EP3602582A1 - Elektrisches bauteil, bauteilanordnung und verfahren zur herstellung einer bauteilanordnung - Google Patents
Elektrisches bauteil, bauteilanordnung und verfahren zur herstellung einer bauteilanordnungInfo
- Publication number
- EP3602582A1 EP3602582A1 EP18715546.0A EP18715546A EP3602582A1 EP 3602582 A1 EP3602582 A1 EP 3602582A1 EP 18715546 A EP18715546 A EP 18715546A EP 3602582 A1 EP3602582 A1 EP 3602582A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- connection
- mounting device
- component
- wire
- latching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2823—Wires
- H01F27/2828—Construction of conductive connections, of leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/06—Mounting, supporting or suspending transformers, reactors or choke coils not being of the signal type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/06—Mounting, supporting or suspending transformers, reactors or choke coils not being of the signal type
- H01F2027/065—Mounting on printed circuit boards
Definitions
- the present invention relates to an electrical component comprising a winding of a wire.
- it is an inductive component such as a choke or a transformer.
- Such components are mounted, for example by PTH (pin-through-hole) - mounting on a circuit board.
- PTH pin-through-hole
- an electrical component which has a winding body and a winding of a wire around the winding body.
- the component in particular an inductive component, for example a choke or a trans ⁇ formator.
- the component has a connection region, wherein the
- Connection area comprises a wire end of the wire.
- Connection area is in particular for electrical connection of the component to a connection device, such as a Printed circuit board, formed.
- the connection area is designed for latching with a mounting device.
- the mounting device is a plate
- the component can have several such features
- connection device a surface mounting of the component can be made possible on the connection device.
- the position of the connection area can be determined.
- connection areas which are locked with the mounting device, it can be ensured that the connection areas lie on one level.
- a required for surface mounting planarity can be made.
- the wire has a thickness of at least 1.5 mm. In such thick wires, surface mounting by conventional methods has been difficult. However, the wire may also have a smaller thickness, depending on the component size and weight.
- connection area is spaced from the winding body downwards, so that an arrangement of a
- connection area is possible.
- the mounting device can be clamped between the winding or the winding body and the connection area.
- the mounting device can be pressed from the connection region to the winding or the winding body. In this way it can be achieved that the connection area close to the Mounting device is applied and so in its position
- connection region has a latching edge for latching with a mounting device.
- Connection area may additionally or alternatively a
- the indentation can be designed to accommodate a part of the mounting device. By locking edge and / or indentation can be made a positionally accurate locking of the connection area with the mounting device.
- the wire end is formed directly for locking with the mounting device.
- the locking edge and / or the indentation can be formed directly from the wire end.
- the wire end has a different cross-sectional shape than an adjoining wire area. For example, this indicates
- Wire end a flat side, wherein a subsequent wire area is round.
- the changed shape of the wire end is produced by a deformation of the wire end such as pinching.
- the connection region can be formed in a particularly simple and cost-effective manner for latching.
- the component has a connector attached to the wire end, which is designed for latching with the mounting device.
- the connection piece can provide a latching edge.
- the connector surrounds, for example, the wire end.
- connection piece may be a metallic band piece
- the connection piece is fastened to the end of the wire, for example by means of a clamping or crimping connection, so that a connection area which is suitable for latching can be produced by means of a low-cost and easy-to-install connection piece become.
- a component arrangement comprising the component specified and described advancing a latched with the component mounting ⁇ device.
- the latching is produced by the connection area.
- the mounting device is designed such that, in the case of a plurality of connection regions latched to the mounting device, the connection regions are arranged in one plane. This will be a reliable one
- connection areas allow.
- the mounting device is a plate
- connection area abuts, for example, on an underside of the mounting device and the winding body rests against an upper side of the mounting device.
- the mounting device is in particular between the connection area and the
- Winding body and / or the winding clamped Winding body and / or the winding clamped.
- the mounting device may have one or more latching areas, which are formed for example as openings or depressions in the bottom of the mounting device.
- the latching areas are designed in particular for latching to the one or more connection areas. According to a further aspect of the present invention, an arrangement of the previously described component arrangement and a connecting device is specified.
- Connection device is designed for example as a printed circuit board.
- the component arrangement is in particular in
- a component as described above and a mounting device is provided.
- the assembly ⁇ device is disposed between the connection region of the component and the winding body or the winding. In this case, a locking of the connection area is produced with the mounting device.
