EP3618566B1 - Heizer - Google Patents
Heizer Download PDFInfo
- Publication number
- EP3618566B1 EP3618566B1 EP18790840.5A EP18790840A EP3618566B1 EP 3618566 B1 EP3618566 B1 EP 3618566B1 EP 18790840 A EP18790840 A EP 18790840A EP 3618566 B1 EP3618566 B1 EP 3618566B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- resistor
- ceramic body
- heat
- slit
- heater
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000000919 ceramic Substances 0.000 claims description 75
- 230000002093 peripheral effect Effects 0.000 claims description 14
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 14
- 238000010438 heat treatment Methods 0.000 description 14
- 239000000463 material Substances 0.000 description 9
- 239000004020 conductor Substances 0.000 description 8
- 239000002344 surface layer Substances 0.000 description 8
- 230000020169 heat generation Effects 0.000 description 7
- 230000008646 thermal stress Effects 0.000 description 6
- 238000009826 distribution Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 4
- 229910052750 molybdenum Inorganic materials 0.000 description 4
- 229910052721 tungsten Inorganic materials 0.000 description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- ODINCKMPIJJUCX-UHFFFAOYSA-N Calcium oxide Chemical compound [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 229910052593 corundum Inorganic materials 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229910001845 yogo sapphire Inorganic materials 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 229910001182 Mo alloy Inorganic materials 0.000 description 1
- 229910020968 MoSi2 Inorganic materials 0.000 description 1
- 229910000691 Re alloy Inorganic materials 0.000 description 1
- 229910008814 WSi2 Inorganic materials 0.000 description 1
- 230000001464 adherent effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000005429 filling process Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 235000000396 iron Nutrition 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- MGRWKWACZDFZJT-UHFFFAOYSA-N molybdenum tungsten Chemical compound [Mo].[W] MGRWKWACZDFZJT-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 1
- DECCZIUVGMLHKQ-UHFFFAOYSA-N rhenium tungsten Chemical compound [W].[Re] DECCZIUVGMLHKQ-UHFFFAOYSA-N 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/40—Heating elements having the shape of rods or tubes
- H05B3/42—Heating elements having the shape of rods or tubes non-flexible
- H05B3/48—Heating elements having the shape of rods or tubes non-flexible heating conductor embedded in insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
- H05B2203/003—Heaters using a particular layout for the resistive material or resistive elements using serpentine layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/013—Heaters using resistive films or coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/021—Heaters specially adapted for heating liquids
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/022—Heaters specially adapted for heating gaseous material
Definitions
- the present disclosure relates to a heater used for fluid-heating purposes, powder-heating purposes, gas-heating purposes, oxygen sensors, soldering irons, etc.
- a heretofore known heater including: a ceramic body having a rod shape or cylindrical shape, the ceramic body including, in an outer peripheral surface thereof, a slit-shaped recess extending from a front end toward a rear end of the ceramic body; and a heat-generating resistor embedded inside the ceramic body, wherein the heat-generating resistor includes a first resistor and a second resistor which are disposed in parallel.
- the present invention provides a heater according to claim 1. Preferred embodiments are described in the dependent claims.
- the conventional heater is not configured so that a heat-generating resistor is located in a slit-shaped recess of a ceramic body.
- This construction is disadvantageous in durability. That is, with a rise in temperature, the temperature of a region near the slit-shaped recess becomes lower than the temperature of surrounding regions, causing a temperature gradient. Consequently, under heat cycles, a microcrack may appear in the ceramic body due to resultant thermal stress, and, the propagation of the crack may lead to occurrence of a break at and around part of the heat-generating resistor located close to the slit-shaped recess.
- the disclosure has been made in view of the circumstances as discussed supra, and accordingly its object is to provide a highly durable heater with a heat-generating resistor which is less prone to a break.
- FIG. 1 is a schematic perspective view showing an example of a heater
- FIG. 2 is a fragmentary perspective view of the heater shown in FIG. 1
- FIG. 3 is a sectional view taken along the line III-III of FIG. 1
- FIG. 4 is a developed view showing a pattern of the heat-generating resistor shown in FIG. 1 .
