EP3478437A1 - Procédé et dispositif de reprise de processus de sciage par scie à fil d'une pièce après une interruption non programmée - Google Patents

Procédé et dispositif de reprise de processus de sciage par scie à fil d'une pièce après une interruption non programmée

Info

Publication number
EP3478437A1
EP3478437A1 EP17735021.2A EP17735021A EP3478437A1 EP 3478437 A1 EP3478437 A1 EP 3478437A1 EP 17735021 A EP17735021 A EP 17735021A EP 3478437 A1 EP3478437 A1 EP 3478437A1
Authority
EP
European Patent Office
Prior art keywords
wire
sawing
gate
workpiece
saw
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP17735021.2A
Other languages
German (de)
English (en)
Inventor
Alexander Rieger
Walter SPÖCKNER
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siltronic AG
Original Assignee
Siltronic AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siltronic AG filed Critical Siltronic AG
Publication of EP3478437A1 publication Critical patent/EP3478437A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/0007—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00 using saw wires
    • B23D57/0023—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00 using saw wires with a plurality of saw wires or saw wires having plural cutting zones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
    • B23D57/0053—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of drives for saw wires; of wheel mountings; of wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
    • B23D57/0061—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of devices for guiding or feeding saw wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
    • B23D57/0069—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of devices for tensioning saw wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work

