EP3292743A1 - Printed circuit board and a method for producing a printed circuit board - Google Patents
Printed circuit board and a method for producing a printed circuit boardInfo
- Publication number
- EP3292743A1 EP3292743A1 EP16722569.7A EP16722569A EP3292743A1 EP 3292743 A1 EP3292743 A1 EP 3292743A1 EP 16722569 A EP16722569 A EP 16722569A EP 3292743 A1 EP3292743 A1 EP 3292743A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- circuit board
- substrate
- printed circuit
- sensor
- sensor head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 46
- 239000004020 conductor Substances 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims description 20
- 229920002430 Fibre-reinforced plastic Polymers 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 239000011151 fibre-reinforced plastic Substances 0.000 claims description 4
- 238000007654 immersion Methods 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 claims 1
- 239000007788 liquid Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 239000012208 gear oil Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 208000031872 Body Remains Diseases 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0082—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for transmission control units, e.g. gearbox controllers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09045—Locally raised area or protrusion of insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
Definitions
- the invention relates to a printed circuit board for an electronic component according to the preamble of claim 1.
- the invention further relates to a method for producing such a printed circuit board.
- electronic components with an electronic control circuit and associated electronic components such as sensors for different tasks are used. For example, when using the electronic component as a control unit in a transmission by means of a number of sensors speeds of waves and positions of gear actuators are detected.
- the sensors are electrically connected via electrical leads, in particular stamped grid or flexible foil conductor with the electronic control circuit, which are usually arranged on a printed circuit board.
- the stamped grid for example, with plastic encapsulated electrical signal ⁇ lines and form with the sensor as an electronic component and a sensor cover a sensor dome.
- a printed circuit board for an electronic component comprises an electrically insulating substrate, a number of electrically conductive strip conductors and at least one sensor dome with a sensor head and a carrier body for receiving the sensor head.
- the carrier body is formed integrally with the substrate.
- the carrier body is formed from the substrate of the printed circuit board, no additional materials for the production of the sensor dome are necessary.
- the circuit board is thus compared to the prior art much more cost-effectively.
- costs are reduced in the electrical connection of the sensor dome compared to known printed circuit boards, since the embedded in the substrate tracks for electrical contacting of the sensor dome are used and separate
- the substrate consists of a fiber reinforced plastic, particularly preferably glass ⁇ fiber reinforced plastic, is formed so that the Lei ⁇ terplatte is inexpensive to manufacture.
- fiber-reinforced plastic is particularly advantageous as a material for the carrier body, since this allows a very good mechanical stability.
- the mechanical stability is particularly advantageous when the carrier body with the sensor head and thus the sensor dome protrudes perpendicularly from a surface side of the substrate.
- the spatially separated arrangement of the sensor head of the Lei ⁇ terplatte is dependent on a position and location of a component whose parameters are to be detected by the sensor head.
- the sensor head is mechanically and electrically conductively connected to at least one conductor track.
- the number of tracks is arranged on the surface side as well as within the substrate. For example, to the circuit board multi-layered and has several layers with tracks.
- the carrier body is formed integrally with the substrate, the already existing in the substrate interconnects for electrical contacting of the sensor head can be used, so that separate electrical leads, in particular punched grid or flexible film conductors, are not required and thus costs compared to the prior art are reducible.
- the circuit board preferably has a sensor encapsulating the sensor dome. The cover can be laminated to the sensor dome or glued to it.
- an inventive method for producing the printed circuit board described is provided, wherein the carrier body of the sensor dome is formed integrally with the substrate of the printed circuit board. The method enables a cost-efficient production of the printed circuit board with a reduced cost compared to the prior art and reduced process ⁇ steps, since a separate mounting of the sensor dome on the circuit board is not required.
- An embodiment of the method provides that the Trä ⁇ gerraj is separated out with a predetermined contour of the substrate by a layer is introduced into the circuit board to which the insulating layers of the circuit terplatte not adhere, wherein at least a portion of the support ⁇ body remains integrally connected to the substrate.
- the severed carrier body is then positioned with the Sen ⁇ sorkopf in the direction of a vertical axis relative to the surface side of the substrate.
- the connected part of the carrier body forms the bottom or foot of the sensor dome, whereby a separate connection of the sensor dome to the circuit board is not required.
- the circuit board is thus produced in a particularly simple manner.
- Another embodiment of the method provides the following steps:
- the arrangement of the film and of the sensor head within the substrate can take place, for example, in the liquid state of the substrate, which subsequently hardens.