- the heater according to the disclosure shown in FIGS. 1 to 4 includes: a ceramic body 1 having a rod shape or cylindrical shape, the ceramic body 1 including, in an outer peripheral surface thereof, a slit-shaped recess 11 extending from a front end toward a rear end of the ceramic body; and a heat-generating resistor 2 embedded inside the ceramic body 1.
- the heat-generating resistor 2 includes a first resistor 21 and a second resistor 22 which are disposed in parallel.
- the heat-generating resistor 2 includes a first region 31 in which the first resistor 21 and the second resistor 22 extend, in a meandering manner, in parallel along a circumferential direction of the ceramic body 1 between the front end and rear end of the ceramic body 1, and a second region 32 located near the slit-shaped recess 11, the second region 32 in which only the first resistor 21 extends in a meandering manner.
- the ceramic body 1 is built as an elongated rod-shaped or tubular member.
- rod-shaped forms include a circular column and a rectangular column.
- tubular forms include a circular cylinder and a rectangular tube.
- the ceramic body 1 is shaped in a circular cylinder.
- the ceramic body 1 has a length of 20 mm to 60 mm.
- the outside diameter of the cylindrical sectional profile of the ceramic body 1, or the diameter of the circular sectional profile of the ceramic body 1 falls in the range of 2.5 mm to 5.5 mm.
- the heater When using the ceramic body 1 in tubular (cylindrical) form, the heater operates to apply heat to a heating target set in contact with the inner peripheral surface or outer peripheral surface of the ceramic body 1. On the other hand, when using the ceramic body 1 in rod-shaped form, the heater operates to apply heat to a heating target set in contact with the outer peripheral surface of the ceramic body 1.
- the ceramic body 1 is made of an insulating ceramic material.
- the insulating ceramic material include alumina, silicon nitride, and aluminum nitride.
- Alumina is desirable from the standpoints of resistance to oxidation and manufacturability.
- Silicon nitride is desirable from the viewpoint of attaining excellence in strength, toughness, insulation properties, and heat resistance.
- Aluminum nitride is desirable from the viewpoint of attaining excellence in thermal conductivity.
- a compound of metal elements contained in the heat-generating resistor 2 may be contained in the ceramic body 1.
- WSi 2 or MoSi 2 may be contained in the ceramic body 1.
- the ceramic body 1 includes a rod-shaped or tubular core member 12 and a surface layer portion 13 disposed so as to cover a side surface of the core member 12.
- the ceramic body 1 includes, in its outer peripheral surface, the slit-shaped recess 11 extending from the front end toward the rear end of the ceramic body 1.
- the depth of the recess 11 falls in the range of 0.1 mm to 1.5 mm.
- the opening width of the recess 11 falls in the range of 0.3 mm to 2 mm.
- the opening width refers to the length of a curve extending along the outside diameter of the cross section of the ceramic body 1.
- the heat-generating resistor 2 is embedded inside the ceramic body 1. Where the ceramic body is composed of the core member 12 and the surface layer portion 13, for example, the heat-generating resistor 2 is interposed between the core member 12 and the surface layer portion 13.
- the heat-generating resistor 2 generates heat by applying electric current to heat the ceramic body 1.
- the heat-generating resistor 2 is constructed of a conductor composed predominantly of a high-melting-point metal such as tungsten (W), molybdenum (Mo), or rhenium (Re).
- W tungsten
- Mo molybdenum
- Re rhenium
- the width falls in the range of 0.3 mm to 2 mm
- the thickness falls in the range of 0.01 mm to 0.1 mm
- the total length of the heat-generating resistor 2 falls in the range of 500 mm to 5000 mm.
- the dimensions are suitably determined in accordance with the temperature at which the heat-generating resistor 2 generates heat, the magnitude of voltage applied to the heat-generating resistor 2, etc.
- the heat-generating resistor 2 is disposed so that heat can be generated to the greatest extent on the front-end side of the ceramic body 1.
- the heat-generating resistor 2 includes a folded portion (meandering portion) in which part of the heat-generating resistor 2 extends, in a meandering manner, along a circumferential direction of the ceramic body 1 at the front-end side of the ceramic body 1 lengthwise.
- a pair of linear portions is formed at the rear end of the folded portion. At the rear end of each linear portion, the heat-generating resistor 2 is electrically connected to a draw-out portion as described later.
