EP3027995B1 - Verdampfer mit rückschlagvorrichtung für zweiphasigen kreislauf - Google Patents

Verdampfer mit rückschlagvorrichtung für zweiphasigen kreislauf Download PDF

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Publication number
EP3027995B1
EP3027995B1 EP14747908.3A EP14747908A EP3027995B1 EP 3027995 B1 EP3027995 B1 EP 3027995B1 EP 14747908 A EP14747908 A EP 14747908A EP 3027995 B1 EP3027995 B1 EP 3027995B1
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EP
European Patent Office
Prior art keywords
evaporator
strip
evaporator according
inlet orifice
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Not-in-force
Application number
EP14747908.3A
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English (en)
French (fr)
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EP3027995A1 (de
Inventor
Vincent De Troz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Euro Heat Pipes SA
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Euro Heat Pipes SA
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/043—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers

Definitions

  • the present invention relates to evaporators for two-phase thermal transfer systems with capillary pumping.
  • the invention relates to the constitution of such evaporators, in particular those intended to evacuate the calories generally produced by a dissipative element, in particular but not exclusively by an electronic processor or any electronic switching device.
  • the condenser function still uses a fan and the evaporator placed in contact with each processor is complex to manufacture and therefore the system is expensive.
  • EP 0739647 discloses an evaporator for two-phase thermal transfer system with ribs disposed in the liquid compartment of the evaporator, thereby improving the liquid supply.
  • Such an evaporator can be used either in a two-phase loop called 'LHP' (Loop Heat Pipe) with tank attached to the evaporator or in a two-phase loop called 'CPL' (Capillary Pumped Loop) with separate tank of the 'evaporator.
  • 'LHP' Loop Heat Pipe
  • 'CPL' Pilly Pumped Loop
  • the liquid is refluxed from the evaporator to the condenser and thus makes the start of the capillary loop reliable.
  • LHP configuration it improves its behavior vis-à-vis sudden changes in thermal load, including a sudden drop in load.
  • the invention also aims at a two-phase thermal transfer system with capillary pumping for evacuating the heat dissipated by a dissipative element comprising an evaporator as described above, with the advantages mentioned above for both the LHP configuration and the CPL configuration.
  • the figure 1 represents an example of a closed loop two-loop loop cooling device, which comprises an evaporator 10, a condenser module 8, a first fluid line 40 called 'steam' connecting the outlet of the evaporator to the inlet of the condenser module, and a second fluid line 50 called 'liquid' connecting the outlet of the condenser module to the inlet of the evaporator.
  • the circulation of a two-phase working fluid is ensured by means of the capillary effect prevailing in a porous mass 3 arranged inside the evaporator 10.
  • Said porous mass 3 separates a first chamber 11 in thermal contact with the hot source and intended to generally contain working fluid in the gas phase, a second chamber 12 arranged opposite the hot source in the evaporator and intended to contain working fluid mainly in the liquid phase.
  • the thermal energy provided at the evaporator converts liquid to vapor which absorbs energy equivalent to the latent heat of vaporization of the working fluid.
  • the steam thus created is directed under pressure into the first line 40 to the inlet 8a of the condenser module.
  • the working fluid transfers its heat directly into the environment, or to another fluid 18 in liquid penstock (as shown, inlet 18a, 18b output), and in that the working fluid passes in the liquid phase after yielding an energy corresponding to the latent heat.
  • the liquid fluid at the outlet 8b of the condenser is sucked by the pumping effect provided by the capillary structure of the porous mass, the second chamber and the pipe 50 being filled with the working fluid in the liquid phase.
  • Such capillary pumping systems are known by the acronyms of LHP ('Loop Heat Pipe') or CPL ('Capillary Pumped Loop') and are used in both gravity-free (space) and gravity-ground applications.
  • figure 1 does not mention the vertical direction and therefore there is no particular constraint concerning the orientation and the respective position of the evaporator and the condenser module as long as the capillary pumping effect remains greater than the effects of the gravity given the density of the fluid used.
  • the main aim is terrestrial systems with high volume or large series applications, that is to say very large numbers of parts to be manufactured.
