EP3178622A1 - Plaque en matériau dérivé du bois présentant une faible émission de composés organiques volatiles (cov) et son procédé de fabrication - Google Patents
Plaque en matériau dérivé du bois présentant une faible émission de composés organiques volatiles (cov) et son procédé de fabrication Download PDFInfo
- Publication number
- EP3178622A1 EP3178622A1 EP15198210.5A EP15198210A EP3178622A1 EP 3178622 A1 EP3178622 A1 EP 3178622A1 EP 15198210 A EP15198210 A EP 15198210A EP 3178622 A1 EP3178622 A1 EP 3178622A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- wood
- wood chips
- heat
- treated
- chips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002023 wood Substances 0.000 title claims abstract description 149
- 238000000034 method Methods 0.000 title claims abstract description 73
- 239000012855 volatile organic compound Substances 0.000 title claims abstract description 33
- 239000000463 material Substances 0.000 title description 6
- 229920002522 Wood fibre Polymers 0.000 claims abstract description 96
- 239000002025 wood fiber Substances 0.000 claims abstract description 96
- 239000010875 treated wood Substances 0.000 claims abstract description 52
- 230000008569 process Effects 0.000 claims abstract description 44
- 239000011093 chipboard Substances 0.000 claims abstract description 41
- 238000004519 manufacturing process Methods 0.000 claims abstract description 35
- 239000011230 binding agent Substances 0.000 claims abstract description 30
- 239000000835 fiber Substances 0.000 claims abstract description 30
- 239000011094 fiberboard Substances 0.000 claims abstract description 16
- 238000004026 adhesive bonding Methods 0.000 claims abstract description 10
- 238000003825 pressing Methods 0.000 claims abstract description 8
- 230000029087 digestion Effects 0.000 claims abstract description 3
- 239000002356 single layer Substances 0.000 claims abstract description 3
- 238000010438 heat treatment Methods 0.000 claims description 32
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 16
- 239000000203 mixture Substances 0.000 claims description 15
- 239000012298 atmosphere Substances 0.000 claims description 6
- 239000000080 wetting agent Substances 0.000 claims description 6
- 229920006395 saturated elastomer Polymers 0.000 claims description 5
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 21
- 239000010410 layer Substances 0.000 description 20
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 18
- 239000000853 adhesive Substances 0.000 description 16
- 230000001070 adhesive effect Effects 0.000 description 16
- 150000001299 aldehydes Chemical class 0.000 description 14
- 238000001035 drying Methods 0.000 description 11
- 238000004537 pulping Methods 0.000 description 11
- JARKCYVAAOWBJS-UHFFFAOYSA-N hexanal Chemical compound CCCCCC=O JARKCYVAAOWBJS-UHFFFAOYSA-N 0.000 description 8
- NUJGJRNETVAIRJ-UHFFFAOYSA-N octanal Chemical compound CCCCCCCC=O NUJGJRNETVAIRJ-UHFFFAOYSA-N 0.000 description 8
- 150000007524 organic acids Chemical class 0.000 description 8
- 235000005985 organic acids Nutrition 0.000 description 8
- HGBOYTHUEUWSSQ-UHFFFAOYSA-N pentanal Chemical compound CCCCC=O HGBOYTHUEUWSSQ-UHFFFAOYSA-N 0.000 description 8
- 239000000047 product Substances 0.000 description 7
- 239000007789 gas Substances 0.000 description 6
- 238000003754 machining Methods 0.000 description 6
- 229920002488 Hemicellulose Polymers 0.000 description 5
- 239000004814 polyurethane Substances 0.000 description 5
- 229920002635 polyurethane Polymers 0.000 description 5
- 241000196324 Embryophyta Species 0.000 description 4
- 229920002678 cellulose Polymers 0.000 description 4
- 239000001913 cellulose Substances 0.000 description 4
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 4
- 239000003063 flame retardant Substances 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 238000007731 hot pressing Methods 0.000 description 4
- FUZZWVXGSFPDMH-UHFFFAOYSA-N n-hexanoic acid Natural products CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 238000009736 wetting Methods 0.000 description 4
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 3
- WWZKQHOCKIZLMA-UHFFFAOYSA-N Caprylic acid Natural products CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 229920001807 Urea-formaldehyde Polymers 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- GONOPSZTUGRENK-UHFFFAOYSA-N benzyl(trichloro)silane Chemical compound Cl[Si](Cl)(Cl)CC1=CC=CC=C1 GONOPSZTUGRENK-UHFFFAOYSA-N 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 229920005610 lignin Polymers 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 238000000197 pyrolysis Methods 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000007858 starting material Substances 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 2
- 239000002028 Biomass Substances 0.000 description 2
- 241000273930 Brevoortia tyrannus Species 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 159000000032 aromatic acids Chemical class 0.000 description 2
- 239000012496 blank sample Substances 0.000 description 2
- 238000003776 cleavage reaction Methods 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005056 compaction Methods 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- HYBBIBNJHNGZAN-UHFFFAOYSA-N furfural Chemical compound O=CC1=CC=CO1 HYBBIBNJHNGZAN-UHFFFAOYSA-N 0.000 description 2
- 230000003301 hydrolyzing effect Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- ODGAOXROABLFNM-UHFFFAOYSA-N polynoxylin Chemical compound O=C.NC(N)=O ODGAOXROABLFNM-UHFFFAOYSA-N 0.000 description 2
- 235000019260 propionic acid Nutrition 0.000 description 2
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 2
- 230000007017 scission Effects 0.000 description 2
- 238000012216 screening Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- 238000010626 work up procedure Methods 0.000 description 2
- DGXAGETVRDOQFP-UHFFFAOYSA-N 2,6-dihydroxybenzaldehyde Chemical compound OC1=CC=CC(O)=C1C=O DGXAGETVRDOQFP-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 239000004114 Ammonium polyphosphate Substances 0.000 description 1
- 241000972773 Aulopiformes Species 0.000 description 1
- 241000771208 Buchanania arborescens Species 0.000 description 1
- 244000025254 Cannabis sativa Species 0.000 description 1
- 235000012766 Cannabis sativa ssp. sativa var. sativa Nutrition 0.000 description 1
- 235000012765 Cannabis sativa ssp. sativa var. spontanea Nutrition 0.000 description 1
- 241000218631 Coniferophyta Species 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical class OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 description 1
- 229910021536 Zeolite Inorganic materials 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- GZCGUPFRVQAUEE-SLPGGIOYSA-N aldehydo-D-glucose Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C=O GZCGUPFRVQAUEE-SLPGGIOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 235000019826 ammonium polyphosphate Nutrition 0.000 description 1
- 229920001276 ammonium polyphosphate Polymers 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 150000003934 aromatic aldehydes Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 238000006065 biodegradation reaction Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical class OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 150000001642 boronic acid derivatives Chemical class 0.000 description 1
- 235000009120 camo Nutrition 0.000 description 1
- 239000002775 capsule Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- 235000005607 chanvre indien Nutrition 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000004939 coking Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000012084 conversion product Substances 0.000 description 1
- 238000010411 cooking Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- 150000002016 disaccharides Chemical class 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 230000003203 everyday effect Effects 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 239000011121 hardwood Substances 0.000 description 1
- 239000011487 hemp Substances 0.000 description 1
- 238000000265 homogenisation Methods 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 230000005661 hydrophobic surface Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000012432 intermediate storage Methods 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 150000002772 monosaccharides Chemical class 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 235000021317 phosphate Nutrition 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 235000019515 salmon Nutrition 0.000 description 1
