EP3292743A1 - Carte de circuit imprimé et son procédé de fabrication - Google Patents

Carte de circuit imprimé et son procédé de fabrication

Info

Publication number
EP3292743A1
EP3292743A1 EP16722569.7A EP16722569A EP3292743A1 EP 3292743 A1 EP3292743 A1 EP 3292743A1 EP 16722569 A EP16722569 A EP 16722569A EP 3292743 A1 EP3292743 A1 EP 3292743A1
Authority
EP
European Patent Office
Prior art keywords
circuit board
substrate
printed circuit
sensor
sensor head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP16722569.7A
Other languages
German (de)
English (en)
Inventor
Johannes Bock
Thomas Schmidt
Bernhard Schuch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vitesco Technologies Germany GmbH
Original Assignee
Conti Temic Microelectronic GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Conti Temic Microelectronic GmbH filed Critical Conti Temic Microelectronic GmbH
Publication of EP3292743A1 publication Critical patent/EP3292743A1/fr
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0082—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for transmission control units, e.g. gearbox controllers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09045—Locally raised area or protrusion of insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending

Definitions

  • the invention relates to a printed circuit board for an electronic component according to the preamble of claim 1.
  • the invention further relates to a method for producing such a printed circuit board.
  • electronic components with an electronic control circuit and associated electronic components such as sensors for different tasks are used. For example, when using the electronic component as a control unit in a transmission by means of a number of sensors speeds of waves and positions of gear actuators are detected.
  • the sensors are electrically connected via electrical leads, in particular stamped grid or flexible foil conductor with the electronic control circuit, which are usually arranged on a printed circuit board.
  • the stamped grid for example, with plastic encapsulated electrical signal ⁇ lines and form with the sensor as an electronic component and a sensor cover a sensor dome.
  • a printed circuit board for an electronic component comprises an electrically insulating substrate, a number of electrically conductive strip conductors and at least one sensor dome with a sensor head and a carrier body for receiving the sensor head.
  • the carrier body is formed integrally with the substrate.
  • the carrier body is formed from the substrate of the printed circuit board, no additional materials for the production of the sensor dome are necessary.
  • the circuit board is thus compared to the prior art much more cost-effectively.
  • costs are reduced in the electrical connection of the sensor dome compared to known printed circuit boards, since the embedded in the substrate tracks for electrical contacting of the sensor dome are used and separate
  • the substrate consists of a fiber reinforced plastic, particularly preferably glass ⁇ fiber reinforced plastic, is formed so that the Lei ⁇ terplatte is inexpensive to manufacture.
  • fiber-reinforced plastic is particularly advantageous as a material for the carrier body, since this allows a very good mechanical stability.
  • the mechanical stability is particularly advantageous when the carrier body with the sensor head and thus the sensor dome protrudes perpendicularly from a surface side of the substrate.
  • the spatially separated arrangement of the sensor head of the Lei ⁇ terplatte is dependent on a position and location of a component whose parameters are to be detected by the sensor head.
  • the sensor head is mechanically and electrically conductively connected to at least one conductor track.
  • the number of tracks is arranged on the surface side as well as within the substrate. For example, to the circuit board multi-layered and has several layers with tracks.
  • the carrier body is formed integrally with the substrate, the already existing in the substrate interconnects for electrical contacting of the sensor head can be used, so that separate electrical leads, in particular punched grid or flexible film conductors, are not required and thus costs compared to the prior art are reducible.
  • the circuit board preferably has a sensor encapsulating the sensor dome. The cover can be laminated to the sensor dome or glued to it.
  • an inventive method for producing the printed circuit board described is provided, wherein the carrier body of the sensor dome is formed integrally with the substrate of the printed circuit board. The method enables a cost-efficient production of the printed circuit board with a reduced cost compared to the prior art and reduced process ⁇ steps, since a separate mounting of the sensor dome on the circuit board is not required.
  • An embodiment of the method provides that the Trä ⁇ gerraj is separated out with a predetermined contour of the substrate by a layer is introduced into the circuit board to which the insulating layers of the circuit terplatte not adhere, wherein at least a portion of the support ⁇ body remains integrally connected to the substrate.
  • the severed carrier body is then positioned with the Sen ⁇ sorkopf in the direction of a vertical axis relative to the surface side of the substrate.
  • the connected part of the carrier body forms the bottom or foot of the sensor dome, whereby a separate connection of the sensor dome to the circuit board is not required.
  • the circuit board is thus produced in a particularly simple manner.
  • Another embodiment of the method provides the following steps:
  • the arrangement of the film and of the sensor head within the substrate can take place, for example, in the liquid state of the substrate, which subsequently hardens.
  • the film can be easily positioned between the layers. Then the layers are joined together.
  • the film is used in the process of easy separation of the carrier body from the substrate, so that perpendicular to the vertical axis no separation process is required.