- connection region is bent away, for example, from the winding body and then snaps spring-loaded into the mounting device. In this way, the mounting device is pressed against the winding body and / or the winding.
- a method for surface mounting of the above-described component is specified.
- a component arrangement comprising the component and a mounting ⁇ device is formed.
- a connection device for example a printed circuit board.
- Connection area of the component assembly is on the
- connection area is soldered to the circuit board.
- Figure 1A shows a first embodiment of an electrical
- FIG. 1B shows connection areas of the embodiment from FIG. 1A in an enlarged view
- Figure IC is a latching of a connection area of the
- FIG. 2A shows a first embodiment of a component arrangement in a perspective view obliquely from above
- FIG. 2B shows the component arrangement from FIG. 2A in FIG
- Figure 3A shows a second embodiment of an electrical
- Figure 3B connecting portions of the embodiment of Figure 3A in an enlarged view
- Figure 3C is a locking of a terminal portion of the
- Figure 4A shows a second embodiment of an electrical
- Figure 5A shows a further embodiment of an electrical
- FIG. 5B shows the connection regions of the embodiment from FIG. 5B
- FIG. 5C shows a latching of a connection region from FIGS
- FIGS. 5A and 5B on a mounting device in a side view FIG. 6A shows a further embodiment of a component arrangement in a side, perspective view
- FIG. 6B shows the component arrangement from FIG. 6A in a further lateral, perspective view.
- Figure 1A shows an electrical component 1 comprising a winding body 2, around which a winding 3 of a wire 4 is arranged.
- the winding 3 is shown schematically in a planar form.
- the component 1 is designed as an inductive component, in particular as a throttle. It can also be a transformer.
- the wound body 2 is formed as a magnetic core, in particular as a ferrite core. In the present case, this is a closed core, in particular a toroidal core. There are also other shapes and types of bobbins in question. For example, it may be a mushroom kernel,
- Cylinder core or act around a D-core
- the component 1 may have a plurality of windings 3, 5 of wires 4, 6. In the present case there are two windings 3, 5 which are each formed by a wire 4, 6. There may also be fewer or more windings and wires. For example, it may be an single-conductor, two-conductor, three-conductor, four-conductor or five-conductor component.
- the wires 4, 6 are, for example, as relatively thick wires, in particular with a diameter greater than 1.5 mm
- the wires have one
- the wires 4, 6 have for example, a round cross-sectional shape.
- each is a copper wire, in particular a copper enameled wire.
- the wires 4, 6 could also have a smaller thickness.
- the component 1 has a plurality of connection regions 7, 8, 19, 20 (see also FIG. 2B). Only two connection areas 7, 8 are described in detail below, but the explanations also apply accordingly to the others
- the terminal areas 7, 8 are each formed by a wire end 9, 10.
- the connection ⁇ regions 7, 8 are for surfaces (SMD) - mounting on a terminal device 22 (see Fig. 2A), such as a printed circuit board is formed.
- connection areas 7, 8 are downwardly from the winding 3, 5 and the winding body 2 from.
- connection areas 7, 8 of the winding body 2 and the connection areas 7, 8 of the winding body 2 are downwardly from the connection areas 7, 8 of the winding body 2 and the connection areas 7, 8 of the winding body 2 and the connection areas 7, 8 of the winding body 2 and the connection areas 7, 8 of the winding body 2 and the connection areas 7, 8 of the winding body 2 and the connection areas 7, 8 of the winding body 2 and the
- the wire ends 9, 10 are formed and bent to form the terminal portions 7, 8.
- FIG. 1B shows an enlarged view of the connection regions 7, 8 from FIG. 1A.
- the connection areas 7, 8 have flat undersides 11, 12, which in SMD mounting on a
- connection area 7, 8 are designed in the form of connection feet.
- the wire ends 9, 10 are formed to form the terminal portions 7, 8, for example by squeezing.
- the wire ends 9, 10 have a different cross-sectional shape than adjoining wire portions 28, 29, in particular
- the wire ends 9, 10 have no round cross-sectional shape.
- the terminal portions 7, 8, 19, 20 consist of the wire ends 9, 10, so that no further elements are required for assembly.
- the wire ends 9, 10 and thus also the connection regions 7, 8 each have a latching edge 13, 14 for latching to a mounting device 17 (see FIG. 1C).
- Locking edge 13, 14 is formed by the deformation of the wire ends 9, 10.
- the wire ends 9, 10 have in particular the form of latching hooks.
- a recess 15, 16 for receiving a portion of the mounting device 17 is provided.