- 230000001932 seasonal effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000010186 staining Methods 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 238000007669 thermal treatment Methods 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
- JEJAMASKDTUEBZ-UHFFFAOYSA-N tris(1,1,3-tribromo-2,2-dimethylpropyl) phosphate Chemical compound BrCC(C)(C)C(Br)(Br)OP(=O)(OC(Br)(Br)C(C)(C)CBr)OC(Br)(Br)C(C)(C)CBr JEJAMASKDTUEBZ-UHFFFAOYSA-N 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
- 235000021122 unsaturated fatty acids Nutrition 0.000 description 1
- 150000004670 unsaturated fatty acids Chemical class 0.000 description 1
- 239000003643 water by type Substances 0.000 description 1
- 210000002268 wool Anatomy 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
- B27N1/00—Pretreatment of moulding material
- B27N1/003—Pretreatment of moulding material for reducing formaldehyde gas emission
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27K—PROCESSES, APPARATUS OR SELECTION OF SUBSTANCES FOR IMPREGNATING, STAINING, DYEING, BLEACHING OF WOOD OR SIMILAR MATERIALS, OR TREATING OF WOOD OR SIMILAR MATERIALS WITH PERMEANT LIQUIDS, NOT OTHERWISE PROVIDED FOR; CHEMICAL OR PHYSICAL TREATMENT OF CORK, CANE, REED, STRAW OR SIMILAR MATERIALS
- B27K5/00—Treating of wood not provided for in groups B27K1/00, B27K3/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27K—PROCESSES, APPARATUS OR SELECTION OF SUBSTANCES FOR IMPREGNATING, STAINING, DYEING, BLEACHING OF WOOD OR SIMILAR MATERIALS, OR TREATING OF WOOD OR SIMILAR MATERIALS WITH PERMEANT LIQUIDS, NOT OTHERWISE PROVIDED FOR; CHEMICAL OR PHYSICAL TREATMENT OF CORK, CANE, REED, STRAW OR SIMILAR MATERIALS
- B27K5/00—Treating of wood not provided for in groups B27K1/00, B27K3/00
- B27K5/001—Heating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27K—PROCESSES, APPARATUS OR SELECTION OF SUBSTANCES FOR IMPREGNATING, STAINING, DYEING, BLEACHING OF WOOD OR SIMILAR MATERIALS, OR TREATING OF WOOD OR SIMILAR MATERIALS WITH PERMEANT LIQUIDS, NOT OTHERWISE PROVIDED FOR; CHEMICAL OR PHYSICAL TREATMENT OF CORK, CANE, REED, STRAW OR SIMILAR MATERIALS
- B27K5/00—Treating of wood not provided for in groups B27K1/00, B27K3/00
- B27K5/0085—Thermal treatments, i.e. involving chemical modification of wood at temperatures well over 100°C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
- B27N1/00—Pretreatment of moulding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
- B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
- B27N3/02—Manufacture of substantially flat articles, e.g. boards, from particles or fibres from particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
- B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
- B27N3/08—Moulding or pressing
- B27N3/18—Auxiliary operations, e.g. preheating, humidifying, cutting-off
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27K—PROCESSES, APPARATUS OR SELECTION OF SUBSTANCES FOR IMPREGNATING, STAINING, DYEING, BLEACHING OF WOOD OR SIMILAR MATERIALS, OR TREATING OF WOOD OR SIMILAR MATERIALS WITH PERMEANT LIQUIDS, NOT OTHERWISE PROVIDED FOR; CHEMICAL OR PHYSICAL TREATMENT OF CORK, CANE, REED, STRAW OR SIMILAR MATERIALS
- B27K2240/00—Purpose of the treatment
- B27K2240/10—Extraction of components naturally occurring in wood, cork, straw, cane or reed
Definitions
- the present invention relates to a process for the production of wood-based panels, in particular chipboard or fiberboard according to the preamble of claim 1, with the process produced chipboard according to claim 10, produced by the method wood fiber boards according to claim 12, their use according to claim 14 and the use of heat-treated wood chips produced wood chips and wood fibers according to claim 15.
- Wood-based panels such as chipboard or wood fiber boards, which in the present case are always medium or high density wood fiber boards (MDF / HDF) are understood to be the basis of many everyday objects, such as furniture or coverings for wall, floor or ceiling.
- MDF / HDF medium or high density wood fiber boards
- VOCs volatile organic compounds
- chipboard and wood fiber boards are used uncoated on a larger scale (eg as tongue and groove panels, interior fittings, etc.).
- the use of lightweight and super light wood fiber boards is often done without coating.
- AgBB scheme by assuming emissions of a space loading of 1 m 2 / m 3 and a defined air change (0.5 / h).
- air exchange of 0.5 / h is often well below in modern low-energy houses. This, in combination, can lead to higher room concentrations of wood constituents.
- Volatile organic compounds also called VOCs, include volatile organic compounds that readily evaporate or are already present as gas at lower temperatures, such as room temperature.
- the volatile organic compounds VOC are either already present in the wood material and are released during workup from this or they are formed according to the current state of knowledge by the degradation of unsaturated fatty acids, which in turn are decomposition products of wood.
- Typical conversion products that occur during processing are, for example, higher aldehydes or organic acids.
- Organic acids are produced in particular as cleavage products of the wood constituents cellulose, hemicelluloses and lignin, alkanoic acids such as acetic acid, propionic acid, hexanoic acid or aromatic acids preferably being formed.
- Aldehydes will be formed during the hydrolytic workup from the basic building blocks of cellulose or hemicellulose.
- the aldehyde furfural is formed from mono- and disaccharides of cellulose or hemicellulose, while aromatic aldehydes can be liberated during the partial hydrolytic exclusion of lignin.
- Other released aldehydes include i.a. the higher aldehydes hexanal, pentanal or octanal.
- alkaline substances it is also possible by adding alkaline substances to increase the pH in the wood matrix so as to prevent or reduce the acid-catalyzed reactions taking place in the wood matrix ( Roffael, E., et al, Holzzentralblatt 1990, 116: 1684-1685 ).
- Other options in reducing the emission of volatile organic compound are the addition of zeolite (WO 2010/136106 ), Bisulfites or pyrosulfites ( US2009 / 0130474 A1 ) as aldehyde scavengers or in the addition of polyamines for reducing aldehydes and organic acids released during aqueous wood pulping ( EP 2 567 798 ).
- the present invention is therefore based on the technical object of providing a process for the production of wood-based panels, in particular of chipboards or fiberboard, which enables the production of these panels with significantly improved VOC emissions. This should be done without any serious change to the usual manufacturing process and not lead to cost increases. In addition, the production itself should not generate higher emissions or place more pressure on the process waters that are usually generated. In addition, the resulting products should be processable without any problems in the subsequent value-added chain.
- the present method enables the production of wood-based panels such as chipboard and fiberboard using heat-treated wood, in particular heat-treated wood chips, which are introduced into a known manufacturing process in addition to or as an alternative to untreated, non-heat-treated wood chips.
- a wood-based panel produced by the method according to the invention in particular in the form of a chipboard or a fiberboard with a typical density of 400 to 1200 kg / m 3 comprising wood chips or wood fibers produced from heat-treated wood chips has a reduced emission of volatile organic compounds, especially higher aldehydes and of organic acids.
- the presently applied heat treatment of the wood chips is preferably carried out in a saturated steam atmosphere, in particular under an elevated pressure, preferably above 5 bar.
- Torrefaction is a thermal treatment process in which the material to be torrefied is typically heated at atmospheric pressure in an oxygen-free gas atmosphere.
- the treatment of biomass without air access leads to a pyrolytic decomposition and drying.
- the process is carried out at relatively low temperatures of 250 to 300 ° C for pyrolysis.
- the aim is, as in the case of coking, to increase the mass and volume-related energy density and thus the calorific value of the raw material, to increase transportability or to reduce the expense of subsequent biomass milling.
