EP3651929A1 - Dispositif de brasage, installation de brasage et procédé - Google Patents

Dispositif de brasage, installation de brasage et procédé

Info

Publication number
EP3651929A1
EP3651929A1 EP18735574.8A EP18735574A EP3651929A1 EP 3651929 A1 EP3651929 A1 EP 3651929A1 EP 18735574 A EP18735574 A EP 18735574A EP 3651929 A1 EP3651929 A1 EP 3651929A1
Authority
EP
European Patent Office
Prior art keywords
solder balls
soldering
axis
brush
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP18735574.8A
Other languages
German (de)
English (en)
Inventor
Meinrad Eckert
Stefan Voelker
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ersa GmbH
Original Assignee
Ersa GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ersa GmbH filed Critical Ersa GmbH
Publication of EP3651929A1 publication Critical patent/EP3651929A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/018—Unsoldering; Removal of melted solder or other residues
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0257—Brushing, e.g. cleaning the conductive pattern by brushing or wiping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder

Definitions

  • the invention relates to a soldering device for removing solder balls and / or solder balls from a lower side of a printed circuit board, in particular a soldering device for a soldering system for selective wave soldering, with a soldering device for removing solder balls and / or solder balls from a lower side of a printed circuit board, in particular a soldering device for a soldering system for selective wave soldering, with a
  • Brush has, which is designed for removing the solder balls and / or solder balls.
  • soldering assemblies especially when soldering power strips and other comparable components, which can be inserted through a printed circuit board and soldered to the bottom of the circuit board, on the underside of the circuit board small solder balls or
  • Adhere solder balls which can lead to failures over the life of the circuit board, for example. When the solder balls or solder balls peel off over time. By detached solder balls or solder balls can be
  • Brush roller which has bristles on its lateral surface, removed from an underside of a circuit board, while the circuit board is driven in the machine direction by a system, for example.
  • a soldering for selective wave soldering so that the circuit board is moved relative to the fixed brush roller.
  • Solder beads and solder balls can also lead to failures in the course of the life of the circuit board, for example. When the solder balls or solder balls over time
  • the invention is therefore based on the object, a
  • Soldering device is characterized in that a Moving device is provided, the
  • An X, Y and Z axis are axes of an axis system, as is commonly used in machine tools, in which all axes are arranged orthogonal to one another.
  • the X- and Y-axis are arranged parallel to the circuit board, so that a method of
  • Soldering device is provided that the traversing device is a portal system.
  • the gantry system has at least one X-axis drive, which is used to move the
  • the gantry system has at least one Y-axis drive, which is designed for movement of the Bürst worn along the Y-axis and wherein the gantry system has at least one Z-axis drive, which is used to move the
  • the axis drives are arranged to be movable towards each other, so that a
  • Method of Y-axis drive leads to a displacement of the X-axis drive and arranged on the X-axis drive Z-axis drive in the direction of the Y-axis, wherein a
  • Moving the X-axis drive leads to a displacement of the X-axis drive arranged Z-axis drive in the Z-axis direction.
  • the axis drives as
  • Linear drives in particular as chain drives,
  • Pneumatic cylinders are formed.
  • the traversing device is a manipulator of a robot. It is conceivable that the Bürst issued at a free end of a robot.
  • Robot arm of an industrial robot is arranged.
  • Brushing a brush drive which is designed to generate an oscillating rotational movement of the brush. The generation of an oscillating
