Classifications

• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F28—HEAT EXCHANGE IN GENERAL
  • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
  • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
  • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
  • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
  • F28D15/043—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F28—HEAT EXCHANGE IN GENERAL
  • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
  • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
  • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
  • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
  • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure

Definitions

• the present invention relates to evaporators, usually used in two-phase working fluid heat transfer systems.
• This type of evaporator is usually used to cool electronic equipment, such as a processor (CPU, GPU), a power module (IGBT, SiC, Gan etc.), or any other electronic component generating calories, or any other source heat.
• electronic equipment such as a processor (CPU, GPU), a power module (IGBT, SiC, Gan etc.), or any other electronic component generating calories, or any other source heat.
• This type of evaporator is used in a system that includes a condenser and return lines for circulating the fluid between the evaporator and the condenser.
• the known vaporization interfaces do not make it possible to treat a surface thermal flux above 20 Watts / cm 2 because the heat exchange coefficients degrade very strongly with the increase in the heat flux density of the reactor. made of a depression of the vaporization front inside the primary wick. The increase in the number of vapor bubbles inside the wick increases the risk of drying out, that is to say the risk of an interruption of the supply of liquid there, a phenomenon that it should be avoided.
• the subject of the invention is a capillary evaporator for a heat transfer system, the evaporator comprising:
• a calorie receiving member (1) comprising a base (10) and a plurality of projections (11), each projection extending from the base to a vertex (12), and whose size decreases with One distance from the base, each projection having side flanks (13),
• thin layer is meant a layer of thickness less than 1 mm. The inventors have found that advantageously a low thickness associated with the projections contributed to obtaining a good performance.
• the thin layer of porous material is in contact with the primary wick at a junction zone, at the location where the liquid passes from the primary wick to the thin layer. porous material forming a so-called secondary wick.
• the fluid in the liquid phase is pumped by capillarity from the primary wick into the thin layer that covers the projections where the vaporization takes place; the exchange surface is increased. Thanks to these arrangements, an evaporation interface is obtained capable of treating a thermal flux greater than 50 Watts / cm 2 , with heat exchange coefficients W / (m 2 K) much higher than those of the prior art and , depending on the different possible configurations the evaporation interface will even be able to process tens or even hundreds of Watts / cm 2 .
• the heat flow transferred directly to the primary wick is greatly reduced vis-à-vis the total heat flow (it vaporizes mainly on the flanks) and therefore avoids creating a boiling phenomenon in the zone of contact with the primary wick, in other words it avoids the overheating of the primary wick.
• the parasitic flux transfer is limited both by greatly limiting the penetration of the vaporization front into the primary wick and also by limiting the overheating of the receiving member while promoting the extraction of the vapor created in the channels. dedicated.
• the thin layer may have a substantially uniform thickness. According to this configuration, a relatively simple manufacturing and assembly method can be provided by using a metallic woven fabric which is intimately connected to the surface of the receiving member.
• the thin layer may have a non-uniform thickness, the thickest portion (31) of the thin layer being disposed in contact with the primary wick in the vicinity of the apex of each projection, and the thickness (EC) of said thin layer decreasing away from the primary wick.
• This configuration makes it possible to obtain a better overall performance in terms of power dissipated per unit area.
• the calorie receiving member may comprise a plate, which corresponds to a planar configuration for the heat source to be cooled.
• the calorie receiving member may be generally formed as a cylinder, which may correspond to a cylindrical configuration for the heat source to be cooled, which is as common as the flat configuration.
• This cylindrical configuration is common when using a high pressure fluid, such as ammonia for space applications; in this case one can have a flat sole, usually aluminum, assembled on the outer surface of one cylindrical evaporator.
• the projections can advantageously be formed in the form of rectilinear section ribs trapezoidal (or even triangular); the calorie receiving member is thus easy to manufacture by extrusion or simple machining (milling). Moreover, such a trapezoidal section allows a robust transmission of the mechanical forces, in particular induced by the compression assembly of the power modules on one evaporator by screwing (which do not allow conventional thin fins which have a substantially constant thickness on their height, especially with copper).
• each steam channel (4) has a generally triangular section with one of its points directed towards the base of the receiving member. The density of the areas covered by the thin layer is thus maximized and therefore the heat exchanges also, for a given total available area.
• the projection section forms a symmetrical isosceles trapezoid (ie a "tooth"), with the short side having a length of at most 20% relative to the length of the long side.