- the step of heat treating the woodchips may be provided in various ways in the present process.
- the step of heat treatment of the woodchips into the manufacturing process of the wood-based panels, such as chipboard and fiberboard, i. the heat treatment step is integrated into the overall process or process line and takes place online.
- the step of heat treatment of the wood chips can be carried out separately from the production process of the wood-based panels, such as chipboard and wood fiber boards. Accordingly, the heat treatment step in this embodiment of the present method is outside the overall process or process line.
- the woodchips are thereby discharged from the manufacturing process and introduced into the heat treatment apparatus (e.g., heat treatment reactor). Subsequently, the heat-treated woodchips may possibly be introduced again into the conventional manufacturing process after an intermediate storage. This allows a high flexibility in the manufacturing process.
- the woodchips used herein may have a length between 10 to 100 mm, preferably 20 to 90 mm, particularly preferably 30 to 80 mm; a width between 5 to 70 mm, preferably 10 to 50 mm, particularly preferably 15 to 20 mm; and a thickness between 1 and 30 mm, preferably between 2 and 25 mm, particularly preferably between 3 and 20 mm.
- the wood chips are heat treated at temperatures between 200 ° C and 280 ° C, more preferably between 220 ° C and 260 ° C.
- the heat treatment process of the wood chips may be between 1 and 5 hours, preferably between 2 and 3 hours, with the duration of the process varying depending on the amount and type of starting material used.
- the process of heat treatment is preferably completed at a mass loss of the woodchips of 10 to 30%, preferably 15 to 20%.
- the wood chips are heat-treated by heating in a low-oxygen or oxygen-free atmosphere, in particular in a saturated steam atmosphere. This can be done under atmospheric pressure.
- the heat treatment process preferably proceeds at temperatures between 160 ° C and 220 ° C and pressures of 6 bar to 16 bar.
- woodchips are heat treated at a moisture content of 20-50% by weight, i. no previous drying of the wood chips takes place here, but the wood chips are fed to the heat treatment device after further machining without further pretreatment.
- the presently used heat treatment reactor can be present as a batch plant or as a continuously operated plant.
- the pyrolysis gases released during the heat treatment process essentially from hemicelluloses and other low molecular weight compounds are used to generate process energy.
- the amount of gas mixture formed as gaseous fuel is sufficient to operate the process energetically self-sufficient.
- the heat-treated woodchips are preferably cooled to room temperature and, if appropriate, temporarily stored or returned to the production process directly, if necessary after moistening.
- the heat-treated woodchips are cooled and watered in a water bath, wherein at least one wetting agent is added to the water.
- the wetting agent e.g. a conventional surfactant facilitates the wetting of the resulting hydrophobic surface of the woodchips with water by the heat treatment.
- the amount of wetting agent is in the water bath, in which the wood chips are transferred at 0.1 to 1.0% by weight. Watering positively influences the subsequent cutting or defibering process. The wetting of the chips or fibers with binders containing water as a solvent is thereby improved.
- the moisture of the heat-treated wood chips is adjusted to 5 to 20%, preferably 10 to 15%.
- the moisture content of the untreated, non-heat treated wood chips is adjusted accordingly.
- the woodchips are in this step e.g. washed and cooked.
- the water treatment is desirable so that the wood chips can be chipped or shredded.
- without water in the machining or defibration would be very unwanted dust.
- the wood chips produced in the cutting process are divided into fine and coarse chip material, wherein the larger wood chips are preferably used in the middle layer of the chipboard and the smaller wood chips are preferably used in the cover layers. It is preferred if the wood chips used in the middle layer were produced from heat-treated wood chips, since these typically have a dark color. When using the dark colored chips in the middle layer, the plate optics is thus not affected. In addition, since the middle layer is typically about 2/3 of a particle board, the effect on emission reduction is not adversely affected.
- the wood fibers produced by the defibration process have a length between 1.5 mm and 20 mm and a thickness between 0.05 mm and 1 mm.
- the wood chips after the machining process or the wood fibers after the defibration process are brought into contact with at least one binder suitable for crosslinking the wood chips or fibers, the contacting of the wood chips and wood fibers with the binder in each case in different ways can be done.
- the wood fibers can be contacted with the at least one binder in step d) in a blow-line process in which the binder is injected into the stream of wood fibers. It is possible that the binders described below for wood fiber crosslinking in the blow-line are fed to a wood fiber-steam mixture.
- wood chips are preferably contacted with the binder in a mixing device.
- the amount of binder added depends on the type of binder and the type of wood-based panel.
- the amount of binder to be applied to the wood fibers is from 3 to 20% by weight, preferably from 5 to 15% by weight, more preferably from 8 to 12% by weight. If, on the other hand, polyurethane-containing binders, such as PMDI, are used for wood fiber boards, the necessary amount of binder is reduced to 1 to 10% by weight, preferably 2 to 8% by weight, particularly preferably 4 to 6% by weight.
- Binders based on formaldehyde are preferably used in the case of wood chip boards, wherein binder amounts of between 5 and 8% by weight, preferably between 6 and 7% by weight, and for the cover layer between 6 and 10% by weight, preferably between 8 and 9% by weight, are used for the middle layer become.
- binder amounts of between 5 and 8% by weight, preferably between 6 and 7% by weight, and for the cover layer between 6 and 10% by weight, preferably between 8 and 9% by weight, are used for the middle layer become.
- a polyurethane-based binder such as PMDI
- the amount of binder in the middle layer is between 2 and 5% by weight, preferably 3% by weight, and in the top layer between 4 and 8% by weight, preferably 5% by weight.
- a polymer adhesive is preferably used as a binder, which is selected from the group consisting of formaldehyde adhesives, polyurethane adhesives, epoxy adhesives, polyester adhesives, wherein mainly formaldehyde adhesives are used.
- formaldehyde adhesive in particular, a phenol-formaldehyde resin adhesive (PF), a cresol / resorcinol-formaldehyde resin adhesive, urea-formaldehyde resin adhesive (UF), and / or melamine-formaldehyde resin adhesive (MF) can be used.
- PF phenol-formaldehyde resin adhesive
- UF cresol / resorcinol-formaldehyde resin adhesive
- UF urea-formaldehyde resin adhesive
- MF melamine-formaldehyde resin adhesive
- Polyurethane adhesives based on aromatic polyisocyanates in particular polydiphenylmethane diisocyanate (PMDI), tolylene diisocyanate (TDI) and / or diphenylmethane diisocyanate (MDI), with PMDI being particularly preferred, are available to a lesser extent as an alternative to the formaldehyde adhesive.
- PMDI polydiphenylmethane diisocyanate
- TDI tolylene diisocyanate
- MDI diphenylmethane diisocyanate
- the flame retardant may typically be added to the wood fiber-binder mixture in an amount of between 1 and 20% by weight, preferably between 5 and 15% by weight, more preferably 10% by weight.
- Typical flame retardants are selected from the group comprising phosphates, borates, in particular ammonium polyphosphate, tris (tri-bromneopentyl) phosphate, zinc borate or boric acid complexes of polyhydric alcohols.
- the wood chips or wood fibers are dried to a degree of moisture of 1 to 10%, preferably 3 to 5%.
- the drying process is preferably carried out in a one-step process, e.g. in a drum dryer, whereas wood fibers can be dried in a two-stage process.
- the dried wood chips or wood fibers are then sorted according to their size or sighted and preferably stored, for example, in silos or bunkers.
- the screening of the chips or fibers after the drying process is typically associated with a post-cleaning.
- the fibers are placed in an air stream and freed either largely by vortex formation, sharp deflections, impact vision, Steigluftsichtung or a combination of several effects of heavy particles such as glue lumps.