  • an immersion depth of a separating tool for separating out the carrier body is set as a function of a position of the film in the substrate.
  • FIGS. 1A to 5B show various schematic views of an embodiment of a circuit board according to the invention during manufacture. Corresponding parts are provided in all figures with the same reference numerals.
  • Figures 1A to 5B show various views of a printed circuit board 1 during a manufacturing process.
  • Figures 1A and 1B show the circuit board 1 schematically in a first process step Sl, where figure Lei ⁇ terplatte 1 shows a semi-transparent top view and Figure 1B a sectional view of Figure 1A.
  • the printed circuit board 1 shown is formed from an electrically isolie ⁇ leaders substrate 1.1, and has a number of electrically conductive conductor tracks 1.2, wherein a conductor is shown for example in Figure 2B 1.2.
  • the substrate 1.1 is, for example, a multilayer carrier plate made of a fiber-reinforced
  • Plastic, z. B. epoxy resin is made.
  • the number of printed conductors 1.2 is applied in each case to one layer in the substrate 1.1.
  • FIG. 2B shows a conductor 1.2 by way of example in the interior of the substrate 1.1.
  • the printed circuit board 1 ⁇ at least one connecting surface for electrically con- clocking of (not shown).
  • a film F with a non-stick coating for.
  • the non-stick coating serves to ensure that the film F receives no or at least only a negligibly small connection with the substrate 1.1 of the printed circuit board 1.
  • the film F is formed in accordance with the dimensions of a hither ⁇ alternate end sensor dome S relative to the circuit board. 1
  • the arrangement of the film F in the substrate 1.1 takes place during the manufacture of the circuit board 1 from the substrate 1.1, which is provided, for example, as a casting resin in liquid form and cures. Alternatively, it is also possible to terplatte 1 to produce from several already cured layers.
  • FIGS. 2A and 2B show the printed circuit board 1 in a second method step S2, which adjoins the first method step S1 in terms of time.
  • FIG. 2A shows the circuit board 1 in a semitransparent plan view and FIG. 2B in a sectional view.
  • the printed circuit board 1 is equipped with electronic components, wherein in the embodiments shown as an electronic component, a sensor head 2 of the sensor dome S is arranged on ⁇ .
  • the circuit board 1 can be equipped with other not ge ⁇ showed electronic components.
  • the arrangement of the sensor head 2 also takes place during the production of the printed circuit board 1 from the substrate 1.1, wherein the sensor head 2 is immersed, for example, in the liquid casting resin.
  • the cured layers with corresponding recesses for receiving the sensor and other electronic components, wherein the layers are then joined together.
  • FIG. 2B shows the Sen ⁇ sorkopf 2, which is connected to a conductor track 1.2 in the interior of the substrate 1.1.
  • a contour K of a sensor dome S to be produced is separated from the substrate 1.1.
  • a contour K of a carrier body 2.1 of the sensor dome S shown in greater detail in FIGS. 4A to 5B is cut out.
  • Figures 3A and 3B the circuit board 1 in the third step S3, wherein Figure 3A, the circuit board 1 in a Semi-transparent plan view and Figure 3B shows a sectional view.
  • the The The The The The The The The The The The The The The The The The The The The SeazutMapde contour K is determined by the dimensions of the film F, which is a separating tool, for. B. a milling ⁇ machine, are known.
  • the separator separates the tool carrier body ⁇ then 2.1 K corresponding to the contour of the substrate 1.1 out, one edge of a bottom or foot of the support body 2.1 is connected to the substrate 1.1. For this purpose, for example, at a viewing direction of the in
  • the film F which is a separating tool, for. B. a milling ⁇ machine, are known.
  • the separator separates the tool carrier body ⁇ then 2.1 K corresponding to the contour of the substrate 1.1 out, one edge of a bottom or foot of the support body 2.1 is connected to the substrate 1.1.
  • the film F which is a separating tool, for. B. a milling ⁇ machine, are known.
  • the separator separates the tool carrier body ⁇ then 2.1 K corresponding to
  • the carrier body 2.1 is positioned relative to the printed circuit board 1 in a fourth method step S4 with the sensor head 2 in the direction of a vertical axis z.
  • FIG. 4A and 4B show the printed circuit board 1 in the fourth method step S4, whereby FIG. 4A shows the printed circuit board 1 in a semitransparent plan view and FIG. 4B in a sectional view.
  • the carrier body 2.1, the sensor head 2 and a portion of the conductor 1.2, which together form the sensor dome S are moved in the fourth step S4 in the direction of the vertical axis z until a longitudinal orientation of the support body 2.1 is perpendicular to a flat side of the circuit board 1.
  • the sensor dome S is provided with a cover 2.2, as shown in Figures 5A and 5B.
  • FIG. 5A and 5B show the printed circuit board 1 in a fifth method step S5 subsequent to the fourth method step S4, wherein FIG. 5A shows the printed circuit board 1 in a semitransparent plan view and FIG. 5B in a sectional view.
  • the cover 2.2 is preferably formed of an electrically insulating material and is applied media-tight on the sensor dome S, z. B. by lamination or gluing. By means of the cover 2.2 is the sensor dome S from external influences, eg. As chemically aggressive media such as gear oils, protected. 2.2 In addition, stabilizes the Abde ⁇ ckung the sensor dome S mechanical.
  • the printed circuit board 1 produced in this way is for arrangement in an electronic component in a motor vehicle, for. B. a transmission control unit, suitable.
  • the sensor dome S is - as already mentioned - provided for example for speed detection and / or for detecting positions of gear actuators.
  • the printed circuit board 1 can also have a plurality of sensor diodes S.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

