EP3662474A4 - A memory-based distributed processor architecture - Google Patents
A memory-based distributed processor architecture Download PDFInfo
- Publication number
- EP3662474A4 EP3662474A4 EP18841178.9A EP18841178A EP3662474A4 EP 3662474 A4 EP3662474 A4 EP 3662474A4 EP 18841178 A EP18841178 A EP 18841178A EP 3662474 A4 EP3662474 A4 EP 3662474A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- memory
- processor architecture
- based distributed
- distributed processor
- architecture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/07—Responding to the occurrence of a fault, e.g. fault tolerance
- G06F11/16—Error detection or correction of the data by redundancy in hardware
- G06F11/1658—Data re-synchronization of a redundant component, or initial sync of replacement, additional or spare unit
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F12/00—Accessing, addressing or allocating within memory systems or architectures
- G06F12/02—Addressing or allocation; Relocation
- G06F12/06—Addressing a physical block of locations, e.g. base addressing, module addressing, memory dedication
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/07—Responding to the occurrence of a fault, e.g. fault tolerance
- G06F11/08—Error detection or correction by redundancy in data representation, e.g. by using checking codes
- G06F11/10—Adding special bits or symbols to the coded information, e.g. parity check, casting out 9's or 11's
- G06F11/1008—Adding special bits or symbols to the coded information, e.g. parity check, casting out 9's or 11's in individual solid state devices
- G06F11/1012—Adding special bits or symbols to the coded information, e.g. parity check, casting out 9's or 11's in individual solid state devices using codes or arrangements adapted for a specific type of error
- G06F11/1016—Error in accessing a memory location, i.e. addressing error
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- G06F11/07—Responding to the occurrence of a fault, e.g. fault tolerance
- G06F11/08—Error detection or correction by redundancy in data representation, e.g. by using checking codes
- G06F11/10—Adding special bits or symbols to the coded information, e.g. parity check, casting out 9's or 11's
- G06F11/1008—Adding special bits or symbols to the coded information, e.g. parity check, casting out 9's or 11's in individual solid state devices
- G06F11/1012—Adding special bits or symbols to the coded information, e.g. parity check, casting out 9's or 11's in individual solid state devices using codes or arrangements adapted for a specific type of error
- G06F11/102—Error in check bits
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-
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- G06F11/16—Error detection or correction of the data by redundancy in hardware
- G06F11/1608—Error detection by comparing the output signals of redundant hardware
- G06F11/1616—Error detection by comparing the output signals of redundant hardware where the redundant component is an I/O device or an adapter therefor
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- G06F13/14—Handling requests for interconnection or transfer
- G06F13/16—Handling requests for interconnection or transfer for access to memory bus
- G06F13/1605—Handling requests for interconnection or transfer for access to memory bus based on arbitration
- G06F13/1652—Handling requests for interconnection or transfer for access to memory bus based on arbitration in a multiprocessor architecture
- G06F13/1657—Access to multiple memories
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- G06F9/30003—Arrangements for executing specific machine instructions
- G06F9/30007—Arrangements for executing specific machine instructions to perform operations on data operands
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- G06F9/30—Arrangements for executing machine instructions, e.g. instruction decode
- G06F9/38—Concurrent instruction execution, e.g. pipeline, look ahead
- G06F9/3885—Concurrent instruction execution, e.g. pipeline, look ahead using a plurality of independent parallel functional units
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- G06F9/30—Arrangements for executing machine instructions, e.g. instruction decode
- G06F9/38—Concurrent instruction execution, e.g. pipeline, look ahead
- G06F9/3885—Concurrent instruction execution, e.g. pipeline, look ahead using a plurality of independent parallel functional units
- G06F9/3893—Concurrent instruction execution, e.g. pipeline, look ahead using a plurality of independent parallel functional units controlled in tandem, e.g. multiplier-accumulator
- G06F9/3895—Concurrent instruction execution, e.g. pipeline, look ahead using a plurality of independent parallel functional units controlled in tandem, e.g. multiplier-accumulator for complex operations, e.g. multidimensional or interleaved address generators, macros
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
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- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
- G11C11/165—Auxiliary circuits
- G11C11/1653—Address circuits or decoders
- G11C11/1655—Bit-line or column circuits
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- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/4063—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
- G11C11/407—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
- G11C11/4076—Timing circuits
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- G—PHYSICS
- G11—INFORMATION STORAGE
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- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
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- G11C11/4063—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
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- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
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- G11C11/407—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
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- G11C7/1072—Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers for memories with random access ports synchronised on clock signal pulse trains, e.g. synchronous memories, self timed memories
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- G06F2015/765—Cache
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP23151586.7A EP4187539A1 (en) | 2017-07-30 | 2018-07-30 | A memory-based distributed processor architecture |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201762538724P | 2017-07-30 | 2017-07-30 | |
US201762538722P | 2017-07-30 | 2017-07-30 | |
US201762548990P | 2017-08-23 | 2017-08-23 | |