- the fibers are again separated by cyclone from the air flow and fed to further use. In the case of sighting of wood chips, these are subdivided into coarser chips for the middle class and finer chips for the outer layers.
- the gluing of the wood fibers can be done before drying.
- the gluing of the wood chamfers can also be done after drying.
- the gluing is done after the screening, wherein the gluing is done by mixing chips and glue.
- the glued wood chips or wood fibers are sprinkled on a conveyor belt to form a chip cake or fiber cake.
- the scattering station typically used in the case of wood fibers consists of a dosing bunker, a mat diffusion and a mat smoothing.
- wood shavings it is customary to work with wind scattering, in which case firstly a first covering layer, followed by the middle layer and finally a second covering layer, is spread.
- the chip cake or fiber cake is then first pre-pressed and then pressed hot at temperatures between 100 ° C and 250 ° C, preferably 130 ° C and 220 ° C, especially at 200 ° C.
- the chip cake or the fiber cake is first weighed after spreading and measured the moisture.
- the chip or fiber cake then passes into the pre-press.
- the cake is reduced in thickness during the cold pre-compaction, so that the subsequent hot presses can be charged more efficiently and the risk of damage to the cake is reduced.
- the pre-compaction in the run is usually worked with tape pre-pressing, according to the principle of the conveyor belt (rarely with Plattenbandvorpressen, according to the principle of the tank chain, or with Walzenbandvorpressen, according to the principle of pyramid stone transport with round timbers).
- the trimming of the compacted cake or mat follows.
- side strips are separated from the mat, so that the corresponding desired plate width can be produced.
- the side strips are in front of the spreader in the Process returned.
- Other measuring devices for density control or metal detection may follow.
- a Mattenbesprühung to improve the surface qualities or acceleration of the Mattwart bienrmung can follow.
- the hot pressing which can be clocked or continuously performed.
- continuous hot pressing is preferred.
- continuous presses are used, which work with a press belt or press plates, via which the pressure and the temperature are transmitted.
- the tape is supported either by a roll carpet, a rod carpet or an oil pad against the mostly with thermal oil (more rarely with steam) heated heating plates.
- This press system enables the production of plate thicknesses between 1.5 mm and 60 mm.
- On calender presses only thin chipboard or fibreboard can be produced. The pressing takes place here with press rolls and an outer belt on a heated calender roll.
- the pressed plates are assembled. This is usually followed by a series of quality control measurements, in particular thickness control.
- the use of heat-treated woodchips for the production of particle boards and fiberboard has a number of advantages.
- the wood chips and wood fibers produced from the heat-treated wood chips are particularly easy to dry, which is due in particular to the low hydrophilicity of the heat-treated wood.
- This is also advantageous for the use of the wood fiberboards produced, since the wood chips or wood fibers produced from the heat-treated wood chips have a lower equilibrium moisture content at defined temperatures and humidities than the non-heat-treated wood.
- Another positive aspect of the use of heat-treated woodchips as starting material is that a homogenization of the starting raw material wood is achieved. This is of particular economic importance, since the use of wood chips for the production of chipboard, wood fiber boards or other wood materials, the seasonal variations of the raw material wood must be considered. Another advantage is that heat treated woodchips are not subject to biodegradation or other alterations due to storage, allowing storage of the heat treated woodchips for an extended period of time. Furthermore, no ingredients are washed out by contact with water, as they have been destroyed in the heat treatment process.
- the present method enables the production of a particle board and fibrous board having reduced emission of volatile organic compounds (VOCs), which comprise wood chips or wood fibers produced from heat-treated wood chips, respectively.
- VOCs volatile organic compounds
- the present chipboard may consist entirely of wood shavings made from heat-treated wood chips or may consist of a mixture of wood shavings made from untreated (i.e., not heat-treated) wood chips and heat-treated wood chips.
- the present wood fiber board may be wholly made of wood fibers made of heat-treated wood chips, or may consist of a mixture of wood fibers made from untreated (i.e., not heat-treated) wood chips and wood fibers made from heat-treated wood chips.
- the present chipboard or wood fiber board has a reduced emission of aldehydes released during the wood pulping, in particular pentanal, hexanal or octanal, and / or of organic acids, in particular acetic acid.
- the present wood-based panel in the form of a chipboard or wood fiber board may have a bulk density between 400 and 1200 kg / m 3 , preferably between 500 and 1000 kg / m 3 , particularly preferably between 600 and 800 kg / m 3 .
- the thickness of the present wood-based panel as chipboard or wood fiber board may be between 3 and 20 mm, preferably between 5 and 15 mm, in particular, a thickness of 10 mm is preferred.
- the present chipboard consists of 60 to 90% by weight, preferably 70 to 80% by weight of wood chips and 5 to 20% by weight, preferably 10 to 15% by weight of binders.
- the present wood fiber board consists of a fiber mixture comprising 60 to 90% by weight, preferably 70 to 80% by weight of wood fibers and 5 to 20% by weight, preferably 10 to 15% by weight of binders.
- binders preferably 10 to 15% by weight
- both the present wood chip board and the present wood fiber board may consist of a mixture of wood shavings / wood fibers produced from non-heat treated wood chips and wood shavings / wood fibers made of heat treated wood chips.
- the mixture used in the chipboard and in the wood fiberboard may be between 10 and 50% by weight, preferably between 20 and 30% by weight, of chips / fibers produced from non-heat treated woodchips and between 50 and 90% by weight, preferably between 70 and 80% by weight. comprise chips / fibers produced from heat-treated wood chips.
- the chips obtained from the heat-treated woodchips are preferably used in the middle layer.
- Both the present chipboard and the present fiberboard can be used as a low-emission wood chip or wood fiber board for furniture and floor, wall or ceiling coverings.
- the object of the present invention is also achieved with the use of wood chips or wood fibers produced from heat-treated wood chips according to claim 15.
- wood chips and wood fibers produced from heat-treated woodchips are used to reduce the emission of volatile organic compounds (VOCs) from wood chip boards or wood fiber boards.
- VOCs volatile organic compounds
- the wood chips and wood fibers produced from heat-treated woodchips are used to reduce aldehydes and / or organic acids released during wood pulping.
- the wood chips / wood fibers produced from heat-treated woodchips are presently preferably used for reducing the emission of organic acids, in particular for reducing the emission of acetic acid and hexanoic acid.
- Organic acids are produced in particular as cleavage products of the wood constituents cellulose, hemicelluloses and lignin, alkanoic acids such as acetic acid, propionic acid, hexanoic acid or aromatic acids preferably being formed.
- wood shavings / wood fibers made from heat treated woodchips to reduce the emission of aldehydes.
- the wood fibers are used to reduce aldehydes released during the aqueous wood pulping process.
- the wood chips or wood fibers produced from heat-treated wood chips are used to reduce the emission of C1-C10 aldehydes, more preferably pentanal, hexanal or octanal.
- FIG. 1 shown first embodiment of the method according to the invention describes the individual process steps, starting with the provision of the wood output product to the finished wood fiber board.
- step 1 suitable wood starting material for producing the woodchips is first provided.
- wood source material all conifers, hardwoods or mixtures thereof are suitable.
- the roundwood is debarked and shredded in wood chippers or drum chippers (step 2), whereby the size of the wood chippings can be controlled accordingly.
- step 3 At least part of the optionally pre-dried wood chips from the usual manufacturing process is discharged and introduced into a heat treatment reactor (step 3).
- the heat treatment of the discharged wood chips takes place in a temperature range between 220 ° and 260 ° C.
- the resulting pyrolysis gases are used to generate the energy required for the process plant.
