EP3292743A1 - Printed circuit board and a method for producing a printed circuit board - Google Patents

Printed circuit board and a method for producing a printed circuit board

Info

Publication number
EP3292743A1
EP3292743A1 EP16722569.7A EP16722569A EP3292743A1 EP 3292743 A1 EP3292743 A1 EP 3292743A1 EP 16722569 A EP16722569 A EP 16722569A EP 3292743 A1 EP3292743 A1 EP 3292743A1
Authority
EP
European Patent Office
Prior art keywords
circuit board
substrate
printed circuit
sensor
sensor head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP16722569.7A
Other languages
German (de)
French (fr)
Inventor
Johannes Bock
Thomas Schmidt
Bernhard Schuch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vitesco Technologies Germany GmbH
Original Assignee
Conti Temic Microelectronic GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Conti Temic Microelectronic GmbH filed Critical Conti Temic Microelectronic GmbH
Publication of EP3292743A1 publication Critical patent/EP3292743A1/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0082—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for transmission control units, e.g. gearbox controllers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09045—Locally raised area or protrusion of insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending

Definitions

  • the invention relates to a printed circuit board for an electronic component according to the preamble of claim 1.
  • the invention further relates to a method for producing such a printed circuit board.
  • electronic components with an electronic control circuit and associated electronic components such as sensors for different tasks are used. For example, when using the electronic component as a control unit in a transmission by means of a number of sensors speeds of waves and positions of gear actuators are detected.
  • the sensors are electrically connected via electrical leads, in particular stamped grid or flexible foil conductor with the electronic control circuit, which are usually arranged on a printed circuit board.
  • the stamped grid for example, with plastic encapsulated electrical signal ⁇ lines and form with the sensor as an electronic component and a sensor cover a sensor dome.
  • a printed circuit board for an electronic component comprises an electrically insulating substrate, a number of electrically conductive strip conductors and at least one sensor dome with a sensor head and a carrier body for receiving the sensor head.
  • the carrier body is formed integrally with the substrate.
  • the carrier body is formed from the substrate of the printed circuit board, no additional materials for the production of the sensor dome are necessary.
  • the circuit board is thus compared to the prior art much more cost-effectively.
  • costs are reduced in the electrical connection of the sensor dome compared to known printed circuit boards, since the embedded in the substrate tracks for electrical contacting of the sensor dome are used and separate
  • the substrate consists of a fiber reinforced plastic, particularly preferably glass ⁇ fiber reinforced plastic, is formed so that the Lei ⁇ terplatte is inexpensive to manufacture.
  • fiber-reinforced plastic is particularly advantageous as a material for the carrier body, since this allows a very good mechanical stability.
  • the mechanical stability is particularly advantageous when the carrier body with the sensor head and thus the sensor dome protrudes perpendicularly from a surface side of the substrate.
  • the spatially separated arrangement of the sensor head of the Lei ⁇ terplatte is dependent on a position and location of a component whose parameters are to be detected by the sensor head.
  • the sensor head is mechanically and electrically conductively connected to at least one conductor track.
  • the number of tracks is arranged on the surface side as well as within the substrate. For example, to the circuit board multi-layered and has several layers with tracks.
  • the carrier body is formed integrally with the substrate, the already existing in the substrate interconnects for electrical contacting of the sensor head can be used, so that separate electrical leads, in particular punched grid or flexible film conductors, are not required and thus costs compared to the prior art are reducible.
  • the circuit board preferably has a sensor encapsulating the sensor dome. The cover can be laminated to the sensor dome or glued to it.
  • an inventive method for producing the printed circuit board described is provided, wherein the carrier body of the sensor dome is formed integrally with the substrate of the printed circuit board. The method enables a cost-efficient production of the printed circuit board with a reduced cost compared to the prior art and reduced process ⁇ steps, since a separate mounting of the sensor dome on the circuit board is not required.
  • An embodiment of the method provides that the Trä ⁇ gerraj is separated out with a predetermined contour of the substrate by a layer is introduced into the circuit board to which the insulating layers of the circuit terplatte not adhere, wherein at least a portion of the support ⁇ body remains integrally connected to the substrate.
  • the severed carrier body is then positioned with the Sen ⁇ sorkopf in the direction of a vertical axis relative to the surface side of the substrate.
  • the connected part of the carrier body forms the bottom or foot of the sensor dome, whereby a separate connection of the sensor dome to the circuit board is not required.
  • the circuit board is thus produced in a particularly simple manner.
  • Another embodiment of the method provides the following steps:
  • the arrangement of the film and of the sensor head within the substrate can take place, for example, in the liquid state of the substrate, which subsequently hardens.
  • the film can be easily positioned between the layers. Then the layers are joined together.
  • the film is used in the process of easy separation of the carrier body from the substrate, so that perpendicular to the vertical axis no separation process is required.