PCT/IB2018/000995 WO2019025864A2 (en) | 2017-07-30 | 2018-07-30 | A memory-based distributed processor architecture |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP23151586.7A Division EP4187539A1 (en) | 2017-07-30 | 2018-07-30 | A memory-based distributed processor architecture |
EP23151586.7A Division-Into EP4187539A1 (en) | 2017-07-30 | 2018-07-30 | A memory-based distributed processor architecture |
Publications (3)
Publication Number | Publication Date |
---|---|
EP3662474A2 EP3662474A2 (en) | 2020-06-10 |
EP3662474A4 true EP3662474A4 (en) | 2021-07-07 |
EP3662474B1 EP3662474B1 (en) | 2023-02-22 |
Family
ID=65233543
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
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EP18841178.9A Active EP3662474B1 (en) | 2017-07-30 | 2018-07-30 | A memory-based distributed processor architecture |
EP23151586.7A Pending EP4187539A1 (en) | 2017-07-30 | 2018-07-30 | A memory-based distributed processor architecture |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP23151586.7A Pending EP4187539A1 (en) | 2017-07-30 | 2018-07-30 | A memory-based distributed processor architecture |
Country Status (7)
Country | Link |
---|---|
US (9) | US11126511B2 (en) |
EP (2) | EP3662474B1 (en) |
JP (1) | JP7242634B2 (en) |
KR (1) | KR20200047551A (en) |
CN (2) | CN113918481A (en) |
TW (2) | TWI779069B (en) |
WO (1) | WO2019025864A2 (en) |
Families Citing this family (52)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11934945B2 (en) | 2017-02-23 | 2024-03-19 | Cerebras Systems Inc. | Accelerated deep learning |
JP6854473B2 (en) | 2017-04-17 | 2021-04-07 | セレブラス システムズ インク. | Accelerated Deep Learning Data Flow Trigger Tasks |
US11488004B2 (en) | 2017-04-17 | 2022-11-01 | Cerebras Systems Inc. | Neuron smearing for accelerated deep learning |
EP3607506B1 (en) | 2017-04-17 | 2021-07-14 | Cerebras Systems Inc. | Fabric vectors for deep learning acceleration |
US11514996B2 (en) | 2017-07-30 | 2022-11-29 | Neuroblade Ltd. | Memory-based processors |
TWI779069B (en) * | 2017-07-30 | 2022-10-01 | 埃拉德 希提 | Memory chip with a memory-based distributed processor architecture |
US11144316B1 (en) | 2018-04-17 | 2021-10-12 | Ali Tasdighi Far | Current-mode mixed-signal SRAM based compute-in-memory for low power machine learning |
US11328208B2 (en) * | 2018-08-29 | 2022-05-10 | Cerebras Systems Inc. | Processor element redundancy for accelerated deep learning |
EP3647801A1 (en) * | 2018-10-30 | 2020-05-06 | dSPACE digital signal processing and control engineering GmbH | Method for testing a fpga program |
GB2580151B (en) * | 2018-12-21 | 2021-02-24 | Graphcore Ltd | Identifying processing units in a processor |
EP3966698A4 (en) * | 2019-05-07 | 2023-01-18 | Memryx Inc. | Memory processing unit architecture |
US20220405221A1 (en) * | 2019-07-03 | 2022-12-22 | Huaxia General Processor Technologies Inc. | System and architecture of pure functional neural network accelerator |
US20210011732A1 (en) * | 2019-07-09 | 2021-01-14 | MemryX Inc. | Matrix Data Reuse Techniques in Processing Systems |
CN114586019A (en) * | 2019-08-13 | 2022-06-03 | 纽罗布拉德有限公司 | Memory-based processor |
US20220269645A1 (en) * | 2019-08-13 | 2022-08-25 | Neuroblade Ltd. | Memory mat as a register file |
US11055003B2 (en) | 2019-08-20 | 2021-07-06 | Micron Technology, Inc. | Supplemental AI processing in memory |
US11182110B1 (en) * | 2019-08-21 | 2021-11-23 | Xilinx, Inc. | On-chip memory block circuit |
US11449739B2 (en) | 2019-08-22 | 2022-09-20 | Google Llc | General padding support for convolution on systolic arrays |
US11573705B2 (en) * | 2019-08-28 | 2023-02-07 | Micron Technology, Inc. | Artificial intelligence accelerator |
US11017842B2 (en) | 2019-08-29 | 2021-05-25 | Micron Technology, Inc. | Copy data in a memory system with artificial intelligence mode |
US11650746B2 (en) * | 2019-09-05 | 2023-05-16 | Micron Technology, Inc. | Intelligent write-amplification reduction for data storage devices configured on autonomous vehicles |
US10915298B1 (en) | 2019-10-08 | 2021-02-09 | Ali Tasdighi Far | Current mode multiply-accumulate for compute in memory binarized neural networks |
CN112783555A (en) * | 2019-11-11 | 2021-05-11 | 深圳市中兴微电子技术有限公司 | RISC-V vector expansion instruction-based encoding processing method and device, and storage medium |
EP3841530B1 (en) * | 2019-11-15 | 2023-11-08 | Kunlunxin Technology (Beijing) Company Limited | Distributed ai training topology based on flexible cable connection |
WO2021126203A1 (en) * | 2019-12-19 | 2021-06-24 | Google Llc | Processing sequential inputs using neural network accelerators |
US11615256B1 (en) | 2019-12-30 | 2023-03-28 | Ali Tasdighi Far | Hybrid accumulation method in multiply-accumulate for machine learning |
US11610104B1 (en) | 2019-12-30 | 2023-03-21 | Ali Tasdighi Far | Asynchronous analog accelerator for fully connected artificial neural networks |
KR20210092467A (en) * | 2020-01-16 | 2021-07-26 | 삼성전자주식회사 | Memory die including local processor and global processor, memory device, and electronic device |
TWI727643B (en) * | 2020-02-05 | 2021-05-11 | 旺宏電子股份有限公司 | Artificial intelligence accelerator and operation thereof |
RU2732201C1 (en) * | 2020-02-17 | 2020-09-14 | Российская Федерация, от имени которой выступает ФОНД ПЕРСПЕКТИВНЫХ ИССЛЕДОВАНИЙ | Method for constructing processors for output in convolutional neural networks based on data-flow computing |
CN111600204B (en) * | 2020-06-05 | 2022-03-18 | 杭州交联电力设计股份有限公司 | Automatic arrangement method of single-group electrical equipment |
US11409594B2 (en) * | 2020-06-27 | 2022-08-09 | Intel Corporation | Self-supervised learning system for anomaly detection with natural language processing and automatic remediation |
US11693699B2 (en) | 2020-07-02 | 2023-07-04 | Apple Inc. | Hybrid memory in a dynamically power gated hardware accelerator |
US11604645B2 (en) * | 2020-07-22 | 2023-03-14 | Flex Logix Technologies, Inc. | MAC processing pipelines having programmable granularity, and methods of operating same |
WO2022046075A1 (en) * | 2020-08-28 | 2022-03-03 | Siemens Industry Software, Inc. | Method and system for protocol processing |
CN112256409B (en) * | 2020-09-15 | 2022-03-04 | 中科驭数(北京)科技有限公司 | Task execution method and device based on multiple database accelerators |
US11556790B2 (en) * | 2020-09-30 | 2023-01-17 | Micron Technology, Inc. | Artificial neural network training in memory |
EP4229511A1 (en) * | 2020-10-16 | 2023-08-23 | Neuroblade, Ltd. | Memory appliances for memory intensive operations |
US11314508B1 (en) * | 2021-02-01 | 2022-04-26 | National Technology & Engineering Solutions Of Sandia, Llc | FPGA-based computing system for processing data in size, weight, and power constrained environments |
