EP3494765A1 - Carte de circuit imprimé et procédé de fabrication d'une carte de circuit imprimé - Google Patents

Carte de circuit imprimé et procédé de fabrication d'une carte de circuit imprimé

Info

Publication number
EP3494765A1
EP3494765A1 EP17735506.2A EP17735506A EP3494765A1 EP 3494765 A1 EP3494765 A1 EP 3494765A1 EP 17735506 A EP17735506 A EP 17735506A EP 3494765 A1 EP3494765 A1 EP 3494765A1
Authority
EP
European Patent Office
Prior art keywords
circuit board
hole
ceramic substrate
printed circuit
paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP17735506.2A
Other languages
German (de)
English (en)
Inventor
Erich Mattmann
Waldemar Brinkis
Jürgen ZACHERL
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vitesco Technologies GmbH
Original Assignee
Continental Automotive GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Continental Automotive GmbH filed Critical Continental Automotive GmbH
Publication of EP3494765A1 publication Critical patent/EP3494765A1/fr
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09481—Via in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1438—Treating holes after another process, e.g. coating holes after coating the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1225—Screens or stencils; Holders therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H05K3/1291—Firing or sintering at relative high temperatures for patterns on inorganic boards, e.g. co-firing of circuits on green ceramic sheets

Definitions

  • the present invention relates to a printed circuit board, a sensor with such a printed circuit board, a fuel level measurement system for a motor vehicle with such a sensor and a method for producing such a printed circuit board.
  • circuit boards which function on both sides as circuit carriers are known.
  • Such circuit boards may e.g. have a sintered ceramic as a carrier material for conductor tracks.
  • circuit boards may have metallized holes, which on both sides of the
  • Such a printed circuit board can be found e.g. in a so-called magnetic, passive position sensor, also called MAPPS (MAgnetic Passive Position Sensor), which is used in a fuel tank of a motor vehicle for fuel level detection used.
  • MAPPS Magnetic Passive Position Sensor
  • Such a sensor contains a printed circuit board with a circuit carrier or substrate made of a sintered ceramic, which is provided on one side with conductor tracks and with a contact spring structure, wherein the contact spring structure cooperates with the conductor tracks.
  • This contact spring structure is contacted depending on the fuel level of the tank by means of a magnet with the conductor tracks.
  • the sintered ceramic comprises e.g. two metallized holes to connect the tracks on both sides of the sintered ceramic.
  • a layer of electrically conductive thick-film paste or sintering paste is first applied to one side of the sintered ceramic substrate in the region of the holes. Then this paste is from the other side partially sucked into the holes by means of a negative pressure. The ceramic substrate is then dried and fired, whereby the thick-film paste and sintering paste aussintert and undergoes a metallurgical joint with the Ke ⁇ ramiksubstrat.
  • the holes are finally closed by means of a glass mass in order to be able to liquid-tightly or hermetically seal off the side of the substrate which is equipped with the conductor tracks and the contact spring structure.
  • An object of the present invention is to improve such a via.
  • claim 1 provides a circuit board under protection.
  • Claims 7 and 8 provide a sensor with such a printed circuit board and a fuel level measurement system with such a sensor under protection.
  • the claim 9 provides a method for producing the proposed circuit board under protection.
  • Advantageous embodiments of the invention are the subject of the dependent claims. It is proposed a circuit board with formed on two sides of a ceramic ⁇ substrate interconnects, wherein the ceramic substrate at least one metallized hole for
  • the hole of the sintered ceramic substrate is filled with a metal-containing sintering paste filled with pressing pressure, which in the sintered state at least makes a materially coherent connection with the ceramic substrate and thereby completely fills the hole.
  • a positive connection between the ceramic substrate and the sintering paste can also arise.
  • Such a graft can represent a material supernatant of sintering paste relative to the respective substrate side of about 2 to 5 ⁇ .
  • a printed circuit board or board is to be understood as meaning a printed circuit board whose carrier material or substrate is suitable for a high-temperature or sintering process, i. for a treatment at about 950 ° C or at about 1500 ° C.
  • a substrate or substrate made of an alumina ceramic is suitable for treatment at such high temperatures.
  • the printed conductors can be applied or applied to the carrier material or substrate by means of the screen printing method or stencil printing method.
  • Such a printed ceramic substrate carrier is fired, whereby the conductor tracks merge or sinter out into very resistant and reliable layers.
  • a firing process can take place according to the so-called LTCC (Low Temperature Cofired Ceramics) or HTCC (High Temperature Cofired Ceramics) technology.
  • sintering or sintering is meant a solidification and compression of a sintered paste into a compact material as a result of a temperature treatment in a sintering furnace.
  • the ceramic substrate carrier to be through-contacted by this invention is already sintered before its at least one hole is filled with the sintering paste.
  • the filling of VIAs or VIA fillings is a filling of a hole of a green product - also called "green tape" or sintered film - in screen printing or stencil printing for the purpose of a via.
  • Such a green tape ('' Green Tape '') consists of a layer of a dry, but unsintered sintered mass or foil, such as alumina ceramics, which compacts and solidifies during drying and a firing process in a sintering furnace to form a solid support material , During production, this green layer is applied to a plastic carrier film and wound into a roll.
  • Such a green compact position or sintering paste layer may have a thickness of about 0.1 mm in ge ⁇ dried but unsintered state.