- the recesses 15, 16 have, for example, flat surfaces.
- FIG. 1C shows a latching of one of the connection regions 7 with a mounting device 17 in a sectional view.
- the mounting device 17 is for example as a plate
- connection areas 8, 19, 20 are correspondingly locked to the mounting device 17.
- connection region 7 projects downward from the winding 3 in such a way that the mounting device 17 can be received between the connection region 7 and the winding 3 or the winding body 2.
- the mounting device 17 has an opening 18 through which the wire 4 is guided.
- Latching area 21 for locking with the connection area 7, in particular with the latching edge 13 is formed.
- Latching area 21 has wedge-shaped contours, the one
- Connection area 7 is resilient. For locking with the mounting device 17, the connection portion 7 is bent slightly and then snaps resiliently into the
- the mounting device 17 is from the connection region 7 to the winding 3 and / or the
- Winding body 2 is pressed and is thus between the
- the mounting device 17 thereby provides a coplanar
- connection areas 7, 8, 19, 20 ago whereby a reliable SMD mounting is possible.
- the connection ⁇ areas 7,8, 19, 20 abut by their resilient bias on the fixture 17th
- the latching regions 21 of the mounting device 17 are designed such that a planar arrangement of the connection regions 7, 8, 19, 20 is produced.
- an SMD assembly is in particular for
- the mounting device 17 is fastened by simple latching on the component 1.
- Figures 2A and 2B show a first embodiment of a component assembly 23 comprising a component 1 and a
- FIG. 2A thus also shows an arrangement comprising a component arrangement 23 and a connection device 22, wherein the component arrangement 23 is fastened to the connection device 22 in surface mounting.
- connection regions 7, 8, 19, 20 (FIG. 2B) and the connection regions 7, 8, 19, 20 are arranged coplanar.
- all terminal areas 7, 8, 19, 20 are at the same height position.
- the component 1 on a planar connection device 22 are arranged so that all connection regions 7, 8, 19, 20 rest on the connection ⁇ device 22 and the component 1 is not wobble.
- the component assembly 23 can be attached to the connection device 22 by surface mounting.
- the component assembly 23 is soldered to the connection device 22.
- the connecting device 22 may be formed as a printed circuit board.
- connection areas 7, 8, 19, 20 are thus simultaneously for latching with the mounting device 17 and the
- Connecting device 22 is formed.
- the first connector 22 is formed.
- the mounting device 17 has a plurality of openings 18 through which the connection areas 7, 8 are passed for mounting.
- Terminal areas 19, 20 are at a rear side of the Mounting device 17 passed. Subsequently, the component 1 is laterally with respect to the mounting device 17th
- connection areas 7, 8, 19, 20 engage with latching areas 21 of the mounting device 17.
- the mounting device 17 can be moved and the component 1 fixed.
- connection areas 7, 8, 19, 20 are arranged, for example, as shown in FIG. 2B.
- the first connection region 7 is arranged next to the second connection region 8.
- the third and fourth connection regions 19, 20 are arranged next to one another and offset towards the rear in relation to the first and second connection regions 7, 8. Due to the position of the respective wire ends 9, 10, 31, 32, the first and second connection regions 7, 8 are arranged closer to one another than the third and fourth connection regions 19, 20.
- the first and third connection regions 7, 19 are formed by wire ends 9, 31 of the winding 3 and the second and fourth connection regions 8, 20 by wire ends 10, 32 of the further winding 5.
- Figure 3A shows a second embodiment of an electrical component 1. This embodiment differs from the embodiment of Figure 1A by the formation of
- connection areas 7, 8 Only two connection areas 7, 8 are described in detail below, but the explanations also apply correspondingly to the other connection areas 19, 20
- Connection areas 7, 8 each have a wire end 9, 10.
- connectors 24, 25 are attached.
- the fittings 24, 25 are for example as formed prefabricated sleeves which are pushed onto the wire ends 9, 10 and then press-fastened for attachment to the wire ends 9, 10.
- fittings 24, 25 into consideration, for example, metallic band pieces.
- the band pieces can be bent around the wire ends 9, 10 and fastened by a Klemmoder crimp on the wire ends 9, 10. In particular, they may be so-called "splice crimps".
- FIG. 3B shows an enlarged view of the connection regions 7, 8 from FIG. 1A.
- the connection regions 7, 8 have Unters ⁇ nits 11, 12, which are suitable for SMD mounting.
