EP3523348A1 - Vergussmasse, isolationswerkstoff und verwendung dazu - Google Patents
Vergussmasse, isolationswerkstoff und verwendung dazuInfo
- Publication number
- EP3523348A1 EP3523348A1 EP17822556.1A EP17822556A EP3523348A1 EP 3523348 A1 EP3523348 A1 EP 3523348A1 EP 17822556 A EP17822556 A EP 17822556A EP 3523348 A1 EP3523348 A1 EP 3523348A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- potting compound
- compound according
- tetrahydro
- present
- potting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
- C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
- C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5093—Complexes of amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
Definitions
- the invention relates to a novel sealing compound, insbeson ⁇ particular one that is used for producing an insulating material by means of anhydrid arthritiser curing.
- the invention relates to the use of the insulating material in switchgear, transformers, casting resin dry-type transformers and / or in the corresponding semifinished product.
- thermosets mineral-filled Harzformulierun ⁇ gen as casting compounds for manufacturing chemically and electrically highly resistant insulation materials are known.
- the base resins used are preferably epoxy resin formulations. These are usually a two-component approaches ( "2K") beitet processed, wherein a reactive resin or a reactive resin mixture based on bisphenol A or F Diglycidyletherbasis in a Mi ⁇ research with phthalic anhydrides (PSA), and additional additives to improve the flow characteristics or Form material properties find use.
- Lations to increase the iso-electric medium and at Hochnapssbe ⁇ utilization, such as to improve the partial discharge behavior or to increase the dielectric strength, are microscale the reaction resin mixture, and or
- nanoscale dimensioned, inorganic and organic fillers such as silica derivatives such as quartz ⁇ flour, alpha-quartz, amorphous fused silica, alumina, Glim ⁇ mer, boron nitride, wollastonite, aluminum trihydrate in proportions of 50 wt% to 80 wt .-% with particle sizes in the micrometer range and / or inorganic and / or organic nanoparticles tikel added.
- silica derivatives such as quartz ⁇ flour, alpha-quartz, amorphous fused silica, alumina, Glim ⁇ mer, boron nitride, wollastonite, aluminum trihydrate in proportions of 50 wt% to 80 wt .-% with particle sizes in the micrometer range and / or inorganic and / or organic nanoparticles tikel added.
- nitrogen derivatives of cyclic and / or aliphatic nature are used.
- the sterically hindered, in particular aliphatic ⁇ and especially the cycloaliphatic epoxy resins for example based on epoxidized cyclohexene derivatives such as diepoxide 3,4-epoxycyclohexylmethyl-3 ', 4' - epoxycyclohexanecarboxylate, hereinafter referred to as "ECC"
- ECC epoxycyclohexanecarboxylate
- MHHPA Methylhexahydrophthalic anhydride
- Methylhexahydrophthalic anhydride is, for example, a provision of low viscosity potting compounds, their subsequent curing after the addition mechanism and thus the preparation of such insulating materials according to the current state of the art without the above-mentioned hardening no longer possible.
- Heat quantities of up to 600 joules per gram can be released.
- Object of the present invention is therefore to overcome the disadvantages of the prior art, so homopolyme ⁇ rillone, filled or unfilled sterically hindered epoxy xidharze make large volume accessible and in particular a anhydridbridge, thermal and to the Super acids old ⁇ native method for cross-linking to High polymers of sterically hindered epoxy resins, eg of the type ECC, with otherwise constant process parameters such as pressure, temperature, etc. to create.
- it is an object of the present invention ⁇ to provide a hardener for sterically hindered epoxy resins, the slow-moving Homopoly- merization of sterically hindered epoxy resin, even in large components, causes and leads to low brittle moldings.
- the subject of the present invention is therefore a
- Potting compound comprising a sterically hindered, insbesonde re an aliphatic and / or cycloaliphatic epoxy resin and a curing agent containing a basic compound which shows the structural element I,
- the subject matter of the invention is an insulating material obtainable by potting and hardening of this potting compound, as well as an insulation system comprising such an insulating material for electrical insulation.
- the subject matter of the invention is the use of the potting compound, containing filler or filler ⁇ substance-free, by anionic gelation and / or curing as a casting, infusion, impregnation, and / or coating resin in electrical engineering.
- Insulation materials according to the present invention are used for example for insulation and / or encasing in electrical engineering. In particular, they serve as Wickeliso ⁇ -regulation in electrical equipment such as transformers, casting resin dry transformers etc. as the main insulation.
- Potting compounds are used, for example, via vacuum pressure impregnation after curing for the wrapping of insulating winding tapes.