  • Several such layers of alumina ceramic sintered pastes can be stacked on top of each other depending on the application.
  • Each layer of such a stack of layers may have printed conductors, resistors and at least one hole for the through-connection of the layer.
  • Such holes are filled in screen printing or stencil printing with a thick film (VIA filling). That is, these holes are already filled before the stack is compressed.
  • Such a stack is subsequently isostatically pressed, but not to fill or fill the holes, but to press it around the stack.
  • Such a compressed stack of individual greening layers is finally sintered in an oven or formed into a solid or compacted and solidified sintered ceramic by the drying and the firing process in the oven.
  • sintering in the context of through-plating is to be understood as meaning a process in which a paste-like mixture - for example of a noble metal, a glass, a resin and a thinner - is physically and electrically fixed for use as a conductive paste or sintering paste conductive structure arises.
  • a metallization of the hole ensures a fail-safe via of the substrate, because at each point of the hole enough electrically conductive material is present.
  • the metal-containing sintering paste is a silver and palladium-containing paste or Sil ⁇ ber-palladium paste.
  • the silver palladium paste has a palladium content of at least 5%, preferably 10 to 15%.
  • the Palladium is an important part of the paste composition, because it increases the adhesion of the sintering paste in the hole of ge ⁇ Sintered ceramic substrate. Such a hole is drilled by means of a laser. In this case, glazing forms on the surface of the hole, which makes the connection with the sintering paste more difficult.
  • the Bindeme ⁇ mechanism is significantly improved in the hole during pressing, the sintered paste.
  • the palladium content in the sintering paste also causes better compatibility with a subsequently printed in screen printing or stencil printing in the region of the hole filled metallic and acting as a conductor sintered paste by the palladium reduces or eliminates the so-called Kirkendall effect, known as such to the expert is.
  • the Kirkendall effect is that at sufficiently high temperature for two adjacent solid phases, the volume of one phase decreases as the volume of the other phase increases. The effect becomes particularly visible if the phase boundary was previously marked, because then one Displacement of the label observed relative to an outer sample geometry. The phase boundary does not migrate itself, but it moves matter between the phases and thus the position of the phase boundary relative to the outer sample geometry.
  • the metal-containing sintering paste can be lead-containing or lead-free, depending on the requirements placed on the sintering paste.
  • a sensor is also proposed, in particular a fuel level sensor, with a printed circuit board of the type described above.
  • a printed circuit board is proposed in particular for use in a so-called magnetic, passive position sensor, also called MAPPS (MAgnetic Passive Position Sensor) ,
  • MAPPS MAgnetic Passive Position Sensor
  • a method for manufacturing a printed circuit board of the type described above is proposed in which at least one hole of a sintered ceramic substrate of the printed circuit board is metallized in order to achieve a through-connection of the ceramic substrate.
  • the ceramic substrate may be an alumina ceramic.
  • the hole of the ceramic substrate is filled with the application of a pressing pressure with a metal-containing sintering paste, wherein The sintering paste is then dried and fired, sintering out during firing.
  • the sintering takes place under the influence of temperature at about 850 ° C, for example in an oven and / or by means of other heat sources.
  • the sintering paste enters into at least one cohesive connection with the ceramic substrate, thereby completely filling the hole.
  • a supernatant of material or a material plug is formed, which engages behind the respective ceramic substrate side or the respective hole edge, a positive connection between the ceramic substrate and the sintering paste.
  • a graft can represent a material supernatant of sintering paste relative to the respective substrate side of about 2 to 5 ⁇ .
  • a pressing pressure of preferably 2 to 4 bar is applied by means of a movable component in order to press the sintering paste.
  • a moving component in the context of this application is a piston to understand that forms a closed space with a surrounding housing, which is filled with the sintering paste to be pressed.
  • the piston may have an elongated extension, for example in the form of a sword, in order to be able to fill a plurality of holes arranged in a row relative to one another at the same time.
  • the pressing pressure is 3 bar.
  • Such a pressure must be applied at substrate thicknesses from about 0.25 mm to ensure filling of the hole of the sintered ceramic substrate.
  • the aforementioned compression pressure range is suitable for processing substrate thicknesses of approx. 0, 25mm to 5mm.
  • the preferred range of substrate thicknesses is 0.5mm to 0.7mm.
  • advantageously at least two such holes with the same and / or un ⁇ ter Kunststoff diameters can be filled simultaneously with the sintering Fit or filled, in order to ensure process optimization.
  • a plurality of such ceramic substrates can be produced simultaneously with such metallizing holes.
  • the ceramic substrate can be fixed on a support by means of a negative pressure by the ceramic substrate is sucked in via at least one formed in the carrier intake duct against the carrier after it correspondingly ⁇ directed previously has been or has been positioned with the aid of at least one stop.
  • the at least one hole of Kera ⁇ miksubstrates is filled using a template. This will prevent contamination on one side of the substrate.
  • a compliant layer can be used, the Kera ⁇ miksubstrat between and is disposed the support.
  • a paper layer is used for this purpose.
  • the ceramic substrate can be enclosed by a reinforcing frame, which protects the substrate from damage due to the application of pressing pressure when filling the holes with the sintering paste.
  • printed conductors of different widths and thicknesses can be applied by screen printing or stencil printing on a substrate through-plated in this way.
