. No additional insulations are needed to be placed. Therefore, the metal plate 10 is formed in a four-layer structured. For further improving the accuracy of the layering position of metal plates 10 on each layer, when the layering process is complete, the layering positions and layouts of the metal plates 10 are scanned by X-ray for preventing any deviations from existing, thus precisely improving the accuracy of the layering position of the metal plates 10.
  • the metal plate 10 of the present invention comprises a first metal plate 11, a second metal plate 12, a third metal plate 13, and a fourth metal plate 14, wherein the first metal plate 11 and the fourth metal plate 14 are disposed on the outer side of the two outer insulation layers 20, respectively, and the second metal plate 12 and the third metal plate 13 are disposed on the inner side of the two outer insulation layers 20 and the two sides of the inner insulation layer 21, respectively. Therefore, the inner insulation layer 21 is positioned between the second metal plate 12 and the third metal plate 13.
  • the layout of the first metal plate 11 is identical to the layout of the fourth metal plate 14, and the layout of the second metal plate 12 is identical to the layout of the third metal plate 13, while the layout of the first metal plate 11 is different from the layout of the second metal plate 12.
  • the first metal plate 11 and the fourth metal plate 14 are horizontally presented in a mirror image; also, the second metal plate 12 and the third metal plate 13 are horizontally presented in a mirror image. Therefore, after the vertical layering process, the first metal plate 11 and the fourth metal plate 14 are structurally reversed; the second metal plate 12 and the third metal plate 13 are structurally reversed.
  • the hot press machine 40 is applied again for assuring that the first metal plate 11 and the fourth metal plate 14 are stably adhered on the two outer insulation layers 20, respectively.
  • an amount of through bores for electrical conduction are formed according to different demands.
  • An automatic boring machine is applied for boring the layout of each metal plate 10, so as to form the needed through bores, and the through bores of the metal plates 10 of each layer are then electroplated by a horizontal electroplating equipment.
  • a solder mask ink is coated on the outer side of each outer insulation layer 20 to undergo a screen printing process, so as to form a solder mask layer 30 on each outer insulation layer 20 for protecting the metal plates 10 exposed on the outer side of the outer insulation layer 20, thus preventing short cut or open cut due to scrape from occurring, and achieving a solder mask function.
  • solder mask layer 30 is plated with an anti-oxidative layer for preventing the exposed solder mask layer 30 and through bores from oxidation, facilitating further soldering operation. Then, the whole metal plate 10 is cut by a forming machine to form a transformer circuit board 100 in the target size.
  • each through bore is soldered with a connection pillar 50 for fixing the structure of the transformer circuit board 100.
  • each connection pillar 50 is formed in a column shape tapering from the bottom to the top. Also, each connection pillar 50 has a helical surface which is favorable for the solder to flow into a guide groove 51 of each connection pillar 50.
  • the transformer circuit board 100 is glued with a matched magnetic core to form a transformer, which subsequently undergoes various property tests of different inspection instruments, including inductance, coils ratio, leakage inductance, voltage, and pressure resistance. Therefore, a transformer with low leakage inductance and high electro-magnetic interference shield is acquired.
  • the metal plates 10 of the present invention are stamped to be formed with corresponding mold, so as to replace the conventional operations of exposing, developing, and etching by use of chemical agents, thus preventing lateral etching upon copper foil from occurring and improving the yield rate of the manufacturing process of transformer circuit board 100. Also, consistency of the layouts on each metal plate 10 is enhanced, thus improving the production quality and efficiency.
  • the metal plates 10 of each layer are arranged in a precise alignment for preventing positional deviation between the metal plates 10 from occurring.
  • the manufacturing process of the metal plates 10 of the present invention eliminates the issues of lateral etching, so as to further increase the stability of transformer circuit board 100.
  • the transformer circuit board 100 is combined with corresponding magnetic core, thus forming a transformer having low leakage inductance and high electro-magnetic interference shield.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)

Claims (9)

