EP3386699A1 - Panneau en matériau dérivé du bois présentant une émission réduite de composés organiques volatiles (cov) et procédé de fabrication de celui-ci - Google Patents

Panneau en matériau dérivé du bois présentant une émission réduite de composés organiques volatiles (cov) et procédé de fabrication de celui-ci

Info

Publication number
EP3386699A1
EP3386699A1 EP16794249.9A EP16794249A EP3386699A1 EP 3386699 A1 EP3386699 A1 EP 3386699A1 EP 16794249 A EP16794249 A EP 16794249A EP 3386699 A1 EP3386699 A1 EP 3386699A1
Authority
EP
European Patent Office
Prior art keywords
wood
wood chips
heat
treated
chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP16794249.9A
Other languages
German (de)
English (en)
Inventor
Norbert Dr. Kalwa
Jens Siems
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Swiss Krono Tec AG
Original Assignee
Swiss Krono Tec AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Swiss Krono Tec AG filed Critical Swiss Krono Tec AG
Publication of EP3386699A1 publication Critical patent/EP3386699A1/fr
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N1/00—Pretreatment of moulding material
    • B27N1/003—Pretreatment of moulding material for reducing formaldehyde gas emission
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27K—PROCESSES, APPARATUS OR SELECTION OF SUBSTANCES FOR IMPREGNATING, STAINING, DYEING, BLEACHING OF WOOD OR SIMILAR MATERIALS, OR TREATING OF WOOD OR SIMILAR MATERIALS WITH PERMEANT LIQUIDS, NOT OTHERWISE PROVIDED FOR; CHEMICAL OR PHYSICAL TREATMENT OF CORK, CANE, REED, STRAW OR SIMILAR MATERIALS
    • B27K5/00—Treating of wood not provided for in groups B27K1/00, B27K3/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27K—PROCESSES, APPARATUS OR SELECTION OF SUBSTANCES FOR IMPREGNATING, STAINING, DYEING, BLEACHING OF WOOD OR SIMILAR MATERIALS, OR TREATING OF WOOD OR SIMILAR MATERIALS WITH PERMEANT LIQUIDS, NOT OTHERWISE PROVIDED FOR; CHEMICAL OR PHYSICAL TREATMENT OF CORK, CANE, REED, STRAW OR SIMILAR MATERIALS
    • B27K5/00—Treating of wood not provided for in groups B27K1/00, B27K3/00
    • B27K5/001—Heating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27K—PROCESSES, APPARATUS OR SELECTION OF SUBSTANCES FOR IMPREGNATING, STAINING, DYEING, BLEACHING OF WOOD OR SIMILAR MATERIALS, OR TREATING OF WOOD OR SIMILAR MATERIALS WITH PERMEANT LIQUIDS, NOT OTHERWISE PROVIDED FOR; CHEMICAL OR PHYSICAL TREATMENT OF CORK, CANE, REED, STRAW OR SIMILAR MATERIALS
    • B27K5/00—Treating of wood not provided for in groups B27K1/00, B27K3/00
    • B27K5/0085—Thermal treatments, i.e. involving chemical modification of wood at temperatures well over 100°C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N1/00—Pretreatment of moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/02—Manufacture of substantially flat articles, e.g. boards, from particles or fibres from particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/08—Moulding or pressing
    • B27N3/18—Auxiliary operations, e.g. preheating, humidifying, cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27K—PROCESSES, APPARATUS OR SELECTION OF SUBSTANCES FOR IMPREGNATING, STAINING, DYEING, BLEACHING OF WOOD OR SIMILAR MATERIALS, OR TREATING OF WOOD OR SIMILAR MATERIALS WITH PERMEANT LIQUIDS, NOT OTHERWISE PROVIDED FOR; CHEMICAL OR PHYSICAL TREATMENT OF CORK, CANE, REED, STRAW OR SIMILAR MATERIALS
    • B27K2240/00—Purpose of the treatment
    • B27K2240/10—Extraction of components naturally occurring in wood, cork, straw, cane or reed