• D3 ⁇ 0.2 W are formed steam channels of sufficient size including their width between the tops of the projections allows a rapid flow of steam without excessive pressure losses.
• the small side D3 (i.e., the width of the apex) has a dimension ⁇ 0.3 mm.
• the half aperture angle at the aperture is less than 45 °, and preferably between 5 ° and 30 °. This corresponds to the fact that the height of the H2 projections is greater than 1/2 of their W-grip on the base, which partly explains the increase in efficiency of the exchanges by an increase in the effective surface area.
• the primary wick is obtained preferentially from a bad thermal conductor material, such as nickel, stainless steel, ceramic or teflon; typically with a thermal conductivity less than 100 W / mK. This avoids heating the liquid located on the other side of the primary wick and strongly limits parasitic thermal leakage.
• a bad thermal conductor material such as nickel, stainless steel, ceramic or teflon
• the thin layer is obtained from a good thermal conductor, such as copper or aluminum; typically with a coefficient greater than 100 W / mK and preferably greater than 380 W / mK.
• the pore diameter of the thin layer is smaller than the pore diameter of the primary wick.
• liquid supply of the thin layer from the primary wick and inside the thin layer is encouraged from the thickest part of said thin layer.
• the thickness EC of the thin layer is less than 0.5 mm, preferably wherever the thin layer is in contact with the heat receiving plate 1.
• the inventors have found that advantageously such a small thickness was enough to get a good performance.
• the calorie reception plate is not flat (presence of projections 11) contrary to certain embodiments of the prior art.
• the thickness H1 of the base is between 0.5 and 5 mm. This thickness is adjusted to obtain sufficient rigidity and strength for assembly, for example by screwing, the component to be cooled.
• the height H2 of the projections is between 0.5 and 3 mm. This height is adjusted to obtain a sufficient passage section for the steam channels to avoid potential problems of loss of loads.
• the projections are formed in the form of circular ribs. This can be used in the case where the evaporator is in disk form.
• the projections are formed in the form of a conical stud or a pyramidal stud.
• the surface efficiency can be further improved and depending on the manufacturing methods used, the cost price of the coated calorie receiving plate can remain reasonable.
• the thickness E2 of the primary lock is constant and preferably between 1 and 8 mm.
• Such a simple primary wick is an available and inexpensive material.
• the top of the projections is in contact with the primary wick on a surface less than 20% of the effective surface of the primary wick.
• the invention also relates to a heat transfer system comprising an evaporator as described above, a condenser, fluid conduits with either a gravity pumping namely a thermosiphon configuration (including configurations called “pool boiling”) either pumping only capillary or in combination with a jet, or else an evaporator fed by a mechanical pump.
• a gravity pumping namely a thermosiphon configuration (including configurations called “pool boiling") either pumping only capillary or in combination with a jet, or else an evaporator fed by a mechanical pump.
• FIG. 1 is a general schematic view of a heat transfer system including an evaporator according to the invention
• FIG. 2 is a partial cross-sectional view of an evaporator according to a first embodiment, along a sectional plane II-II visible in FIG. 1;
• FIG. 3 represents a partial schematic perspective view of the evaporator
• FIG. 4 shows in greater detail a portion of the cross-section illustrating a projection and its porous coating
• FIG. 5 represents a second embodiment of cylindrical evaporator type (instead of plane),
• FIG. 6 represents the distribution of the vaporization flow along the side of the projections coated with the thin layer of porous material
• FIG. 7 represents the heat flow inside the projection as well as the flow of liquid supply along the thin layer
• FIG. 8 illustrates the arrangement of the steam channels in a horizontal section along a sectional plane VIII-VIII visible in FIG. 2,
• FIG. 9 is a schematic horizontal sectional view of a stud evaporator which represents another alternative embodiment.
• FIG. 10 illustrates two alternative embodiments relating to the configuration of the thin layer of porous material.
• FIG. 1 shows a heat transfer system comprising an evaporator 7 comprising a receiving member 1 which makes it possible to evacuate a flow of calories Qin received by the evaporator 7 from a dissipative component ('hot source') towards a condenser COND can receive these calories and evacuate Qout to a 'cold source' (ambient air, warm or cold water, radiative panel, etc. ).
• a dissipative component 'hot source'
• COND condenser COND
• a steam pipe 8 conveys the steam produced in the evaporator to the condenser.
• a liquid pipe 9 makes it possible to bring the condensed liquid back into the condenser towards the evaporator 7.