L'invention concerne une carte de circuit imprimé (1) pour un composant électronique, comprenant : un substrat électro-isolant (1.1), - un certain nombre de tracés électroconducteurs (1.2), et - au moins un dôme capteur (S) présentant une tête de capteur (2) et un corps de support (2.1) destiné à recevoir la tête de capteur (2). Selon l'invention, le corps de support (2.1) forme une seule pièce avec le substrat (1.1). L'invention concerne en outre un procédé pour produire un telle carte de circuit imprimé (1).
EP16722569.7A 2015-05-07 2016-04-28 Carte de circuit imprimé et son procédé de fabrication Pending EP3292743A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102015208523.6A DE102015208523A1 (de) 2015-05-07 2015-05-07 Leiterplatte und Verfahren zur Herstellung einer Leiterplatte
PCT/EP2016/059542 WO2016177631A1 (fr) 2015-05-07 2016-04-28 Carte de circuit imprimé et son procédé de fabrication

Publications (1)

Publication Number Publication Date
EP3292743A1 true EP3292743A1 (fr) 2018-03-14

Family

ID=55969104

Family Applications (1)

Application Number Title Priority Date Filing Date
EP16722569.7A Pending EP3292743A1 (fr) 2015-05-07 2016-04-28 Carte de circuit imprimé et son procédé de fabrication

Country Status (7)

Country Link
US (1) US10251276B2 (fr)
EP (1) EP3292743A1 (fr)
JP (1) JP2018515925A (fr)
KR (1) KR20170131593A (fr)
CN (1) CN107535049B (fr)
DE (1) DE102015208523A1 (fr)
WO (1) WO2016177631A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10886208B2 (en) * 2018-10-12 2021-01-05 Advanced Semiconductor Engineering, Inc. Semiconductor device package, electronic assembly and method for manufacturing the same

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4631819A (en) * 1985-05-29 1986-12-30 Motorola, Inc. Low stress, tolerance free method for mounting power devices
US5257718A (en) * 1993-03-26 1993-11-02 Chiu Ming T Method of bending and soldering corners of a folding printed-circuit board
JP2790122B2 (ja) * 1996-05-31 1998-08-27 日本電気株式会社 積層回路基板
JP2003298239A (ja) * 2002-03-28 2003-10-17 Taiyo Yuden Co Ltd 三次元積層モジュール及びそれに用いられる電子部品
JP4069712B2 (ja) * 2002-09-12 2008-04-02 株式会社デンソー 多層プリント基板
JP2004119624A (ja) * 2002-09-25 2004-04-15 Matsushita Electric Works Ltd 回路基板
DE102006007813A1 (de) * 2006-02-17 2007-08-30 Innovative Sensor Technology Ist Ag Verfahren zur Kontaktierung eines Sensorelements mit einer Leiterplatte und entsprechendes Messgerät
JP2008229789A (ja) * 2007-03-22 2008-10-02 Nec Corp 凹部形成方法、凹部形成装置、及び凹部形成用材料
DE102008028300B4 (de) * 2008-06-13 2021-10-07 Tdk Electronics Ag Leiterplatte mit flexiblem Bereich und Verfahren zur Herstellung
US8766099B2 (en) * 2009-09-29 2014-07-01 Apple Inc. Component mounting structures for electronic devices
DE102011006632A1 (de) * 2011-04-01 2012-10-04 Robert Bosch Gmbh Elektronikmodul
DE102011017692A1 (de) * 2011-04-28 2012-10-31 Robert Bosch Gmbh Leiterplattenanordnung mit einem schwingfähigen System
DE102013212940A1 (de) * 2013-06-26 2014-12-31 Zf Friedrichshafen Ag Sensormodul, Mechatronik-Modul und Verfahren zum Herstellen eines Mechatronik-Moduls

Also Published As

Publication number Publication date
CN107535049A (zh) 2018-01-02
JP2018515925A (ja) 2018-06-14
DE102015208523A1 (de) 2016-11-10
WO2016177631A1 (fr) 2016-11-10
KR20170131593A (ko) 2017-11-29
US20180070450A1 (en) 2018-03-08
CN107535049B (zh) 2019-09-03
US10251276B2 (en) 2019-04-02

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