  • it is sought to reduce the cost price and the production cost of the system components and in particular of the capillary evaporator 10.
  • FIG. 2 schematically shown an electronic card 19 provided with at least one processor 9. In the illustrated configuration, the card is shown in a horizontal position, but it could just as well be in a vertical position.
  • a capillary evaporator 10 configured to collect calories dissipated by the processor 9 according to a diphasic capillary loop process already described above.
  • the condenser module 8 is formed by a heat exchanger of liquid / liquid type preferably cross-flow, known per se and therefore not described in detail here.
  • the cooling fluid 18 will typically be water, at the temperature where it is available in the building, or close to room temperature or slightly cooled.
  • the evaporator comprises a base plate 1 intended to come into physical and thermal contact with the processor 9 according to an interface plane P and a body 2 which complements the base plate to form an enclosure also called an internal space 20, in which are arranged the elements of the evaporator which will be described below.
  • the base plate 1 comprises a peripheral edge 14 and an external thermal reception face 17 intended to receive heat from a dissipative element such as the processor 9 in question.
  • a dissipative element such as the processor 9 in question.
  • the projections could also be pions arranged in a matrix or staggered and separated from each other.
  • the base plate is preferably formed of copper, which material has a very good coefficient of thermal conduction.
  • a capillary structure layer forming a porous mass 3 which in the illustrated example is a layer of constant thickness without any particular secondary form. Thus, it suffices to cut a porous layer with the correct dimensions of width and length, there is no need to machine steam channels inside this porous mass.
  • the aforementioned body 2 of the evaporator is arranged above the base plate and the porous mass, this body is preferably made of stainless steel called 'stainless steel'.
  • This body 2 comprises a bottom 21, which forms a wall parallel to the plane P, side walls 22 (side portions) which extend from the bottom all around the evaporator towards a border 24 which borders the body 2 in the vicinity of the P interface plane.
  • the border 24 and the peripheral edge 14 of the base plate 1 are assembled together hermetically by brazing, welding, screwing, riveting, crimping or any other suitable method.
  • an anti-return device 6 is formed in the second chamber 12, in particular to prevent a backflow of liquid towards the liquid line 50.
  • This device is, in the illustrated example, formed by an elongated flexible strip 60 extending between a first end 61 fixed relative to the evaporator and a second end 62 or free end arranged in the vicinity of the mouth of the inlet orifice 5.
  • the free end 62 comes to rest flat against the face 9a of the inner wall or opens the liquid line; the fixed end is fixed against the wall 9b perpendicular to the aforementioned face 9a.
  • the first end 61 called “fixing end” is fixed to the wall 22b by means of an electric soldering point, or as illustrated by a recess in a slot provided for this purpose.
  • the flexible strip 60 is formed by a strip of stainless steel similar to the material of the body 2.
  • the thickness E of the strip is constant and can be chosen between 0.2 mm and 2 mm.
  • the width H (also called 'height' in the illustrated example) of the band is constant and can be chosen typically between 3 mm and 12 mm.
  • the strip has a width at least 8 times greater than its thickness.
  • the length L of the strip may be chosen typically between 4 cm and 25 cm.
  • the band has a length at least 10 times greater than its width.
  • the strip has a length at least 10 times greater than the diameter of the inlet orifice 5.
  • the flexible band is longer and extends over the entire length of the liquid chamber 12 ; it is fixed in this case to the wall 22c located opposite the wall 22a where opens the inlet port.
  • the operation of the flexible band is similar to that described for the case of the figure 4 .
  • a lip-shaped projection 25 forms a tight separation between the first chamber and the second chamber.
  • the body 2 comprises lateral extensions 16 obtained integrally by forming the body 2, these lateral extensions preferably extend parallel to the plane P and are provided with holes 66.
  • the screws spring (not shown) allow to press the evaporator against the processor.
  • the bottom 21 of the body may have on its outer face a plurality of fins 28 whose function is to limit the heating of the liquid in the second chamber 12 and which also allow to re-condense gas bubbles that could have form near the porous mass and rise to the bottom 21.