- the heat-generating resistor 2 may be made to have any one of a circular cross section, an elliptical cross section, and a rectangular cross section. Instead of the folded portion only at the front-end side, a folded portion at both of the front-end side and the rear- end side may be imparted to the heat-generating resistor 2. The details of such a pattern of the heat-generating resistor 2 will be described later.
- the folded portion at the front-end side and the pair of linear portions at the rear-end side may be made of the same material.
- the linear portion may be made lower in resistance value per unit length than the folded portion by adjusting the cross-sectional area of the linear portion to be greater than that of the folded portion, or by reducing the amount of the ceramic body 1-constituting material contained in the linear portion.
- a draw-out portion is embedded in the rear-end side of the ceramic body 1.
- the draw-out portion is built as a through hole conductor including one end electrically connected to the rear end of the heat-generating resistor 2 and the other end drawn out to a side surface of the rear-end side of the ceramic body 1.
- the draw-out portion may be made either of the same material as that used for the heat-generating resistor 2 or of a material which is lower in resistance value than the heat-generating resistor 2.
- the illustration of the draw-out portion is omitted from FIG. 4 .
- the side surface of the rear-end side of the ceramic body 1 is, on an as needed basis, provided with an electrode pad 5 which is electrically connected to the draw-out portion embedded inside the ceramic body 1.
- a lead terminal is joined to the electrode pad 5 to be electrically connected with an external circuit (external power supply).
- an external circuit external power supply
- one connected via the draw-out portion to both of one end of the first resistor 21 and one end of the second resistor 22 is a first pad 51 which serves as a common pad
- one connected via the draw-out portion to the other end of the first resistor 21 is a second pad 52
- one connected via the draw-out portion to the other end of the second resistor 22 is a third pad 53.
- the electrode pad 5 may be formed either of a molybdenum (Mo)- or tungsten (W)-made conductor layer alone or of the above-described conductor layer having, for example, a Ni-B- or Au-made plating layer formed on its surface.
- Mo molybdenum
- W tungsten
- the electrode pad 5 has a thickness of 50 ⁇ m to 300 ⁇ m, and a length, as well as a width, of 5 mm to 10 mm.
- the heat-generating resistor 2 includes the first resistor 21 and the second resistor 22 which are disposed in parallel.
- the first and second resistors 21 and 22 disposed in parallel are included in the heat-generating resistor 2
- the amount of heat generation can be reduced by applying voltage to only one of the heat-generating resistors (for example, the first resistor 21)
- the amount of heat generation can be increased by applying voltage to a plurality of the heat-generating resistors (the first resistor 21 and the second resistor 22) simultaneously. That is, the amount of heat generation is easily adjustable.
- the heat-generating resistor 2 includes the first region 31 in which the first resistor 21 and the second resistor 22 extend, in a meandering manner, in parallel along the circumferential direction of the ceramic body 1 between the front end and rear end of the ceramic body 1, and the second region 32 located near the slit-shaped recess 11, the second region 32 in which only the first resistor 21 extends in a meandering manner.
- the first resistor 21 is located on the front-end side of the ceramic body 1
- the second resistor 22 is located on the rear-end side of the ceramic body 1 in parallel to the first resistor 21, and, the first resistor 21 and the second resistor 22 extend, in a meandering manner, along the circumferential direction of the ceramic body 1 between the front end and rear end of the ceramic body 1.
- only the first resistor 21 extends in a meandering manner.
- the first resistor 21 may be made lower in resistance value than the second resistor 22.
- the lower the resistance value the larger the current and the greater the amount of heat generation.
- the temperature of the region near the slit-shaped recess 11 rises at a higher rate. This makes it possible to attain a uniform temperature distribution over the outer peripheral surface of the heater, and thereby reduce thermal stress, with consequent enhancement in durability.
- a way for making the first resistor 21 lower in resistance value than the second resistor 22 is to adjust the line width of the first resistor 21 to be greater (wider) than the line width of the second resistor 22 as shown in FIG. 5 , for example.
- the line width of the second resistor 22 is set to equal 1.1 to 1.5 times the line width of the first resistor 21.
- Another way for making the first resistor 21 lower in resistance value than the second resistor 22 is to adjust the specific resistance of the first resistor 21 to be lower than the specific resistance of the second resistor 22.