Definitions

  • the present invention relates to a method of resuming an interrupted process of sawing a workpiece into a plurality of disks with a wire saw using a cutting wire covered with cutting grain, for example a diamond saw wire.
  • the method according to the invention is illustrated here using the example of a process for sawing a workpiece made of semiconductor material into a plurality of disks with a diamond wire saw, but is also suitable for workpieces made of other materials.
  • the present invention also includes an apparatus for sawing a workpiece into a plurality of disks with a saw wire, which apparatus enables detection of the position of a wire tear.
  • semiconductor substrates For electronics, microelectronics, and micro-electromechanics, semiconductor substrates (wafers) with extreme requirements for global and local flatness, single-sided local flatness (nanotopology), roughness, and cleanliness are needed as starting materials (substrates).
  • semiconductor wafers are wafers of semiconductor materials, in particular
  • Compound semiconductors such as gallium arsenide and predominantly elemental semiconductors such as silicon and occasionally germanium.
  • semiconductor wafers are produced in a multiplicity of successive process steps, wherein in the first step, for example, a single crystal (rod) of semiconductor material is pulled by the Czochralski process or a polycrystalline block of semiconductor material is cast, and in a further step the resulting one circular-cylindrical or block-shaped workpiece made of semiconductor material ("ingot") by means of
  • Wire saws are separated into individual semiconductor wafers.
  • Wire saws are used to make a large number of disks ("wafers") out of one
  • the printed publications DE 195 17 107 C2 DE 10 201 1 008 397 A1 and US Pat. No. 5,771,876 describe the functional principle of a wire saw which is suitable for producing semiconductor wafers.
  • the essential components of these wire saws include a machine frame, a feed mechanism, and a sawing tool consisting of a wire wire gate consisting of parallel sections of wire
  • the spacing of the wires in the wire gate depends on the desired target thicknesses of the slices to be separated for discs of semiconductor material for example, at 100 to 1000 ⁇ .
  • the wire gate is formed by a plurality of parallel wire sections, which are spanned between at least two wire guide rollers, wherein the wire guide rollers are rotatably mounted and of which at least one is driven.
  • Diamond wire saws are also used for sawing a hard workpiece into a multiplicity of disks.
  • Diamond wire saws differ from wire saws in principle in that the saw wire is covered in a diamond wire saw with cutting grains of diamonds, whereby a higher sawing performance is achieved.
  • the saw wire Upon penetration of the wire gate in the workpiece, the saw wire according to the prior art in a defined time at a certain speed a predetermined length forward (wire forward) and a further defined length rewound (wire backward), the return length WBL usually shorter is as the lead length (WFL).
  • This sawing method is also referred to as a reciprocating movement method and is disclosed, for example, in DE 39 40 691 A1 and in US 2010 1630 10 A2.
  • EP 1 717 001 B1 teaches that when sawing a workpiece with a wire saw, the saw wire makes a forward and backward movement, the length of the wire being shorter in the return movement (WBL) than the length of the wire in the
  • the sawing of a workpiece with a wire saw in many slices takes place in the presence of a liquid cutting means, including the removal of the through the saw wire removed material from the shegespalte and applied according to the prior art on the saw wire.
  • the cutting means also serves as a coolant, so to dissipate the heat generated during the machining of the workpiece from the saw blade out.
  • Cutting grain is supplied to the cutting grain in the form of a suspension (cutting agent suspension, "Sägeslurry”, “slurry”) during the separation process.
  • a suspension cutting agent suspension, "Sägeslurry”, “slurry”
  • the saw wire with a cutting pad e.g. Diamond, occupied
  • a cutting medium without cutting grain (abrasive) used since
  • liquids used in diamond wire sawing which contain water for cost reasons and better heat removal, high levels of glycols and additives, such as dispersants, silicate inhibitors and wetting agents, since the resulting silicon abrasion with water reacts to silicates separates and clumps.
  • wire breakage wire breakage
  • diamond sawing wires are very sensitive in terms of wire damage and wire tears due to their low elasticity, high brittleness and high mechanical notch effect.
  • the sawing process must be interrupted as quickly as possible in order to avoid damage to the wire saw and the material to be cut.
  • WO 201 1/151022 A1 discloses a method for monitoring wire tears when cutting a workpiece by means of a wire gate, in which a direct current is passed through the wire gate the wire field one
  • Torque detection for quick detection of a wire tear. As soon as an abnormal value of the rotational resistance of the deflection roller is detected metrologically, the
  • Wire tear but can not determine the location of the wire tear along the longitudinal axis of the wire guide roller or the workpiece.
  • the workpiece and the wire gate are separated.
  • the workpiece can be moved upwards out of the gate.
  • Cutting means introduced into the wire gate. To resume the wire sawing process after its unscheduled