- the film can be easily positioned between the layers. Then the layers are joined together.
- the film is used in the process of easy separation of the carrier body from the substrate, so that perpendicular to the vertical axis no separation process is required.
- an immersion depth of a separating tool for separating out the carrier body is set as a function of a position of the film in the substrate.
- FIGS. 1A to 5B show various schematic views of an embodiment of a circuit board according to the invention during manufacture. Corresponding parts are provided in all figures with the same reference numerals.
- Figures 1A to 5B show various views of a printed circuit board 1 during a manufacturing process.
- Figures 1A and 1B show the circuit board 1 schematically in a first process step Sl, where figure Lei ⁇ terplatte 1 shows a semi-transparent top view and Figure 1B a sectional view of Figure 1A.
- the printed circuit board 1 shown is formed from an electrically isolie ⁇ leaders substrate 1.1, and has a number of electrically conductive conductor tracks 1.2, wherein a conductor is shown for example in Figure 2B 1.2.
- the substrate 1.1 is, for example, a multilayer carrier plate made of a fiber-reinforced
- Plastic, z. B. epoxy resin is made.
- the number of printed conductors 1.2 is applied in each case to one layer in the substrate 1.1.
- FIG. 2B shows a conductor 1.2 by way of example in the interior of the substrate 1.1.
- the printed circuit board 1 ⁇ at least one connecting surface for electrically con- clocking of (not shown).
- a film F with a non-stick coating for.
- the non-stick coating serves to ensure that the film F receives no or at least only a negligibly small connection with the substrate 1.1 of the printed circuit board 1.
- the film F is formed in accordance with the dimensions of a hither ⁇ alternate end sensor dome S relative to the circuit board. 1
- the arrangement of the film F in the substrate 1.1 takes place during the manufacture of the circuit board 1 from the substrate 1.1, which is provided, for example, as a casting resin in liquid form and cures. Alternatively, it is also possible to terplatte 1 to produce from several already cured layers.
- FIGS. 2A and 2B show the printed circuit board 1 in a second method step S2, which adjoins the first method step S1 in terms of time.
- FIG. 2A shows the circuit board 1 in a semitransparent plan view and FIG. 2B in a sectional view.
- the printed circuit board 1 is equipped with electronic components, wherein in the embodiments shown as an electronic component, a sensor head 2 of the sensor dome S is arranged on ⁇ .
- the circuit board 1 can be equipped with other not ge ⁇ showed electronic components.
- the arrangement of the sensor head 2 also takes place during the production of the printed circuit board 1 from the substrate 1.1, wherein the sensor head 2 is immersed, for example, in the liquid casting resin.
- the cured layers with corresponding recesses for receiving the sensor and other electronic components, wherein the layers are then joined together.
- FIG. 2B shows the Sen ⁇ sorkopf 2, which is connected to a conductor track 1.2 in the interior of the substrate 1.1.
- a contour K of a sensor dome S to be produced is separated from the substrate 1.1.
- a contour K of a carrier body 2.1 of the sensor dome S shown in greater detail in FIGS. 4A to 5B is cut out.
- Figures 3A and 3B the circuit board 1 in the third step S3, wherein Figure 3A, the circuit board 1 in a Semi-transparent plan view and Figure 3B shows a sectional view.
- the The The The The The The The The The The The The The The The The The The The The SeazutMapde contour K is determined by the dimensions of the film F, which is a separating tool, for. B. a milling ⁇ machine, are known.
- the separator separates the tool carrier body ⁇ then 2.1 K corresponding to the contour of the substrate 1.1 out, one edge of a bottom or foot of the support body 2.1 is connected to the substrate 1.1. For this purpose, for example, at a viewing direction of the in
- the film F which is a separating tool, for. B. a milling ⁇ machine, are known.
- the separator separates the tool carrier body ⁇ then 2.1 K corresponding to the contour of the substrate 1.1 out, one edge of a bottom or foot of the support body 2.1 is connected to the substrate 1.1.
- the film F which is a separating tool, for. B. a milling ⁇ machine, are known.
- the separator separates the tool carrier body ⁇ then 2.1 K corresponding to
- the carrier body 2.1 is positioned relative to the printed circuit board 1 in a fourth method step S4 with the sensor head 2 in the direction of a vertical axis z.
- FIG. 4A and 4B show the printed circuit board 1 in the fourth method step S4, whereby FIG. 4A shows the printed circuit board 1 in a semitransparent plan view and FIG. 4B in a sectional view.