- the heat-treated woodchips After completion of the heat treatment, which takes in the present case about 2 hours, the heat-treated woodchips be reintroduced into the process and are optionally together with the non-heat treated woodchips in a washing and cooking step 4 back to a humidity of 10-20% brought.
- step 5 the wood fibers are subjected to the pulping process in a refiner (step 5), whereby a suitable wetting agent is supplied to the wood fibers in the course of the pulping process.
- the wood fibers can be mixed immediately after the fiber pulping with a liquid binder and optionally a flame retardant (step 6). Inklontaktil the wood fibers with the liquid binder can be done in this process step, for example, in a blow-line process.
- the gluing step 6 is followed by a drying process of the glued wood fibers (step 7), wherein this drying process can take place in two stages I, II.
- the dryer is designed as a 2-stage dryer, with the main drying in stage 1 being done by means of hot gases (air or superheated steam) and after-drying in stage 2, where it is also possible to use hot air or superheated steam.
- the mixture is separated in / after each stage by means of separation cyclone and capsule plants.
- the dried wood fibers are sorted according to their size (step 8).
- step 9 the formed fiber cake first fed to a pre-press (step 10) and finally pressed in the hot press (step 11) to a large-sized wood fiber board.
- the wood fiber board obtained is assembled in a suitable manner.
- FIG. 2 shown second embodiment differs from the in FIG. 1 in the first embodiment in that the step of heat treatment of the woodchips (step 3) is integrated into the manufacturing process of the wood fiber boards, ie, the heat treatment step is incorporated into the overall process line and takes place online. Removal of wood chips from the process line for heat treatment is thus eliminated. This is particularly advantageous if the wood fiber board is made entirely from wood fibers obtained from heat-treated wood chips.
- Wood chips are kept undried (humidity: approx. 50%, format: approx. 5 x 5 cm, thickness: approx. 1 cm) in a continuous heat treatment device at 220 ° C under saturated steam for approx. 2 h.
- the device consists of a conveyor through which the wood chips are transported slowly by means of a screw conveyor.
- the chips are cooled in the wood chips laundry and then led to the normal defibration.
- 0.1% of a commercially available surfactant was in the water of the wood chips washing. This was added to improve the wetting of the hydrophobic chips.
- the water of the laundry showed a clear lower staining and exposure to organic compounds was reduced by about 90%.
- the wood chips resulting after defibration were glued in the blowline with a commercially available urea-formaldehyde glue and dried. Subsequently, the fibers were scattered and processed into MDF having a density of 650 kg / m 3 and a thickness of 10 mm.
- the resulting MDF is then tested for VOC emission according to the AgBB scheme along with a blank sample (from non-heat treated wood chips). For reasons of time, the 3-day value was determined.
- Chamber parameters temperature 23C ° C; Humidity 50% + - 5%; Air change 0.5 / h + - 0.1 / h; Load 1m 2 / m 3 ; Chamber volume 225 m 3 parameter Blank sample ⁇ g / m 3 Test plate ⁇ g / m 3 acetic acid 188 9 hexanoic 91 nn hexanal 51 4 pentanal 43 9 octanal 33 5
- the emissions of the quantitatively most important parameters from the test plate are at a significantly lower level.
- the production of particleboard is generally known.
- the heat treated wood chips analogous to Example 1 are fed to a chipper. After cutting, the wood chips are dried to a residual moisture content of approx. 2% in a drum dryer. After drying, the wood chips are sorted and separated into coarser chips for the middle layer and finer chips for the top layer.
- the chips After gluing with urea-formaldehyde glue, the chips are scattered to multilayer chip cake, wherein the chips used in the middle layer of heat treated wood chips was obtained, and pressed at temperatures of about 200 ° C to plates.
Landscapes
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Wood Science & Technology (AREA)
- Forests & Forestry (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Dry Formation Of Fiberboard And The Like (AREA)
Priority Applications (13)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ES15198210.5T ES2687495T3 (es) | 2015-12-07 | 2015-12-07 | Procedimiento para la fabricación de un tablero de material derivado de la madera con emisión reducida de compuestos orgánicos volátiles (VOC) |
PT15198210T PT3178622T (pt) | 2015-12-07 | 2015-12-07 | Processo para a produção de uma placa de derivados da madeira com emissão reduzida de compostos orgânicos voláteis (voc) |
EP15198210.5A EP3178622B1 (fr) | 2015-12-07 | 2015-12-07 | Procédé de fabrication d'une plaque en matériau dérivé du bois présentant une émission réduit de composés organiques volatiles (cov) |
PL15198210T PL3178622T3 (pl) | 2015-12-07 | 2015-12-07 | Sposób wytwarzania płyty drewnopochodnej o obniżonej emisji lotnych związków organicznych (voc) |
EP16794249.9A EP3386699A1 (fr) | 2015-12-07 | 2016-11-03 | Panneau en matériau dérivé du bois présentant une émission réduite de composés organiques volatiles (cov) et procédé de fabrication de celui-ci |
US15/778,882 US10399245B2 (en) | 2015-12-07 | 2016-11-03 | Wood material board with reduced emission of volatile organic compounds (VOCs) and method for the production thereof |
JP2018548275A JP6622423B2 (ja) | 2015-12-07 | 2016-11-03 | 揮発性有機化合物(voc)の放出が抑制された木質材料ボード、および当該木質材料ボードの製造方法 |
CA3007578A CA3007578A1 (fr) | 2015-12-07 | 2016-11-03 | Panneau en materiau derive du bois presentant une emission reduite de composes organiques volatiles (cov) et procede de fabrication de celui-ci |
PCT/EP2016/076568 WO2017097506A1 (fr) | 2015-12-07 | 2016-11-03 | Panneau en matériau dérivé du bois présentant une émission réduite de composés organiques volatiles (cov) et procédé de fabrication de celui-ci |
RU2018124570A RU2689571C1 (ru) | 2015-12-07 | 2016-11-03 | Способ изготовления плит на основе древесного материала с уменьшенным выделением летучих органических соединений |
RU2019112232A RU2766678C2 (ru) | 2015-12-07 | 2019-04-23 | Плита на основе древесного материала с уменьшенным выделением летучих органических соединений (voc) и ее применение |
US16/506,441 US11148317B2 (en) | 2015-12-07 | 2019-07-09 | Wood material board with reduced emission of volatile organic compounds (VOCs) and method for the production thereof |
JP2019210187A JP6832411B2 (ja) | 2015-12-07 | 2019-11-21 | 揮発性有機化合物(voc)の放出が抑制された木質材料ボード、および当該木質材料ボードの製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP15198210.5A EP3178622B1 (fr) | 2015-12-07 | 2015-12-07 | Procédé de fabrication d'une plaque en matériau dérivé du bois présentant une émission réduit de composés organiques volatiles (cov) |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3178622A1 true EP3178622A1 (fr) | 2017-06-14 |
EP3178622B1 EP3178622B1 (fr) | 2018-07-04 |
Family
ID=54834693
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP15198210.5A Active EP3178622B1 (fr) | 2015-12-07 | 2015-12-07 | Procédé de fabrication d'une plaque en matériau dérivé du bois présentant une émission réduit de composés organiques volatiles (cov) |