TWI775402B (en) * | 2021-04-22 | 2022-08-21 | 臺灣發展軟體科技股份有限公司 | Data processing circuit and fault-mitigating method |
CN113254392B (en) * | 2021-07-12 | 2022-06-14 | 深圳比特微电子科技有限公司 | Data storage method for system on chip and device based on system on chip |
WO2023004347A1 (en) * | 2021-07-20 | 2023-01-26 | The Regents Of The University Of California | Run-time configurable architectures |
KR20230068572A (en) * | 2021-11-11 | 2023-05-18 | 삼성전자주식회사 | Connection circuits in memory arrays |
TWI779923B (en) * | 2021-11-11 | 2022-10-01 | 南亞科技股份有限公司 | Pattern verification system and operating method thereof |
JP7243006B1 (en) | 2021-12-20 | 2023-03-22 | エッジコーティックス ピーティーイー. リミテッド | Network-on-chip reconfigurability |
WO2023128009A1 (en) * | 2021-12-30 | 2023-07-06 | 리벨리온 주식회사 | Neural processing device and synchronization method thereof |
US20230317122A1 (en) * | 2022-03-31 | 2023-10-05 | Macronix International Co., Ltd. | In memory data computation and analysis |
TWI811038B (en) * | 2022-07-25 | 2023-08-01 | 慧榮科技股份有限公司 | Memory controller and method for controlling output of debug messages |
US11630605B1 (en) | 2022-08-10 | 2023-04-18 | Recogni Inc. | Methods and systems for processing read-modify-write requests |
CN115328849B (en) * | 2022-08-10 | 2023-10-03 | 苏州迅芯微电子有限公司 | Chip combined structure for data transmission and reception |
CN115237036B (en) * | 2022-09-22 | 2023-01-10 | 之江实验室 | Full-digitalization management device for wafer-level processor system |
US11896952B1 (en) * | 2023-10-12 | 2024-02-13 | King Faisal University | Adsorbent using biowaste and plastic waste for wastewater treatment |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070214335A1 (en) * | 2006-03-10 | 2007-09-13 | Bellows Chad A | Memory device with mode-selectable prefetch and clock-to-core timing |
US20090196116A1 (en) * | 2008-02-01 | 2009-08-06 | Jong-Hoon Oh | Semiconductor memory having a bank with sub-banks |
US20170194045A1 (en) * | 2015-12-30 | 2017-07-06 | Samsung Electronics Co., Ltd. | Semiconductor memory devices and memory systems including the same |
Family Cites Families (266)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4724520A (en) * | 1985-07-01 | 1988-02-09 | United Technologies Corporation | Modular multiport data hub |
US5297260A (en) | 1986-03-12 | 1994-03-22 | Hitachi, Ltd. | Processor having a plurality of CPUS with one CPU being normally connected to common bus |
US4837747A (en) * | 1986-11-29 | 1989-06-06 | Mitsubishi Denki Kabushiki Kaisha | Redundary circuit with a spare main decoder responsive to an address of a defective cell in a selected cell block |
US4873626A (en) * | 1986-12-17 | 1989-10-10 | Massachusetts Institute Of Technology | Parallel processing system with processor array having memory system included in system memory |
US5014235A (en) * | 1987-12-15 | 1991-05-07 | Steven G. Morton | Convolution memory |
EP0421696A3 (en) | 1989-10-02 | 1992-01-29 | Motorola Inc. | Staggered access memory |
US5239654A (en) | 1989-11-17 | 1993-08-24 | Texas Instruments Incorporated | Dual mode SIMD/MIMD processor providing reuse of MIMD instruction memories as data memories when operating in SIMD mode |
US5179702A (en) | 1989-12-29 | 1993-01-12 | Supercomputer Systems Limited Partnership | System and method for controlling a highly parallel multiprocessor using an anarchy based scheduler for parallel execution thread scheduling |
JP3210319B2 (en) | 1990-03-01 | 2001-09-17 | 株式会社東芝 | Neurochip and neurocomputer using the chip |
EP0446721B1 (en) | 1990-03-16 | 2000-12-20 | Texas Instruments Incorporated | Distributed processing memory |
US5155729A (en) | 1990-05-02 | 1992-10-13 | Rolm Systems | Fault recovery in systems utilizing redundant processor arrangements |
US5708836A (en) | 1990-11-13 | 1998-01-13 | International Business Machines Corporation | SIMD/MIMD inter-processor communication |
ATE180586T1 (en) * | 1990-11-13 | 1999-06-15 | Ibm | PARALLEL ASSOCIATIVE PROCESSOR SYSTEM |
US5590345A (en) | 1990-11-13 | 1996-12-31 | International Business Machines Corporation | Advanced parallel array processor(APAP) |
JP3001252B2 (en) * | 1990-11-16 | 2000-01-24 | 株式会社日立製作所 | Semiconductor memory |
US5214747A (en) | 1990-12-24 | 1993-05-25 | Eastman Kodak Company | Segmented neural network with daisy chain control |
US5440752A (en) | 1991-07-08 | 1995-08-08 | Seiko Epson Corporation | Microprocessor architecture with a switch network for data transfer between cache, memory port, and IOU |
US5506992A (en) | 1992-01-30 | 1996-04-09 | Saxenmeyer; George | Distributed processing system with asynchronous communication between processing modules |
US5502728A (en) | 1992-02-14 | 1996-03-26 | International Business Machines Corporation | Large, fault-tolerant, non-volatile, multiported memory |
KR960002777B1 (en) * | 1992-07-13 | 1996-02-26 | 삼성전자주식회사 | Row redundancy device for a semiconductor device |
US5345552A (en) * | 1992-11-12 | 1994-09-06 | Marquette Electronics, Inc. | Control for computer windowing display |
US5396608A (en) * | 1993-06-28 | 1995-03-07 | Analog Devices, Inc. | Method and apparatus for accessing variable length words in a memory array |
DE69431386T2 (en) | 1993-10-05 | 2003-05-15 | Seiko Epson Corp | Method and device for generating a program for parallel processing |
EP0694854B1 (en) | 1994-07-28 | 2002-06-05 | International Business Machines Corporation | Improved neural semiconductor chip architectures and neural networks incorporated therein |
JP3723599B2 (en) * | 1995-04-07 | 2005-12-07 | 株式会社ルネサステクノロジ | Semiconductor memory device |
US5956703A (en) | 1995-07-28 | 1999-09-21 | Delco Electronics Corporation | Configurable neural network integrated circuit |
JP3252666B2 (en) * | 1995-08-14 | 2002-02-04 | 日本電気株式会社 | Semiconductor storage device |
JP3036411B2 (en) * | 1995-10-18 | 2000-04-24 | 日本電気株式会社 | Semiconductor storage integrated circuit device |
JPH09198861A (en) * | 1996-01-16 | 1997-07-31 | Mitsubishi Electric Corp | Synchronous semiconductor storage device |
JP3355595B2 (en) * | 1996-03-25 | 2002-12-09 | シャープ株式会社 | Nonvolatile semiconductor memory device |
JPH09288888A (en) * | 1996-04-22 | 1997-11-04 | Mitsubishi Electric Corp | Semiconductor memory |
IT1288076B1 (en) | 1996-05-30 | 1998-09-10 | Antonio Esposito | ELECTRONIC NUMERICAL MULTIPROCESSOR PARALLEL MULTIPROCESSOR WITH REDUNDANCY OF COUPLED PROCESSORS |
US5844856A (en) * | 1996-06-19 | 1998-12-01 | Cirrus Logic, Inc. | Dual port memories and systems and methods using the same |
US5802005A (en) * | 1996-09-23 | 1998-09-01 | Texas Instruments Incorporated | Four bit pre-fetch sDRAM column select architecture |