- the undersides 11, 12 are present not completely flat, but slightly curved. However, the undersides 11, 12, in particular due to the connecting pieces 24, 25 a
- connecting pieces 24, 25 cause a significant broadening of the connection areas 7, 8.
- the connecting pieces 24, 25 are spaced laterally from the outer sides of the wire ends 9, 10.
- connection pieces 24, 25 are designed for latching with a mounting device 17.
- the connection pieces 24, 25 form latching edges 13, 14 for latching with a mounting device 17.
- the connection areas 7, 8 have indentations 15, 16 which are formed by parts of the wires 4, 6 adjoining the latching edges 13, 14.
- FIG. 3C shows a latching of one of the connection regions 7 with a mounting device 17 in a sectional view.
- the Locking applies accordingly for the others
- the wire ends 9, 10 have the same cross-sectional shape as adjoining wire regions 28, 29, in particular a round cross-sectional shape.
- the latching with the mounting device 17 is similar to that in Figure IC, however, the latching by the
- connection area 7 is partially in the
- Mounting device 17 sunk.
- the mounting device 17 is also pressed by the connection region 7 to the winding 3 and / or the winding body 2 and in between
- connection areas 7, 8, 19, 20 Arrangement of the connection areas 7, 8, 19, 20 achieved, so that an SMD mounting is possible.
- Figures 4A and 4B show a second embodiment of a component assembly 23 comprising a component 1 and a mounting device 17 from a view obliquely from above and obliquely below.
- the component 1 can according to the figures 3A to 3C and the mounting device 17 may be formed according to Figure 3C.
- a connection ⁇ device 22 is indicated by dashed lines, on which the component assembly 23 can be fixed by SMD mounting.
- connection areas 7, 8 In contrast to the component arrangement 23 from FIGS. 2A and 2B, the connection areas 7, 8 have connection pieces 24, 25, 26, 27, which are fastened to the wire ends 9, 10, 31, 32.
- FIG. 5A shows a second embodiment of an electrical component 1. This embodiment differs from the embodiment of FIG. 1A by the shape of the wound body 2 and of the winding 3.
- the winding body 2 is formed as a mushroom core.
- the component 1 may be a mushroom core choke.
- a winding 3 is wound.
- the wire ends 9, 10 of the winding 3 are formed by forming and bending as terminal portions 7, 8, the
- connection areas 7, 8 from FIG. 1A are corresponding to the connection areas 7, 8 from FIG. 1A.
- FIG. 5B shows in enlargement a connection region 7 of the embodiment according to FIG. 5A.
- the connection regions 7 have a latching edge 13 for latching to a mounting device and a flat bottom 11 for electrical connection to a connection device.
- FIG. 5C shows a latching of a connection region 7 from FIGS. 5A and 5B on a mounting device 17.
- the mounting device 17 has one or more latching regions 21 for latching to the latching edge 13 of the connection region 7.
- the latching regions 21 may each have oblique outer sides.
- the mounting device 17 is pushed between the connection areas 7, 8 and the winding body 2.
- the mounting device 17 has lateral openings 18.
- the connection regions 7, 8 engage with the latching region 21 of the mounting device 17.
- the latching region 21 is formed here by a lateral outer edge of the mounting device 17.
- the connection areas 7, 8 are thus on the side over the mounting device 17 via. This leads to a more compact form of the mounting device 17 in comparison to Figure IC.
- the mounting device 17 is laterally beyond the connection areas 7, 8 via.
- Figures 6A and 6B show another embodiment of a component assembly 23 comprising a component 1 and a mounting device 17 from lateral, perspective
- the component 1 can according to the figures 5A to 5C and the mounting device 17 may be formed according to Figure 5C.