  • the object of the invention is therefore to provide a method and a device that avoids a renewed tearing of the wire at the location of the previous wire break in an unscheduled process interruption when wire sawing a workpiece made of semiconductor material when restarting the process.
  • the object is achieved by a method for resuming an interrupted process for sawing a workpiece 6 into a plurality of disks with a wire saw, comprising detecting the exact or approximate position of the
  • Wire sections which are wetted by a liquid, are introduced into a plurality of already present in the workpiece 6 shegespalte 7, characterized in that the wire gate 5 in the region of the sawing gap 7, in which the wire tear has taken place, is so expanded that either a defined area left and right of the saw crack 7 affected by the wire tear or only the affected by the wire tear crevice 7 is excluded from reinserting the new wire sections and the new wire section.
  • the object is also achieved by a device for sawing a workpiece 6 into a plurality of disks with a saw wire 3, which is characterized by at least two
  • Wire guide rollers 4 is clamped in one of a plurality of parallel wire sections comprehensive wire gate 5, characterized in that the
  • Wire sections are monitored by at least one sensor 8 such that in a wire tear the exact or approximate position of the wire section that is torn, can be determined.
  • the object is further achieved by a device for sawing a workpiece 6 in a plurality of discs with a saw wire 3, by at least two
  • Wire guide rollers 4 is clamped in one of a plurality of parallel wire sections comprehensive wire gate 5, characterized in that the after a wire tear rebuilt wire gate 5 either by a corresponding winding around the at least two wire guide 5 spanning wire guide rollers 4 or by at least one guide roller 2b the position or in the area in which the wire tear has occurred, is clamped so that at least the sawing gap 7, in which the wire tear has occurred, not with a wire section when rewinding the
  • Wire sections in the shegespalte 7 of the workpiece 6 is occupied. While the present invention primarily relates to workpieces of semiconductor material, it is applicable to the sawing of a workpiece of any material with a wire saw.
  • the inventive method are both wire saws, in which the saw wire in the wire gate firmly bonded abrasive, such as diamond grain or silicon carbide containing, as well as wire saws, in which the saw wire has no Abrasivbelegung and the cutting power by an abrasive containing cutting suspension, during or before the sawing process is applied to the saw wire is guaranteed.
  • Diamond wire saw so a wire saw is described, is used in the occupied with diamond grain saw wire, the invention are used in all wire sawing regardless of the saw wire used.
  • a workpiece is a geometric body with a surface consisting of at least two parallel, flat surfaces (front sides) and a lateral surface, which is formed by parallel straight lines.
  • the end faces are round and the lateral surface is convex.
  • a cuboid cylindrical workpiece is the
  • a workpiece of semiconductor material is a single crystal or a crystal of semiconductor material, wherein the semiconductor material is usually silicon.
  • the discs of semiconductor material (wafers) sawn from the workpiece made of semiconductor material have a front and a rear side as well as a circumferential edge and are finished in further processing steps.
  • Figure 1 a shows greatly simplified the structure of a wire saw for sawing a
  • the saw wire 3 is from a transmitting coil (1 a) via at least one guide roller 2a via a
  • Wire guide roller 4 is guided in a wire gate 5.
  • the wire gate 5 consists of a plurality of parallel wire sections and is spanned by at least two wire guide rollers 4.
  • the wire sections of the wire gate 5 penetrate into the workpiece 6 during the sawing process.
  • the leading out of the wire gate 5 sawing wire 3 is wound over at least one further deflection roller 2a on a receiver coil (1 b).
  • Figure 1 b shows greatly simplified the structure of a wire saw for sawing a
  • the wire gate 5 is clamped in this illustration by way of example by four wire guide rollers 4 and the wire gate 5 is not in contact with the workpiece 6, which is attached via a bar 6a in the wire saw stands.
  • the saw wire 3 is guided by a transmitting coil (not shown) via at least one deflection roller 2a via a wire guide roller 4 in a wire gate 5.
  • the wire gate 5 consists of a plurality of parallel wire sections and is spanned by four wire guide rollers 4. The wire sections of the wire gate 5 penetrate into the workpiece 6 during the sawing process. The from the
  • Wire gate 5 leading saw wire 3 is wound on at least one further guide roller 2a on a receiver coil (not shown).
  • FIG. 2 schematically shows a workpiece 6 with a multiplicity of saw gaps 7 after an interrupted wire sawing process and after the wire gate 5 has been moved out of the workpiece.
  • FIG. 3 shows in a greatly simplified manner the structure of a wire saw for sawing a wire saw
  • the saw wire 3 is from a
  • Transmitting coil (not shown) via at least one guide roller 2a via a Wire guide roller 4 is guided in a wire gate 5.
  • the wire gate 5 consists of a plurality of parallel wire sections and is spanned by four wire guide rollers 4.
  • the wire sections of the wire gate 5 penetrate into the workpiece 6 during the sawing process.
  • the leading out of the wire gate 5 sawing wire 3 is wound over at least one further deflection roller 2a on a receiver coil (not shown).