US5841712A (en) * | 1996-09-30 | 1998-11-24 | Advanced Micro Devices, Inc. | Dual comparator circuit and method for selecting between normal and redundant decode logic in a semiconductor memory device |
JPH10269765A (en) * | 1997-03-24 | 1998-10-09 | Mitsubishi Electric Corp | Semiconductor memory device |
US6026464A (en) | 1997-06-24 | 2000-02-15 | Cisco Technology, Inc. | Memory control system and method utilizing distributed memory controllers for multibank memory |
US6044438A (en) | 1997-07-10 | 2000-03-28 | International Business Machiness Corporation | Memory controller for controlling memory accesses across networks in distributed shared memory processing systems |
JP4039532B2 (en) * | 1997-10-02 | 2008-01-30 | 株式会社ルネサステクノロジ | Semiconductor integrated circuit device |
US6096094A (en) * | 1997-10-03 | 2000-08-01 | National Instruments Corporation | Configuration manager for configuring a data acquisition system |
US5959929A (en) * | 1997-12-29 | 1999-09-28 | Micron Technology, Inc. | Method for writing to multiple banks of a memory device |
JPH11203862A (en) | 1998-01-13 | 1999-07-30 | Mitsubishi Electric Corp | Semiconductor storage device |
NO308149B1 (en) | 1998-06-02 | 2000-07-31 | Thin Film Electronics Asa | Scalable, integrated data processing device |
US6349051B1 (en) | 1998-01-29 | 2002-02-19 | Micron Technology, Inc. | High speed data bus |
US6173356B1 (en) * | 1998-02-20 | 2001-01-09 | Silicon Aquarius, Inc. | Multi-port DRAM with integrated SRAM and systems and methods using the same |
US6678801B1 (en) | 1998-04-17 | 2004-01-13 | Terraforce Technologies Corp. | DSP with distributed RAM structure |
KR100273293B1 (en) * | 1998-05-13 | 2001-01-15 | 김영환 | Refresh scheme of redundant word lines |
US6553355B1 (en) | 1998-05-29 | 2003-04-22 | Indranet Technologies Limited | Autopoietic network system endowed with distributed artificial intelligence for the supply of high volume high-speed multimedia telesthesia telemetry, telekinesis, telepresence, telemanagement, telecommunications, and data processing services |
JP2000011681A (en) | 1998-06-22 | 2000-01-14 | Mitsubishi Electric Corp | Synchronous semiconductor memory device |
US6999950B1 (en) | 1998-06-23 | 2006-02-14 | Intellix A/S | N-tuple or RAM based neural network classification system and method |
DE19838813A1 (en) * | 1998-08-26 | 2000-03-02 | Siemens Ag | Storage system |
US6366989B1 (en) * | 1998-09-17 | 2002-04-02 | Sun Microsystems, Inc. | Programmable memory controller |
US6041400A (en) | 1998-10-26 | 2000-03-21 | Sony Corporation | Distributed extensible processing architecture for digital signal processing applications |
US6798420B1 (en) * | 1998-11-09 | 2004-09-28 | Broadcom Corporation | Video and graphics system with a single-port RAM |
US6216178B1 (en) | 1998-11-16 | 2001-04-10 | Infineon Technologies Ag | Methods and apparatus for detecting the collision of data on a data bus in case of out-of-order memory accesses of different times of memory access execution |
US6067262A (en) | 1998-12-11 | 2000-05-23 | Lsi Logic Corporation | Redundancy analysis for embedded memories with built-in self test and built-in self repair |
US6449732B1 (en) | 1998-12-18 | 2002-09-10 | Triconex Corporation | Method and apparatus for processing control using a multiple redundant processor control system |
US6523018B1 (en) | 1998-12-29 | 2003-02-18 | International Business Machines Corporation | Neural chip architecture and neural networks incorporated therein |
JP2000207884A (en) * | 1999-01-11 | 2000-07-28 | Hitachi Ltd | Semiconductor integrated circuit device |
US6389497B1 (en) | 1999-01-22 | 2002-05-14 | Analog Devices, Inc. | DRAM refresh monitoring and cycle accurate distributed bus arbitration in a multi-processing environment |
US6145069A (en) | 1999-01-29 | 2000-11-07 | Interactive Silicon, Inc. | Parallel decompression and compression system and method for improving storage density and access speed for non-volatile memory and embedded memory devices |
GB9902115D0 (en) | 1999-02-01 | 1999-03-24 | Axeon Limited | Neural networks |
DE19906382A1 (en) * | 1999-02-16 | 2000-08-24 | Siemens Ag | Semiconductor memory with number of memory banks |
US6453398B1 (en) * | 1999-04-07 | 2002-09-17 | Mitsubishi Electric Research Laboratories, Inc. | Multiple access self-testing memory |
JP3959211B2 (en) * | 1999-09-22 | 2007-08-15 | 株式会社東芝 | Semiconductor memory device |
KR20020001879A (en) | 1999-05-14 | 2002-01-09 | 가나이 쓰토무 | Semiconductor device, image display device, and method and apparatus for manufacture thereof |
US6404694B2 (en) | 1999-08-16 | 2002-06-11 | Hitachi, Ltd. | Semiconductor memory device with address comparing functions |
US6751698B1 (en) | 1999-09-29 | 2004-06-15 | Silicon Graphics, Inc. | Multiprocessor node controller circuit and method |
US6708254B2 (en) | 1999-11-10 | 2004-03-16 | Nec Electronics America, Inc. | Parallel access virtual channel memory system |
JP2001155485A (en) * | 1999-11-29 | 2001-06-08 | Mitsubishi Electric Corp | Semiconductor memory |
US6414890B2 (en) * | 1999-12-27 | 2002-07-02 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor memory device capable of reliably performing burn-in test at wafer level |
US6601126B1 (en) | 2000-01-20 | 2003-07-29 | Palmchip Corporation | Chip-core framework for systems-on-a-chip |
AU2001243463A1 (en) | 2000-03-10 | 2001-09-24 | Arc International Plc | Memory interface and method of interfacing between functional entities |
US6668308B2 (en) | 2000-06-10 | 2003-12-23 | Hewlett-Packard Development Company, L.P. | Scalable architecture based on single-chip multiprocessing |
JP4632107B2 (en) * | 2000-06-29 | 2011-02-16 | エルピーダメモリ株式会社 | Semiconductor memory device |
US6785780B1 (en) | 2000-08-31 | 2004-08-31 | Micron Technology, Inc. | Distributed processor memory module and method |
US6785841B2 (en) | 2000-12-14 | 2004-08-31 | International Business Machines Corporation | Processor with redundant logic |
US20020087828A1 (en) * | 2000-12-28 | 2002-07-04 | International Business Machines Corporation | Symmetric multiprocessing (SMP) system with fully-interconnected heterogenous microprocessors |
AU2002243655A1 (en) | 2001-01-25 | 2002-08-06 | Improv Systems, Inc. | Compiler for multiple processor and distributed memory architectures |
US6714467B2 (en) * | 2002-03-19 | 2004-03-30 | Broadcom Corporation | Block redundancy implementation in heirarchical RAM's |
US6396760B1 (en) | 2001-03-16 | 2002-05-28 | Virage Logic Corporation | Memory having a redundancy scheme to allow one fuse to blow per faulty memory column |
US7233998B2 (en) * | 2001-03-22 | 2007-06-19 | Sony Computer Entertainment Inc. | Computer architecture and software cells for broadband networks |