- connection areas 7, 8 are arranged next to one another and project beyond the mounting device 17.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Coils Or Transformers For Communication (AREA)
- Coils Of Transformers For General Uses (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Abstract
Description
Claims
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PL18715546T PL3602582T3 (pl) | 2017-03-31 | 2018-03-22 | Elektryczny element konstrukcyjny, układ elementu konstrukcyjnego i sposób wytwarzania układu elementu konstrukcyjnego |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102017106970.4A DE102017106970A1 (de) | 2017-03-31 | 2017-03-31 | Elektrisches Bauteil, Bauteilanordnung und Verfahren zur Herstellung einer Bauteilanordnung |
| PCT/EP2018/057308 WO2018177883A1 (de) | 2017-03-31 | 2018-03-22 | Elektrisches bauteil, bauteilanordnung und verfahren zur herstellung einer bauteilanordnung |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP3602582A1 true EP3602582A1 (de) | 2020-02-05 |
| EP3602582B1 EP3602582B1 (de) | 2021-08-18 |
Family
ID=61899206
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP18715546.0A Active EP3602582B1 (de) | 2017-03-31 | 2018-03-22 | Elektrisches bauteil, bauteilanordnung und verfahren zur herstellung einer bauteilanordnung |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US11488765B2 (de) |
| EP (1) | EP3602582B1 (de) |
| JP (1) | JP6833061B2 (de) |
| CN (1) | CN110692113B (de) |
| DE (1) | DE102017106970A1 (de) |
| ES (1) | ES2896501T3 (de) |
| PL (1) | PL3602582T3 (de) |
| WO (1) | WO2018177883A1 (de) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR3094553B1 (fr) * | 2019-03-25 | 2021-02-26 | Continental Automotive | Procédé de fixation d’une self sur une carte électronique |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4602235A (en) | 1984-08-20 | 1986-07-22 | Micron Industries Corp. | Transformer assembly with terminal plates in support |
| JP4406187B2 (ja) | 2002-03-01 | 2010-01-27 | 株式会社エス・エッチ・ティ | 表面実装型コイル装置 |
| CN2726077Y (zh) * | 2004-07-02 | 2005-09-14 | 郑长茂 | 电感器 |
| DE102006026364A1 (de) * | 2006-02-16 | 2007-08-30 | Klaus Lorenzen | Bauelement für SMD-Leiterplattenbestückung |
| JP4783183B2 (ja) * | 2006-03-16 | 2011-09-28 | スミダコーポレーション株式会社 | インダクタ |
| JP4837485B2 (ja) * | 2006-08-07 | 2011-12-14 | スミダコーポレーション株式会社 | インダクタおよびインダクタの製造方法 |
| US8400245B2 (en) * | 2008-07-11 | 2013-03-19 | Cooper Technologies Company | High current magnetic component and methods of manufacture |
| JP4924598B2 (ja) * | 2007-12-27 | 2012-04-25 | Tdk株式会社 | コイル部品の継線方法 |
| US20090256666A1 (en) * | 2008-04-14 | 2009-10-15 | Shieh Ming-Ming | Inductor and a coil thereof |
| JP4714779B2 (ja) * | 2009-04-10 | 2011-06-29 | 東光株式会社 | 表面実装インダクタの製造方法とその表面実装インダクタ |
| US9576721B2 (en) * | 2013-03-14 | 2017-02-21 | Sumida Corporation | Electronic component and method for manufacturing electronic component |
| JP6245263B2 (ja) * | 2013-07-08 | 2017-12-13 | 株式会社村田製作所 | コイル部品 |
| DE102015107605B4 (de) | 2015-05-13 | 2018-01-25 | Sma Solar Technology Ag | Induktives Bauelement für Leiterplattenmontage und Wechselrichter mit einem leiterplattenmontierten induktiven Bauelement |
| KR101590132B1 (ko) * | 2015-07-31 | 2016-02-01 | 삼성전기주식회사 | 트랜스포머, 및 판상 코일 성형체 |
-
2017
- 2017-03-31 DE DE102017106970.4A patent/DE102017106970A1/de not_active Withdrawn
-
2018
- 2018-03-22 US US16/498,308 patent/US11488765B2/en active Active
- 2018-03-22 EP EP18715546.0A patent/EP3602582B1/de active Active
- 2018-03-22 CN CN201880022764.7A patent/CN110692113B/zh active Active
- 2018-03-22 PL PL18715546T patent/PL3602582T3/pl unknown
- 2018-03-22 ES ES18715546T patent/ES2896501T3/es active Active
- 2018-03-22 WO PCT/EP2018/057308 patent/WO2018177883A1/de not_active Ceased
- 2018-03-22 JP JP2019553482A patent/JP6833061B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| DE102017106970A1 (de) | 2018-10-04 |
| CN110692113A (zh) | 2020-01-14 |
| US20200176172A1 (en) | 2020-06-04 |
| JP6833061B2 (ja) | 2021-02-24 |
| CN110692113B (zh) | 2023-06-16 |
| US11488765B2 (en) | 2022-11-01 |
| EP3602582B1 (de) | 2021-08-18 |
| ES2896501T3 (es) | 2022-02-24 |
| JP2020512702A (ja) | 2020-04-23 |
| WO2018177883A1 (de) | 2018-10-04 |
| PL3602582T3 (pl) | 2022-01-17 |
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