  1. Procédé de fabrication d'une carte de circuits imprimés de transformateur (100), comprenant les étapes suivantes :
    un estampage de plaques (S1), pour mettre en forme une pluralité de plaques de métal (10) avec un moule d'estampage, chaque plaque de métal (10) ayant un trou d'alignement (101), respectivement, les trous d'alignement (101) des plaques de métal (10) étant disposés dans un alignement axial ;
    une superposition primaire (S2), pour superposer les plaques de métal (10) entre deux couches d'isolation extérieures (20) et placer les plaques de métal (10) en alignement axial les unes avec les autres par alignement des trous d'alignement (101), avec une couche d'isolation intérieure (21) disposée entre deux plaques de métal voisines (10), de façon à former une structure multicouche ayant une pluralité de plaques de métal (10) et une couche d'isolation intérieure (21) disposées de manière alternée ;
    un pressage primaire (S3), pour presser à chaud pour combiner les couches d'isolation extérieures (20) et la couche d'isolation intérieure (21) par fusion thermique pour fixer les plaques de métal (10) entre les deux couches d'isolation extérieures (20) ;
    caractérisé par
    une superposition secondaire (S4), pour superposer une autre plaque de métal (10) sur un côté extérieur des deux couches d'isolation extérieures (20), respectivement, à une position correspondant à des positions des trous d'alignement (101) des plaques de métal (10) placées précédemment ;
    un pressage secondaire (S5), pour presser à chaud les plaques de métal (10) sur le côté extérieur des couches d'isolation extérieures (20) pour obtenir une combinaison étroite de celles-ci ; et
    un alésage (S6), pour former un alésage traversant sur un tracé de chaque plaque de métal (10), et sérigraphier pour former une couche de masque de soudure (30) sur chaque couche d'isolation extérieure (20), avec un pilier de connexion (50) soudé pour chaque alésage traversant pour la fixation des plaques de métal (10), et découper pour former une carte de circuits imprimés de transformateur (100).
  2. Procédé selon la revendication 1, dans lequel, dans l'étape de superposition primaire (S2) et l'étape de superposition secondaire (S4), les plaques de métal (10) de chaque couche sont placées dans un alignement vertical ; également, des positions relatives entre les plaques de métal (10) et des tracés sur les plaques de métal (10) sont balayées avec des rayons X pour calibrer tout écart de celles-ci.
  3. Procédé selon la revendication 2, dans lequel, dans l'étape de superposition primaire (S2), les plaques de métal (10) de chaque couche sont autocollantes et superposées manuellement ; les positions relatives des plaques de métal (10) sont projetées sur des positions cibles correspondantes sur les couches d'isolation intérieures (21) par l'intermédiaire de rayons infrarouges avec des motifs de tracé à une échelle 1:1, et chaque plaque de métal autocollante (10) est amenée manuellement à adhérer sur des positions cibles de chaque couche d'isolation intérieure (21), chaque couche d'isolation extérieure (20) étant disposée par la suite.
  4. Procédé selon la revendication 3, dans lequel, dans l'étape de superposition secondaire (S4), chaque plaque de métal autocollante (10) est positionnée et amenée manuellement à adhérer à une position cible sur la couche d'isolation extérieure (20) et disposée en alignement avec la plaque de métal (10) sur un côté intérieur de la couche d'isolation extérieure (20) ; chaque plaque de métal (10) comprend une première plaque de métal (11), une deuxième plaque de métal (12), une troisième plaque de métal (13) et une quatrième plaque de métal (14), la première plaque de métal (11) et la quatrième plaque de métal (14) étant disposées sur le côté extérieur des deux couches d'isolation extérieures (20), et la deuxième plaque de métal (12) et la troisième plaque de métal (13) étant disposées de manière ordonnée sur le côté intérieur des deux couches d'isolation extérieures (20) entre les deux couches d'isolation extérieures (20), avec la couche d'isolation intérieure (21) disposée dans la deuxième plaque de métal (12) et la troisième plaque de métal (13) ; lorsque les plaques de métal (10) sont superposées de manière alternée avec les couches d'isolation extérieures (20) et la couche d'isolation intérieure (21), la première plaque de métal (11) et la quatrième plaque de métal (14) sont structurellement inversées, et la deuxième plaque de métal (12) et la troisième plaque de métal (14) sont structurellement inversées.