US6385071B1 (en) * | 2001-05-21 | 2002-05-07 | International Business Machines Corporation | Redundant scheme for CAMRAM memory array |
JP2003092364A (en) * | 2001-05-21 | 2003-03-28 | Mitsubishi Electric Corp | Semiconductor memory device |
JP2003068074A (en) * | 2001-08-30 | 2003-03-07 | Mitsubishi Electric Corp | Semiconductor memory |
JP2003132675A (en) * | 2001-10-26 | 2003-05-09 | Seiko Epson Corp | Semiconductor memory |
US6778443B2 (en) * | 2001-12-25 | 2004-08-17 | Kabushiki Kaisha Toshiba | Non-volatile semiconductor memory device having memory blocks pre-programmed before erased |
CN1278239C (en) | 2002-01-09 | 2006-10-04 | 株式会社瑞萨科技 | Storage system and storage card |
US6640283B2 (en) | 2002-01-16 | 2003-10-28 | Hewlett-Packard Development Company, L.P. | Apparatus for cache compression engine for data compression of on-chip caches to increase effective cache size |
JP2003263892A (en) * | 2002-03-11 | 2003-09-19 | Toshiba Corp | Semiconductor memory device |
US7107285B2 (en) | 2002-03-16 | 2006-09-12 | Questerra Corporation | Method, system, and program for an improved enterprise spatial system |
US6717834B2 (en) | 2002-03-26 | 2004-04-06 | Intel Corporation | Dual bus memory controller |
US6877046B2 (en) | 2002-03-29 | 2005-04-05 | International Business Machines Corporation | Method and apparatus for memory with embedded processor |
AU2003226394A1 (en) | 2002-04-14 | 2003-11-03 | Bay Microsystems, Inc. | Data forwarding engine |
US7836168B1 (en) | 2002-06-04 | 2010-11-16 | Rockwell Automation Technologies, Inc. | System and methodology providing flexible and distributed processing in an industrial controller environment |
US7415594B2 (en) * | 2002-06-26 | 2008-08-19 | Coherent Logix, Incorporated | Processing system with interspersed stall propagating processors and communication elements |
US7159141B2 (en) | 2002-07-01 | 2007-01-02 | Micron Technology, Inc. | Repairable block redundancy scheme |
GB2417586B (en) | 2002-07-19 | 2007-03-28 | Picochip Designs Ltd | Processor array |
US7120068B2 (en) * | 2002-07-29 | 2006-10-10 | Micron Technology, Inc. | Column/row redundancy architecture using latches programmed from a look up table |
KR100510496B1 (en) * | 2002-11-19 | 2005-08-26 | 삼성전자주식회사 | Semiconductor memory device having the structure of being capable of converting page length according to specific mode, and method of converting page length of the semiconductor memory device |
US20040153911A1 (en) * | 2002-12-24 | 2004-08-05 | Alon Regev | Testing of a CAM |
JP4223936B2 (en) | 2003-02-06 | 2009-02-12 | 株式会社リコー | Projection optical system, enlargement projection optical system, enlargement projection apparatus, and image projection apparatus |
US20040181503A1 (en) * | 2003-03-13 | 2004-09-16 | Motorola, Inc. | Information storage and retrieval method and apparatus |
US7194568B2 (en) | 2003-03-21 | 2007-03-20 | Cisco Technology, Inc. | System and method for dynamic mirror-bank addressing |
CN1823392A (en) * | 2003-07-15 | 2006-08-23 | 尔必达存储器株式会社 | Semiconductor storage device |
JP2005092969A (en) * | 2003-09-16 | 2005-04-07 | Renesas Technology Corp | Nonvolatile semiconductor memory |
US7162551B2 (en) * | 2003-10-31 | 2007-01-09 | Lucent Technologies Inc. | Memory management system having a linked list processor |
TWI289750B (en) | 2004-01-05 | 2007-11-11 | Sony Corp | Data storage apparatus, and data storage controlling apparatus and method |
US20050240806A1 (en) | 2004-03-30 | 2005-10-27 | Hewlett-Packard Development Company, L.P. | Diagnostic memory dump method in a redundant processor |
US7519875B2 (en) * | 2004-08-20 | 2009-04-14 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Method and apparatus for enabling a user to determine whether a defective location in a memory device has been remapped to a redundant memory portion |
JP2006294144A (en) * | 2005-04-12 | 2006-10-26 | Toshiba Corp | Nonvolatile semiconductor memory device |
US7978561B2 (en) * | 2005-07-28 | 2011-07-12 | Samsung Electronics Co., Ltd. | Semiconductor memory devices having vertically-stacked transistors therein |
US7562271B2 (en) | 2005-09-26 | 2009-07-14 | Rambus Inc. | Memory system topologies including a buffer device and an integrated circuit memory device |
US8074031B2 (en) | 2005-12-20 | 2011-12-06 | Nxp B.V. | Multi-processor circuit with shared memory banks |
US7826243B2 (en) * | 2005-12-29 | 2010-11-02 | Bitmicro Networks, Inc. | Multiple chip module and package stacking for storage devices |
JP2007207380A (en) * | 2006-02-03 | 2007-08-16 | Renesas Technology Corp | Nonvolatile semiconductor memory device |
US8984256B2 (en) | 2006-02-03 | 2015-03-17 | Russell Fish | Thread optimized multiprocessor architecture |
US20070220369A1 (en) | 2006-02-21 | 2007-09-20 | International Business Machines Corporation | Fault isolation and availability mechanism for multi-processor system |
US20080177979A1 (en) * | 2006-03-01 | 2008-07-24 | Gheorghe Stefan | Hardware multi-core processor optimized for object oriented computing |
US7610537B2 (en) | 2006-04-04 | 2009-10-27 | International Business Machines Corporation | Method and apparatus for testing multi-core microprocessors |
US7882307B1 (en) | 2006-04-14 | 2011-02-01 | Tilera Corporation | Managing cache memory in a parallel processing environment |
US8648403B2 (en) | 2006-04-21 | 2014-02-11 | International Business Machines Corporation | Dynamic memory cell structures |
US7949820B2 (en) | 2006-05-23 | 2011-05-24 | Dataram, Inc. | Method for managing memory access and task distribution on a multi-processor storage device |
US7882320B2 (en) | 2006-05-23 | 2011-02-01 | Dataram, Inc. | Multi-processor flash memory storage device and management system |
JP2007317247A (en) * | 2006-05-23 | 2007-12-06 | Nec Electronics Corp | Nonvolatile semiconductor memory device and operating method of nonvolatile semiconductor memory device |
KR20070112950A (en) | 2006-05-24 | 2007-11-28 | 삼성전자주식회사 | Multi-port memory device, multi-processor system including the same, and method of transferring data in multi-processor system |
US7640386B2 (en) * | 2006-05-24 | 2009-12-29 | International Business Machines Corporation | Systems and methods for providing memory modules with multiple hub devices |
JP2008010082A (en) * | 2006-06-29 | 2008-01-17 | Nec Electronics Corp | Nonvolatile semiconductor memory device and word line driving method |
EP2052483A2 (en) * | 2006-07-14 | 2009-04-29 | Interdigital Technology Corporation | Symbol rate hardware accelerator |
KR100748460B1 (en) * | 2006-08-16 | 2007-08-13 | 주식회사 하이닉스반도체 | Semiconductor memory and controlling method of the same |
US7783936B1 (en) * | 2006-09-28 | 2010-08-24 | L-3 Communications, Corp. | Memory arbitration technique for turbo decoding |