Definitions

  • VOCs volatile organic compounds
  • the present invention relates to a process for the production of wood-based panels, in particular chipboard or fiberboard according to the preamble of claim 1, with the process produced chipboard according to claim 10, produced by the method wood fiber boards according to claim 12, their use according to claim 14 and the use of heat-treated wood chips produced wood chips and wood fibers according to claim 15.
  • Wood-based panels such as chipboard or wood fiber boards, which in the present case are always medium or high density wood fiber boards (MDF / HDF) are understood to be the basis of many everyday objects, such as furniture or coverings for wall, floor or ceiling.
  • MDF / HDF medium or high density wood fiber boards
  • VOCs volatile organic compounds
  • chipboard and wood fiber boards are used uncoated on a larger scale (eg as tongue and groove panels, interior fittings, etc.).
  • the use of lightweight and super light wood fiber boards is often done without coating.
  • the volatile organic compounds VOC are either already present in the wood material and are released during workup from this or they are formed according to the current state of knowledge by the degradation of unsaturated fatty acids, which in turn are decomposition products of wood.
  • Typical conversion products that occur during processing are, for example, higher aldehydes or organic acids.
  • Organic acids are produced in particular as cleavage products of the wood constituents cellulose, hemicelluloses and lignin, alkanoic acids such as acetic acid, propionic acid, hexanoic acid or aromatic acids preferably being formed.
  • Aldehydes will be formed during the hydrolytic workup from the basic building blocks of cellulose or hemicellulose.
  • the aldehyde furfural is formed from mono- and disaccharides of cellulose or hemicellulose, while aromatic aldehydes can be liberated during the partial hydrolytic exclusion of lignin.
  • Other released aldehydes include i.a. the higher aldehydes hexanal, pentanal or octanal.
  • the pH in the wood matrix can be increased so as to prevent or reduce the acid catalyzed reactions taking place in the wood matrix (Roffael, E., et al, Holzzentralblatt 1990, 16: 1684-1 685).
  • Further possibilities for reducing the emission of volatile organic compounds are the addition of zeolite (WO 2010/136166), bisulfites or pyrosulfites (US2009 / 0130474 A1) as aldehyde scavenger or in the addition of polyamines to reduce released during the aqueous wood pulping aldehydes and organic acids (EP 2 567 798).
  • EP 0639434 B2 a manufacturing method for MDF wood fiber boards is described, which differs from the conventional method in the field of fiber pulping.
  • a CTMP chemo-thermo-mechanical-pulping
  • Na 2 S0 3 or NaOH was added as the chemical component.
  • this method has not yet prevailed on the market.
  • the present invention is therefore based on the technical object of providing a process for the production of wood-based panels, in particular of particle board or wood fiber boards, which allows the production of these wood-based panels with significantly improved VOC emissions. This should be done without any serious change to the usual manufacturing process and not lead to cost increases. In addition, the production itself should not generate higher emissions or place more pressure on the process waters that are usually generated. In addition, the resulting products should be processable without any problems in the subsequent value-added chain. This object is achieved by a process for the production of wood-based panels, in particular of particleboard and wood fiber boards with the features of claim 1 and produced by this method wood-based panels according to claims 1 0 and 1 2.
  • a process for making wood-based panels, in particular chipboard panels and reduced-volatile-matter (VOC) emission wood fiber panels comprising the steps of: a) making wood chips from suitable timbers, b) heat treatment of at least a portion of the woodchips at a temperature between 1 50 ° C and 300 ° C over a period of 1 h to 5 h; c) crushing the non-heat treated wood chips and at least a portion of the heat treated wood chips by machining to obtain wood chips or by digestion to obtain wood fibers; d) lining the wood chips or wood fibers with at least one binder; e) applying the glued wood chips to a conveyor belt to form a multi-layered chipboard or the glued wood fibers on a conveyor belt to form a single-layer fiber cake; and f) pressing the chip cake or the fiber cake into a wood-based panel.
  • VOC reduced-volatile-matter
  • the present method enables the production of wood-based panels such as chipboard and fiberboard using heat-treated wood, in particular heat-treated wood chips, which are introduced into a known manufacturing process in addition to or as an alternative to untreated, non-heat-treated wood chips.
  • a wood-based panel produced by the method according to the invention in particular in the form of a chipboard or a fiberboard with a typical density of 400 to 1200 kg / m 3 comprising wood chips or wood fibers produced from heat-treated wood chips has a reduced emission of volatile organic compounds, especially higher aldehydes and of organic acids.
  • the present method provides the present method, there are further advantages.
  • a simple production of wood-based panels, such as chipboard and wood fiber boards is possible without significantly affecting the usual process chain.
  • the emission of volatile compounds into the air during the manufacturing process of the wood-based panels and the burden of process water is reduced.
  • the presently applied heat treatment of the wood chips is preferably carried out in a saturated steam atmosphere, in particular under an elevated pressure, preferably above 5 bar.
  • the present heat treatment can be understood both as torrefaction known per se and, at least with regard to the pressure conditions, as a modification of the torrefaction known per se.
  • Torrefaction is a thermal treatment process in which the material to be torrefied is typically heated at atmospheric pressure in an oxygen-free gas atmosphere.
  • the treatment of biomass without air access leads to a pyrolytic decomposition and drying.
  • the process is carried out at relatively low temperatures of 250 to 300 ° C for pyrolysis.
  • the aim is, as in the case of coking, to increase the mass and volume-related energy density and thus the calorific value of the raw material, to increase transportability or to reduce the expense of subsequent biomass milling.
  • the step of heat treating the woodchips may be provided in various ways in the present process.
  • the step of heat treatment of the woodchips into the manufacturing process of the wood-based panels, such as chipboard and fiberboard, i. the heat treatment step is integrated into the overall process or process line and takes place online.
  • the step of heat treatment of the wood chips can be carried out separately from the production process of the wood-based panels, such as chipboard and wood fiber boards. Accordingly, the heat treatment step in this embodiment of the present method is outside the overall process or process line.
  • the woodchips are thereby discharged from the manufacturing process and introduced into the heat treatment apparatus (e.g., heat treatment reactor). Subsequently, the heat-treated woodchips may possibly be introduced again into the conventional manufacturing process after an intermediate storage. This allows a high flexibility in the manufacturing process.