  • Wire gate 5 are two sensors 8, which are connected to a meter 9. These sensors 8 serve to monitor the wire gate 5 and detect the location in the wire gate 5 at which a wire tear has occurred. About the additional guide rollers 2b, the wire gate 5 in the area in which the wire tear has occurred in the workpiece 6, so widened that this area is bridged, so no wire sections are present.
  • Figure 4a shows a first embodiment of the wire gate 5 for resuming the wire sawing process after its unplanned interruption by a wire tear.
  • the repaired wire gate 5, which is spanned by at least two wire guide rollers 4, is exemplified by means of at least one additional guide rollers 2b in the
  • Figure 4b shows a second embodiment of the wire gate 5 for resuming the wire sawing process after its unplanned interruption by a wire tear.
  • the repaired wire gate 5, which is spanned by at least two wire guide rollers 4, is stretched by the wire guide roller 4 at the location of the wire tear so that the saw gap in the workpiece 6 (not shown), in which the wire tear has taken place, is excluded from the further sawing process ,
  • 5 wire gate comprising a plurality of parallel wire sections, which is spanned by at least two wire guide rollers
  • a diamond wire saw according to the prior art is preferably used, since workpieces 6 can be sawed into slices faster with a diamond wire saw than with a wire saw which uses a saw wire 3 without bonded abrasive grain (abrasive).
  • a diamond wire saw for separating (sawing) workpieces made of semiconductor material is disclosed, for example, in US Pat. No. 5,878,737 A.
  • the inventive method is also suitable for wire saws that use a saw wire without bonded abrasive.
  • the workpiece to be sawn 6 is usually fixed on a saw bar 6a, which is clamped with a mounting plate in the wire saw.
  • the sawing of the workpiece 6 is accomplished with a wire gate 5.
  • the wire gate 5 is at least two
  • Wire guide rollers 4 spanned and includes a plurality of parallel wire sections.
  • the at least two (possibly also three, four or more) wire guide rollers 4 are rotatably mounted and at least one of the wire guide rollers 4 is electrically driven.
  • Wire sections usually belong to a single, finite saw wire 3, which is guided spirally around the wire guide roller system and by a transmitting coil
  • the saw wire 3 may be a saw wire without bonded abrasive or a saw wire with bonded abrasives.
  • the diamond wire 3 (diamond wire) is a wire having a core diameter of about 100 ⁇ to 800 ⁇ , which is covered with diamond as a cutting grain.
  • the diamond grain size is usually between 15 ⁇ and 150 ⁇ .
  • the sawing or penetration of the wire gate 5 in the workpiece 6 is provided with a
  • Feed device causes the workpiece 6 against the wire gate 5, the wire gate 5 against the workpiece 6 or the workpiece 6 and the wire gate 5 against each other leads (cutting feed).
  • the saw wire 3 is wound on a receiver coil 1 b by a transmitting coil 1 a via the wire gate 5 (FIG. 1).
  • the wire 3 works by removing material to form parallel crevices 7 through the workpiece 6, whereby a comb is formed from the disks that are being formed (FIG. 2).
  • Wire gate 5 during the sawing process preferably via nozzles with a liquid
  • Suitable cutting means for a saw wire 3 without bonded abrasive are all liquid media according to the prior art.
  • glycol, oil or water are preferably used as carrier material and silicon carbide as abrasive.
  • the wire sections of the wire gate 5 are preferably acted upon via nozzles with a liquid coolant during the sawing process.
  • the cooling lubricant serves on the one hand a better sliding action of the diamond saw wire 3 in the kerfs 7 and on the other hand the discharge of the machining of the
  • Water is preferably used as the cooling lubricant, wherein the water may contain additives, such as, for example, surfactants.
  • additives such as, for example, surfactants.
  • further cooling lubricants are disclosed, for example, in WO 2013/1 13859 A1.
  • the wire sawing of workpieces 6 made of semiconductor material is preferably carried out according to the so-called.
  • Pilgrim step method (wire oscillation method), ie the saw wire 3 in the wire gate 5 is alternately moved back and forth by a suitable drive, wherein the phase of the forward movement of the saw wire 3, and thus the length of the guided during the forward movement through the kerf 7 wire 3 is greater than the phase or the length of the wire 3 during the backward movement.
  • the wire sawing of workpieces 6 made of semiconductor material can be unidirectional, ie the saw wire 3 in the wire gate 5 is moved by a suitable drive during the entire sawing only in one direction, so from the transmitting coil 1 a wound on the receiver coil 1 b.
  • the wire sawing process consisting of the wire drive and the cutting feed, is automatically ended and the wire saw is shut down in a controlled manner within a few seconds after the unscheduled event.
  • the workpiece 6 is moved out of the wire gate 5. If necessary, the broken wire 3 has to be pulled out of the workpiece 6 manually.
  • the area of the sawing gaps 7 or the sawing gap 7, in which the wire tear has taken place is excluded from re-threading of the wire sections into the sawing gaps 7 of the workpiece 6.
  • the method according to the invention therefore comprises on the one hand the use of at least one sensor 8 for monitoring the wire gate 5 during the wire sawing process.
  • position refers to the position of the broken wire section and thus of the