EP16794249.9A Ceased EP3386699A1 (fr) | 2015-12-07 | 2016-11-03 | Panneau en matériau dérivé du bois présentant une émission réduite de composés organiques volatiles (cov) et procédé de fabrication de celui-ci |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP16794249.9A Ceased EP3386699A1 (fr) | 2015-12-07 | 2016-11-03 | Panneau en matériau dérivé du bois présentant une émission réduite de composés organiques volatiles (cov) et procédé de fabrication de celui-ci |
Country Status (9)
Country | Link |
---|---|
US (2) | US10399245B2 (fr) |
EP (2) | EP3178622B1 (fr) |
JP (2) | JP6622423B2 (fr) |
CA (1) | CA3007578A1 (fr) |
ES (1) | ES2687495T3 (fr) |
PL (1) | PL3178622T3 (fr) |
PT (1) | PT3178622T (fr) |
RU (2) | RU2689571C1 (fr) |
WO (1) | WO2017097506A1 (fr) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110948630A (zh) * | 2019-12-21 | 2020-04-03 | 寿光市鲁丽木业股份有限公司 | 一种表层为超薄大片刨花的定向刨花板及其制备工艺 |
EP3778163A1 (fr) * | 2019-08-16 | 2021-02-17 | Volkswagen AG | Procédé de fabrication d'une partie de moule en bois |
CN115401762A (zh) * | 2022-07-11 | 2022-11-29 | 大亚人造板集团有限公司 | 一种enf级难燃空心刨花板的制造工艺 |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3170635B1 (fr) * | 2015-11-18 | 2017-12-13 | SWISS KRONO Tec AG | Plaque en matériau dérivé du bois osb (panneau de lamelles orientées) présentant des caractéristiques améliorées et son procédé de fabrication |
CN109746991B (zh) * | 2018-12-29 | 2023-08-01 | 湖北宝源木业有限公司 | 设置有阻燃剂喷洒装置的湿刨片输送装置及阻燃剂喷洒方法 |
KR102114579B1 (ko) * | 2019-03-18 | 2020-05-22 | 장직수 | 친환경 섬유판과 그의 제조 방법 |
CN110815485A (zh) * | 2019-10-09 | 2020-02-21 | 寿光市鲁丽木业股份有限公司 | 一种防水抗菌定向刨花板及其制备方法 |
JP7064552B1 (ja) | 2020-10-30 | 2022-05-10 | 大建工業株式会社 | 木質ボード |
JP2022118559A (ja) * | 2021-02-02 | 2022-08-15 | 大建工業株式会社 | 木質ボードの製造方法 |
JP2022118558A (ja) * | 2021-02-02 | 2022-08-15 | 大建工業株式会社 | 木質ボード用の木質小薄片及びその製造方法 |
JP7064630B1 (ja) | 2021-02-19 | 2022-05-10 | 大建工業株式会社 | 木質積層ボード |
JP7064638B1 (ja) | 2021-05-28 | 2022-05-10 | 大建工業株式会社 | 木質複合材、内装材、床材及び防音床材 |
JP7072781B1 (ja) | 2021-09-09 | 2022-05-23 | 大建工業株式会社 | 木質複合材及び床材 |
EP4241950A1 (fr) * | 2022-03-10 | 2023-09-13 | SWISS KRONO Tec AG | Procédé de fabrication d'un panneau de particules de bois, ainsi que panneau de particules de bois |
JP7174185B1 (ja) | 2022-04-28 | 2022-11-17 | 大建工業株式会社 | 木質ボード |
JP7174186B1 (ja) | 2022-04-28 | 2022-11-17 | 大建工業株式会社 | 木質ボード |
WO2024163662A1 (fr) * | 2023-01-31 | 2024-08-08 | Louisiana-Pacific Corporation | Procédé de nettoyage de plateaux de presse à l'aide d'une résine thermodurcissable |
JP7536976B1 (ja) | 2023-09-12 | 2024-08-20 | 大建工業株式会社 | パーティクルボード及びパーティクルボードの製造方法 |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5641819A (en) * | 1992-03-06 | 1997-06-24 | Campbell; Craig C. | Method and novel composition board products |
EP0639434B2 (fr) | 1993-08-18 | 2004-01-07 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Procédé de fabrication de panneaux de moyenne densité en fibres de bois (MDF) |
DE102004010796A1 (de) * | 2004-03-05 | 2005-09-22 | Roffael, Edmone, Prof. Dr.-Ing. | Verfahren zur Verminderung der Formaldehydabgabe von Lignocellulose haltigen Holzwerkstoffen, insbesondere von mitteldichten Faserplatten (MDF) |
FR2883788A1 (fr) * | 2005-04-04 | 2006-10-06 | Edmond Pierre Picard | Procede de traitement thermique de bois, installation pour la mise en oeuvre du procede, et du bois traite thermiquement |
US20090130474A1 (en) | 2005-07-06 | 2009-05-21 | Ipposha Oil Industries Co., Ltd. | Scavenger for aldehyde(s) and a manufacturing method of a woody panel using the same |
WO2010136106A1 (fr) | 2009-05-28 | 2010-12-02 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Matériau à base de bois et procédé pour sa fabrication |
WO2012168563A2 (fr) * | 2011-06-09 | 2012-12-13 | Ekolite Oy | Procédé pour la fabrication d'un matériau composite de fibres naturelles, produits obtenus par celui-ci et leurs procédés d'application |
EP2567798A1 (fr) | 2011-09-12 | 2013-03-13 | Kronotec AG | Utilisation de polyamine dans des matières dérivées du bois pour la réduction de l'émission d'aldéhydes et/ou d'acides |
FR2989016A1 (fr) * | 2012-04-06 | 2013-10-11 | Dumoulin Bois | Procede d'obtention de panneaux fibreux a partir de bois modifie thermiquement comportant un motif en relief sur au moins l'une des faces |
EP2447332B1 (fr) | 2010-10-27 | 2014-01-22 | Kronotec AG | Colle hybride et son utilisation dans des plaques en bois |
EP2765178A1 (fr) * | 2013-02-07 | 2014-08-13 | Arbaflame Technology AS | Procédé de production de matériau de biomasse enrichie en carbone |
US20150217477A1 (en) * | 2004-09-30 | 2015-08-06 | Jeld-Wen, Inc. | Treatment of wood for the production of building structures and other wood products |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SU551190A1 (ru) * | 1975-12-03 | 1977-03-25 | Всесоюзный Научно-Исследовательский Институт Деревообрабатывающей Промышленности | Способ получени древесноволокнистых плит |
FR2512053B1 (fr) * | 1981-08-28 | 1985-08-02 | Armines | Procede de transformation de matiere ligneuse d'origine vegetale et matiere d'origine vegetale ligneuse transformee par torrefaction |
JP2000280208A (ja) | 1999-03-29 | 2000-10-10 | Yamaha Corp | 木質繊維板及びその製造法 |
RU2437755C2 (ru) * | 2006-01-17 | 2011-12-27 | Басф Се | Способ сокращения выделения формальдегида в древесных материалах |
DE102007038041A1 (de) * | 2007-08-10 | 2009-02-12 | Kronotec Ag | Verfahren zur Vermeidung der Emission von Aldehyden und flüchtigen organischen Verbindungen aus Holzwerkstoffen |
RU74099U1 (ru) * | 2008-02-12 | 2008-06-20 | Анатолий Васильевич Бычков | Устройство производства древесноволокнистых плит |
SG183181A1 (en) * | 2010-02-04 | 2012-09-27 | Titan Wood Ltd | Process for the acetylation of wood elements |
US20120202041A1 (en) * | 2010-12-17 | 2012-08-09 | Basf Se | Multilayer lignocellulose-containing moldings having low formaldehyde emission |
JP5965670B2 (ja) * | 2012-03-01 | 2016-08-10 | 国立研究開発法人森林総合研究所 | 熱処理木材の製造方法 |
EP2889112A1 (fr) * | 2013-12-27 | 2015-07-01 | "Latvian State Institute of Wood Chemistry" Derived public person | Procédé de traitement hydrothermique de bois |
CN104690803B (zh) | 2015-02-14 | 2017-05-24 | 广西丰林木业集团股份有限公司 | 一种非甲醛豆粕纤维板的制造方法 |
EP3170635B1 (fr) * | 2015-11-18 | 2017-12-13 | SWISS KRONO Tec AG | Plaque en matériau dérivé du bois osb (panneau de lamelles orientées) présentant des caractéristiques améliorées et son procédé de fabrication |
-
2015
- 2015-12-07 EP EP15198210.5A patent/EP3178622B1/fr active Active
- 2015-12-07 PT PT15198210T patent/PT3178622T/pt unknown
- 2015-12-07 PL PL15198210T patent/PL3178622T3/pl unknown
- 2015-12-07 ES ES15198210.5T patent/ES2687495T3/es active Active
-
2016
- 2016-11-03 EP EP16794249.9A patent/EP3386699A1/fr not_active Ceased
- 2016-11-03 US US15/778,882 patent/US10399245B2/en active Active
- 2016-11-03 RU RU2018124570A patent/RU2689571C1/ru active
- 2016-11-03 JP JP2018548275A patent/JP6622423B2/ja not_active Expired - Fee Related
- 2016-11-03 WO PCT/EP2016/076568 patent/WO2017097506A1/fr active Application Filing
- 2016-11-03 CA CA3007578A patent/CA3007578A1/fr active Pending
-
2019
- 2019-04-23 RU RU2019112232A patent/RU2766678C2/ru active
- 2019-07-09 US US16/506,441 patent/US11148317B2/en active Active
- 2019-11-21 JP JP2019210187A patent/JP6832411B2/ja active Active
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5641819A (en) * | 1992-03-06 | 1997-06-24 | Campbell; Craig C. | Method and novel composition board products |