  • an immersion depth of a separating tool for separating out the carrier body is set as a function of a position of the film in the substrate.
  • FIGS. 1A to 5B show various schematic views of an embodiment of a circuit board according to the invention during manufacture. Corresponding parts are provided in all figures with the same reference numerals.
  • Figures 1A to 5B show various views of a printed circuit board 1 during a manufacturing process.
  • Figures 1A and 1B show the circuit board 1 schematically in a first process step Sl, where figure Lei ⁇ terplatte 1 shows a semi-transparent top view and Figure 1B a sectional view of Figure 1A.
  • the printed circuit board 1 shown is formed from an electrically isolie ⁇ leaders substrate 1.1, and has a number of electrically conductive conductor tracks 1.2, wherein a conductor is shown for example in Figure 2B 1.2.
  • the substrate 1.1 is, for example, a multilayer carrier plate made of a fiber-reinforced
  • Plastic, z. B. epoxy resin is made.
  • the number of printed conductors 1.2 is applied in each case to one layer in the substrate 1.1.
  • FIG. 2B shows a conductor 1.2 by way of example in the interior of the substrate 1.1.
  • the printed circuit board 1 ⁇ at least one connecting surface for electrically con- clocking of (not shown).
  • a film F with a non-stick coating for.
  • the non-stick coating serves to ensure that the film F receives no or at least only a negligibly small connection with the substrate 1.1 of the printed circuit board 1.
  • the film F is formed in accordance with the dimensions of a hither ⁇ alternate end sensor dome S relative to the circuit board. 1
  • the arrangement of the film F in the substrate 1.1 takes place during the manufacture of the circuit board 1 from the substrate 1.1, which is provided, for example, as a casting resin in liquid form and cures. Alternatively, it is also possible to terplatte 1 to produce from several already cured layers.
  • FIGS. 2A and 2B show the printed circuit board 1 in a second method step S2, which adjoins the first method step S1 in terms of time.
  • FIG. 2A shows the circuit board 1 in a semitransparent plan view and FIG. 2B in a sectional view.
  • the printed circuit board 1 is equipped with electronic components, wherein in the embodiments shown as an electronic component, a sensor head 2 of the sensor dome S is arranged on ⁇ .
  • the circuit board 1 can be equipped with other not ge ⁇ showed electronic components.
  • the arrangement of the sensor head 2 also takes place during the production of the printed circuit board 1 from the substrate 1.1, wherein the sensor head 2 is immersed, for example, in the liquid casting resin.
  • the cured layers with corresponding recesses for receiving the sensor and other electronic components, wherein the layers are then joined together.
  • FIG. 2B shows the Sen ⁇ sorkopf 2, which is connected to a conductor track 1.2 in the interior of the substrate 1.1.
  • a contour K of a sensor dome S to be produced is separated from the substrate 1.1.
  • a contour K of a carrier body 2.1 of the sensor dome S shown in greater detail in FIGS. 4A to 5B is cut out.
  • Figures 3A and 3B the circuit board 1 in the third step S3, wherein Figure 3A, the circuit board 1 in a Semi-transparent plan view and Figure 3B shows a sectional view.
  • the The The The The The The The The The The The The The The The The The The The The SeazutMapde contour K is determined by the dimensions of the film F, which is a separating tool, for. B. a milling ⁇ machine, are known.
  • the separator separates the tool carrier body ⁇ then 2.1 K corresponding to the contour of the substrate 1.1 out, one edge of a bottom or foot of the support body 2.1 is connected to the substrate 1.1. For this purpose, for example, at a viewing direction of the in
  • the film F which is a separating tool, for. B. a milling ⁇ machine, are known.
  • the separator separates the tool carrier body ⁇ then 2.1 K corresponding to the contour of the substrate 1.1 out, one edge of a bottom or foot of the support body 2.1 is connected to the substrate 1.1.
  • the film F which is a separating tool, for. B. a milling ⁇ machine, are known.
  • the separator separates the tool carrier body ⁇ then 2.1 K corresponding to
  • the carrier body 2.1 is positioned relative to the printed circuit board 1 in a fourth method step S4 with the sensor head 2 in the direction of a vertical axis z.
  • FIG. 4A and 4B show the printed circuit board 1 in the fourth method step S4, whereby FIG. 4A shows the printed circuit board 1 in a semitransparent plan view and FIG. 4B in a sectional view.
  • the carrier body 2.1, the sensor head 2 and a portion of the conductor 1.2, which together form the sensor dome S are moved in the fourth step S4 in the direction of the vertical axis z until a longitudinal orientation of the support body 2.1 is perpendicular to a flat side of the circuit board 1.
  • the sensor dome S is provided with a cover 2.2, as shown in Figures 5A and 5B.
  • FIG. 5A and 5B show the printed circuit board 1 in a fifth method step S5 subsequent to the fourth method step S4, wherein FIG. 5A shows the printed circuit board 1 in a semitransparent plan view and FIG. 5B in a sectional view.
  • the cover 2.2 is preferably formed of an electrically insulating material and is applied media-tight on the sensor dome S, z. B. by lamination or gluing. By means of the cover 2.2 is the sensor dome S from external influences, eg. As chemically aggressive media such as gear oils, protected. 2.2 In addition, stabilizes the Abde ⁇ ckung the sensor dome S mechanical.
  • the printed circuit board 1 produced in this way is for arrangement in an electronic component in a motor vehicle, for. B. a transmission control unit, suitable.
  • the sensor dome S is - as already mentioned - provided for example for speed detection and / or for detecting positions of gear actuators.
  • the printed circuit board 1 can also have a plurality of sensor diodes S.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