  • no new saw wire 3 is inserted into the at least one kerf 7, in which the wire tear has occurred, at the resumption of the wire sawing process, i. a small piece of the workpiece 6 is not further separated after the resumption of the wire sawing process.
  • the size or the length of this piece is minimal
  • the length L of the workpiece 6 to be discarded increases according to the total number of omitted crevasses. For example, become a total of twenty
  • a device for sawing a workpiece 6 in a plurality of slides with a saw wire 3 by at least two
  • Wire guide rollers 4 is clamped in one of a plurality of parallel wire sections comprehensive wire gate 5 and by at least one sensor 8, the monitoring of the wire sections such that in a wire tear the exact or approximate position of the wire section is torn or the sawing gap 7 in the workpiece. 6 in which the wire tear has occurred can be determined.
  • the at least one sensor is preferably connected to a measuring device 9 suitable for this purpose.
  • two sensors 8 are preferably used to monitor the individual wire sections, so that on the two sides of the workpiece 6, which face the wire guide 5 spanning wire guide rollers 4, respectively a sensor 8 is located (Figure 3).
  • the at least one sensor 8 for monitoring the wire gate 5, the individual wire sections for example, electrically, optically, acoustically or in the form of
  • Wire sections of the wire gate 5 used during the wire sawing process The position of the at least one sensor 8 depends on the sensor type used, so that the positioning of two sensors 8 below the wire gate 5 shown in FIG. 3 does not limit the invention to this embodiment.
  • the length of a sensor 8 preferably corresponds to at least the width of the wire gate 5, so that each wire section of the wire gate can be monitored by the sensor. If, for example, a wire gate 5 at a width of 80 cm comprises nine hundred individual wire sections, the sensor in the embodiment shown in FIG. 3 is preferably likewise at least 80 cm wide. It is critical to the invention, however, that the sensor 8, regardless of its length or design, monitor the entire length of the wire gate 5, ie all the wire sections belonging to the wire gate 5 during the wire sawing and the position of a wire tear affected by a wire tear
  • the accuracy with which the Position of the affected wire section can be determined depends not only on the resolution and speed of the at least one sensor 8 but also on the conditions during the occurrence of the wire tear, so for example if the wire tear occurred within the workpiece 6 or outside of the workpiece 6.
  • the number of sawing gaps 7 which according to the invention are excluded from the further sawing process depends on the accuracy of the sensor 8 used.
  • the length of the area to be excluded, and thus the number of gaps 7 recessed for the resumption of the wire sawing process, is preferably such that the sawing gap 7 affected by the wire tear is safely in this area, but the area is not too large the no longer usable part of the
  • the recess of the at least one saw gap 7 for the resumption of the wire sawing process by a device for sawing a workpiece 6 into a plurality of discs with a saw wire 3, by at least two wire guide rollers 4 in one of a plurality of parallel Arranged wire sections comprehensive wire gate 5 is clamped, characterized in that the rebuilt after a wire tear wire gate 5 by at least one
  • Deflection pulley 2b at the position or in the area in which the wire tear has occurred, is clamped such that at least the sawing gap 7, in which the wire tear has occurred, not with a wire section when re-threading the wire sections in the
  • the first method according to the invention is particularly suitable for resuming a wire sawing process in which the exact position of the kerf 7 affected by the wire tear can not be determined, that is to say an area of a plurality of kerfs 7 for the
  • the wire tear can take place in the edge region of the wire gate 5 or in the middle region of the wire gate. If the wire tear is made in the edge region of the wire gate, the recess of this area can also by an appropriate positioning of the wire tear.
  • Deflection pulleys 2a take place, i. the wire gate 5 is only after, based on the affected edge area to be excluded area or the number of excluded
  • the wire gate 5 in the case of a wire tear in the middle region of the wire gate 5, the wire gate 5 must be constructed twice.
  • the first part of the wire gate 5 is built up to the beginning of the area which securely encloses the kerf 7 affected by the wire tear, i. the saw wire 3 is wound as a single wire sections around the at least two wire guide rollers 4. From the beginning of the area affected by the wire tear, the saw wire 3 on one side of the workpiece 6 is moved over at least one, preferably two or three deflection rollers 2b along the area affected by the wire tear from its beginning to its end outside the first
  • the number and or the size of the deflection rollers 2b in the apparatus according to the invention for sawing a workpiece 6 into a plurality of disks with a saw wire 3 is determined by various factors. On the one hand, the length of the area to be bridged on the first wire guide roller 4 is decisive. This length results from the number and the thickness of the shegespalte to be spared 7. For a longer range, if necessary, larger and / or more deflection rollers 2b must be used to bridge this area. On the other hand, the number and size of the guide rollers 2b is determined both by the number of wire guide rollers 4 in the wire saw and by the way the wire 3 is returned to the wire guide roller 4 at the end of the area.
