EP3584353A4 - Metallstoff für elektronische komponente, verfahren zur herstellung des besagten metallstoffs und anschlussklemme, steckverbinder und elektronische komponente, in der der besagte metallstoff verwendet wird - Google Patents

Metallstoff für elektronische komponente, verfahren zur herstellung des besagten metallstoffs und anschlussklemme, steckverbinder und elektronische komponente, in der der besagte metallstoff verwendet wird Download PDF

Info

Publication number
EP3584353A4
EP3584353A4 EP17896426.8A EP17896426A EP3584353A4 EP 3584353 A4 EP3584353 A4 EP 3584353A4 EP 17896426 A EP17896426 A EP 17896426A EP 3584353 A4 EP3584353 A4 EP 3584353A4
Authority
EP
European Patent Office
Prior art keywords
metallic material
electronic component
connector
manufacturing
connector terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP17896426.8A
Other languages
English (en)
French (fr)
Other versions
EP3584353A9 (de
EP3584353A1 (de
Inventor
Satoru Endo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
Original Assignee
JX Nippon Mining and Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp
Publication of EP3584353A1 publication Critical patent/EP3584353A1/de
Publication of EP3584353A9 publication Critical patent/EP3584353A9/de
Publication of EP3584353A4 publication Critical patent/EP3584353A4/de
Withdrawn legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/34Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
    • C23C28/341Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one carbide layer
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/07Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 containing phosphates
    • C23C22/08Orthophosphates
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/32Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
    • C23C28/321Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer with at least one metal alloy layer
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/32Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
    • C23C28/322Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer only coatings of metal elements only
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/32Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
    • C23C28/325Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer with layers graded in composition or in physical properties
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/34Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
    • C23C28/345Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/36Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including layers graded in composition or physical properties
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10Electroplating with more than one layer of the same or of different metals
    • C25D5/12Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48After-treatment of electroplated surfaces
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48After-treatment of electroplated surfaces
    • C25D5/50After-treatment of electroplated surfaces by heat-treatment
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D9/00Electrolytic coating other than with metals
    • C25D9/02Electrolytic coating other than with metals with organic materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/03Contact members characterised by the material, e.g. plating, or coating materials
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/12Electroplating: Baths therefor from solutions of nickel or cobalt
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/30Electroplating: Baths therefor from solutions of tin
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/46Electroplating: Baths therefor from solutions of silver
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/562Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48After-treatment of electroplated surfaces
    • C25D5/50After-treatment of electroplated surfaces by heat-treatment
    • C25D5/505After-treatment of electroplated surfaces by heat-treatment of electroplated tin coatings, e.g. by melting

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
EP17896426.8A 2017-02-15 2017-10-26 Metallstoff für elektronische komponente, verfahren zur herstellung des besagten metallstoffs und anschlussklemme, steckverbinder und elektronische komponente, in der der besagte metallstoff verwendet wird Withdrawn EP3584353A4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017026202A JP6309124B1 (ja) 2017-02-15 2017-02-15 電子部品用金属材料及びその製造方法、それを用いたコネクタ端子、コネクタ及び電子部品
PCT/JP2017/038821 WO2018150641A1 (ja) 2017-02-15 2017-10-26 電子部品用金属材料及びその製造方法、それを用いたコネクタ端子、コネクタ及び電子部品

Publications (3)

Publication Number Publication Date
EP3584353A1 EP3584353A1 (de) 2019-12-25
EP3584353A9 EP3584353A9 (de) 2020-03-25
EP3584353A4 true EP3584353A4 (de) 2020-12-09

Family

ID=61901978

Family Applications (1)

Application Number Title Priority Date Filing Date
EP17896426.8A Withdrawn EP3584353A4 (de) 2017-02-15 2017-10-26 Metallstoff für elektronische komponente, verfahren zur herstellung des besagten metallstoffs und anschlussklemme, steckverbinder und elektronische komponente, in der der besagte metallstoff verwendet wird

Country Status (6)

Country Link
EP (1) EP3584353A4 (de)
JP (1) JP6309124B1 (de)
KR (1) KR20190117596A (de)
CN (1) CN110268097A (de)
TW (1) TWI653363B (de)
WO (1) WO2018150641A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6653340B2 (ja) * 2018-02-01 2020-02-26 Jx金属株式会社 バーンインテストソケット用表面処理金属材料、それを用いたバーンインテストソケット用コネクタ及びバーンインテストソケット
JP6592140B1 (ja) * 2018-05-28 2019-10-16 Jx金属株式会社 表面処理金属材料、表面処理金属材料の製造方法、及び、電子部品
JP7306879B2 (ja) * 2019-05-31 2023-07-11 古河電気工業株式会社 電気接点用材料およびその製造方法、コネクタ端子、コネクタならびに電子部品
CN211208718U (zh) * 2019-09-05 2020-08-07 华为机器有限公司 连接器引脚、连接器和电子设备
JP2021048094A (ja) * 2019-09-19 2021-03-25 株式会社オートネットワーク技術研究所 ピン端子、コネクタ、コネクタ付きワイヤーハーネス、及びコントロールユニット
JP7353928B2 (ja) 2019-11-13 2023-10-02 古河電気工業株式会社 電気接点用材料およびその製造方法、コネクタ端子、コネクタならびに電子部品

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014041807A (ja) * 2012-06-15 2014-03-06 Jx Nippon Mining & Metals Corp 電子部品用金属材料及びその製造方法、それを用いたコネクタ端子、コネクタ及び電子部品
JP2015046268A (ja) * 2013-08-27 2015-03-12 Jx日鉱日石金属株式会社 電子部品用金属材料及びその製造方法、それを用いたコネクタ端子、コネクタ及び電子部品