  • the wood chips used in the present case may have a length between 10 to 100 mm, preferably 20 to 90 mm, particularly preferably 30 to 80 mm; a width between 5 to 70 mm, preferably 1 0 to 50 mm, particularly preferably 15 to 20 mm; and a thickness between 1 and 30 mm, preferably between 2 and 25 mm, particularly preferably between 3 and 20 mm.
  • the wood chips are heat treated at temperatures between 200 ° C and 280 ° C, more preferably between 220 ° C and 260 ° C.
  • the heat treatment process of the wood chips may be between 1 and 5 hours, preferably between 2 and 3 hours, with the duration of the process varying depending on the amount and type of starting material used.
  • the process de heat treatment is preferably terminated at a mass loss of wood chips from 1 0 to 30%, preferably 1 5 to 20%.
  • the wood chips are heat-treated by heating in a low-oxygen or oxygen-free atmosphere, in particular in a saturated steam atmosphere. This can be done under atmospheric pressure.
  • the heat treatment process preferably takes place at temperatures between 1 60 ° C and 220 ° C and pressures of 6 bar to 16 bar.
  • woodchips are heat treated at a moisture content of 20-50% by weight, i. no previous drying of the wood chips takes place here, but the wood chips are fed to the heat treatment device after further machining without further pretreatment.
  • the presently used heat treatment reactor can be present as a batch plant or as a continuously operated plant.
  • the pyrolysis gases released during the heat treatment process essentially from hemicelluloses and other low molecular weight compounds are used to generate process energy.
  • the amount of gas mixture formed as gaseous fuel is sufficient to operate the process energetically self-sufficient.
  • the heat-treated woodchips are preferably cooled to room temperature and, if appropriate, temporarily stored or returned to the production process directly, if necessary after moistening.
  • the heat-treated woodchips are cooled and watered in a water bath, wherein at least one wetting agent is added to the water.
  • the wetting agent for example a conventional surfactant, facilitates the wetting of the hydrophobic surface of the woodchip chips produced by the heat treatment with water.
  • the amount of wetting agent is in the water bath, in which the wood chips are transferred at 0, 1 to 1, 0% by weight. Watering positively influences the subsequent cutting or defibering process.
  • the wetting of the chips or fibers with binders containing water as a solvent is thereby improved.
  • the moisture content of the heat-treated chips is adjusted to 5 to 20%, preferably 1 0 to 1 5%.
  • the moisture content of the untreated, non-heat treated wood chips is adjusted accordingly.
  • the woodchips are in this step e.g. washed and cooked.
  • the water treatment is desirable so that the wood chips can be chipped or shredded.
  • without water in the machining or defibration would be very unwanted dust.
  • a machining process of the woodchips in a chipper or a defibration process of the wood chips in a refiner wherein wood chips or the wood fibers during the fiberization process also a wetting agent for improving the water wetting of the heat-treated wood or wood chips can also be added.
  • the wood chips produced in the cutting process are divided into fine and coarse chip material, wherein the larger wood chips are preferably used in the middle layer of the chipboard and the smaller wood chips are preferably used in the cover layers. It is preferred if the wood chips used in the middle layer were produced from heat-treated wood chips, since these typically have a dark color. When using the dark colored chips in the middle layer, the plate optics is thus not affected.
  • the middle layer is typically about 2/3 of a particle board, the effect on emission reduction is not adversely affected.
  • the wood fibers produced by the defibration process have a length of between 1, 5 mm and 20 mm and a thickness of between 0.05 mm and 1 mm.
  • the wood chips after the machining process or the wood fibers after the defibration process are brought into contact with at least one binder suitable for crosslinking the wood chips or fibers, the contacting of the wood chips and wood fibers with the binder in each case in different ways can be done.
  • the wood fibers can be contacted with the at least one binder in step d) in a blow-line process in which the binder is injected into the stream of wood fibers. It is possible that the binders described below for wood fiber crosslinking in the blow-line are fed to a wood fiber-steam mixture.
  • wood chips are preferably contacted with the binder in a mixing device.
  • the amount of binder added depends on the type of binder and the type of wood-based panel.
  • the amount of binder to be applied to the wood fibers is from 3 to 20% by weight, preferably from 5 to 15% by weight, more preferably from 8 to 12% by weight. If, on the other hand, polyurethane-containing binders, such as PMDI, are used for wood fiber boards, the necessary amount of binder is reduced to 1 to 10% by weight, preferably 2 to 8% by weight, particularly preferably 4 to 6% by weight.
  • Binders based on formaldehyde are preferably used in the case of wood chip boards, with binder amounts of from 5 to 8% by weight, preferably from 6 to 7% by weight, and from 6 to 10% by weight, preferably from 8 to 9% by weight, for the middle layer. be used.
  • the amount of binder in the middle layer is between 2 and 5% by weight, preferably 3% by weight, and in the top layer between 4 and 8% by weight, preferably 5% by weight.
  • a polymer adhesive is preferably used as a binder, which is selected from the group consisting of formaldehyde adhesives, polyurethane adhesives, epoxy adhesives, polyester adhesives, wherein mainly formaldehyde adhesives are used.
  • formaldehyde adhesive in particular, a phenol-formaldehyde resin adhesive (PF), a cresol / resorcinol-formaldehyde resin adhesive, urea-formaldehyde resin adhesive (UF), and / or melamine-formaldehyde resin adhesive (MF) can be used.
  • Polyurethane adhesives based on aromatic polyisocyanates in particular polydiphenylmethane diisocyanate (PMDI), tolylene diisocyanate (TDI) and / or diphenylmethane diisocyanate (MDI), with PMDI being particularly preferred, are available to a lesser extent as an alternative to the formaldehyde adhesive.
  • PMDI polydiphenylmethane diisocyanate
  • TDI tolylene diisocyanate
  • MDI diphenylmethane diisocyanate
  • the flame retardant may typically be added in an amount of between 1 and 20% by weight, preferably between 5 and 15% by weight, more preferably 10% by weight, of the wood fiber-binder mixture.
  • Typical flame retardants are selected from the group comprising phosphates, borates, in particular ammonium polyphosphate, tris (tri-bromneopentyl) phosphate, zinc borate or boric acid complexes of polyhydric alcohols.
  • the wood chips or wood fibers are dried to a degree of moisture of 1 to 1 0%, preferably 3 to 5%.
  • the drying process is preferably carried out in a one-step process, e.g. in a drum dryer, whereas wood fibers can be dried in a two-stage process.
  • the dried wood chips or wood fibers are then sorted according to their size or sighted and preferably stored, for example, in silos or bunkers.
  • the screening of the chips or fibers after the drying process is typically associated with a post-cleaning.
  • the fibers are placed in an air stream and freed either largely by vortex formation, sharp deflections, impact vision, Steigluftsichtung or a combination of several effects of heavy particles such as glue lumps.