  • the wire 3 can again contact the respective wire guide roller 4 above or below the wire guide roller 4. Furthermore, the position of the at least one deflection roller 2b with respect to the axis of rotation of the wire guide roller 4 also has an influence on the size and / or number of deflection rollers 2b.
  • the inventive device necessary for the inventive method comprises at least one deflection roller 2b, which leads away the saw wire 3 from a first position on the wire guide roller 4 and the wire 3 at a second position on the
  • Wire guide roller which has a certain distance to the first position, leads back.
  • the distance between the first and the second position on the wire guide roller is determined by the number of kerfs 7 to be bridged, into which no new one
  • Wire section is inserted for the resumption of the interrupted wire sawing process.
  • the distance is also determined by the number of repaired or rebuilt
  • Wire gate 5 missing wire sections determined. In order for the wire sections in the wire gate 5 to continue to run parallel despite the missing wire sections, this includes
  • Device preferably on each of the at least two wire guide rollers spanning the wire gate 4 at least one deflection roller 2b (Fig. 4a), whose position relative to the respective axis of rotation of the wire guide rollers 4 is aligned with each other so that the existing wire sections are still aligned parallel to each other are.
  • Wire sections a second area that contains no wire sections and a third area, which in turn contains a defined number of wire sections.
  • the number of wire sections in the first region of the wire gate 5 may be the same, similar or completely different from the number of wire sections in the third region of the wire gate 5.
  • the at least one deflection roller 2b can preferably be positioned parallel to the longitudinal axis of a wire guide roller 4 in the method according to the invention. Since a wire 3, which is coated with bonded abrasives, for example a diamond wire, has a significantly higher rigidity than a saw wire 3 without bonded abrasive, the at least one deflection roller 2b must have a diameter when using a wire 3 which has been bonded with bonded abrasives a wire tear by twist leads.
  • the resumption of an interrupted Drahttsägereaes begins with the insertion of the individual wire sections of the first portion of the wire gate 5 in the first existing shegespalte 7 in the workpiece 6.
  • the second portion of the wire gate 5 saves the area comprising a plurality of adjacent shegespalte 7, of which in a the wire tear took place, ie no new or repaired sawing wire 3 is introduced into the sawing gaps 7 lying in this area.
  • the third region of the wire gate 5 is in turn inserted into the remaining statgespalte 7 of the workpiece 6.
  • the saw wire 3 is preferably at low speed, preferably 0.1 - 0.5 m / s, in the direction "wire forward" of the supply roll 1 a over the
  • Wire gate 5 and the at least one guide roller 2b bobbin on a take-up reel 1 b and formed of the parallel wire sections wire gate 5 is in
  • the wire gate 5 is in three parts after completion of the wire insertion process, wherein both the first part of the wire gate 5 and the third part of the wire gate 4 each by a defined number parallel arranged wire sections which are in the respective kerfs 7 in the workpiece 6 right and left of a recessed area along the longitudinal axis of the workpiece 6, is formed.
  • the first and the third part of the wire gate 5 are separated by bridging a region along the longitudinal axis of the at least one wire guide roller 4 by means of at least one deflection roller 2b.
  • the individual wire sections of the wire gate are monitored by the at least one sensor 8 with respect to a wire tear.
  • the second method according to the invention is particularly suitable for resuming a wire sawing process in which the exact position of the saw crack 7 affected by the wire tear can be determined, ie only preferably a sawing gap 7 must be recessed.
  • the wire gate 5 must be constructed only once. At the point where the affected by the wire rip sawing 7 or a narrow range of one to three crevices 7, the right and left of the affected by the wire tear crevice 7, the saw wire 3 is so spanning the wire gate 5 at least placed two wire guide rollers 4 that in the affected sawing 7 and possibly in the adjacent kerfs 7 no new wire section is introduced. The wire gate 5 is widened over the respective wire guide rollers 4 so that it has no wire section or no wire sections at the position of the affected sawing gap 7, possibly additionally the adjacent sawing gaps 7.
  • the resumption of an interrupted Drahttsägereaes begins in the second method according to the invention with the insertion of the wire gate 5 in the already existing shegespalte 7 in the workpiece 6, wherein in the at least one kerf 7, in which the wire tear has occurred or in a narrow range of one to three Crevices 7 around this crevice 7 around, no new or repaired saw wire 3 is introduced.
  • the saw wire 3 is preferably at low speed, preferably 0.1 - 0.5 m / s, in the direction "wire forward" of the supply roll 1 a via the wire gate. 5 wound on a take-up reel 1 b and formed from the parallel wire sections wire gate 5 is again inserted in the presence of cutting or cooling lubricant into the existing shegespalte 7 of the workpiece 6 until the position of the wire gate 5 in the workpiece 6 at the time of interruption is reached.
  • the individual wire sections of the wire gate are monitored by the at least one sensor 8 with respect to a wire tear.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)