- General knowledge of the invention is that - contrary to the prior art - the anionic homopolymerization - ie the polymerization of the same monomer building blocks - of in ⁇ particular cycloaliphatic, sterically hindered,
- the class of epoxy resins preferably used herein are in addition to the sterically hindered cycloaliphatic epoxy ECC (3, 4-epoxycyclohexylmethyl-3 ⁇ 4 - epoxycyclohexane carboxylate) also generally aliphatic GEHIN ⁇ -made epoxy resins such as epoxidized soya abohnenöle. There ⁇ to here only the glycidyl ether and
- Triethylenetetramine, isophoronediamine, aminoethylpiperazine, diaminocyclohexane, diaminodiphenylmethane, phenylenediamine or diaminophenylsulfone leads to no or only extremely slow gelling, even at high temperatures of 70-90 ° C, or no or only soft curing to the molding.
- cycloaliphatic epoxy resin such as the advantageous diepoxide ECC to gel at moderate accelerator levels and at Curing for 10 hours at 145 ° C to homopolymerize the defect-free molded body.
- strong superbases with pKB values which are complementary to those of the superacid used hitherto are suitable for acting as hardeners for the sterically hindered epoxide resins.
- superbases which show a MeCNpKBH + value of 23.5 and higher for the conjugated acid, measured in anhydrous acetonitrile, are used.
- the hardener is a super base with at least one structural element I
- the hardener has no NH functionalities in the molecular structure.
- it can be used in the form of an adduct and / or a complex compound, in particular complexed to a metal salt.
- complex or “complexed” in the metallor ⁇ ganischen sense of the word, so used that the hardener is attached as a ligand to a central atom, but not all ligands of the complex to the central atom. There may be other ligands that do not
- Perceive hardening function in sterically hindered epoxy resin be provided on the complex compound used.
- the basic hardener is used with the above-ge Attach ⁇ th structural element I in the form of a copper and / or Zinksal ⁇ zes, such as Zn (SCN) 2 * (DBN) 2 or Zn (Cl) 2 * (DBN). 2
- the hardener comprises 1, 5-diazabicyclo [4.3.0] ⁇ -5-ene, CAS no. 3001-72-7, hereafter abbreviated to "DBN", with the structural formula II
- the basic hardener is used with the above-ge Attach ⁇ th structural element I in the form of a copper and / or Zinksal ⁇ zes, such as Zn (SCN) 2 * (DBN) 2 or Zn (Cl) 2 * (DBN). 2
- DBN is a very thin liquid compound at room temperature, which has relatively low vacuum stability at altitude ⁇ ren temperatures, it, in addition to the sole use as a curing agent, advantageously, the molecule or the person responsible for the homopolymerization of ECC, active environment covalently bound is Coupling other, higher molecular weight molecules such as acrylate, acrylate derivative, and / or oxirane containing compounds, so as to increase the vacuum resistance.
- the following structures show exemplary parent compounds for hardener components:
- R methyl, ethyl, propyl, iso-propyl, butyl, isobutyl, benzyl, phenyl, fluoro, chloro, bromo, iodo, hydroxy, aldehyde, carboxylate.
- Pentaerythritol tetraacrylate PETA
- dipentaerythritol pentacrylate / dipentaerythritol hexacrylate and / or oxirane-containing compounds of defined molecular length for stabilization.
- an adduct of one of the following Ver ⁇ compounds with an acrylate or an acrylate derivative and / or an oxirane compound having a defined length of the molecule is used as hardener: ectoine (CAS No. 96702-03-3.) And / or any
- vorteilhaf ⁇ ter may be the following compounds having the structural formulas V to X in the curing agent alone or as mixtures:
- R 1, R 2, R 3 and R 4 H, methyl, ethyl, propyl, isopropyl, butyl, isobutyl, benzyl, phenyl
- n 1 to 12
- the binding of the superbase with the structural unit I to stabilize it can also be bound to a compound of oxime group-containing compound of defined molecular length, such as, for example, a glycidyl compound, such as, for example, a glycidyl ether
- Glycidylesterharm in particular one with less than 50 C-atoms, take place.
- oxirane-containing compounds in particular glycidyl compounds, the adduct of which is present in the hardener with the component which contains the structural unit I:
- the glycidyl compound of a bisphenol, diol, triol, and / or higher alcohol may be derived, at ⁇ play, from the group of the following compounds:
- Tricyclodecanedimethanol (Ci 2 Hi 8 ) (OH) 2
- glycerol carbonate (C 4 H 5 ) (OH) 1.