- the carrier body 2.1, the sensor head 2 and a portion of the conductor 1.2, which together form the sensor dome S are moved in the fourth step S4 in the direction of the vertical axis z until a longitudinal orientation of the support body 2.1 is perpendicular to a flat side of the circuit board 1.
- the sensor dome S is provided with a cover 2.2, as shown in Figures 5A and 5B.
- FIG. 5A and 5B show the printed circuit board 1 in a fifth method step S5 subsequent to the fourth method step S4, wherein FIG. 5A shows the printed circuit board 1 in a semitransparent plan view and FIG. 5B in a sectional view.
- the cover 2.2 is preferably formed of an electrically insulating material and is applied media-tight on the sensor dome S, z. B. by lamination or gluing. By means of the cover 2.2 is the sensor dome S from external influences, eg. As chemically aggressive media such as gear oils, protected. 2.2 In addition, stabilizes the Abde ⁇ ckung the sensor dome S mechanical.
- the printed circuit board 1 produced in this way is for arrangement in an electronic component in a motor vehicle, for. B. a transmission control unit, suitable.
- the sensor dome S is - as already mentioned - provided for example for speed detection and / or for detecting positions of gear actuators.
- the printed circuit board 1 can also have a plurality of sensor diodes S.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102015208523.6A DE102015208523A1 (en) | 2015-05-07 | 2015-05-07 | Printed circuit board and method for producing a printed circuit board |
PCT/EP2016/059542 WO2016177631A1 (en) | 2015-05-07 | 2016-04-28 | Printed circuit board and a method for producing a printed circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
EP3292743A1 true EP3292743A1 (en) | 2018-03-14 |
Family
ID=55969104
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP16722569.7A Ceased EP3292743A1 (en) | 2015-05-07 | 2016-04-28 | Printed circuit board and a method for producing a printed circuit board |
Country Status (7)
Country | Link |
---|---|
US (1) | US10251276B2 (en) |
EP (1) | EP3292743A1 (en) |
JP (1) | JP2018515925A (en) |
KR (1) | KR20170131593A (en) |
CN (1) | CN107535049B (en) |
DE (1) | DE102015208523A1 (en) |
WO (1) | WO2016177631A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10886208B2 (en) * | 2018-10-12 | 2021-01-05 | Advanced Semiconductor Engineering, Inc. | Semiconductor device package, electronic assembly and method for manufacturing the same |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4631819A (en) * | 1985-05-29 | 1986-12-30 | Motorola, Inc. | Low stress, tolerance free method for mounting power devices |
US5257718A (en) * | 1993-03-26 | 1993-11-02 | Chiu Ming T | Method of bending and soldering corners of a folding printed-circuit board |
JP2790122B2 (en) * | 1996-05-31 | 1998-08-27 | 日本電気株式会社 | Laminated circuit board |
JP2003298239A (en) * | 2002-03-28 | 2003-10-17 | Taiyo Yuden Co Ltd | Three-dimensional laminated module and electronic component used for the same |
JP4069712B2 (en) * | 2002-09-12 | 2008-04-02 | 株式会社デンソー | Multilayer printed circuit board |
JP2004119624A (en) * | 2002-09-25 | 2004-04-15 | Matsushita Electric Works Ltd | Circuit board |
DE102006007813A1 (en) * | 2006-02-17 | 2007-08-30 | Innovative Sensor Technology Ist Ag | Sensor unit and printed circuit board contacting method, involves providing feed-throughs in sensor unit and circuit board and inserting pin into feed-throughs, where pin is electrically and/or mechanically connected with sensor unit |
JP2008229789A (en) * | 2007-03-22 | 2008-10-02 | Nec Corp | Recessed part forming method and device, and material for forming recessed part |
DE102008028300B4 (en) * | 2008-06-13 | 2021-10-07 | Tdk Electronics Ag | Flexible area printed circuit board and method of manufacture |
US8766099B2 (en) * | 2009-09-29 | 2014-07-01 | Apple Inc. | Component mounting structures for electronic devices |
DE102011006632A1 (en) * | 2011-04-01 | 2012-10-04 | Robert Bosch Gmbh | electronic module |
DE102011017692A1 (en) * | 2011-04-28 | 2012-10-31 | Robert Bosch Gmbh | Circuit board arrangement with a swingable system |
DE102013212940A1 (en) * | 2013-06-26 | 2014-12-31 | Zf Friedrichshafen Ag | Sensor module, mechatronic module and method for producing a mechatronic module |
-
2015
- 2015-05-07 DE DE102015208523.6A patent/DE102015208523A1/en not_active Withdrawn
-
2016
- 2016-04-28 JP JP2017557959A patent/JP2018515925A/en active Pending
- 2016-04-28 KR KR1020177030697A patent/KR20170131593A/en not_active Application Discontinuation