Abstract

La présente invention concerne un procédé de reprise d'un processus qui a été interrompu et vise à scier une pièce (6) en une pluralité de tranches avec une scie à fil utilisant un fil à scier (3) recouvert de grains coupants, par exemple un fil de diamant. Le procédé selon l'invention est illustré en prenant l'exemple d'un processus visant à scier une pièce en matériau semi-conducteur en une pluralité de tranches au moyen d'une scie à fil de diamant, mais s'applique également à des pièces consistant en d'autres matériaux. La présente invention concerne par ailleurs un dispositif destiné à scier une pièce en une pluralité de tranches au moyen d'un fil à scier, ledit dispositif permettant d'identifier la position d'une rupture de fil.
EP17735021.2A 2016-06-30 2017-06-20 Procédé et dispositif de reprise de processus de sciage par scie à fil d'une pièce après une interruption non programmée Withdrawn EP3478437A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102016211883.8A DE102016211883B4 (de) 2016-06-30 2016-06-30 Verfahren und Vorrichtung zur Wiederaufnahme des Drahtsägeprozesses eines Werkstückes nach einer unplanmäßigen Unterbrechung
PCT/EP2017/065082 WO2018001793A1 (fr) 2016-06-30 2017-06-20 Procédé et dispositif de reprise de processus de sciage par scie à fil d'une pièce après une interruption non programmée

Publications (1)

Publication Number Publication Date
EP3478437A1 true EP3478437A1 (fr) 2019-05-08

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EP17735021.2A Withdrawn EP3478437A1 (fr) 2016-06-30 2017-06-20 Procédé et dispositif de reprise de processus de sciage par scie à fil d'une pièce après une interruption non programmée

Country Status (9)

Country Link
US (1) US20200316817A1 (fr)
EP (1) EP3478437A1 (fr)
JP (1) JP2019519385A (fr)
KR (1) KR20190025654A (fr)
CN (1) CN109414774A (fr)
DE (1) DE102016211883B4 (fr)
SG (1) SG11201811636RA (fr)
TW (1) TWI628020B (fr)
WO (1) WO2018001793A1 (fr)

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EP3858569A1 (fr) 2020-01-28 2021-08-04 Siltronic AG Procédé de séparation d'une pluralité de disques à partir de pièces au moyen d'une scie à fil lors d'une séquence de processus de séparation
DE102020105223B4 (de) 2020-02-27 2021-11-04 Gebrüder Linck, Maschinenfabrik "Gatterlinck" GmbH & Co. KG Vorrichtung zur Vorhersage eines Blattabrisses eines Bandsägeblattes einer Bandsäge
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EP4302952A1 (fr) 2022-07-07 2024-01-10 Siltronic AG Procédé de séparation simultanée d'une pluralité de disques d'une pièce au moyen d'une scie à fils

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Publication number Publication date
US20200316817A1 (en) 2020-10-08
DE102016211883B4 (de) 2018-02-08
TWI628020B (zh) 2018-07-01
JP2019519385A (ja) 2019-07-11
KR20190025654A (ko) 2019-03-11
CN109414774A (zh) 2019-03-01
SG11201811636RA (en) 2019-01-30
TW201801831A (zh) 2018-01-16
DE102016211883A1 (de) 2018-01-04
WO2018001793A1 (fr) 2018-01-04

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