- the specific resistance of the first resistor 21 is set to equal 20 to 80% of the specific resistance of the second resistor 22.
- a tungsten-molybdenum alloy is used to form the first resistor 21, and, a tungsten-rhenium alloy is used to form the second resistor 22.
- the first resistor 21 and the second resistor 22 are made of the same conductor material, as long as the amount of addition of an insulating material, which is the same as that used for the ceramic body 1, to the second resistor 22 is greater than the amount of addition of the same material to the first resistor 21, the first resistor 21 can be made lower in specific resistance than the second resistor 22.
- the first resistor 21 may be shaped so that its line width becomes smaller (narrower) gradually or stepwise with increasing proximity to the slit-shaped recess 11.
- the amount of heat generated in a portion of the first resistor 21 having a smaller line width (smaller sectional area) is greater than the amount of heat generated in other portions.
- the second region 31 in which only the first resistor 21 extends in a meandering manner, as well as the region near the slit-shaped recess 11, undergoes greater temperature rise. This makes it possible to attain a uniform temperature distribution over the outer peripheral surface of the heater, and thereby reduce thermal stress, with consequent enhancement in durability.
- Whether such a design is obtained can be determined by line width comparison among part of the first resistor 21 located farthest away from the slit-shaped recess 11 (the midportion of the first resistor 21 as viewed in FIG. 6 ), part of the first resistor 21 located at the boundary between the first region 31 and the second region 32, and part of the first resistor 21 located closest to the slit-shaped recess 11. These parts refer to first resistor portions aligned in a circumferential direction of the ceramic body 1.
- the line widths of, respectively, the front end, the midportion, and the rear end of this portion in the lengthwise direction are measured, and the average of those measurements is taken as the line width of the portion.
- Such a design that the first resistor 21 is shaped so that its line width becomes smaller (narrower) gradually or stepwise with increasing proximity to the slit-shaped recess 11 is not limited to one as shown in FIG. 6 , but may be applicable to a case where the line width of the first resistor 21 is smaller (narrower) than that of the second resistor 22. In this case, the first resistor 21 may be entirely made smaller (narrower) in line width than second resistor 22. It is also possible to adopt a design wherein part of the first resistor 21 located farthest away from the slit-shaped recess 11 (the midportion of the first resistor 21 as viewed in FIG.
- the first resistor 21 may be shaped so that the pitch of pattern segments becomes shorter gradually or stepwise with increasing proximity to the slit-shaped recess 11. The shorter the pitch of pattern segments, the denser the arrangement of the first resistor 21 portions and the greater the amount of heat generation therein. Also in this case, the second region 31 in which only the first resistor 21 extends in a meandering manner, as well as the region near the slit-shaped recess 11, undergoes greater temperature rise. This makes it possible to attain a uniform temperature distribution over the outer peripheral surface of the heater, and thereby reduce thermal stress, with consequent enhancement in durability.
- the following describes an example of a heater manufacturing method.
- the following description deals with the case where the ceramic body is formed of alumina ceramics.
- the ceramic body 1 made of alumina ceramics composed predominantly of Al 2 O 3 a ceramic slurry prepared by blending Al 2 O 3 with sintering aids such as SiO 2 , CaO, MgO, ZrO 2 , etc. is molded into sheet form to obtain a ceramic green sheet which constitutes the surface layer portion 13 of the ceramic body 1.
- a resistor paste for forming the heat-generating resistor 2 is applied to form a predetermined pattern by means of screen printing or otherwise.
- a conductor paste for forming the electrode pad 5 is applied in a predetermined pattern by means similar to that for forming the pattern of the heat-generating resistor 2.
- the ceramic green sheet is subjected to perforation work for electrical connection between the heat-generating resistor 2 and the electrode pad 5, and to conductor-paste filling process for formation of a through hole conductor which serves as the draw-out portion.
- the first region 31 in which a plurality of resistor pattern segments (including the first resistor 21 and the second resistor) are laid out in parallel so as to extend from the common pad 51, and resistor pattern segments extend in a meandering manner longitudinally
- the second region 32 in which only the outermost resistor pattern segment (the first resistor 21) extends in a meandering manner longitudinally.
- the resistor paste and the conductor paste are prepared by kneading high-melting-point metal such as W, Mo, or Re, which can be fired concurrently with the firing of the ceramic body-forming material, blended with a ceramic raw material, a binder, an organic solvent, etc.