• the condenser and the pipes are assumed to be known per se and will not be described here in more detail.
• the evaporator, condenser and lines form a heat transfer loop, which operates either by gravity (thermosiphon) or by capillary pumping, a solution that works both on land and in weightlessness or against an acceleration field (gravity, movement of a vehicle) is still pumping assisted by a mechanical pump.
• a reservoir RES which serves as an expansion vessel for the liquid (thermal expansion of the liquid and variation of the volume of vapor outside the reservoir); in the case where this tank is present as a separate element, we speak of a loop called 'CPL' (Capillary Pumped Loop).
• the reservoir function is provided inside the evaporator and in this case we speak of a loop called 'LHP' (Loop Heat Pipe '). In the case of a configuration "thermosiphon" the presence of the tank is not necessary.
• the evaporator 7 comprises a calorie-receiving member marked 1; in the first example illustrated, it is a plate 1 to which is leaned an element to be cooled (not shown) which provides a stream of calories marked Qin.
• This plate is provided with a particular structure on the inner side to the evaporator, this will be detailed later.
• the evaporator 7 in question is a capillary-type evaporator, that is to say it contains a wick, in other words a porous mass, which draws, by capillary action, liquid which is in a liquid compartment 5 in communication with the liquid line 9 and the expansion tank RES.
• transfer member 1
• receiving member may also be replaced in some cases by the term “hot plate” or "receiving plate”.
• the evaporator 7 comprises the above-mentioned hot plate 1, a capillary structure which will be detailed later, the above-mentioned liquid compartment 5 and a cover-case which makes it possible to assemble the whole and to delimit a sealed interior space of the evaporator which hermetically contains the working fluid.
• the capillary structure comprises a marked primary wick 2 completed by a capillary coating structure which forms a thin layer of porous material (item 3) which will be discussed in more detail below.
• the hot plate in other words the heat receiving member 1, comprises a base 10 which extends along a YZ plane in 2 directions Y, Z perpendicular to the depth axis denoted X, and a plurality of projections 11, each extending from the base 10 to a vertex 12, with side flanks marked 13.
• each of said projections 11 decreases with the distance from the base.
• at least one dimension of the projection 11 decreases as one moves away from the base 10.
• the lateral flanks 13 are not parallel to each other.
• the section of the projection in the XY plane (Figs 2 and 4), it has a trapezoidal shape with a wide base of dimension denoted by W and a narrow vertex of dimension denoted D3.
• the base and the top are parallel, here parallel to the Y axis, and the lateral flanks 13 of the projection extend obliquely with an angle ⁇ relative to the base.
• a half aperture angle at the apex of between 5 ° and 30 °.
• the small side D3 will have a size ⁇ 0.3 mm.
• the projections extend in constant section along the direction Z.
• voids are formed, formed as grooves 4 and also referred to herein as “vaporization channels. 4 or “steam channels”.
• the projections 11 are adjacent to each other, each neighboring projections being separated by a steam channel 4; we therefore note a repeating pattern along the Y axis with a pitch corresponding to the dimension W which is none other than the width of the projection 11 at its base.
• the height of the vaporization channels is marked H2.
• the projections are formed as rectilinear ribs of trapezoidal section and W represents the pitch / pitch of repetition taken along the Y axis.
• the primary wick, marked 2 is formed as a thick layer of porous material; in the example illustrated, the thickness E2 of this layer is constant over the entire surface of one evaporator which allows the use of a standard inexpensive product.
• the thickness E2 of this primary wick it is possible to choose a value of between 1 and 8 mm, preferably of between 2 mm and 5 mm.
• the primary wick 2 has a front face 20 facing the receiving plate 1, and a rear face 25 in contact with the liquid 5.
• the primary planar wick can be supplemented by internal walls 28 which forms a rigid structure allowing to strengthen the mechanical strength of one evaporator.
• These inner walls may be porous or non-porous depending on the possible needs of capillary liquid distribution functions.
• a material is chosen rather poor thermal conductor such as nickel, stainless steel or Teflon.
• a material having a thermal conductivity of less than 70 W / mK, preferably less than 20 W / mK, will be chosen.
• flanks 13 of the projections are coated with a thin layer 3 of porous material.
• An interface plane P designates a plane parallel to YZ adjacent to the apex 12 of the projections, and which, in the assembled state of the evaporator, also coincides with the front face 20 of the primary wick.