  • Rotational motion has proven to be particularly effective for the removal of the solder bumps and / or solder balls from the underside of the circuit board. It is conceivable that the brush drive as an electric or pneumatic drive is trained. The drive is advantageously designed such that the brush is oscillating
  • the drive is designed such that it oscillates at a voltage of 24 volts 14000
  • Control of the voltage between 0 and 24 volts is adjustable. However, it is also conceivable that the drive the
  • Brush does not oscillate drives, but the brush in a rotational movement in the clockwise direction or opposite offset.
  • the brush having electrically conductive bristles. It is conceivable that the bristles made of a so-called ESD plastic (electrostatic discharge plastic) are. However, it is also conceivable that the brush comprises bristles of electrically conductive carbon.
  • Soldering device is provided that the brush a
  • the brush is cylindrically shaped, i. the bristles of the brush extend cylindrically in the direction of the drive axis.
  • the brush has a brush diameter in the range of about 1 mm to about 40 mm, preferably in the range of about 6 mm to about 20 mm.
  • Adjustment of a machining angle of the Bürst founded is formed in the range of about 0 ° to about 20 ° to the Z-axis.
  • An angle of rotation is understood to mean an angle between the drive axis of the brushing direction and the Z axis of the travel device.
  • Angle adjustment at least one electric servomotor comprises. However, it is also conceivable that the angle adjustment is done manually.
  • a further advantageous embodiment of the soldering device provides that a collecting container is provided, which is designed for collecting solder balls and / or solder balls removed from the underside of the printed circuit board.
  • the collecting container is cup-shaped and concentric with the drive axis of the
  • the collecting container is not motion-coupled with the brush. It is particularly preferred if a
  • Suction device which is designed to generate a negative pressure in the collecting container.
  • a soldering system for selective wave soldering comprising a
  • the object mentioned at the outset is furthermore achieved by a method for removing solder balls and / or solder balls from a lower side of a printed circuit board,
  • Soldering system according to claim 15, wherein solder beads and / or
  • Solder balls are removed from the underside of the circuit board with a brush that has an oscillating
  • Printed circuit board is automatically moved in the direction of the X, Y and / or Z axis.
  • Figure 1 is a schematic side view of a
  • Soldering device for removing solder balls and / or solder balls from an underside of a
  • Figure 2 is a schematic side view of a
  • FIG. 1 shows a brushing device 10 of a soldering device 12 according to the invention shown in FIG. 2 for removing solder balls and / or solder balls from a lower side of a printed circuit board 14 shown in FIG. 2 in a schematic side view.
  • FIG. 2 shows a schematic
  • FIG. 2 Side view of the soldering device 12 according to the invention.
  • the printed circuit board 14 is shown, through which from a top side 16 a
  • solder balls and / or solder balls 24 On the underside 22 of the printed circuit board 14 adhere in the region of the contact pins 20 small solder balls and / or solder balls 24, which have been generated by a solder wave in the selective wave soldering. These so-called solder balls and / or solder balls 24 are undesirable and can in the course of Life of the circuit board 14 lead to failure of the circuit board 14 and the component 18, if they peel off over time. Detached solder balls and / or solder balls 24 can lead to short circuits, which can lead to destruction of an electronic component 18.
  • the soldering device 12 is a total for removing the
  • Lot beads and / or solder balls 24 from the bottom 22 of the circuit board 14 can be designed in particular to be installed in a soldering system, not shown in the figures for selective wave soldering.
  • the soldering device 12 has the one shown in FIG.
  • the brushing device 10 in turn has a brush 28 that can be driven about a drive axis 26 and that is designed to remove the solder balls and / or solder balls 24.
  • the brushing device 10 has a brush drive 30, which is designed to generate an oscillating rotational movement of the brush 28 about the drive axis 26.