EP0639434B2 (fr) | 1993-08-18 | 2004-01-07 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Procédé de fabrication de panneaux de moyenne densité en fibres de bois (MDF) |
DE102004010796A1 (de) * | 2004-03-05 | 2005-09-22 | Roffael, Edmone, Prof. Dr.-Ing. | Verfahren zur Verminderung der Formaldehydabgabe von Lignocellulose haltigen Holzwerkstoffen, insbesondere von mitteldichten Faserplatten (MDF) |
US20150217477A1 (en) * | 2004-09-30 | 2015-08-06 | Jeld-Wen, Inc. | Treatment of wood for the production of building structures and other wood products |
FR2883788A1 (fr) * | 2005-04-04 | 2006-10-06 | Edmond Pierre Picard | Procede de traitement thermique de bois, installation pour la mise en oeuvre du procede, et du bois traite thermiquement |
US20080263890A1 (en) * | 2005-04-04 | 2008-10-30 | Edmond-Pierre Picard | Wood Heat Treating Method, a Plant for Carrying Out Said Method and Heat Treated Wood |
US20090130474A1 (en) | 2005-07-06 | 2009-05-21 | Ipposha Oil Industries Co., Ltd. | Scavenger for aldehyde(s) and a manufacturing method of a woody panel using the same |
WO2010136106A1 (fr) | 2009-05-28 | 2010-12-02 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Matériau à base de bois et procédé pour sa fabrication |
EP2447332B1 (fr) | 2010-10-27 | 2014-01-22 | Kronotec AG | Colle hybride et son utilisation dans des plaques en bois |
WO2012168563A2 (fr) * | 2011-06-09 | 2012-12-13 | Ekolite Oy | Procédé pour la fabrication d'un matériau composite de fibres naturelles, produits obtenus par celui-ci et leurs procédés d'application |
EP2567798A1 (fr) | 2011-09-12 | 2013-03-13 | Kronotec AG | Utilisation de polyamine dans des matières dérivées du bois pour la réduction de l'émission d'aldéhydes et/ou d'acides |
FR2989016A1 (fr) * | 2012-04-06 | 2013-10-11 | Dumoulin Bois | Procede d'obtention de panneaux fibreux a partir de bois modifie thermiquement comportant un motif en relief sur au moins l'une des faces |
EP2765178A1 (fr) * | 2013-02-07 | 2014-08-13 | Arbaflame Technology AS | Procédé de production de matériau de biomasse enrichie en carbone |
Non-Patent Citations (4)
Title |
---|
DATABASE WPI Week 200667, Derwent World Patents Index; AN 2006-638689 * |
M SCHÄFER ET AL: "On the formaldehyde release of wood", HOLZ ALS ROH- UND WERKSTOFF - 58, 31 December 2000 (2000-12-31), pages 259 - 264, XP055282437, Retrieved from the Internet <URL:http://link.springer.com/content/pdf/10.1007/s001070050422.pdf> [retrieved on 20160621] * |
ONER UNSAL ET AL: "PROPERTIES OF WOOD AND WOOD BASED MATERIALS SUBJECTED TO THERMAL TREATMENTS UNDER VARIOUS CONDITIONS Oner UNSAL -Umit BUYUKSARI -Nadir AYRILMIS -Suleyman KORKUT", "WOOD SCIENCE AND ENGINEERING IN THE THIRD MILLENIUM" CONFERENCE, 6 June 2009 (2009-06-06), pages 81 - 94, XP055282372, Retrieved from the Internet <URL:http://www.rta.org/assets/docs/ResearchandArticlesonDualTreatments/properties of wood and wood based materials subjected to thermal treatments under various conditions 2009.pdf> [retrieved on 20160621] * |
ROFFAEL, E. ET AL., HOLZZENTRALBLATT, vol. 116, 1990, pages 1684 - 1685 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3778163A1 (fr) * | 2019-08-16 | 2021-02-17 | Volkswagen AG | Procédé de fabrication d'une partie de moule en bois |
CN110948630A (zh) * | 2019-12-21 | 2020-04-03 | 寿光市鲁丽木业股份有限公司 | 一种表层为超薄大片刨花的定向刨花板及其制备工艺 |
CN115401762A (zh) * | 2022-07-11 | 2022-11-29 | 大亚人造板集团有限公司 | 一种enf级难燃空心刨花板的制造工艺 |
Also Published As
Publication number | Publication date |
---|---|
JP2020023195A (ja) | 2020-02-13 |
RU2766678C2 (ru) | 2022-03-15 |
ES2687495T3 (es) | 2018-10-25 |
WO2017097506A1 (fr) | 2017-06-15 |
ES2687495T8 (es) | 2019-09-18 |
JP6832411B2 (ja) | 2021-02-24 |
US10399245B2 (en) | 2019-09-03 |
EP3178622B1 (fr) | 2018-07-04 |
US20180345529A1 (en) | 2018-12-06 |
CA3007578A1 (fr) | 2017-06-15 |
RU2019112232A3 (fr) | 2021-11-18 |
US11148317B2 (en) | 2021-10-19 |
RU2689571C1 (ru) | 2019-05-28 |
JP6622423B2 (ja) | 2019-12-18 |
JP2018536568A (ja) | 2018-12-13 |
PT3178622T (pt) | 2018-10-30 |
RU2019112232A (ru) | 2019-07-15 |
EP3386699A1 (fr) | 2018-10-17 |
PL3178622T3 (pl) | 2018-12-31 |
US20190329445A1 (en) | 2019-10-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP3178622B1 (fr) | Procédé de fabrication d'une plaque en matériau dérivé du bois présentant une émission réduit de composés organiques volatiles (cov) | |
DE60009165T2 (de) | Herstellung von hochwertigen produkten aus abfällen | |
EP3377283B1 (fr) | Plaque en matériau dérivé du bois osb (panneau de lamelles orientées) présentant des caractéristiques améliorées et son procédé de fabrication | |
DE102006006655A1 (de) | Cellulose- bzw. lignocellulosehaltige Verbundwerkstoffe auf der Basis eines auf Silan basierenden Komposits als Bindemittel | |
EP3615288B1 (fr) | Procédé de fabrication de panneaux de lamelles orientées osb à faible émission sur des composés organiques volatils (cov) | |
EP3453504B1 (fr) | Procédé de fabrication de panneaux de lamelles orientées osb à faible émission sur des composés organiques volatils (cov) | |
DE69730412T2 (de) | Verfahren zur Herstellung von Celluloseverbundwerkstoffen | |
WO2008077793A1 (fr) | Panneau de fibres et son procédé de fabrication | |
EP3268190B1 (fr) | Procédé de fabrication d'un matériau à base de particules de bois et durcisseur employé dans ledit matériau pour aminoplaste | |
EP2567798B1 (fr) | Utilisation de polyamine dans des matières dérivées du bois pour la réduction de l'émission d'aldéhydes et/ou d'acides | |
DE102010001719B4 (de) | Verfahren zur Herstellung von Verbundwerkstoffen | |
EP2974841B1 (fr) | Procede de fabrication d'un panneau de fibres | |
EP3150345B1 (fr) | Materiaux isolants en fibres de bois presentant une faible emission de composes organiques volatiles (cov) et son procede de fabrication | |
EP2853648B1 (fr) | Utilisation de particules de cuir dans des plaques en matériau bois pour la réduction des émissions de composés organiques volatiles (COV) | |
DE102011118009A1 (de) | Verfahren zur Herstellung von OSB-Platten und Wafer-Platten aus Palmen | |
EP4122662B1 (fr) | Procédé de fabrication de panneau fibreux à émission réduite de cov | |
DE10116686A1 (de) | Verfahren zur Aufbereitung von Stroh und anderen Einjahrespflanzen für die Herstellung von Faser-, Span- und Dämmplatten sowie Wandelementen und anderen Formteilen und Verfahren zur Herstellung von Faser-, Span- und Dämmplatten sowie Wandelementen und anderen Formteilen | |
DE2744425C2 (de) | Trockenverfahren zur Herstellung von Faserformkörpern aus gegenüber Stammholzmaterial unterschiedlichem pflanzlichem lignocellulosehaltigem Material, sowie Einrichtung zur Durchführung dieses Verfahren | |
EP2765166B1 (fr) | Utilisation d'une composition contenant du phosphate dans des matières dérivées du bois destinées à réduire l'émission de aldéhydes et/ou acides | |
DE2401282A1 (de) | Verfahren zur herstellung einer matte aus lignocellulosefasern |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20160921 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
AX | Request for extension of the european patent |
Extension state: BA ME |
|
GRAP | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOSNIGR1 |
|
INTG | Intention to grant announced |
Effective date: 20180131 |
|
