EP3372709A4 - Vernickelungsadditiv und satinvernickelungsbad damit - Google Patents

Vernickelungsadditiv und satinvernickelungsbad damit Download PDF

Info

Publication number
EP3372709A4
EP3372709A4 EP15907841.9A EP15907841A EP3372709A4 EP 3372709 A4 EP3372709 A4 EP 3372709A4 EP 15907841 A EP15907841 A EP 15907841A EP 3372709 A4 EP3372709 A4 EP 3372709A4
Authority
EP
European Patent Office
Prior art keywords
nickel
plating
bath containing
containing same
satin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP15907841.9A
Other languages
English (en)
French (fr)
Other versions
EP3372709A1 (de
Inventor
Kazuo Ibata
Kaori Nakayama
Kana Shibata
Toshiaki Fukushima
Shinsuke Takagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JCU Corp
Original Assignee
JCU Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JCU Corp filed Critical JCU Corp
Publication of EP3372709A1 publication Critical patent/EP3372709A1/de
Publication of EP3372709A4 publication Critical patent/EP3372709A4/de
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
EP15907841.9A 2015-11-06 2015-11-06 Vernickelungsadditiv und satinvernickelungsbad damit Withdrawn EP3372709A4 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2015/081404 WO2017077655A1 (ja) 2015-11-06 2015-11-06 ニッケルめっき用添加剤およびこれを含有するサテンニッケルめっき浴

Publications (2)

Publication Number Publication Date
EP3372709A1 EP3372709A1 (de) 2018-09-12
EP3372709A4 true EP3372709A4 (de) 2019-06-19

Family

ID=58663185

Family Applications (1)

Application Number Title Priority Date Filing Date
EP15907841.9A Withdrawn EP3372709A4 (de) 2015-11-06 2015-11-06 Vernickelungsadditiv und satinvernickelungsbad damit

Country Status (7)

Country Link
US (2) US20180327922A1 (de)
EP (1) EP3372709A4 (de)
JP (1) JPWO2017077655A1 (de)
KR (1) KR20180078227A (de)
CN (1) CN108350589A (de)
MX (1) MX2018005706A (de)
WO (1) WO2017077655A1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107190287B (zh) * 2017-05-31 2019-01-29 佛山科学技术学院 一种在不锈钢上电镀珍珠镍的镀液及其电镀方法
CN111850623A (zh) * 2020-05-08 2020-10-30 德锡化学(山东)有限公司 一种用于获得绒面镍层的电镀液及电镀工艺
CN111501071A (zh) * 2020-05-26 2020-08-07 珠海冠宇电池股份有限公司 一种镍电沉积层及包括该镍电沉积层的制件
CN112609211A (zh) * 2020-11-16 2021-04-06 清远市信和实业有限公司 一种珍珠镍起砂剂组合物和珍珠镍电镀工艺
CN114525553B (zh) * 2022-03-01 2023-05-30 九牧厨卫股份有限公司 一种蓝白色复合镀层及其制备方法和蓝白色杀菌产品

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4102755A (en) * 1973-06-01 1978-07-25 Langbein-Pfanhauser Werke Ag Method of and electrolytic bath for the electrodeposition of semibright nickel and nickel-cobalt coatings upon a metal surface
US4728398A (en) * 1985-04-22 1988-03-01 Werner Fluhmann AG Electroplating bath for simultaneous deposition of metal and a permanent solid lubricant
WO2003100137A2 (en) * 2002-05-23 2003-12-04 Atotech Deutschland Gmbh Acid plating bath and method for the electolytic deposition of satin nickel deposits
US20080196625A1 (en) * 2004-09-28 2008-08-21 Ahc Oberflachentechnik Gmbh & Co. Ohg Non-Galvanically Applied Nickel Alloy
US20110233065A1 (en) * 2008-07-08 2011-09-29 Enthone Inc. Electrolyte and method for deposition of matte metal layer

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2626065B2 (ja) * 1989-07-04 1997-07-02 上村工業株式会社 サテンニッケル又はニッケル合金めっき浴及びめっき方法
GB2336371B (en) * 1998-04-14 2002-05-08 Reckitt & Colman Inc Aqueous disinfecting and cleaning compositions
JP3816241B2 (ja) * 1998-07-14 2006-08-30 株式会社大和化成研究所 金属を還元析出させるための水溶液
JP3718790B2 (ja) * 1998-12-24 2005-11-24 石原薬品株式会社 銀及び銀合金メッキ浴
JP2001107296A (ja) * 1999-10-06 2001-04-17 Toto Ltd めっき方法及びめっき製品
WO2008157612A1 (en) * 2007-06-21 2008-12-24 Enthone Inc. Codeposition of copper nanoparticles in through silicon via filling
TWI523976B (zh) * 2010-05-19 2016-03-01 諾菲勒斯系統公司 利用具有雙態抑制劑的電解液之矽穿孔填充
GB201105829D0 (en) * 2011-04-06 2011-05-18 Convatec Technologies Inc Antimicrobial compositions
CN102805715B (zh) * 2012-07-23 2014-09-03 北京天辰空间生物医药研发有限公司 一种免冲洗的皮肤清洁护理产品及其制备方法
CN103054775B (zh) * 2013-01-07 2016-01-20 攀柔莎（江苏）生物科技有限公司 一种绿色环保的杀菌保湿洗手液
CN103083710A (zh) * 2013-01-23 2013-05-08 江苏海伦隐形眼镜有限公司 含海藻糖季铵盐的角膜接触镜护理组合物
JP5938426B2 (ja) * 2014-02-04 2016-06-22 株式会社豊田中央研究所 電気めっきセル、及び、金属皮膜の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4102755A (en) * 1973-06-01 1978-07-25 Langbein-Pfanhauser Werke Ag Method of and electrolytic bath for the electrodeposition of semibright nickel and nickel-cobalt coatings upon a metal surface
US4728398A (en) * 1985-04-22 1988-03-01 Werner Fluhmann AG Electroplating bath for simultaneous deposition of metal and a permanent solid lubricant
WO2003100137A2 (en) * 2002-05-23 2003-12-04 Atotech Deutschland Gmbh Acid plating bath and method for the electolytic deposition of satin nickel deposits
US20080196625A1 (en) * 2004-09-28 2008-08-21 Ahc Oberflachentechnik Gmbh & Co. Ohg Non-Galvanically Applied Nickel Alloy
US20110233065A1 (en) * 2008-07-08 2011-09-29 Enthone Inc. Electrolyte and method for deposition of matte metal layer

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2017077655A1 *

Also Published As

Publication number Publication date
EP3372709A1 (de) 2018-09-12
US20210130969A1 (en) 2021-05-06
KR20180078227A (ko) 2018-07-09
JPWO2017077655A1 (ja) 2018-08-16
US20180327922A1 (en) 2018-11-15
WO2017077655A1 (ja) 2017-05-11
CN108350589A (zh) 2018-07-31
MX2018005706A (es) 2019-03-14

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