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Claims (12)

  1. Verdampfer (10) für zweiphasiges Wärmeübertragungssystem mit kapillaren Pumpen, umfassend:
    - eine Basisplatte (1), die sich allgemein parallel zu einer Grenzflächenebene (P) erstreckt und dazu bestimmt ist, Wärme von einem Ableitungselement aufzunehmen,
    - einen Körper (2) mit einem Boden (21), Seitenwänden (9a-9d) und einem Rand, der mit der Basisplatte verbunden ist, um so einen Innenraum (20) des Verdampfers hermetisch zu begrenzen,
    - eine poröse Masse (3), die eine zwischen die Basisplatte und den Boden eingefügte Schicht mit Kapillarstruktur bildet, die eine von der Basisplatte, den Seitenwänden und der Schicht aus poröser Masse begrenzte erste Kammer (11) und eine vom Boden, den Seitenwänden und der Schicht aus poröser Masse begrenzte zweite Kammer (12) definiert,
    wobei die erste Kammer dazu bestimmt ist, Wärmeträgerfluid im Wesentlichen in der Gasphase zu beherbergen,
    wobei die zweite Kammer dazu bestimmt ist, Wärmeträgerfluid im Wesentlichen in der Flüssigphase zu beherbergen, und eine Verdampfereingangsöffnung (5) für eine rohrförmige Flüssigkeitsleitung (50) umfasst,
    dadurch gekennzeichnet, dass eine Rückschlagvorrichtung (6) auf Höhe der Eingangsöffnung (5) in der zweiten Kammer (12) eingerichtet ist, um einen Rückfluss von Flüssigkeit durch die Eingangsöffnung zu vermeiden, sodass man die Risiken einer Austrocknung der porösen Masse vermindert und die Leistungen des Systems bei den schnellen Schwankungen der Wärmeleistung deutlich erhöht.
  2. Verdampfer nach Anspruch 1, wobei die Rückschlagvorrichtung durch einen flexiblen Streifen (6) gebildet ist, der angeordnet ist, um sich an eine (9a) der Seitenwände anzulegen, die die Mündung der Eingangsöffnung (5) umfasst.
  3. Verdampfer nach Anspruch 2, wobei der flexible Streifen durch seine eigene Flexibilität mit einer Vorspannung an die Eingangsöffnung zurückgeführt wird.
  4. Verdampfer nach einem der Ansprüche 2 bis 3, wobei der Streifen mit einem Spiel von weniger als 15 % seiner Höhe in einer zur Grenzflächenebene senkrechten Richtung vom Boden (21) und der porösen Masse (3) eingerahmt ist.
  5. Verdampfer nach einem der Ansprüche 2 bis 4, wobei die zweite Kammer (12) eine allgemein parallelepipedische Form aufweist, wobei der Boden und die poröse Masse den flexiblen Streifen parallel einrahmen.
  6. Verdampfer nach einem der Ansprüche 2 bis 5, wobei der Streifen aus Edelstahl ist und der Körper vorzugsweise ebenfalls aus Edelstahl ist.
  7. Verdampfer nach einem der Ansprüche 2 bis 6, wobei der Streifen eine Länge aufweist, die mindestens 10-mal größer als seine Breite ist, und wobei der Streifen eine Breite aufweist, die mindestens 8-mal größer als seine Dicke ist.
  8. Verdampfer nach einem der Ansprüche 2 bis 7, wobei der Streifen ein Befestigungsende und gegenüber ein freies Ende aufweist, wobei das Befestigungsende durch einen Schweißpunkt oder eine Einlassung an einer der Seitenwände befestigt ist und das freie Ende nahe der Eingangsöffnung (5) eingerichtet ist.
  9. Verdampfer nach einem der Ansprüche 2 bis 7, wobei der Streifen eine Länge aufweist, die mindestens 10-mal größer als der Durchmesser der Eingangsöffnung (5) ist.
  10. Verdampfer nach Anspruch 8, wobei die Seitenwand (9b), an der das Befestigungsende befestigt ist, benachbart zur Seitenwand (9a) ist, an der die Mündung der Eingangsöffnung eingerichtet ist.
  11. Verdampfer nach einem der Ansprüche 2 bis 9, der der Schwerkraft unterliegt, wobei die Eingangsöffnung (5) über dem flexiblen Streifen (6) platziert ist.
  12. Zweiphasiges Wärmeübertragungssystem mit kapillaren Pumpen zum Ausleiten abgeleiteter Wärme durch ein Ableitungselement, umfassend einen Verdampfer nach einem der Ansprüche 1-11 und einen Kondensator.
EP14747908.3A 2013-08-01 2014-07-31 Verdampfer mit rückschlagvorrichtung für zweiphasigen kreislauf Not-in-force EP3027995B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1357682A FR3009377B1 (fr) 2013-08-01 2013-08-01 Evaporateur a dispositif anti-retour pour boucle diphasique
PCT/EP2014/066468 WO2015014926A1 (fr) 2013-08-01 2014-07-31 Evaporateur à dispositif anti-retour pour boucle diphasique

Publications (2)

Publication Number Publication Date
EP3027995A1 EP3027995A1 (de) 2016-06-08
EP3027995B1 true EP3027995B1 (de) 2018-10-17

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EP14747908.3A Not-in-force EP3027995B1 (de) 2013-08-01 2014-07-31 Verdampfer mit rückschlagvorrichtung für zweiphasigen kreislauf

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EP (1) EP3027995B1 (de)
FR (1) FR3009377B1 (de)
WO (1) WO2015014926A1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3103031B1 (fr) * 2019-11-07 2022-02-18 Valeo Systemes Thermiques Évaporateur pour système de transfert thermique diphasique à pompage capillaire et procédé de fabrication associé
FR3103032B1 (fr) * 2019-11-07 2022-02-18 Valeo Systemes Thermiques Évaporateur pour système de transfert thermique diphasique à pompage capillaire et procédé de fabrication associé

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2979981A1 (fr) * 2011-09-14 2013-03-15 Euro Heat Pipes Dispositif de transport de chaleur a pompage capillaire

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2859927B2 (ja) * 1990-05-16 1999-02-24 株式会社東芝 冷却装置および温度制御装置
DE19515095A1 (de) * 1995-04-25 1996-10-31 Dornier Gmbh Kapillarverdampfer
TWI318679B (en) * 2007-05-16 2009-12-21 Ind Tech Res Inst Heat dissipation system with an plate evaporator
KR20090131533A (ko) * 2008-06-18 2009-12-29 잘만테크 주식회사 루프 히트파이프 시스템용 증발기
US8632923B2 (en) * 2010-07-02 2014-01-21 Samsung Sdi Co., Ltd. Battery pack
EP2735834A4 (de) * 2011-07-21 2014-12-10 Panasonic Corp Kühlvorrichtung, elektronische vorrichtung damit und elektrofahrzeug

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2979981A1 (fr) * 2011-09-14 2013-03-15 Euro Heat Pipes Dispositif de transport de chaleur a pompage capillaire

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Publication number Publication date
FR3009377B1 (fr) 2018-10-19
WO2015014926A1 (fr) 2015-02-05
EP3027995A1 (de) 2016-06-08
FR3009377A1 (fr) 2015-02-06

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