  • the fibers are again separated by cyclone from the air flow and fed to further use. In the case of sighting of wood chips, these are subdivided into coarser chips for the middle class and finer chips for the outer layers.
  • the gluing of the wood fibers can be done before drying.
  • the gluing of the wood chamfers can also be done after drying. In the case of the use of wood chips, however, the gluing is done after the screening, wherein the Beieimen done by mixing chips and glue.
  • the glued wood chips or wood fibers are sprinkled on a conveyor belt to form a chip cake or fiber cake.
  • the scattering station typically used in the case of wood fibers consists of a dosing bunker, a mat diffusion and a mat smoothing.
  • wood shavings it is customary to work with wind scattering, in which case firstly a first covering layer, followed by the middle layer and finally a second covering layer, is spread.
  • the chip cake or fiber cake is then first pre-pressed and then pressed hot at temperatures between 1 00 ° C and 250 ° C, preferably 130 ° C and 220 ° C, especially at 200 ° C.
  • the chip cake or the fiber cake is first weighed after spreading and measured the moisture.
  • the chip or fiber cake then passes into the pre-press.
  • the cake is reduced in thickness during the cold pre-compaction, so that the subsequent hot presses can be charged more efficiently and the risk of damage to the cake is reduced.
  • the trimming of the compacted cake or mat follows.
  • side strips are separated from the mat, so that the corresponding desired plate width can be produced.
  • the side strips are in front of the spreader in the Process returned.
  • Other measuring devices for density control or metal detection may follow.
  • a Mattenbesprühung to improve the surface qualities or acceleration of the Mattwartissermung can follow.
  • the hot pressing which can be clocked or continuously performed.
  • continuous hot pressing is preferred.
  • continuous presses are used, which work with a press belt or press plates, via which the pressure and the temperature are transmitted.
  • the tape is supported either by a roll carpet, a rod carpet or an oil pad against the mostly with thermal oil (more rarely with steam) heated heating plates.
  • This press system enables the production of plate thicknesses between 1, 5 mm and 60 mm.
  • On calender presses only thin chipboard or fibreboard can be produced. The pressing takes place here with press rolls and an outer belt on a heated calender roll.
  • the pressed plates are assembled. This is usually followed by a series of quality control measurements, in particular thickness control.
  • the present method for producing a particle board with reduced VOC emission comprises the following steps: a1) producing wood chips from suitable woods, b1) if necessary pre-drying the wood chips, c1) heat treatment of at least part of the wood chips in a Temperature between 1 50 ° C and 300 ° C over a period of 1 h to 5 h, d1) water treatment of the heat-treated wood chips, e1) cutting of the non-heat-treated woodchips and at least part of the heat-treated woodchips into woodchips; f1) sifting of the wood chips; (gl) cladding wood chips produced from heat-treated woodchips or a mixture of wood shavings produced from non-heat-treated wood chips and wood shavings produced from heat-treated wood chips with at least one binder; h1) sprinkling the glued wood chips onto a conveyor belt to form a multi-layered chipboard, the wood chips being spread over one another as first cover layer, middle layer and second cover layer; i1) pressing
  • the present method for producing a wood fiber board with reduced VOC emission comprises the following steps: a2) producing wood chips from suitable woods, b2) if necessary pre-drying the wood chips, c2) heat treatment of at least a portion of the wood chips in a Temperature between 1 50 ° C and 300 ° C over a period of 1 h to 5 h, d2) water treatment of the heat-treated wood chips, e2) fiber pulping of the non-heat-treated wood chips and at least part of the heat-treated wood chips to wood fibers; f2) mixing the wood fibers produced from heat-treated wood chips or a mixture of wood fibers produced from non-heat-treated wood chips and wood fibers produced from heat-treated wood chips with at least one binder; g2) sprinkling the glued wood fibers onto a conveyor belt to form a single-layered fiber cake, h2) pre-pressing the fiber cake, and i2) hot pressing the fiber cake to a fiberboard.
  • the use of heat-treated woodchips for the production of particle boards and fiberboard has a number of advantages.
  • the wood chips and wood fibers produced from the heat-treated wood chips are particularly easy to dry, which is due in particular to the low hydrophilicity of the heat-treated wood.
  • This is also advantageous for the use of the wood fiberboards produced, since the wood chips or wood fibers produced from the heat-treated wood chips have a lower equilibrium moisture content at defined temperatures and humidities than the non-heat-treated wood.
  • Another positive aspect of the use of heat-treated woodchips as starting material is that a homogenization of the starting raw material wood is achieved. This is of particular economic importance, since the use of wood chips for the production of chipboard, wood fiber boards or other wood materials, the seasonal variations of the raw material wood must be considered. Another advantage is that heat treated woodchips are not subject to biodegradation or other alterations due to storage, allowing storage of the heat treated woodchips for an extended period of time. Furthermore, no ingredients are washed out by contact with water, as they have been destroyed in the heat treatment process.
  • the present method enables the production of a particle board and fibrous board having reduced emission of volatile organic compounds (VOCs), which comprise wood chips or wood fibers produced from heat-treated wood chips, respectively.
  • VOCs volatile organic compounds
  • the present chipboard may consist entirely of wood chips produced from heat-treated wood chips or consist of a mixture of untreated (ie not heat-treated) wood chips and wood chips produced from heat-treated wood chips.
  • the present fiberboard may be wholly made of wood fibers made of heat-treated wood chips or may consist of a mixture of wood fibers made from untreated (ie not heat-treated) wood chips and wood fibers made from heat-treated wood chips.
  • the present chipboard or wood fiber board has a reduced emission of aldehydes released during the wood pulping, in particular pentanal, hexanal or octanal, and / or of organic acids, in particular acetic acid.
  • the present wood-based panel in the form of a chipboard or wood fiber board may have a bulk density between 400 and 1200 kg / m 3 , preferably between 500 and 1000 kg / m 3 , particularly preferably between 600 and 800 kg / m 3 .
  • the thickness of the present wood-based panel as chipboard or wood fiber board may be between 3 and 20 mm, preferably between 5 and 1 5 mm, in particular, a thickness of 1 0 mm is preferred.
  • the present chipboard consists of 60 to 90% by weight, preferably 70 to 80% by weight of wood chips and 5 to 20% by weight, preferably 10 to 15% by weight of binders.
  • the present wood fiber board consists of a fiber mixture comprising 60 to 90% by weight, preferably 70 to 80% by weight of wood fibers and 5 to 20% by weight, preferably 1 0 to 1 5% by weight of binders.
  • both the present wood chip board and the present wood fiber board may consist of a mixture of wood shavings / wood fibers produced from non-heat treated wood chips and wood shavings / wood fibers made of heat treated wood chips.