  5. Procédé selon la revendication 2, dans lequel, dans l'étape de superposition primaire (S2), les plaques de métal (10) de chaque couche sont autocollantes et superposées de manière automatique, chaque plaque de métal (10) étant saisie par un bras mécanique d'un équipement automatique, de façon à être placée et amenée à adhérer sur la position relative correspondant à la position de la plaque de métal (10) sur chaque couche d'isolation intérieure (21), puis les couches d'isolation extérieures (20) sont placées.
  6. Procédé selon la revendication 5, dans lequel, dans l'étape de superposition secondaire (S4), chaque plaque de métal autocollante (10) est positionnée à une position cible sur la couche d'isolation extérieure (20) et disposée en alignement avec la plaque de métal (10) sur un côté intérieur de la couche d'isolation extérieure (20) ; chaque plaque de métal (10) comprend une première plaque de métal (11), une deuxième plaque de métal (12), une troisième plaque de métal (13) et une quatrième plaque de métal (14), la première plaque de métal (11) et la quatrième plaque de métal (14) étant disposées sur le côté extérieur des deux couches d'isolation extérieures (20), et la deuxième plaque de métal (12) et la troisième plaque de métal (13) étant disposées de manière ordonnée sur le côté intérieur des deux couches d'isolation extérieures (20) entre les deux couches d'isolation extérieures (20), avec la couche d'isolation intérieure (21) disposée dans la deuxième plaque de métal (12) et la troisième plaque de métal (13) ; lorsque les plaques de métal (10) sont superposées de manière alternée avec les couches d'isolation extérieures (20) et la couche d'isolation intérieure (21), la première plaque de métal (11) et la quatrième plaque de métal (14) sont structurellement inversées, et la deuxième plaque de métal (12) et la troisième plaque de métal (13) sont structurellement inversées.
  7. Procédé selon la revendication 1, dans lequel chaque pilier de connexion (50) est réalisé sous une forme de colonne s'effilant d'une partie inférieure à une partie supérieure de celui-ci, et chaque pilier de connexion (50) a une surface hélicoïdale pour amener un matériau de soudure à s'écouler dans une rainure de guidage (51) du pilier de connexion.
  8. Procédé selon la revendication 1, dans lequel, dans les plaques de métal (10), les couches d'isolation extérieures (20) et la couche d'isolation intérieure (21) superposées de manière alternée, une pluralité de plaques de métal (10) de chaque couche sont placées de manière équidistante dans un alignement horizontal, et les plaques de métal (10) de deux couches voisines sont placées dans un alignement vertical, de façon à fabriquer une pluralité de cartes de circuits imprimés de transformateur (100) en un seul temps de traitement.
  9. Transformateur, comprenant la carte de circuits imprimés de transformateur (100) réalisée par un procédé selon la revendication 1.
EP18215834.5A 2018-12-24 2018-12-24 Procédé de fabrication de carte de circuit de transformateur et transformateur associé Active EP3675144B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
ES18215834T ES2900553T3 (es) 2018-12-24 2018-12-24 Método de fabricación de placa de circuito de transformador y transformador correspondiente
EP18215834.5A EP3675144B1 (fr) 2018-12-24 2018-12-24 Procédé de fabrication de carte de circuit de transformateur et transformateur associé

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP18215834.5A EP3675144B1 (fr) 2018-12-24 2018-12-24 Procédé de fabrication de carte de circuit de transformateur et transformateur associé

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EP3675144A1 EP3675144A1 (fr) 2020-07-01
EP3675144B1 true EP3675144B1 (fr) 2021-10-20

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Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6222437B1 (en) * 1998-05-11 2001-04-24 Nidec America Corporation Surface mounted magnetic components having sheet material windings and a power supply including such components
US7289329B2 (en) * 2004-06-04 2007-10-30 Siemens Vdo Automotive Corporation Integration of planar transformer and/or planar inductor with power switches in power converter
CN101599347B (zh) * 2009-06-17 2011-04-06 北京科耐特科技有限公司 生产多层平板变压器的方法
TWI578872B (zh) * 2015-07-22 2017-04-11 乾坤科技股份有限公司 印刷電路板之多層導線結構、磁性元件及其製造方法

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EP3675144A1 (fr) 2020-07-01
ES2900553T3 (es) 2022-03-17

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