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7037385B2 (en) * 1998-01-27 2006-05-02 Lord Corporation Aqueous metal treatment composition
JP2005126763A (ja) 2003-10-23 2005-05-19 Furukawa Electric Co Ltd:The 被覆材、それを用いた電気・電子部品、それを用いたゴム接点部品、及び被覆材の製造方法
KR101705562B1 (ko) * 2012-07-25 2017-02-13 제이엑스금속주식회사 전자 부품용 금속 재료 및 그 제조 방법, 그것을 사용한 커넥터 단자, 커넥터 및 전자 부품
JP6308516B2 (ja) * 2013-06-21 2018-04-11 株式会社プラズマ化学 放射線量低減用処理液の製造方法、その方法で製造された処理液を用いた、地表からの放射線量低減方法
CN103832048B (zh) * 2013-12-13 2017-03-15 华北铝业有限公司 Ctp版材及其制作方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014041807A (ja) * 2012-06-15 2014-03-06 Jx Nippon Mining & Metals Corp 電子部品用金属材料及びその製造方法、それを用いたコネクタ端子、コネクタ及び電子部品
JP2015046268A (ja) * 2013-08-27 2015-03-12 Jx日鉱日石金属株式会社 電子部品用金属材料及びその製造方法、それを用いたコネクタ端子、コネクタ及び電子部品

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2018150641A1 *

Also Published As

Publication number Publication date
CN110268097A (zh) 2019-09-20
EP3584353A9 (de) 2020-03-25
WO2018150641A1 (ja) 2018-08-23
TWI653363B (zh) 2019-03-11
TW201831725A (zh) 2018-09-01
JP2018131656A (ja) 2018-08-23
EP3584353A1 (de) 2019-12-25
JP6309124B1 (ja) 2018-04-11
KR20190117596A (ko) 2019-10-16

Similar Documents

Publication Publication Date Title
EP3584353A4 (de) Metallstoff für elektronische komponente, verfahren zur herstellung des besagten metallstoffs und anschlussklemme, steckverbinder und elektronische komponente, in der der besagte metallstoff verwendet wird
EP3640782A4 (de) Antifehlfunktionsverfahren und endgerät
EP3562234A4 (de) Datenübertragungsverfahren und elektronisches endgerät
EP3608439A4 (de) Dielektrisches mikrowellenbauelement und herstellungsverfahren dafür
EP3693911A4 (de) Verfahren und endgerät zur verknüpfung von karten
EP3262667B8 (de) Elektrischer anschlusskontakt fuer ein keramisches bauelement, keramisches bauelement, bauelementanordnung und verfahren zu deren herstellung
EP3550942A4 (de) Elektronische komponente und verfahren zur herstellung einer elektronischen komponente
EP3375174A4 (de) Elektronische vorrichtung mit unibody-gehäuse und verfahren zur herstellung davon
EP2868773A4 (de) Metallmaterial für ein elektronisches bauteil, herstellungsverfahren dafür sowie verbindungsendstück, verbinder und elektronisches bauteil mit dem metallmaterial für ein elektronisches bauteil
EP2868776A4 (de) Metallmaterial für elektronische bauteile und herstellungsverfahren dafür sowie verbindungsendstück, steckverbinder und elektronisches bauteil mit diesem metallmaterial für elektronische bauteile
EP3709246A4 (de) Verfahren und endgerät für elektronische transaktion
EP3703190A4 (de) Verbinder und elektronische vorrichtung
EP3572558A4 (de) Anschlussmaterial für verbinder und verfahren zur herstellung davon
HK1254852A1 (zh) 電子部件、連接體、電子部件的設計方法
EP3567834A4 (de) Zeitplanverarbeitungsverfahren und elektronisches endgerät
TWI800640B (zh) 硬掩膜形成用組成物及電子零件的製造方法
EP2868772A4 (de) Metallmaterial für ein elektronisches bauteil, herstellungsverfahren dafür sowie verbindungsendstück, verbinder und elektronisches bauteil mit dem metallmaterial für ein elektronisches bauteil
EP3442793A4 (de) Plattiertes material für elektrische anschlüsse und verfahren zur herstellung davon
EP3525084A4 (de) Datenverarbeitungsverfahren und elektronisches endgerät
EP3422367A4 (de) Elektrisch leitende paste, elektronisches substrat und verfahren zur herstellung des besagten substrats
EP3916928A4 (de) Buchse, elektronische vorrichtung und herstellungsverfahren für buchse
EP3425735A4 (de) Crimpverbindungsanschluss und herstellungsverfahren dafür
EP3664224A4 (de) Elektrischer anschluss, mobiles endgerät und verfahren zur herstellung von elektrischem anschluss
EP3718661A4 (de) Bei niedrigtemperatur sinterbare kupferteilchen und verfahren zur herstellung eines sinterkörpers damit
EP3876583A4 (de) Verarbeitungsverfahren und -endgerät

Legal Events

Date Code Title Description
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE

PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20190914

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

DAV Request for validation of the european patent (deleted)
DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20201105

RIC1 Information provided on ipc code assigned before grant

Ipc: C25D 3/30 20060101ALN20201030BHEP

Ipc: C25D 5/12 20060101ALI20201030BHEP

Ipc: C25D 3/12 20060101ALN20201030BHEP

Ipc: C25D 7/00 20060101ALI20201030BHEP

Ipc: C25D 3/56 20060101ALN20201030BHEP

Ipc: C25D 5/48 20060101ALI20201030BHEP

Ipc: C25D 3/46 20060101ALN20201030BHEP

Ipc: H01R 13/03 20060101ALI20201030BHEP

Ipc: C25D 5/50 20060101ALI20201030BHEP

Ipc: C25D 9/02 20060101ALI20201030BHEP

Ipc: C23C 28/00 20060101AFI20201030BHEP

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20210605