  • the mixture used in the chipboard and in the wood fiberboard may be between 10 and 50% by weight, preferably between 20 and 30% by weight, of chips / fibers produced from non-heat treated woodchips and between 50 and 90% by weight, preferably between 70 and 80% by weight. comprise chips / fibers produced from heat-treated wood chips.
  • the chips obtained from the heat-treated woodchips are preferably used in the middle layer.
  • Both the present chipboard and the present fiberboard can be used as a low-emission wood chip or wood fiber board for furniture and floor, wall or ceiling coverings.
  • the object of the present invention is also achieved with the use of wood chips or wood fibers produced from heat-treated wood chips according to claim 15. Accordingly, wood chips and wood fibers produced from heat-treated woodchips are used to reduce the emission of volatile organic compounds (VOCs) from wood chip boards or wood fiber boards.
  • VOCs volatile organic compounds
  • the wood chips and wood fibers produced from heat-treated woodchips are used to reduce aldehydes and / or organic acids released during wood pulping.
  • the wood chips / wood fibers produced from heat-treated woodchips are presently preferably used for reducing the emission of organic acids, in particular for reducing the emission of acetic acid and hexanoic acid.
  • Organic acids are produced in particular as cleavage products of the wood constituents cellulose, hemicelluloses and lignin, alkanoic acids such as acetic acid, propionic acid, hexanoic acid or aromatic acids preferably being formed.
  • wood shavings / wood fibers made from heat treated woodchips to reduce the emission of aldehydes. In this case, it is particularly preferred if the wood fibers are used to reduce aldehydes released during the aqueous wood pulping process.
  • the wood chips or wood fibers produced from heat-treated wood chips are used to reduce the emission of C1-C10 aldehydes, particularly preferably pentanal, hexanal or octanal.
  • Figure 1 is a schematic representation of a first embodiment of the inventive method for producing a wood fiber board
  • FIG. 2 is a schematic representation of a second embodiment of the method according to the invention for producing a wood fiber board.
  • the first embodiment of the method according to the invention shown in FIG. 1 describes the individual method steps beginning with the provision of the wood starting product to the finished fibreboard.
  • suitable wood starting material for producing the woodchips is first provided.
  • wood source material all conifers, hardwoods or mixtures thereof are suitable.
  • the roundwood is debarked and shredded in wood chippers or drum chippers (step 2), whereby the size of the wood chippings can be controlled accordingly.
  • step 3 After comminution and provision of the wood chips, they are possibly subjected to a predrying process, wherein a moisture content of 5-1 0% is set in relation to the initial moisture content of the woodchips.
  • a predrying process wherein a moisture content of 5-1 0% is set in relation to the initial moisture content of the woodchips.
  • step 3 At least some of the optionally predried woodchips are removed from the conventional production process and introduced into a heat treatment reactor (step 3).
  • the heat treatment of the discharged wood chips takes place in a temperature range between 220 ° and 260 ° C.
  • the resulting pyrolysis gases are used to generate the energy required for the process plant.
  • the heat-treated woodchips After completion of the heat treatment, which takes in the present case about 2 hours, the heat-treated woodchips be reintroduced into the process and optionally together with the non-heat treated wood chips in a washing and cooking step 4 back to a humidity of 1 0-20 % brought.
  • step 5 the wood fibers are subjected to the pulping process in a refiner (step 5), whereby a suitable wetting agent is supplied to the wood fibers in the course of the pulping process.
  • the wood fibers can be mixed immediately after the fiber pulping with a liquid binder and optionally a flame retardant (step 6).
  • the contacting of the wood fibers with the liquid binder can be carried out in this process stage, for example in a blow-Iine method.
  • the gluing step 6 is followed by a drying process of the glued wood fibers (step 7), wherein this drying process can take place in two stages I, II.
  • the dryer is designed as a 2-stage dryer, with the main drying in stage 1 being done by means of hot gases (air or superheated steam) and after-drying in stage 2, where it is also possible to use hot air or superheated steam.
  • the mixture is separated in / after each stage by means of separation cyclone and capsule plants.
  • the dried wood fibers are sorted according to their size (step 8).
  • the glued wood fibers are scattered on a conveyor belt (step 9), the formed fiber cake initially fed to a pre-press (step 1 0) and finally pressed in the hot press (step 1 1) to a large-sized wood fiber board.
  • the wood fiber board obtained is assembled in a suitable manner.
  • the second embodiment shown in Figure 2 differs from the first embodiment shown in Figure 1 in that the step of heat treatment of the woodchips (step 3) is integrated into the manufacturing process of the wood fiber boards, i.
  • the heat treatment step is integrated into the overall process or process line and takes place online. Removal of wood chips from the process line for heat treatment is thus eliminated. This is particularly advantageous if the wood fiber board is made entirely from wood fibers obtained from heat-treated wood chips.
  • Embodiment 1 Wood fiber board, in particular MDF
  • Wood chips are kept undried (humidity: approx. 50%, format: approx. 5 x 5 cm, thickness: approx. 1 cm) in a continuous heat treatment device at 220 ° C under saturated steam for approx. 2 h.
  • the device consists of a conveyor through which the wood chips are transported slowly by means of a screw conveyor.
  • the chips are cooled in the wood chips laundry and then led to the normal defibration.
  • the wood chips washing contained 0.1% of a commercially available surfactant. This was added to improve the wetting of the hydrophobic chips.
  • the water of the laundry showed a clear lower staining and exposure to organic compounds was reduced by about 90%.
  • the wood chips resulting after defibration were glued in the blowline with a commercially available urea-formaldehyde glue and dried. Subsequently, the fibers were scattered and processed into MDF having a density of 650 kg / m 3 and a thickness of 10 mm.
  • the resulting MDF is then tested for VOC emission according to the AgBB scheme along with a blank sample (from non-heat treated wood chips). For reasons of time, the 3-day value was determined.
  • Chamber parameters temperature 23C ° C; Humidity 50% + - 5%; Air change 0.5 / h + - 0.1 / h; Loading 1 m 2 / m 3; Chamber volume 225 m 3
  • Embodiment 2 Chipboard
  • the production of particleboard is generally known.
  • the heat treated wood chips analogous to Example 1 are fed to a chipper. After cutting, the wood chips are dried to a residual moisture content of approx. 2% in a drum dryer. After drying, the wood chips are sorted and separated into coarser chips for the middle layer and finer chips for the top layer.
  • the chips After filling with urea-formaldehyde glue, the chips are scattered to multilayer chip cake, wherein the chips used in the middle layer of heat treated wood chips was obtained, and pressed at temperatures of about 200 ° C to plates.