US20080109691A1 (en) * | 2006-10-27 | 2008-05-08 | James Norris Dieffenderfer | Method and Apparatus for Executing a BIST Routine |
JP4215795B2 (en) * | 2006-11-20 | 2009-01-28 | エルピーダメモリ株式会社 | Lookup table cascade circuit, lookup table cascade array circuit and pipeline control method thereof |
CN101622595A (en) * | 2006-12-06 | 2010-01-06 | 弗森多系统公司(dba弗森-艾奥) | Apparatus, system, and method for storage space recovery in solid-state storage |
US7831606B2 (en) | 2006-12-08 | 2010-11-09 | Pandya Ashish A | Signature search architecture for programmable intelligent search memory |
KR100918299B1 (en) * | 2007-04-25 | 2009-09-18 | 삼성전자주식회사 | Flash memory device including a row decoder having no bad bolck data storage means and control method thereof |
US8429493B2 (en) * | 2007-05-12 | 2013-04-23 | Apple Inc. | Memory device with internal signap processing unit |
WO2008148091A1 (en) * | 2007-05-25 | 2008-12-04 | Marvell World Trade Ltd. | Tree type bit line decoder architecture for nor-type memory array |
US8042082B2 (en) | 2007-09-12 | 2011-10-18 | Neal Solomon | Three dimensional memory in a system on a chip |
US7772880B2 (en) | 2007-09-12 | 2010-08-10 | Neal Solomon | Reprogrammable three dimensional intelligent system on a chip |
US7557605B2 (en) | 2007-09-14 | 2009-07-07 | Cswitch Corporation | Heterogeneous configurable integrated circuit |
US8200992B2 (en) * | 2007-09-24 | 2012-06-12 | Cognitive Electronics, Inc. | Parallel processing computer systems with reduced power consumption and methods for providing the same |
US7721010B2 (en) * | 2007-10-31 | 2010-05-18 | Qimonda North America Corp. | Method and apparatus for implementing memory enabled systems using master-slave architecture |
US8078829B2 (en) * | 2007-12-12 | 2011-12-13 | Itt Manufacturing Enterprises, Inc. | Scaleable array of micro-engines for waveform processing |
US7844798B2 (en) * | 2007-12-13 | 2010-11-30 | Qimonda Ag | Command protocol for integrated circuits |
FR2925187B1 (en) | 2007-12-14 | 2011-04-08 | Commissariat Energie Atomique | SYSTEM COMPRISING A PLURALITY OF TREATMENT UNITS FOR EXECUTING PARALLEL STAINS BY MIXING THE CONTROL TYPE EXECUTION MODE AND THE DATA FLOW TYPE EXECUTION MODE |
JP2009146548A (en) * | 2007-12-18 | 2009-07-02 | Toshiba Corp | Nonvolatile semiconductor storage device |
US8028124B2 (en) | 2007-12-20 | 2011-09-27 | International Business Machines Corporation | Fast processing memory array |
US9196346B2 (en) * | 2008-01-23 | 2015-11-24 | Micron Technology, Inc. | Non-volatile memory with LPDRAM |
US8120990B2 (en) * | 2008-02-04 | 2012-02-21 | Mosaid Technologies Incorporated | Flexible memory operations in NAND flash devices |
JP2009205258A (en) | 2008-02-26 | 2009-09-10 | Toshiba Corp | Semiconductor integrated circuit |
JP2009211780A (en) * | 2008-03-05 | 2009-09-17 | Nec Corp | Address error detector and address error detecting method |
KR20090095955A (en) | 2008-03-07 | 2009-09-10 | 삼성전자주식회사 | Multi port semiconductor memory device for providing direct access function in shared structure of non-volatile memory and multi processor system having the same |
US20110016278A1 (en) | 2008-03-31 | 2011-01-20 | Frederick Ware | Independent Threading of Memory Devices Disposed on Memory Modules |
US8140830B2 (en) * | 2008-05-22 | 2012-03-20 | International Business Machines Corporation | Structural power reduction in multithreaded processor |
US20100005220A1 (en) * | 2008-07-01 | 2010-01-07 | International Business Machines Corporation | 276-pin buffered memory module with enhanced memory system interconnect and features |
US8031505B2 (en) | 2008-07-25 | 2011-10-04 | Samsung Electronics Co., Ltd. | Stacked memory module and system |
KR101493008B1 (en) * | 2008-09-30 | 2015-02-13 | 삼성전자주식회사 | Source line driver circuit and display apparatus thereof |
JP5599559B2 (en) * | 2008-11-27 | 2014-10-01 | ピーエスフォー ルクスコ エスエイアールエル | Semiconductor device and refresh method thereof |
US7877627B1 (en) * | 2008-12-18 | 2011-01-25 | Supercon, L.L.C. | Multiple redundant computer system combining fault diagnostics and majority voting with dissimilar redundancy technology |
TWI401691B (en) * | 2009-03-20 | 2013-07-11 | Phison Electronics Corp | Controller having flash memory testing functions, storage system and testing method thereof |
US7983065B2 (en) * | 2009-04-08 | 2011-07-19 | Sandisk 3D Llc | Three-dimensional array of re-programmable non-volatile memory elements having vertical bit lines |
US8516408B2 (en) * | 2009-05-26 | 2013-08-20 | Lsi Corporation | Optimization of circuits having repeatable circuit instances |
JP4913878B2 (en) * | 2009-05-27 | 2012-04-11 | ルネサスエレクトロニクス株式会社 | Word line selection circuit, row decoder |
US9378003B1 (en) | 2009-07-23 | 2016-06-28 | Xilinx, Inc. | Compiler directed cache coherence for many caches generated from high-level language source code |
US8442927B2 (en) | 2009-07-30 | 2013-05-14 | Nec Laboratories America, Inc. | Dynamically configurable, multi-ported co-processor for convolutional neural networks |
US9477636B2 (en) | 2009-10-21 | 2016-10-25 | Micron Technology, Inc. | Memory having internal processors and data communication methods in memory |
US8856458B2 (en) | 2009-12-15 | 2014-10-07 | Advanced Micro Devices, Inc. | Polymorphous signal interface between processing units |
KR101107163B1 (en) * | 2010-05-25 | 2012-01-25 | 삼성모바일디스플레이주식회사 | Scan driver and display device using the same |
US20110296078A1 (en) * | 2010-06-01 | 2011-12-01 | Qualcomm Incorporated | Memory pool interface methods and apparatuses |
US9672169B2 (en) | 2010-06-30 | 2017-06-06 | Texas Instruments Incorporated | Dual in line memory module with multiple memory interfaces |
JP5508978B2 (en) * | 2010-07-29 | 2014-06-04 | ルネサスエレクトロニクス株式会社 | Digital-analog conversion circuit and display driver |
US9612979B2 (en) | 2010-10-22 | 2017-04-04 | Intel Corporation | Scalable memory protection mechanism |
US8738860B1 (en) | 2010-10-25 | 2014-05-27 | Tilera Corporation | Computing in parallel processing environments |
KR101212738B1 (en) * | 2010-10-29 | 2012-12-14 | 에스케이하이닉스 주식회사 | Refresh control circuit and semiconductor memory device including the same and control method of refresh |
JP2012174297A (en) * | 2011-02-18 | 2012-09-10 | Elpida Memory Inc | Semiconductor device |
US20140040622A1 (en) | 2011-03-21 | 2014-02-06 | Mocana Corporation | Secure unlocking and recovery of a locked wrapped app on a mobile device |
US9262246B2 (en) | 2011-03-31 | 2016-02-16 | Mcafee, Inc. | System and method for securing memory and storage of an electronic device with a below-operating system security agent |
US9432298B1 (en) | 2011-12-09 | 2016-08-30 | P4tents1, LLC | System, method, and computer program product for improving memory systems |