  • Fig. 1 illustrates a substrate 2 as part of a circuit board 1.
  • the substrate 2 made of a sintered ceramic, e.g. an aluminum oxide ceramic, has a hole 3 and is on a first side with a first electrically conductive layer 4 or thick film 4 and on a second side, which is opposite to the first side, with a second electrically conductive layer 5 or Thick layer 5 printed.
  • the hole 3 is formed conical due to production.
  • the two thick layers 4, 5 extend partly into the hole 3 and overlap.
  • Such a coating of the hole 3 represents a through-connection of the substrate 2, through which interconnects 4, 5 formed on the two sides of the substrate 2 are connected to one another.
  • Such a coating of the hole 3 is achieved in that the two thick films 4, 5 are successively sucked into the hole 3 successively from the respective opposite side of the substrate 2 by means of a Un ⁇ tertikes.
  • the thick film 4 was sucked in and then sintered in an oven. Thereafter, the thick film 5 was sucked and sintered in the furnace.
  • a weak point 6 which may have a layer thickness of about 1 to 2 ⁇ , even lead to a failure of the via at a high current load.
  • the hole 3 about by a further printing layer or by further printing layers, or by, for example, a glass mass is introduced or filled in the hole 3, because about one of the two sides of the substrate to be hermetically sealed, such a filling of the hole 3 to an excessive change of Resistance and thus also lead to excessive change in the electrical behavior of the via, this change may be unacceptable as such.
  • the sintering paste 7 is at least materially connected to the substrate 2.
  • the sintering paste 7 may additionally be positively connected to the substrate 2, even if this is not shown in FIG. 2. This depends on whether during the filling of the hole with the sintering paste, a projection of material or a mate ⁇ rialpfropfen forms, which engages behind the respective substrate side or the respective hole edge.
  • the substrate 2 is also printed in the region of the filled hole 3 on both sides, each with an electrically conductive thick film 4, 5.
  • sintering paste 7 When the hole 3 fills sintering paste 7, these are to a pasty mixture which comprises at least silver, Palla ⁇ dium, a glass, a resin and a diluent.
  • This sintering paste 7 solidifies and compacts when passing through a sintering furnace to a physically solid and electrically conductive structure.
  • the sintering paste 7 contains a palladium content of preferably 10 to 15%.
  • the sintering paste 7 can be lead-containing or lead-free.
  • the area X 'required for metallization for metallization around the hole 3 is smaller in comparison with the area X shown in Fig. 1. Consequently, the proposed type of metallization also leads to a saving of space.
  • the region X can be about 600 to 900 ⁇ and the range X 'about 300 ⁇ and less. As a result, the area X 'is at most half as large as the area X.
  • the substrates shown in FIGS. 1 and 2 each have a thickness of about 0.63 mm. Furthermore, the holes 3 shown in FIGS. 1 and 2 each have a conical shape. Such a cone shape is produced due to the drilling of the hole means of a laser.
  • the upper hole diameter can be about 0.1 to 0.3mm.
  • the substrate matrix 20 may comprise a total of 16 substrates 2, such as in a 2x8 array, i. in an arrangement with two rows and in each case 8 substrates 2.
  • the pressing-pressure-filling device 10 thereby enables at least one simultaneous filling of the holes 3 of the substrate matrix 20 arranged in a row with the said sintering paste 7. This row of holes extends in the vertical direction to FIG. 3 or FIG to the picture plane.
  • the substrate matrix 20 can be seen, which is arranged on a support 25.
  • the substrate matrix 20 is preferably enclosed by a reinforcing frame 22 and positioned relative to the carrier 25 such that the holes 3 of the individual substrates 2 are aligned with channels 26 of the carrier 25 arranged at right angles to one another.
  • the positionally precise direction of the substrate matrix 20 can be ensured, for example, via at least one corresponding stop, which is formed approximately on the carrier 25 and is not shown, against which the reinforcing frame 22 can abut, for example.
  • the carrier 25 further includes vertically extending intake passages 28, via which the substrate matrix 20 is sucked by means of a negative pressure against the carrier 25 and thus fixed.
  • a yieldable layer 24 preferably in the
  • the thickness of the template is about 0.1mm.
  • a squeegee 14 is indicated, by means of which the said row of holes of the substrate matrix 20 is filled with the sintering paste 7.
  • This squeegee 14 comprises a collection chamber 16 and a smaller chamber 17 adjacent thereto, which can cover the said row of holes of the substrate matrix 20.
  • the filling of the substrate matrix 20 proceeds as follows: By means of an elongated piston in the shape of a sword 12 which is movable in the collecting chamber 16, the sintering paste 7 located in the chamber 16 in the vertical direction Y via the chamber 17 and pressed the template 18 in the holes 3 of the row of holes. In this case, a pressing pressure of about 2 to 4 bar is applied. In this example, a pressing pressure of about 3 bar is applied.
  • the sintering paste 7 is metered into the holes 3 filled so that form on the underside of the substrate matrix 20 only very small protrusions of material or material drops that extend into the channel 26 and thereby the paper layer 24 bulge locally without them tear or damage.
  • the individual plugs form a material supernatant with respect to the underside of the substrate matrix 20 of about 2 to 5 ⁇ .
  • the squeegee 14 moves from hole row to row of holes in the horizontal direction X to fill the individual rows of holes successively with the sintering paste 7.
  • Both the template 18, over which the squeegee 14 along sweeps, as well as the paper layer 24 serve to prevent smearing of the substrate matrix 20.
  • a slight material overhang also forms with respect to the upper side of the substrate matrix 20, so that the fillings of the individual holes 3 substantially have the formation of a rivet.
  • the substrate matrix 20 passes through a sintering furnace.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Dispersion Chemistry (AREA)