- the heating position and the value of resistance in the heat-generating resistor 2 may be suitably adjusted by making changes to the length of each pattern segment made of the resistor-forming resistor paste or the conductive paste, the distance or gap between folded pattern segments, and the line width of each pattern segment.
- an alumina ceramic molded body in the form of a circular column or a circular cylinder is obtained by extrusion molding.
- the lengthwise extending slit-shaped recess 11 (slot) in the outer peripheral surface (side face) of the ceramic body 1 is created by winding the alumina ceramic green sheet (the surface layer portion 13) around the core member 12 so that a certain space can be left between the opposite ends of the sheet.
- the unitary alumina molded product so obtained is fired in an atmosphere of non-oxidizing gas such as hydrogen gas or a mixture gas (forming gas) of nitrogen gas and hydrogen gas at a temperature of 1500°C to 1600°C, for example. Then, a Ni plating film is deposited onto the electrode pad 5 on the outer peripheral surface of the ceramic body 1 by electrolytic plating technique, for example. In this way, a unitary alumina sintered compact is produced.
- non-oxidizing gas such as hydrogen gas or a mixture gas (forming gas) of nitrogen gas and hydrogen gas at a temperature of 1500°C to 1600°C, for example.
- a Ni-made lead terminal is joined to the electrode pad 5 via a brazing material such as a Ag brazing material or solder.
- the lead terminal may be coated with an insulating material in advance. In this case, a part of the insulating material coating is removed for the connection of the lead terminal, and, the insulating material-free part of the lead terminal is connected to the electrode pad 5.
- an insulating tube may be attached to the Ni wire.
- the heater according to this embodiment can be obtained in the manner thus far described.
Landscapes
- Resistance Heating (AREA)
Claims (6)
- Heizvorrichtung, aufweisend:einen Keramikkörper (1) mit einer Stabform oder Rohrform, wobei der Keramikkörper (1) in einer Außenumfangsfläche davon eine schlitzförmige Aussparung (11) aufweist, die sich von einem vorderen Ende in Richtung zu einem hinteren Ende des Keramikkörpers (1) erstreckt; undeinen wärmeerzeugenden Widerstand (2), der innerhalb des Keramikkörpers (1) eingebettet ist,wobei der wärmeerzeugende Widerstand (2) einen ersten Widerstand (21) und einen zweiten Widerstand (22) aufweist, die parallel angeordnet sind,wobei der wärmeerzeugende Widerstand (2) einen ersten Bereich (31), in dem sich der erste Widerstand (21) und der zweite Widerstand (22) mäanderförmig parallel entlang einer Umfangsrichtung des Keramikkörpers (1) zwischen dem vorderen Ende und dem hinteren Ende des Keramikkörpers erstrecken, und einen zweiten Bereich (32) benachbart zu der schlitzförmigen Aussparung (11) aufweist, wobei sich im zweiten Bereich nur der erste Widerstand (21) mäanderförmig erstreckt.
- Heizvorrichtung gemäß Anspruch 1, wobei der erste Widerstand (21) einen geringeren Widerstandswert als der zweite Widerstand (22) hat.
- Heizvorrichtung gemäß Anspruch 1 oder 2, wobei der erste Widerstand (21) eine größere Linienbreite als der zweite Widerstand (22) hat.
- Heizvorrichtung gemäß Anspruch 1 oder 2, wobei der erste Widerstand (21) einen geringeren spezifischen Widerstand als der zweite Widerstand (22) hat.
- Heizvorrichtung gemäß irgendeinem der Ansprüche 1 bis 4, wobei der erste Widerstand (21) so geformt ist, dass eine Linienbreite davon mit zunehmender Nähe zu der schlitzförmigen Aussparung (11) allmählich oder stufenweise kleiner wird.