  • the brush drive 30 is designed as an electric drive, the brush 28 oscillating during operation
  • the brush drive 30 is designed such that it performs at a voltage of 24 volts 14000 oscillating movements per minute (this corresponds to approximately 230 Hz), wherein the Oscillation speed is adjustable by regulating the voltage between 0 and 24 volts.
  • the brush 28 has an orthogonal to the drive axis 26 arranged brushing surface 32 which is circular (see Figure 1).
  • the brush 28 is cylindrical
  • the brush 28 has a brush diameter 36 in the range of about 1 mm to about 40 mm, preferably in the
  • the brush 28 and its bristles 34 are connected to a ground terminal of the soldering device 12 and a
  • Soldering system for selective wave soldering electrically connected.
  • a collecting container 38 Concentric with the drive axis 26, a collecting container 38 is provided, which for collecting the remote from the bottom 22 of the circuit board 14 solder balls and / or
  • Lotkugeln 24 is formed.
  • the collecting container 38 is cup-shaped and surrounds the brush 28 in
  • Circumferential direction i. orthogonal to the drive axis 26 at least partially, so that a flying around of the means of the Bürst addressed 10 remote solder balls and / or
  • Solder balls 24 can be prevented by using the collecting container 38. In addition, it can be prevented at the same time that removed solder balls and / or
  • Solder balls 24 lead to contamination eg. In the working space of a soldering for selective wave soldering. To one
  • the collecting container 38 is not coupled in motion with the brush 28. It is conceivable that the collecting container 38 is arranged on a hollow shaft which is connected to the drive 30, wherein a drive shaft 28 driving the drive shaft may be guided through the hollow shaft.
  • a suction device 37 is provided, which is designed to generate a negative pressure in the collecting container 38.
  • the suction device 37 can thereby For example, include a vacuum pump and be connected to the collecting container 38 by means of a hose 39.
  • remote solder balls and / or solder balls 24 can be sucked off using the suction device 37 and thus be safely collected by means of the collecting container 38.
  • Bürst acquired 10 arranged on a trained as a portal system traversing device 40 such that it is relative to the circuit board in the direction of an X, Y and Z-axis 42, 44, 46 movable.
  • the X-axis is by the
  • Double arrow 42 wherein the Y-axis is indicated by the double arrow 44 and wherein the Z-axis is indicated by the double arrow 46.
  • An X, Y and Z axis 42, 44, 46 means axes of an axis system, as is commonly used in machine tools and in which all axes are arranged orthogonal to one another.
  • the X and Y axes 42, 44 are parallel to the printed circuit board 14
  • the portal system 40 includes two Y-axis drives 48, an X-axis drive 50, and a Z-axis drive 52.
  • the X-axis drive 50 is configured to move the brushing direction 10 along the X-axis 42.
  • the Y-axis drives 48 are for moving the Bürst driving 10 along the Y-
  • Axis 44 is formed. Further, the Z-axis drive 52 is configured to move the brushing direction 10 along the Z-axis 46. The trained as linear actuators
  • Axle drives 48, 50, 52 are so mutually
  • Axial drives 48 leads to a displacement of the X-axis drive 50 and arranged on the X-axis drive 50 Z-axis drive 52 in the direction of the Y-axis 44, wherein a method of the X-axis drive 50 to a displacement of the arranged on the X-axis drive 50 Z -Axis drive 52 in the direction of the X-axis 42 leads.
  • Actuator provided for the adjustment of a
  • Machining angle of the Bürst noisy 10 in the range of about 0 ° to about 20 ° to the Z-axis 46 in the direction of
  • Double arrow 56 is formed. Under a
  • Machining angle is an angle between the
  • the brush 28 of the brushing 10 is automated, for example. CNC controlled by means of
  • soldering device 12 with which a simple, safe and automated removal of solder balls and / or solder balls 24 from a bottom 22 of a printed circuit board 14 can be made possible.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