- 2016-04-28 CN CN201680014764.3A patent/CN107535049B/en active Active
- 2016-04-28 WO PCT/EP2016/059542 patent/WO2016177631A1/en active Application Filing
- 2016-04-28 EP EP16722569.7A patent/EP3292743A1/en not_active Ceased
-
2017
- 2017-10-30 US US15/797,542 patent/US10251276B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20180070450A1 (en) | 2018-03-08 |
WO2016177631A1 (en) | 2016-11-10 |
CN107535049A (en) | 2018-01-02 |
US10251276B2 (en) | 2019-04-02 |
CN107535049B (en) | 2019-09-03 |
KR20170131593A (en) | 2017-11-29 |
JP2018515925A (en) | 2018-06-14 |
DE102015208523A1 (en) | 2016-11-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE102007042593A1 (en) | Module for integrated control electronics with simplified design | |
DE102013226549B4 (en) | Process for manufacturing a printed circuit board | |
WO2014187834A2 (en) | Electronic module, in particular a control unit for a vehicle, and a method for the production of said module | |
EP3016485A2 (en) | Electrical apparatus for use in a contaminating medium and amethod for producing same | |
DE102009001932A1 (en) | Chip module and method for producing a chip module | |
EP3292743A1 (en) | Printed circuit board and a method for producing a printed circuit board | |
WO2007012514A1 (en) | Electrically conductive connection and method for producing the same | |
DE19701163A1 (en) | Electrical circuit with contact track layer especially for chip card | |
DE102007039618A1 (en) | Module for integrated control electronics with simplified design | |
DE102019132852B4 (en) | Method for producing a conductor structure element and conductor structure element | |
DE10205592B4 (en) | Method for producing a semifinished product for printed circuit boards | |
DE102016119825A1 (en) | circuit board | |
EP3471518B1 (en) | Method for producing optoelectronic sensors, in particular miniature sensors | |
DE202009009950U1 (en) | Electronic module | |
EP3256820A1 (en) | Transmission control module | |
DE102007045511A1 (en) | Module for integrated control electronics with simplified design | |
DE102016215072B4 (en) | Printed circuit board and circuit assembly with a printed circuit board | |
DE102006052458B4 (en) | Electronics housing with new flexible printed circuit board technology | |
DE102006021560A1 (en) | Flat strip conductor for use in automobile, has conductor wires with insulation, and electrical circuit fastened to base via hot stamping, where insulation is injection molded with base, and circuit is impressed on base | |
DE102010003678A1 (en) | Method for manufacturing control module for transmission control of motor car, involves providing recess in printed circuit board, and pressing functional printed circuit board module into recess | |
EP1501341A2 (en) | Arrangement for carrying electrical conductors | |
DE102015221146A1 (en) | Electronic component and method for producing an electronic component | |
WO2016034174A1 (en) | Rolling bearing comprising an electric circuit, and method for producing an electric circuit for a rolling bearing | |
DE102006057096B4 (en) | Method for mounting a printed circuit board on a bottom plate and short circuit-proof arrangement of a printed circuit board on an electrically conductive bottom plate | |
EP4342267A1 (en) | Method for producing a printed circuit board, and printed circuit board having at least one embedded electronic component |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE |
|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE |
|
17P | Request for examination filed |
Effective date: 20171207 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
AX | Request for extension of the european patent |
Extension state: BA ME |
|
DAV | Request for validation of the european patent (deleted) | ||
DAX | Request for extension of the european patent (deleted) | ||
RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: VITESCO TECHNOLOGIES GERMANY GMBH |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: EXAMINATION IS IN PROGRESS |
|
17Q | First examination report despatched |
Effective date: 20210712 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: EXAMINATION IS IN PROGRESS |
|
RAP3 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: VITESCO TECHNOLOGIES GERMANY GMBH |
|
P01 | Opt-out of the competence of the unified patent court (upc) registered |
Effective date: 20230530 |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R003 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION HAS BEEN REFUSED |
|
18R | Application refused |
Effective date: 20240201 |