• flanks 13 of the projections provided with their lining delimit with the front face 20 of the primary wick the passage section of the steam channels 4.
• its thickness is not constant on the flanks 13 of the projections and preferably varies along the flanks away from the primary wick; the thickest part 31 is disposed in contact with the primary wick, at an interface 23 placed in the plane P adjacent the top of each projection 12, and the thickness EC of said thin layer decreases while moving away from the primary wick, to the vicinity of the bottom 41 of the groove where the end portion of the thin layer 32 identified has a thickness almost zero.
• the thickness EC of the thin layer is everywhere less than 0.5 mm.
• an upper limit of thickness EC a value of less than 0.2 x W.
• the thickness EC is EC1 at the abscissa L1 and decreases when moves along L towards the bottom 41 of the groove, where the thickness EC3 is almost zero or at least significantly finer than the EC1 part, passing through intermediate thicknesses EC2.
• the bottom of the groove 41 is considered "punctual". In fact, because of machining opposites and / or to facilitate the creation of the thin layer 3, there may be an area not covered by the thin layer 3 whose size is comparable to D3.
• the thin layer 3 is ideally obtained from a good thermal conductive material, relative to the material constituting the primary wick 2, such as copper, aluminum or nickel, having a thermal conductivity greater than 180 W / mK and preferably greater than 380 W / mK.
• the pore diameter of the thin layer is smaller than the pore diameter of the wick. primary; This makes it possible to supply the liquid from the primary wick and to promote the release of the steam at the surface of the thin layer.
• the base 10 of the receiving member has a thickness H1, typically between 0.5 mm and 5 mm.
• top 12 of the projections is in contact with the primary wick in a plane P on a surface (D3xZ2) less than 20% of the effective surface of the primary wick.
• the top of the projection 12 and the primary wick are continuously in contact with each other along the direction Z2; in other words, there is no interruption of contact between the top of the projections and the underside of the primary lock.
• the contact surface between the primary wick and the thin layer, on each side of the section there is a width denoted D1 with
• D2 typically extends over 10% to 50% of the base width W. It is not excluded to increase up to 80% in the case where the assembly of the primary lock on all Teeth are made with connection fillet (Fig. 10 right). This configuration is interesting in the case of a need for significant mechanical strength or increased drainage of the two-phase liquid.
• Figures 6 and 7 show the operation of the progressive section vaporization surface (i.e., the thin layer 3 of porous material).
• the thickness of this projection 11 is important, its effectiveness as a fin is close to 1 and its thermal resistance is at least an order of magnitude lower than that due to the vaporization through the thin layer 3. This is the same, as a first approximation, to consider that the temperature of the trapezoidal wing protection varies little.
• the thermal resistance of the thin layer, saturated or partially saturated with liquid, is inversely proportional to its thickness, which varies, for example linearly between EC1 and EC3 (FIG. 4).
• the locally vaporized flow rate in layer 3 follows a curve 61 as illustrated in FIG.
• the local flow (expressed in W / cm 2 ) is extremely important at the place of smaller thickness EC3, ie at the base of the trapezoidal tooth 11. Due to the proposed geometry, the flux density heat decreases as we approach the contact zone 23 with the primary wick. In the example illustrated, which also corresponds to FIG. 4, at the level of the projection top 12, the heat flux density is divided by 20 with respect to the parietal flow, whereas on the evaporators with straight projection or with reentrant groove of the prior art, devoid of thin layer 3, the heat flux is multiplied by a factor greater than 1.
• a boiling phenomenon at the interface between the top 12 of the projections and the primary wick 2 is avoided, or very strongly, thus prevented. Thanks to these arrangements, an evaporation interface is obtained capable of treating a higher heat flow. at 50 watts / cm 2 on average on the outer surface of the evaporator.
• exchange coefficients are achieved thermal of the order of 30 000 W / (m 2 K) or higher (reference: contact surface of the receiving plate).
• the inventors have been able to observe thermal power transferred per unit area (from the receiving plate) above 110 W / cm 2 .
• the thin layer makes it possible to transfer a large flow of liquid, much greater than the quantity of liquid vaporized at the top 12 of the tooth; the rate of liquid transfer in the thin layer is illustrated in curve 62; this curve 62 represents the ratio QLid (h) / QLiq (Ll).
• the abscissa of Figure 7 is the normalized height, ie the h / H2 ratio.
• H is a variable representing the height relative to the base.
• H2 is the total height of the projection.