L'invention concerne un dispositif de brasage destiné à retirer des perles de brasure et/ou des billes de brasure d'une face inférieure d'une carte de circuits imprimés, en particulier un dispositif de brasage pour une installation de brasage permettant un brasage sélectif à la vague. Le dispositif comprend un système de brossage destiné à retirer les perles de brasure et/ou les billes de brasure de la face inférieure de la carte de circuits imprimés. Le système de brossage présente une brosse qui peut être entraînée autour d'un axe d'entraînement et qui est conçue pour retirer les perles de brasure et/ou les billes de brasure. Un système de déplacement est présent, le système de brossage étant agencé sur le système de déplacement de manière à pouvoir être déplacé par rapport à la carte de circuits imprimés en direction d'un axe X-, Y- et Z.
EP18735574.8A 2017-07-11 2018-07-02 Dispositif de brasage, installation de brasage et procédé Withdrawn EP3651929A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102017115548.1A DE102017115548B4 (de) 2017-07-11 2017-07-11 Lötvorrichtung und Lötanlage
PCT/EP2018/067749 WO2019011686A1 (fr) 2017-07-11 2018-07-02 Dispositif de brasage, installation de brasage et procédé

Publications (1)

Publication Number Publication Date
EP3651929A1 true EP3651929A1 (fr) 2020-05-20

Family

ID=62791755

Family Applications (1)

Application Number Title Priority Date Filing Date
EP18735574.8A Withdrawn EP3651929A1 (fr) 2017-07-11 2018-07-02 Dispositif de brasage, installation de brasage et procédé

Country Status (5)

Country Link
US (1) US20200156168A1 (fr)
EP (1) EP3651929A1 (fr)
CN (1) CN110869155B (fr)
DE (1) DE102017115548B4 (fr)
WO (1) WO2019011686A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019123294A1 (de) * 2019-08-30 2020-07-23 Seho Systemtechnik Gmbh Lötdüse und Verfahren zu ihrer Herstellung
DE102021132818A1 (de) 2021-12-13 2023-06-15 Odelo Gmbh Fahrzeugleuchte mit ESD Schutz

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3923002A (en) * 1973-08-24 1975-12-02 Louis Vanyi Soldering machine accessory
EP0147000A1 (fr) 1983-12-15 1985-07-03 Hollis Automation Inc. Système I à souder par ondes destiné à la fabrication en masse
JP2660248B2 (ja) * 1988-01-06 1997-10-08 株式会社 半導体エネルギー研究所 光を用いた膜形成方法
DE4122615A1 (de) 1991-07-09 1993-01-14 Manfred Bahnemann Recycling Sy Verfahren zum entfernen von leiterplattenbestueckungen
US5715592A (en) 1994-11-08 1998-02-10 Nec Corporation Parts disassembling apparatus
JP3243412B2 (ja) * 1996-05-29 2002-01-07 千住金属工業株式会社 プリント基板のはんだ除去方法、はんだ除去装置およびキャリヤー
JP2872139B2 (ja) * 1996-09-03 1999-03-17 埼玉日本電気株式会社 表面実装部品の自動搭載設備
US6273317B1 (en) 1998-10-29 2001-08-14 Denso Corporation Flow soldering apparatus having resilient substrate clamping mechanism and solder oxide film removing mechanism
AT413668B (de) * 2003-05-13 2006-04-15 Fronius Int Gmbh Gasdüse für einen schweissbrenner und schweissbrenner mit einer derartigen gasdüse
CN2788510Y (zh) * 2005-01-24 2006-06-14 林木发 自动擦板机
JP4680704B2 (ja) 2005-07-19 2011-05-11 パナソニック株式会社 基板クリーニング装置、及び基板搬送装置
JP4804324B2 (ja) * 2006-12-15 2011-11-02 富士通株式会社 ペースト印刷装置およびペースト印刷方法
WO2013168198A1 (fr) * 2012-05-10 2013-11-14 三菱電機株式会社 Dispositif de nettoyage de buse, dispositif de brasage tendre, et procédé de nettoyage de buse
CN103096632B (zh) * 2013-02-17 2013-12-18 精成科技电子(东莞)有限公司 一种用于加工硬盘pcb的去除助焊剂装置和方法
CN104149093B (zh) * 2013-05-14 2016-03-09 苏州汉扬精密电子有限公司 自动除尘结构
CN204429738U (zh) * 2015-01-27 2015-07-01 安徽通源电力科技有限公司 一种基座式多角度清扫刷
CN108608083B (zh) * 2018-07-04 2022-01-25 北京京瀚禹电子工程技术有限公司 一种电子产品用自动焊锡装置

Also Published As

Publication number Publication date
US20200156168A1 (en) 2020-05-21
CN110869155A (zh) 2020-03-06
WO2019011686A1 (fr) 2019-01-17
CN110869155B (zh) 2022-08-30
DE102017115548B4 (de) 2019-09-05
DE102017115548A1 (de) 2019-01-17

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