- the hardener has a nitrogen density D in the range of 1 to 15 mmol / g.
- the used herein, mass-specific, capable molar nitrogen density D polymerization is in this case (by the A ⁇ unit 10 -3 mol / g per mol corresponding to a thousandth
- R1, R2 and R3 methyl, ethyl, propyl, iso-propyl, butyl, iso-butyl, benzyl, phenyl
- n 1 to 4
- the term "derivative” denotes any component which is obtainable by reaction of the parent compound, ie compounds whose molecules contain, instead of an H atom or a functional group, another atom or another atomic group or in which one atom or one atomic group is removed ,
- the chemical and physical properties of derivatives are often no longer similar to those of the parent compounds, but may be similar.
- the production of a chemical derivative is called derivatization.
- the curing catalyst is present in the solid insulating material in an amount of less than 25% by weight, for example from 0.001% to 15% by weight, preferably in the range from 0.01 to 10% by weight, particularly preferably 0.1% by weight. to 5% by weight, before, so that gel times of several hours can be realized.
- the responds are present in the solid insulating material in an amount of less than 25% by weight, for example from 0.001% to 15% by weight, preferably in the range from 0.01 to 10% by weight, particularly preferably 0.1% by weight. to 5% by weight, before, so that gel times of several hours can be realized.
- the responds are present in the solid insulating material in an amount of less than 25% by weight, for example from 0.001% to 15% by weight, preferably in the range from 0.01 to 10% by weight, particularly preferably 0.1% by weight. to 5% by weight, before, so that gel times of several hours can be realized.
- the responds are present in the solid insulating material in an amount of less than 25% by weight, for example from 0.001%
- the bond is a comparison with the structure I, within a gel time of 0.5 h to 48 h, preferably from 0.5 hour to 24 hours and be ⁇ Sonders preferably from 0.5 to 16 h h at vacuum and
- plant ⁇ material may comprise one or more epoxidated reactive diluents, ie, aromatic and / or aliphatic, short to long-chain and / or cyclic glycidyl ether; cyclic reactive diluents such as ethylene carbonate, propylene carbonate, butylene carbonate, glycerol carbonate, glycolic and / or epoxidized
- the potting compound may contain fillers and / or Grestoffkombinati- ons.
- fillers for example, microscale fillers of quartz flour, boron nitride, fused silica, alumina,
- Wollastonite or alumina trihydrate for use kom ⁇ men Wollastonite or alumina trihydrate for use kom ⁇ men.
- partially conductive, microscale and / or nanoscale fillers or filler combinations or doped fillers or filler combinations can be used.
- the potting compound may include conventional flame retardants and / or flame retardant combinations, as well as any other additives.
- the homopolymerization is usually anionic.
- the curing catalyst initiates the polymerization of the
- the curing was first carried out for 10 h at 145 ° C. It was possible to produce a clear, firm and error-free molded body.
- Gelnorm® the Gelierzei ⁇ th were as shown in Figure 1, is determined. For this tempera ⁇ turcombininge gel times were determined in the ECC at 70 ° C to 90 ° C and 1 to 10 wt% DBN.
- the molding material hardened with about 5% by weight of DBN in ECC was examined by means of differential scanning calorimetry (10K / min, in a nitrogen atmosphere, TA DSC Q100), two glass transition regions being detectable.
- differential scanning calorimetry 10K / min, in a nitrogen atmosphere, TA DSC Q100
- FIG. 2 shows the glass transitions in the DBN (5% by weight) in ECC molding material after 10 hours at 145 ° C.
- the invention discloses for the first time a potting compound with a hardener component, by means of which an anionically initiated homopolymerization of sterically hindered epoxide resins, which hitherto was regarded as not feasible according to the prior art, is made possible.