• the conductive flow QT (h) in the body of the tooth 11, relative to the normalized height, follows the curve marked 63.; this curve 63 represents the ratio QT (h) / QT (0) or expressed QT (h) / QT (L2) if we consider that the abscissa L2 corresponds to the base of the projection.
• the permeability and the pore distribution of the thin layer 3 are adapted accordingly to allow the vaporization closer to the base 10 in order to limit the vaporization in the primary wick.
• the thin layer can present, either because manufacturing imperfections, either intentionally, double porosity, ie first areas with larger pores compared to other areas where the pores are smaller; in the same spirit, it is not excluded that there are discontinuities in the thin layer 3 that is to say, grooves or isolated areas devoid of thin layer 3 on the lateral flank 13 of the projection 11 .
• the proposed trapezoidal section allows a robust transmission of mechanical forces, particularly in compression (assembly of power modules by screwing).
• the general arrangement of the evaporator is cylindrical.
• the base 10 is a cylinder receiving the flow Qin, however provisions similar to those already described, mutatis mutandis, are applied for the projections 11, the grooves 4 and the thin layer 3.
• the primary wick 2 is in the form of a tubular sleeve.
• the liquid compartment 5 is formed by the central zone of the cylindrical interior space.
• each of the grooves or each vaporization channel 4 is connected fluidically (in the vapor or liquid phase) to a collector channel 40, itself connected to the outlet of the evaporator (reference Vap_Out) which is connected to the external steam pipe 8.
• the projections 11 are arranged in the form of a conical stud or a pyramidal stud.
• the steam channels 4 are then formed by the intervals between the pads. According to an advantageous option, the decreasing thickness from the top of the studs confers the benefits in terms of efficiency already described above.
• the projections may be formed in the form of circular ribs, in the case of a wafer evaporator or disc.
• Figure 10 are shown two variants, one on the left side of the figure (10-L) another on the right side of the figure (10-R).
• the thickness EC of the thin layer is almost constant.
• a thickness EC of the thin layer of between 0.1 mm and 0.8 mm will be chosen. The operation and the efficiency of such a configuration are quite satisfactory without however being equal to those of the thin layer with decreasing thickness as described above.
• the thickness of the thin layer decreases rapidly to 0, in other words the groove bottom is not coated with material the base plate is bare .
• a leave zone 39 as illustrated by a dotted area, which increases the contact area with the primary wick. Indeed we see that the distance denoted Dl 'is substantially greater than the distance denoted Dl.
• the thickness EC of the thin layer is constant, including in the lower zone 34 and the bottom of the groove 35. Continuing to the left, we find the portion 36 of the same thickness that covers the side of the next tooth.
• a possible solution for forming such a thin layer of constant thickness is to use a lattice 38 in the form of a matrix metal sheet unidirectional.
• the mesh is shaped on the projections including on their sides and is in close contact with the receiving member 1.
• the contact with the lower zone 34 may have a generally triangular section of cavity.
• the preparation of the primary wick 2 consists of cutting a sheet of porous thickness chosen to the right dimensions, length and width.
• the receiving member 1 starts from a copper plate (or nickel, stainless steel or aluminum) of thickness H1 + H2 and then proceeds to the formation of grooves and projections by removal of material either by electro-erosion or by conventional machining or by extrusion, stamping or stamping.
• the thin layer 3 of non-uniform thickness (first embodiment) is formed, for example by atmospheric plasma spraying or by additive manufacturing (3D printing) or by laying a trellis as illustrated above.
• a diffusion connection makes it possible to bond the two porous surfaces at the plane of contact P.
• Compression contact assembly is another possible option.
• the thin layer 3 could also cover the top 12 of the tooth before assembly of the primary wick 2.

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• Engineering & Computer Science (AREA)
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• Sustainable Development (AREA)
• Physics & Mathematics (AREA)
• Thermal Sciences (AREA)
• Mechanical Engineering (AREA)
• General Engineering & Computer Science (AREA)
• Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

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• 2017
  • 2017-04-18 FR FR1753365A patent/FR3065279B1/fr active Active
• 2018
  • 2018-04-12 EP EP18717606.0A patent/EP3612782B1/de active Active
  • 2018-04-12 CN CN201880034753.0A patent/CN110741215B/zh active Active
  • 2018-04-12 WO PCT/EP2018/059450 patent/WO2018192839A1/fr unknown
  • 2018-04-12 JP JP2019556203A patent/JP7100665B2/ja active Active
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