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Forests & Forestry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Dry Formation Of Fiberboard And The Like (AREA)

Abstract

La présente invention concerne un procédé de fabrication de panneaux en matériau dérivé du bois, notamment de panneaux en aggloméré et de panneaux à base de fibres de bois, avec une émission réduite de composés organiques volatils (COV). Le procédé comprend les étapes consistant à : a) produire des copeaux de bois à partir de bois approprié, b) traiter thermiquement au moins une partie des copeaux de bois à une température comprise entre 150°C et 300°C sur une durée de 1h à 5h ; c) broyer les copeaux de bois non traités thermiquement et au moins une partie des copeaux de bois traités thermiquement par découpage pour obtenir des copeaux de bois ou par pulpage pour obtenir des fibres de bois ; d) encoller les copeaux de bois ou les fibres de bois avec au moins un liant ; e) appliquer les copeaux de bois encollées sur une bande transporteuse avec formation d'une galette de particules multicouches ou les fibres de bois encollées sur une bande transporteuse avec formation d'une gâteau de fibres monocouche ; et f) comprimer la galette de particules ou le gâteau de fibres pour obtenir un panneau en matériau dérivé du bois. La présente invention concerne également un panneau aggloméré et un panneau de fibres de bois produit par ce procédé.
EP16794249.9A 2015-12-07 2016-11-03 Panneau en matériau dérivé du bois présentant une émission réduite de composés organiques volatiles (cov) et procédé de fabrication de celui-ci Ceased EP3386699A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP15198210.5A EP3178622B1 (fr) 2015-12-07 2015-12-07 Procédé de fabrication d'une plaque en matériau dérivé du bois présentant une émission réduit de composés organiques volatiles (cov)
PCT/EP2016/076568 WO2017097506A1 (fr) 2015-12-07 2016-11-03 Panneau en matériau dérivé du bois présentant une émission réduite de composés organiques volatiles (cov) et procédé de fabrication de celui-ci

Publications (1)

Publication Number Publication Date
EP3386699A1 true EP3386699A1 (fr) 2018-10-17

Family

ID=54834693

Family Applications (2)

Application Number Title Priority Date Filing Date
EP15198210.5A Active EP3178622B1 (fr) 2015-12-07 2015-12-07 Procédé de fabrication d'une plaque en matériau dérivé du bois présentant une émission réduit de composés organiques volatiles (cov)
EP16794249.9A Ceased EP3386699A1 (fr) 2015-12-07 2016-11-03 Panneau en matériau dérivé du bois présentant une émission réduite de composés organiques volatiles (cov) et procédé de fabrication de celui-ci

Family Applications Before (1)

Application Number Title Priority Date Filing Date
EP15198210.5A Active EP3178622B1 (fr) 2015-12-07 2015-12-07 Procédé de fabrication d'une plaque en matériau dérivé du bois présentant une émission réduit de composés organiques volatiles (cov)

Country Status (9)