GRAJ | Information related to disapproval of communication of intention to grant by the applicant or resumption of examination proceedings by the epo deleted |
Free format text: ORIGINAL CODE: EPIDOSDIGR1 |
|
GRAR | Information related to intention to grant a patent recorded |
Free format text: ORIGINAL CODE: EPIDOSNIGR71 |
|
GRAS | Grant fee paid |
Free format text: ORIGINAL CODE: EPIDOSNIGR3 |
|
GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
INTC | Intention to grant announced (deleted) | ||
AK | Designated contracting states |
Kind code of ref document: B1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
INTG | Intention to grant announced |
Effective date: 20180529 |
|
REG | Reference to a national code |
Ref country code: GB Ref legal event code: FG4D Free format text: NOT ENGLISH |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: EP |
|
REG | Reference to a national code |
Ref country code: AT Ref legal event code: REF Ref document number: 1014006 Country of ref document: AT Kind code of ref document: T Effective date: 20180715 |
|
REG | Reference to a national code |
Ref country code: IE Ref legal event code: FG4D Free format text: LANGUAGE OF EP DOCUMENT: GERMAN |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R096 Ref document number: 502015004918 Country of ref document: DE |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: NV Representative=s name: SCHMAUDER AND PARTNER AG PATENT- UND MARKENANW, CH |
|
REG | Reference to a national code |
Ref country code: SE Ref legal event code: TRGR |
|
REG | Reference to a national code |
Ref country code: ES Ref legal event code: FG2A Ref document number: 2687495 Country of ref document: ES Kind code of ref document: T3 Effective date: 20181025 |
|
REG | Reference to a national code |
Ref country code: PT Ref legal event code: SC4A Ref document number: 3178622 Country of ref document: PT Date of ref document: 20181030 Kind code of ref document: T Free format text: AVAILABILITY OF NATIONAL TRANSLATION Effective date: 20180928 |
|
REG | Reference to a national code |
Ref country code: NL Ref legal event code: MP Effective date: 20180704 |
|
REG | Reference to a national code |
Ref country code: LT Ref legal event code: MG4D |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: NL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20180704 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: FI Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20180704 Ref country code: BG Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20181004 Ref country code: CZ Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20180704 Ref country code: LT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20180704 Ref country code: GR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20181005 Ref country code: NO Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20181004 Ref country code: IS Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20181104 Ref country code: RS Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20180704 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: HR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20180704 Ref country code: LV Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20180704 Ref country code: AL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20180704 |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R097 Ref document number: 502015004918 Country of ref document: DE |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: RO Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20180704 Ref country code: EE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20180704 |
|
PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: SK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20180704 Ref country code: SM Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20180704 Ref country code: DK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20180704 |
|
26N | No opposition filed |
Effective date: 20190405 |
|
PLAA | Information modified related to event that no opposition was filed |
Free format text: ORIGINAL CODE: 0009299DELT |
|
PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: PK Free format text: BERICHTIGUNGEN |
|
REG | Reference to a national code |
Ref country code: GB Ref legal event code: S117 Free format text: CORRECTIONS ALLOWED; REQUEST FOR CORRECTION UNDER SECTION 117 FILED ON 18 JULY 2019 ALLOWED ON 5 AUGUST 2019 Ref country code: GB Ref legal event code: S117 Free format text: REQUEST FILED; REQUEST FOR CORRECTION UNDER SECTION 117 FILED ON 18 JULY 2019 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: LU Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20181207 Ref country code: MC Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20180704 Ref country code: SI Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20180704 |
|
D26N | No opposition filed (deleted) | ||
RIN2 | Information on inventor provided after grant (corrected) |
Inventor name: DR. KALWA, NORBERT |
|
26N | No opposition filed |
Effective date: 20190405 |
|
REG | Reference to a national code |
Ref country code: IE Ref legal event code: MM4A |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: IE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20181207 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: MT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20180704 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: MK Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20180704 Ref country code: HU Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO Effective date: 20151207 Ref country code: CY Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20180704 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: TR Payment date: 20221201 Year of fee payment: 8 Ref country code: PT Payment date: 20221128 Year of fee payment: 8 Ref country code: AT Payment date: 20221216 Year of fee payment: 8 Ref country code: SE Payment date: 20221221 Year of fee payment: 8 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: BE Payment date: 20221220 Year of fee payment: 8 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: ES Payment date: 20230119 Year of fee payment: 8 Ref country code: CH Payment date: 20230103 Year of fee payment: 8 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: IT Payment date: 20221230 Year of fee payment: 8 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: GB Payment date: 20231220 Year of fee payment: 9 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: FR Payment date: 20231219 Year of fee payment: 9 Ref country code: DE Payment date: 20231206 Year of fee payment: 9 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: PL Payment date: 20231124 Year of fee payment: 9 |
|
REG | Reference to a national code |
Ref country code: SE Ref legal event code: EUG |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: PL |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: PT Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20240607 |
|
REG | Reference to a national code |
Ref country code: AT Ref legal event code: MM01 Ref document number: 1014006 Country of ref document: AT Kind code of ref document: T Effective date: 20231207 |
|
REG | Reference to a national code |
Ref country code: BE Ref legal event code: MM Effective date: 20231231 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: PT Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20240607 |