- Heizvorrichtung gemäß irgendeinem der Ansprüche 1 bis 5, wobei der erste Widerstand (21) derart geformt ist, dass ein Abstand von Mustersegmenten mit zunehmender Nähe zu der schlitzförmigen Aussparung (11) allmählich oder stufenweise kürzer wird.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017087327 | 2017-04-26 | ||
PCT/JP2018/016616 WO2018199094A1 (ja) | 2017-04-26 | 2018-04-24 | ヒータ |
Publications (3)
Publication Number | Publication Date |
---|---|
EP3618566A1 EP3618566A1 (de) | 2020-03-04 |
EP3618566A4 EP3618566A4 (de) | 2021-01-06 |
EP3618566B1 true EP3618566B1 (de) | 2021-11-03 |
Family
ID=63918354
Family Applications (1)
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EP18790840.5A Active EP3618566B1 (de) | 2017-04-26 | 2018-04-24 | Heizer |
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EP (1) | EP3618566B1 (de) |
JP (1) | JP6510739B2 (de) |
KR (1) | KR102207442B1 (de) |
CN (1) | CN110521279B (de) |
WO (1) | WO2018199094A1 (de) |
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CN115726036A (zh) * | 2021-08-31 | 2023-03-03 | 银川隆基硅材料有限公司 | 一种加热器及单晶炉热场 |
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JPS58121588A (ja) * | 1982-01-12 | 1983-07-19 | 日本特殊陶業株式会社 | 筒状セラミツクヒ−タ− |
JPH097741A (ja) * | 1995-06-20 | 1997-01-10 | Ngk Spark Plug Co Ltd | セラミックヒータ |
JP3677366B2 (ja) * | 1997-01-31 | 2005-07-27 | 京セラ株式会社 | セラミックヒータ |
JP3691649B2 (ja) * | 1997-10-28 | 2005-09-07 | 日本特殊陶業株式会社 | セラミックヒータ |
JP2000277240A (ja) * | 1999-03-26 | 2000-10-06 | Ibiden Co Ltd | セラミックヒーター |
JP2001102161A (ja) * | 1999-09-29 | 2001-04-13 | Ibiden Co Ltd | セラミックヒーター |
JP2001221504A (ja) * | 2000-02-04 | 2001-08-17 | Toto Ltd | 温水装置 |
US6519835B1 (en) * | 2000-08-18 | 2003-02-18 | Watlow Polymer Technologies | Method of formable thermoplastic laminate heated element assembly |
CN100536621C (zh) * | 2004-05-27 | 2009-09-02 | 京瓷株式会社 | 陶瓷加热器和采用其的氧传感器及烫发剪 |
KR101201388B1 (ko) * | 2004-07-28 | 2012-11-14 | 쿄세라 코포레이션 | 세라믹 히터 및 그것을 사용한 가열용 인두 |
JP4514653B2 (ja) * | 2005-05-27 | 2010-07-28 | 京セラ株式会社 | セラミックヒーター及びこれを用いた加熱用こて |
JP5872759B2 (ja) | 2010-09-21 | 2016-03-01 | Toto株式会社 | 人体洗浄装置 |
JP2013134880A (ja) * | 2011-12-26 | 2013-07-08 | Valeo Japan Co Ltd | セラミックヒータ及びそれを用いた電気発熱式温水加熱装置 |
JP5911179B2 (ja) * | 2013-08-21 | 2016-04-27 | 信越化学工業株式会社 | 立体形状のセラミックスヒーター |
CN211831183U (zh) * | 2020-03-04 | 2020-10-30 | 安徽省宁国市天成科技发展有限公司 | 一种ptc陶瓷加热器 |
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2018
- 2018-04-24 JP JP2018557959A patent/JP6510739B2/ja active Active
- 2018-04-24 KR KR1020197029101A patent/KR102207442B1/ko active IP Right Grant
- 2018-04-24 CN CN201880025057.3A patent/CN110521279B/zh active Active
- 2018-04-24 EP EP18790840.5A patent/EP3618566B1/de active Active
- 2018-04-24 WO PCT/JP2018/016616 patent/WO2018199094A1/ja unknown
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Publication number | Publication date |
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EP3618566A4 (de) | 2021-01-06 |
KR102207442B1 (ko) | 2021-01-26 |
KR20190124764A (ko) | 2019-11-05 |
CN110521279B (zh) | 2021-11-23 |
JPWO2018199094A1 (ja) | 2019-06-27 |
WO2018199094A1 (ja) | 2018-11-01 |
CN110521279A (zh) | 2019-11-29 |
JP6510739B2 (ja) | 2019-05-08 |
EP3618566A1 (de) | 2020-03-04 |
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