US9348852B2 (en) * | 2011-04-27 | 2016-05-24 | Microsoft Technology Licensing, Llc | Frequent pattern mining |
US8904537B2 (en) | 2011-05-09 | 2014-12-02 | F—Secure Corporation | Malware detection |
JP5658082B2 (en) | 2011-05-10 | 2015-01-21 | ルネサスエレクトロニクス株式会社 | Semiconductor device |
US8590050B2 (en) | 2011-05-11 | 2013-11-19 | International Business Machines Corporation | Security compliant data storage management |
KR20120132278A (en) | 2011-05-26 | 2012-12-05 | 삼성전자주식회사 | Memory chip, Memory system and access method for Memory chip |
US10078620B2 (en) | 2011-05-27 | 2018-09-18 | New York University | Runtime reconfigurable dataflow processor with multi-port memory access module |
US9406346B2 (en) * | 2011-06-30 | 2016-08-02 | Sandisk Technologies Llc | Smart bridge for memory core |
US9098209B2 (en) | 2011-08-24 | 2015-08-04 | Rambus Inc. | Communication via a memory interface |
US8599595B1 (en) * | 2011-12-13 | 2013-12-03 | Michael C. Stephens, Jr. | Memory devices with serially connected signals for stacked arrangements |
US9195589B2 (en) * | 2011-12-27 | 2015-11-24 | Intel Corporation | Adaptive configuration of non-volatile memory |
US9110830B2 (en) * | 2012-01-18 | 2015-08-18 | Qualcomm Incorporated | Determining cache hit/miss of aliased addresses in virtually-tagged cache(s), and related systems and methods |
US8977583B2 (en) | 2012-03-29 | 2015-03-10 | International Business Machines Corporation | Synaptic, dendritic, somatic, and axonal plasticity in a network of neural cores using a plastic multi-stage crossbar switching |
US8736831B2 (en) * | 2012-05-15 | 2014-05-27 | Kla-Tencor Corp. | Substrate inspection |
WO2013177310A2 (en) | 2012-05-22 | 2013-11-28 | Xockets IP, LLC | Offloading of computation for rack level servers and corresponding methods and systems |
JP2014010845A (en) * | 2012-06-27 | 2014-01-20 | Ps4 Luxco S A R L | Semiconductor device |
US9348385B2 (en) | 2012-07-09 | 2016-05-24 | L. Pierre deRochement | Hybrid computing module |
KR20140023806A (en) * | 2012-08-17 | 2014-02-27 | 삼성전자주식회사 | Architecture of magnetic resistance memory device |
US8677306B1 (en) | 2012-10-11 | 2014-03-18 | Easic Corporation | Microcontroller controlled or direct mode controlled network-fabric on a structured ASIC |
US8996951B2 (en) | 2012-11-15 | 2015-03-31 | Elwha, Llc | Error correction with non-volatile memory on an integrated circuit |
JP6122135B2 (en) * | 2012-11-21 | 2017-04-26 | コーヒレント・ロジックス・インコーポレーテッド | Processing system with distributed processor |
US9449257B2 (en) | 2012-12-04 | 2016-09-20 | Institute Of Semiconductors, Chinese Academy Of Sciences | Dynamically reconstructable multistage parallel single instruction multiple data array processing system |
CN103902472B (en) * | 2012-12-28 | 2018-04-20 | 华为技术有限公司 | Internal storage access processing method, memory chip and system based on memory chip interconnection |
US10318444B2 (en) | 2013-04-11 | 2019-06-11 | The Regents Of The University Of California | Collective memory transfer devices and methods for multiple-core processors |
US9177646B2 (en) | 2013-05-06 | 2015-11-03 | International Business Machines Corporation | Implementing computational memory from content-addressable memory |
US10741226B2 (en) | 2013-05-28 | 2020-08-11 | Fg Src Llc | Multi-processor computer architecture incorporating distributed multi-ported common memory modules |
US10331583B2 (en) | 2013-09-26 | 2019-06-25 | Intel Corporation | Executing distributed memory operations using processing elements connected by distributed channels |
US9305635B2 (en) | 2013-10-31 | 2016-04-05 | Taiwan Semiconductor Manufacturing Co., Ltd. | High density memory structure |
US9418719B2 (en) * | 2013-11-28 | 2016-08-16 | Gsi Technology Israel Ltd. | In-memory computational device |
US9978014B2 (en) | 2013-12-18 | 2018-05-22 | Intel Corporation | Reconfigurable processing unit |
US20150212861A1 (en) * | 2014-01-24 | 2015-07-30 | Qualcomm Incorporated | Value synchronization across neural processors |
CN105431831B (en) * | 2014-02-17 | 2018-10-02 | 联发科技股份有限公司 | Data access method and the data access device for utilizing same procedure |
US10180828B2 (en) | 2014-04-29 | 2019-01-15 | Significs And Elements, Llc | Systems and methods for power optimization of processors |
US20150324690A1 (en) | 2014-05-08 | 2015-11-12 | Microsoft Corporation | Deep Learning Training System |
JP2015222467A (en) * | 2014-05-22 | 2015-12-10 | ルネサスエレクトロニクス株式会社 | Microcontroller and electronic control device using the same |
US9003109B1 (en) | 2014-05-29 | 2015-04-07 | SanDisk Technologies, Inc. | System and method for distributed computing in non-volatile memory |
US10504020B2 (en) | 2014-06-10 | 2019-12-10 | Sightline Innovation Inc. | System and method for applying a deep learning neural network to data obtained from one or more sensors |
KR20160014976A (en) * | 2014-07-30 | 2016-02-12 | 에스케이하이닉스 주식회사 | Memory device and memory system including the same |
US9810777B2 (en) * | 2014-08-22 | 2017-11-07 | Voxtel, Inc. | Asynchronous LADAR and imaging array |
US9984337B2 (en) | 2014-10-08 | 2018-05-29 | Nec Corporation | Parallelized machine learning with distributed lockless training |
JP2016081340A (en) * | 2014-10-17 | 2016-05-16 | 株式会社東芝 | Multiplex control device |
US10175345B2 (en) * | 2014-10-17 | 2019-01-08 | Voxtel, Inc. | Event tracking imager |
KR102251216B1 (en) | 2014-11-21 | 2021-05-12 | 삼성전자주식회사 | Address-remapped memory chip, memory module and memory system including the same |
KR102497704B1 (en) * | 2014-12-09 | 2023-02-09 | 바스프 에스이 | Optical detector |
US10445641B2 (en) | 2015-02-06 | 2019-10-15 | Deepmind Technologies Limited | Distributed training of reinforcement learning systems |
FR3032814B1 (en) * | 2015-02-18 | 2018-02-02 | Upmem | DRAM CIRCUIT WITH INTEGRATED PROCESSOR |
US20160260024A1 (en) * | 2015-03-04 | 2016-09-08 | Qualcomm Incorporated | System of distributed planning |
US11232848B2 (en) * | 2015-04-30 | 2022-01-25 | Hewlett Packard Enterprise Development Lp | Memory module error tracking |
US20160379109A1 (en) | 2015-06-29 | 2016-12-29 | Microsoft Technology Licensing, Llc | Convolutional neural networks on hardware accelerators |
KR102401271B1 (en) * | 2015-09-08 | 2022-05-24 | 삼성전자주식회사 | Memory system and method of operating the same |
US10726328B2 (en) | 2015-10-09 | 2020-07-28 | Altera Corporation | Method and apparatus for designing and implementing a convolution neural net accelerator |
WO2017065379A1 (en) | 2015-10-16 | 2017-04-20 | 삼성전자 주식회사 | Method and apparatus for processing instructions using processing-in-memory |
US9904874B2 (en) | 2015-11-05 | 2018-02-27 | Microsoft Technology Licensing, Llc | Hardware-efficient deep convolutional neural networks |