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102016223662.8A DE102016223662A1 (de) | 2016-11-29 | 2016-11-29 | Vergussmasse, Isolationswerkstoff und Verwendung dazu |
PCT/EP2017/080610 WO2018099891A1 (de) | 2016-11-29 | 2017-11-28 | Vergussmasse, isolationswerkstoff und verwendung dazu |
Publications (1)
Publication Number | Publication Date |
---|---|
EP3523348A1 true EP3523348A1 (de) | 2019-08-14 |
Family
ID=60888355
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP17822556.1A Withdrawn EP3523348A1 (de) | 2016-11-29 | 2017-11-28 | Vergussmasse, isolationswerkstoff und verwendung dazu |
Country Status (5)
Country | Link |
---|---|
US (1) | US20210102027A1 (de) |
EP (1) | EP3523348A1 (de) |
CN (1) | CN110023371A (de) |
DE (1) | DE102016223662A1 (de) |
WO (1) | WO2018099891A1 (de) |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH487958A (de) * | 1968-03-19 | 1970-03-31 | Ciba Geigy | Härtbare Mischungen aus Epoxidharzen und cyclischen Harnstoffderivaten |
US3549592A (en) * | 1968-08-05 | 1970-12-22 | Jefferson Chem Co Inc | Curing epoxy resins with amidines |
DE2326668B2 (de) * | 1973-05-25 | 1977-08-11 | Veba-Chemie Ag, 4660 Gelsenkirchen-Buer | Verfahren zur herstellung von ueberzuegen oder beschichtungen |
US4127562A (en) * | 1974-09-12 | 1978-11-28 | Veba-Chemie Aktiengesellschaft | Method of preparing coatings |
DE3824254A1 (de) * | 1988-07-14 | 1990-01-18 | Siemens Ag | Isolierband zur herstellung einer mit einer heisshaertenden epoxid-saeureanhydrid-mischung impraegnierten isolierhuelse fuer elektrische leiter |
CN1156463A (zh) * | 1994-07-18 | 1997-08-06 | 国际壳牌研究有限公司 | 用于环氧树脂的环氧化低粘度橡胶增韧改性剂 |
DE4432188A1 (de) * | 1994-09-09 | 1996-03-14 | Siemens Ag | Epoxidharzformmassen zur Umhüllung von elektronischen Bauelementen |
WO1996037532A1 (de) * | 1995-05-24 | 1996-11-28 | Siemens Aktiengesellschaft | Epoxidharzformmassen mit halogenfreiem flammschutz |
US6194490B1 (en) * | 1998-02-27 | 2001-02-27 | Vantico, Inc. | Curable composition comprising epoxidized natural oils |
US20050261398A1 (en) * | 2004-05-21 | 2005-11-24 | General Electric Company | Catalyst for curing epoxy resins, epoxy resin composition, and powder coating composition |
JP5179839B2 (ja) * | 2007-11-08 | 2013-04-10 | 株式会社ダイセル | エポキシ樹脂組成物、及びその硬化物 |
WO2009072632A1 (ja) * | 2007-12-07 | 2009-06-11 | Jsr Corporation | 硬化性組成物、光学素子コーティング用組成物、およびled封止用材料ならびにその製造方法 |
DE102011013645A1 (de) * | 2011-03-11 | 2012-09-13 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Epoxidharzsystem mit visueller Kontrolle des Aushärtezustandes |
US8454815B2 (en) * | 2011-10-24 | 2013-06-04 | Rohm And Haas Electronics Materials Llc | Plating bath and method |
DE102012111836A1 (de) * | 2012-12-05 | 2014-06-05 | Schott Ag | Beschichtungsmaterial und Substrat mit einer semitransparenten Beschichtung |
WO2014108304A2 (de) * | 2013-01-08 | 2014-07-17 | Sika Technology Ag | Härter für emissionsarme epoxidharz-produkte |
KR102135392B1 (ko) * | 2013-03-11 | 2020-07-17 | 비와이케이-케미 게엠베하 | 요변성-증진 첨가제 및 상기 첨가제를 함유하는 조성물 |
JP6216801B2 (ja) * | 2013-10-28 | 2017-10-18 | 富士フイルム株式会社 | 感光性樹脂組成物、パターンの製造方法、硬化膜、有機el表示装置の製造方法、および液晶表示装置の製造方法 |
DE102013226705A1 (de) * | 2013-12-19 | 2015-06-25 | Siemens Aktiengesellschaft | Durchschlag- und überschlagsichere Gießharzzusammensetzung |
US10253136B2 (en) * | 2014-02-06 | 2019-04-09 | Adeka Corporation | Compound and epoxy resin composition containing same |
-
2016
- 2016-11-29 DE DE102016223662.8A patent/DE102016223662A1/de not_active Withdrawn
-
2017
- 2017-11-28 CN CN201780073929.9A patent/CN110023371A/zh active Pending
- 2017-11-28 EP EP17822556.1A patent/EP3523348A1/de not_active Withdrawn
- 2017-11-28 WO PCT/EP2017/080610 patent/WO2018099891A1/de unknown
- 2017-11-28 US US16/464,587 patent/US20210102027A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
CN110023371A (zh) | 2019-07-16 |
US20210102027A1 (en) | 2021-04-08 |
WO2018099891A1 (de) | 2018-06-07 |
DE102016223662A1 (de) | 2018-05-30 |
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