Country Link
US (2) US10399245B2 (fr)
EP (2) EP3178622B1 (fr)
JP (2) JP6622423B2 (fr)
CA (1) CA3007578A1 (fr)
ES (1) ES2687495T3 (fr)
PL (1) PL3178622T3 (fr)
PT (1) PT3178622T (fr)
RU (2) RU2689571C1 (fr)
WO (1) WO2017097506A1 (fr)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2660426T3 (es) * 2015-11-18 2018-03-22 SWISS KRONO Tec AG Tablero de material derivado de la madera OSB (oriented strand board) con propiedades mejoradas y procedimiento para su producción
CN109746991B (zh) * 2018-12-29 2023-08-01 湖北宝源木业有限公司 设置有阻燃剂喷洒装置的湿刨片输送装置及阻燃剂喷洒方法
KR102114579B1 (ko) * 2019-03-18 2020-05-22 장직수 친환경 섬유판과 그의 제조 방법
DE102019122059A1 (de) * 2019-08-16 2021-02-18 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Herstellung eines Holz-Formteils
CN110815485A (zh) * 2019-10-09 2020-02-21 寿光市鲁丽木业股份有限公司 一种防水抗菌定向刨花板及其制备方法
CN110948630A (zh) * 2019-12-21 2020-04-03 寿光市鲁丽木业股份有限公司 一种表层为超薄大片刨花的定向刨花板及其制备工艺
JP7064552B1 (ja) 2020-10-30 2022-05-10 大建工業株式会社 木質ボード
JP2022118558A (ja) * 2021-02-02 2022-08-15 大建工業株式会社 木質ボード用の木質小薄片及びその製造方法
JP2022118559A (ja) * 2021-02-02 2022-08-15 大建工業株式会社 木質ボードの製造方法
JP7064630B1 (ja) 2021-02-19 2022-05-10 大建工業株式会社 木質積層ボード
JP7064638B1 (ja) 2021-05-28 2022-05-10 大建工業株式会社 木質複合材、内装材、床材及び防音床材
JP7072781B1 (ja) 2021-09-09 2022-05-23 大建工業株式会社 木質複合材及び床材
EP4241950A1 (fr) * 2022-03-10 2023-09-13 SWISS KRONO Tec AG Procédé de fabrication d'un panneau de particules de bois, ainsi que panneau de particules de bois
JP7174185B1 (ja) 2022-04-28 2022-11-17 大建工業株式会社 木質ボード
JP7174186B1 (ja) 2022-04-28 2022-11-17 大建工業株式会社 木質ボード
CN115401762A (zh) * 2022-07-11 2022-11-29 大亚人造板集团有限公司 一种enf级难燃空心刨花板的制造工艺

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU551190A1 (ru) * 1975-12-03 1977-03-25 Всесоюзный Научно-Исследовательский Институт Деревообрабатывающей Промышленности Способ получени древесноволокнистых плит
FR2512053B1 (fr) 1981-08-28 1985-08-02 Armines Procede de transformation de matiere ligneuse d'origine vegetale et matiere d'origine vegetale ligneuse transformee par torrefaction
US5641819A (en) * 1992-03-06 1997-06-24 Campbell; Craig C. Method and novel composition board products
DE4327774A1 (de) 1993-08-18 1995-02-23 Fraunhofer Ges Forschung Verfahren zur Herstellung von mitteldichten Holzfaserplatten (MDF)
JP2000280208A (ja) 1999-03-29 2000-10-10 Yamaha Corp 木質繊維板及びその製造法
DE102004010796A1 (de) * 2004-03-05 2005-09-22 Roffael, Edmone, Prof. Dr.-Ing. Verfahren zur Verminderung der Formaldehydabgabe von Lignocellulose haltigen Holzwerkstoffen, insbesondere von mitteldichten Faserplatten (MDF)
WO2006039526A2 (fr) * 2004-09-30 2006-04-13 Jeld-Wen, Inc. Traitement du bois pour la production de structures de construction et autres produits du bois
FR2883788B1 (fr) * 2005-04-04 2011-08-19 Edmond Pierre Picard Procede de traitement thermique de bois, installation pour la mise en oeuvre du procede, et du bois traite thermiquement
US20090130474A1 (en) 2005-07-06 2009-05-21 Ipposha Oil Industries Co., Ltd. Scavenger for aldehyde(s) and a manufacturing method of a woody panel using the same
RU2437755C2 (ru) * 2006-01-17 2011-12-27 Басф Се Способ сокращения выделения формальдегида в древесных материалах
DE102007038041A1 (de) * 2007-08-10 2009-02-12 Kronotec Ag Verfahren zur Vermeidung der Emission von Aldehyden und flüchtigen organischen Verbindungen aus Holzwerkstoffen
RU74099U1 (ru) * 2008-02-12 2008-06-20 Анатолий Васильевич Бычков Устройство производства древесноволокнистых плит
DE102009023643B4 (de) 2009-05-28 2016-08-18 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Holzwerkstoffprodukt und Verfahren zu dessen Herstellung
NZ601675A (en) * 2010-02-04 2014-02-28 Titan Wood Ltd Process for the acetylation of wood elements
EP2447332B1 (fr) 2010-10-27 2014-01-22 Kronotec AG Colle hybride et son utilisation dans des plaques en bois
US20120202041A1 (en) * 2010-12-17 2012-08-09 Basf Se Multilayer lignocellulose-containing moldings having low formaldehyde emission
FI20115570L (fi) * 2011-06-09 2012-12-10 Ekolite Oy Menetelmä luonnonkuitukomposiittimateriaalin valmistamiseksi, aikaan saadut tuotteet ja niiden sovellusmenetelmät
EP2567798B1 (fr) 2011-09-12 2013-07-17 Kronotec AG Utilisation de polyamine dans des matières dérivées du bois pour la réduction de l'émission d'aldéhydes et/ou d'acides
JP5965670B2 (ja) * 2012-03-01 2016-08-10 国立研究開発法人森林総合研究所 熱処理木材の製造方法
FR2989016A1 (fr) * 2012-04-06 2013-10-11 Dumoulin Bois Procede d'obtention de panneaux fibreux a partir de bois modifie thermiquement comportant un motif en relief sur au moins l'une des faces
EP2765178A1 (fr) 2013-02-07 2014-08-13 Arbaflame Technology AS Procédé de production de matériau de biomasse enrichie en carbone
EP2889112A1 (fr) * 2013-12-27 2015-07-01 "Latvian State Institute of Wood Chemistry" Derived public person Procédé de traitement hydrothermique de bois
CN104690803B (zh) 2015-02-14 2017-05-24 广西丰林木业集团股份有限公司 一种非甲醛豆粕纤维板的制造方法
ES2660426T3 (es) * 2015-11-18 2018-03-22 SWISS KRONO Tec AG Tablero de material derivado de la madera OSB (oriented strand board) con propiedades mejoradas y procedimiento para su producción