US11170294B2 (en) | 2016-01-07 | 2021-11-09 | Intel Corporation | Hardware accelerated machine learning |
US10157309B2 (en) | 2016-01-14 | 2018-12-18 | Nvidia Corporation | Online detection and classification of dynamic gestures with recurrent convolutional neural networks |
US9928895B2 (en) * | 2016-02-03 | 2018-03-27 | Samsung Electronics Co., Ltd. | Volatile memory device and electronic device comprising refresh information generator, information providing method thereof, and refresh control method thereof |
US10990872B2 (en) | 2016-03-31 | 2021-04-27 | International Business Machines Corporation | Energy-efficient time-multiplexed neurosynaptic core for implementing neural networks spanning power- and area-efficiency |
US9601183B1 (en) * | 2016-04-14 | 2017-03-21 | Micron Technology, Inc. | Apparatuses and methods for controlling wordlines and sense amplifiers |
US10082964B2 (en) * | 2016-04-27 | 2018-09-25 | Micron Technology, Inc | Data caching for ferroelectric memory |
US10762957B2 (en) * | 2016-06-30 | 2020-09-01 | University of Pittsburgh—of the Commonwealth System of Higher Education | Two-dimensionally accessible non-volatile memory |
US9760827B1 (en) | 2016-07-22 | 2017-09-12 | Alpine Electronics of Silicon Valley, Inc. | Neural network applications in resource constrained environments |
KR102620562B1 (en) * | 2016-08-04 | 2024-01-03 | 삼성전자주식회사 | Nonvolatile memory device |
JP6271655B1 (en) * | 2016-08-05 | 2018-01-31 | 株式会社東芝 | Non-volatile memory |
US10387303B2 (en) | 2016-08-16 | 2019-08-20 | Western Digital Technologies, Inc. | Non-volatile storage system with compute engine to accelerate big data applications |
US9653151B1 (en) | 2016-10-07 | 2017-05-16 | Kilopass Technology, Inc. | Memory array having segmented row addressed page registers |
US20180144244A1 (en) | 2016-11-23 | 2018-05-24 | Vital Images, Inc. | Distributed clinical workflow training of deep learning neural networks |
US10163469B2 (en) * | 2016-11-30 | 2018-12-25 | Micron Technology, Inc. | System and method for write data bus control in a stacked memory device |
US10423876B2 (en) * | 2016-12-01 | 2019-09-24 | Via Alliance Semiconductor Co., Ltd. | Processor with memory array operable as either victim cache or neural network unit memory |
US10032110B2 (en) | 2016-12-13 | 2018-07-24 | Google Llc | Performing average pooling in hardware |
US10073715B2 (en) * | 2016-12-19 | 2018-09-11 | Intel Corporation | Dynamic runtime task management |
US10191799B2 (en) * | 2016-12-29 | 2019-01-29 | Sandisk Technologies Llc | BER model evaluation |
US11062203B2 (en) | 2016-12-30 | 2021-07-13 | Intel Corporation | Neuromorphic computer with reconfigurable memory mapping for various neural network topologies |
US10114795B2 (en) | 2016-12-30 | 2018-10-30 | Western Digital Technologies, Inc. | Processor in non-volatile storage memory |
US10402527B2 (en) | 2017-01-04 | 2019-09-03 | Stmicroelectronics S.R.L. | Reconfigurable interconnect |
US11397687B2 (en) * | 2017-01-25 | 2022-07-26 | Samsung Electronics Co., Ltd. | Flash-integrated high bandwidth memory appliance |
US11144820B2 (en) | 2017-02-28 | 2021-10-12 | Microsoft Technology Licensing, Llc | Hardware node with position-dependent memories for neural network processing |
US10387298B2 (en) | 2017-04-04 | 2019-08-20 | Hailo Technologies Ltd | Artificial neural network incorporating emphasis and focus techniques |
US10032496B1 (en) * | 2017-07-27 | 2018-07-24 | Micron Technology, Inc. | Variable filter capacitance |
TWI779069B (en) * | 2017-07-30 | 2022-10-01 | 埃拉德 希提 | Memory chip with a memory-based distributed processor architecture |
US10304497B2 (en) * | 2017-08-17 | 2019-05-28 | Micron Technology, Inc. | Power supply wiring in a semiconductor memory device |
US10810141B2 (en) | 2017-09-29 | 2020-10-20 | Intel Corporation | Memory control management of a processor |
US10490245B2 (en) * | 2017-10-02 | 2019-11-26 | Micron Technology, Inc. | Memory system that supports dual-mode modulation |
US10388870B2 (en) * | 2017-10-25 | 2019-08-20 | Sandisk Technologies Llc | Barrier modulated cell structures with intrinsic vertical bit line architecture |
US10541273B2 (en) * | 2017-11-28 | 2020-01-21 | Sandisk Technologies Llc | Vertical thin film transistors with isolation |
US11398453B2 (en) * | 2018-01-09 | 2022-07-26 | Samsung Electronics Co., Ltd. | HBM silicon photonic TSV architecture for lookup computing AI accelerator |
CN112912856A (en) * | 2018-09-06 | 2021-06-04 | 纽罗布拉德有限公司 | Memory-based processor |
US11257538B2 (en) * | 2018-10-03 | 2022-02-22 | Micron Technology, Inc. | Systems and methods for improved reliability of components in dynamic random access memory (DRAM) |
TWI714003B (en) * | 2018-10-11 | 2020-12-21 | 力晶積成電子製造股份有限公司 | Memory chip capable of performing artificial intelligence operation and method thereof |
-
2018
- 2018-07-30 TW TW107126383A patent/TWI779069B/en active
- 2018-07-30 EP EP18841178.9A patent/EP3662474B1/en active Active
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- 2018-07-30 EP EP23151586.7A patent/EP4187539A1/en active Pending
- 2018-07-30 CN CN201880062664.7A patent/CN111149166B/en active Active
- 2018-07-30 KR KR1020207006169A patent/KR20200047551A/en not_active Application Discontinuation
- 2018-07-30 WO PCT/IB2018/000995 patent/WO2019025864A2/en unknown
- 2018-07-30 TW TW111132554A patent/TW202301125A/en unknown
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- 2019-07-16 US US16/512,622 patent/US11126511B2/en active Active
- 2019-07-16 US US16/512,613 patent/US11023336B2/en active Active
- 2019-07-16 US US16/512,546 patent/US11269743B2/en active Active
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- 2019-07-16 US US16/512,562 patent/US10885951B2/en active Active
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- 2020-12-04 US US17/112,817 patent/US11301340B2/en active Active
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- 2021-08-09 US US17/397,061 patent/US11914487B2/en active Active
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- 2022-02-04 US US17/649,975 patent/US20220156161A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070214335A1 (en) * | 2006-03-10 | 2007-09-13 | Bellows Chad A | Memory device with mode-selectable prefetch and clock-to-core timing |
US20090196116A1 (en) * | 2008-02-01 | 2009-08-06 | Jong-Hoon Oh | Semiconductor memory having a bank with sub-banks |
US20170194045A1 (en) * | 2015-12-30 | 2017-07-06 | Samsung Electronics Co., Ltd. | Semiconductor memory devices and memory systems including the same |
Non-Patent Citations (1)
Title |
---|
See also references of WO2019025864A2 * |
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