Abstract

L'invention concerne une carte de circuit imprimé, de préférence destinée à être utilisée dans un capteur de niveau de carburant et un système de mesure de niveau de carburant, laquelle carte de circuit imprimé comprend des pistes conductrices (4, 5) formées sur les deux côtés d'un substrat en céramique (2), ledit substrat en céramique (2) présentant au moins un trou (3) métallisé d'interconnexion reliant les pistes conductrices (4, 5). Le trou (3) du substrat en céramique (2) fritté est rempli d'une pâte de frittage à base de métal introduite sous pression qui, à l'état non fritté, établit au moins une liaison de matière avec le substrat en céramique (2) et remplit ainsi totalement le trou. L'invention concerne également un procédé de fabrication de cette carte de circuit imprimé.
EP17735506.2A 2016-08-02 2017-07-04 Carte de circuit imprimé et procédé de fabrication d'une carte de circuit imprimé Pending EP3494765A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102016214265.8A DE102016214265B4 (de) 2016-08-02 2016-08-02 Leiterplatte und Verfahren zur Herstellung einer solchen Leiterplatte
PCT/EP2017/066691 WO2018024426A1 (fr) 2016-08-02 2017-07-04 Carte de circuit imprimé et procédé de fabrication d'une carte de circuit imprimé

Publications (1)

Publication Number Publication Date
EP3494765A1 true EP3494765A1 (fr) 2019-06-12

Family

ID=59285212

Family Applications (1)

Application Number Title Priority Date Filing Date
EP17735506.2A Pending EP3494765A1 (fr) 2016-08-02 2017-07-04 Carte de circuit imprimé et procédé de fabrication d'une carte de circuit imprimé

Country Status (6)

Country Link
US (1) US20200187353A1 (fr)
EP (1) EP3494765A1 (fr)
KR (1) KR20190027914A (fr)
CN (1) CN109565940A (fr)
DE (1) DE102016214265B4 (fr)
WO (1) WO2018024426A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110132453B (zh) * 2019-05-28 2022-09-09 无锡莱顿电子有限公司 一种压力传感器键合方法

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* Cited by examiner, † Cited by third party
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WO2018024426A1 (fr) 2018-02-08
KR20190027914A (ko) 2019-03-15
DE102016214265A1 (de) 2018-02-08
CN109565940A (zh) 2019-04-02
DE102016214265B4 (de) 2022-10-13
US20200187353A1 (en) 2020-06-11

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