Also Published As

Publication number Publication date
JP2018536568A (ja) 2018-12-13
RU2019112232A3 (fr) 2021-11-18
EP3178622A1 (fr) 2017-06-14
US11148317B2 (en) 2021-10-19
RU2019112232A (ru) 2019-07-15
PL3178622T3 (pl) 2018-12-31
PT3178622T (pt) 2018-10-30
CA3007578A1 (fr) 2017-06-15
EP3178622B1 (fr) 2018-07-04
JP2020023195A (ja) 2020-02-13
US10399245B2 (en) 2019-09-03
RU2689571C1 (ru) 2019-05-28
JP6622423B2 (ja) 2019-12-18
US20190329445A1 (en) 2019-10-31
US20180345529A1 (en) 2018-12-06
WO2017097506A1 (fr) 2017-06-15
ES2687495T8 (es) 2019-09-18
JP6832411B2 (ja) 2021-02-24
ES2687495T3 (es) 2018-10-25
RU2766678C2 (ru) 2022-03-15

Similar Documents

Publication Publication Date Title
EP3178622B1 (fr) Procédé de fabrication d'une plaque en matériau dérivé du bois présentant une émission réduit de composés organiques volatiles (cov)
DE60009165T2 (de) Herstellung von hochwertigen produkten aus abfällen
EP3377283B1 (fr) Plaque en matériau dérivé du bois osb (panneau de lamelles orientées) présentant des caractéristiques améliorées et son procédé de fabrication
DE102006006655A1 (de) Cellulose- bzw. lignocellulosehaltige Verbundwerkstoffe auf der Basis eines auf Silan basierenden Komposits als Bindemittel
DE69730412T2 (de) Verfahren zur Herstellung von Celluloseverbundwerkstoffen
DE102006062285B4 (de) Faserplatte und Verfahren zu deren Herstellung
EP3620282A1 (fr) Procédé de fabrication de panneaux en matériaux dérivés du bois osb à faible émission de composés organiques volatils (cov)
EP3268190B1 (fr) Procédé de fabrication d'un matériau à base de particules de bois et durcisseur employé dans ledit matériau pour aminoplaste
DE102010001719B4 (de) Verfahren zur Herstellung von Verbundwerkstoffen
EP2974841B1 (fr) Procede de fabrication d'un panneau de fibres
DE102007054123B4 (de) Verfahren zur Herstellung von Holzfaserplatten mit verringerter Formaldehydemission, hoher Feuchtebeständigkeit und Hydrolyseresistenz der Verleimung
EP3150345B1 (fr) Materiaux isolants en fibres de bois presentant une faible emission de composes organiques volatiles (cov) et son procede de fabrication
DE102008050428A1 (de) Verfahren zur Herstellung von mitteldichten Faserplatten (MDF) mit alkalisch härtenden Phenolformaldehydharzen
EP2853648B1 (fr) Utilisation de particules de cuir dans des plaques en matériau bois pour la réduction des émissions de composés organiques volatiles (COV)
DE102011118009A1 (de) Verfahren zur Herstellung von OSB-Platten und Wafer-Platten aus Palmen
DE2744425C2 (de) Trockenverfahren zur Herstellung von Faserformkörpern aus gegenüber Stammholzmaterial unterschiedlichem pflanzlichem lignocellulosehaltigem Material, sowie Einrichtung zur Durchführung dieses Verfahren
EP2765166B1 (fr) Utilisation d'une composition contenant du phosphate dans des matières dérivées du bois destinées à réduire l'émission de aldéhydes et/ou acides
EP4122662A1 (fr) Procédé de fabrication de panneau fibreux à émission réduite de cov
DE102008023007A1 (de) Verfahren zur Herstellung von Holzfaserplatten mit verringerter Formaldehydemission, hoher Feuchtebeständigkeit und Hydrolyseresistenz der Verleimung

Legal Events

Date Code Title Description
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: UNKNOWN

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE

PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20180613

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

DAV Request for validation of the european patent (deleted)
DAX Request for extension of the european patent (deleted)
RIN1 Information on inventor provided before grant (corrected)

Inventor name: DR. KALWA, NORBERT

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: EXAMINATION IS IN PROGRESS

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: EXAMINATION IS IN PROGRESS

17Q First examination report despatched

Effective date: 20201118

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: EXAMINATION IS IN PROGRESS

REG Reference to a national code

Ref country code: DE

Ref legal event code: R003

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION HAS BEEN REFUSED

18R Application refused

Effective date: 20230820