The invention relates to a printed circuit board (1) for an electronic component, comprising: - an electrically-insulating substrate (1.1), - a number of electrically-conductive conductor tracks (1.2), and - at least one sensor dome (S) having a sensor head (2) and a carrier body (2.1) for receiving said sensor head (2). According to the invention, the carrier body (2.1) is designed to be integral to the substrate (1.1). The invention also relates to a method for producing such a printed circuit board (1).

Description

Beschreibung description
Leiterplatte und Verfahren zur Herstellung einer Leiterplatte Die Erfindung betrifft eine Leiterplatte für eine elektronische Komponente gemäß dem Oberbegriff des Anspruchs 1. Die Erfindung betrifft weiterhin ein Verfahren zur Herstellung einer solchen Leiterplatte . In Kraftfahrzeugen werden elektronische Komponenten mit einer elektronischen Steuerschaltung und zugeordneten elektronischen Bauteilen wie Sensoren für unterschiedliche Aufgaben eingesetzt. Beispielsweise werden beim Einsatz der elektronischen Komponente als Steuergerät in einem Getriebe mittels einer Anzahl von Sensoren Drehzahlen von Wellen und Positionen von Gangstellern erfasst . The invention relates to a printed circuit board for an electronic component according to the preamble of claim 1. The invention further relates to a method for producing such a printed circuit board. In motor vehicles, electronic components with an electronic control circuit and associated electronic components such as sensors for different tasks are used. For example, when using the electronic component as a control unit in a transmission by means of a number of sensors speeds of waves and positions of gear actuators are detected.
Die Sensoren sind über elektrische Zuleitungen, insbesondere Stanzgitter oder flexible Folienleiter mit der elektronischen Steuerschaltung elektrisch verbunden, welche üblicherweise auf einer Leiterplatte angeordnet sind. Die Stanzgitter weisen beispielsweise mit Kunststoff umspritzte elektrische Signal¬ leitungen auf und bilden mit dem Sensor als elektronische Komponente und einer Sensorabdeckung einen Sensordom. The sensors are electrically connected via electrical leads, in particular stamped grid or flexible foil conductor with the electronic control circuit, which are usually arranged on a printed circuit board. The stamped grid, for example, with plastic encapsulated electrical signal ¬ lines and form with the sensor as an electronic component and a sensor cover a sensor dome.
Der Erfindung liegt die Aufgabe zu Grunde, eine gegenüber dem Stand der Technik verbesserte Leiterplatte sowie ein Verfahren zur Herstellung einer solchen Leiterplatte anzugeben. Hinsichtlich der Leiterplatte wird die Aufgabe erfindungsgemäß mit den in Anspruch 1 angegebenen Merkmalen gelöst. Hinsichtlich des Verfahrens wird die Aufgabe erfindungsgemäß mit den in Anspruch 6 angegebenen Merkmalen gelöst. Vorteilhafte Ausgestaltungen der Erfindung sind Gegenstand der Unteransprüche . Eine Leiterplatte für eine elektronische Komponente umfasst ein elektrisch isolierendes Substrat, eine Anzahl elektrisch leitender Leiterbahnen und mindestens einen Sensordom mit einem Sensorkopf und einem Trägerkörper zur Aufnahme des Sensorkopfes. Erfindungsgemäß ist der Trägerkörper einteilig mit dem Substrat ausgebildet . The invention is based on the object to provide a comparison with the prior art improved circuit board and a method for producing such a circuit board. With regard to the circuit board, the object is achieved according to the invention with the features specified in claim 1. With regard to the method, the object is achieved according to the invention with the features specified in claim 6. Advantageous embodiments of the invention are the subject of the dependent claims. A printed circuit board for an electronic component comprises an electrically insulating substrate, a number of electrically conductive strip conductors and at least one sensor dome with a sensor head and a carrier body for receiving the sensor head. According to the invention, the carrier body is formed integrally with the substrate.
Dadurch, dass der Trägerkörper aus dem Substrat der Leiterplatte gebildet ist, sind keine zusätzlichen Materialien zur Her- Stellung des Sensordoms notwendig. Die Leiterplatte ist damit gegenüber dem Stand der Technik wesentlich kosteneffizienter herstellbar. Zudem werden Kosten bei der elektrischen Verbindung des Sensordoms gegenüber bekannten Leiterplatten verringert, da die im Substrat eingebetteten Leiterbahnen zur elektrischen Kontaktierung des Sensordoms verwendbar sind und separateCharacterized in that the carrier body is formed from the substrate of the printed circuit board, no additional materials for the production of the sensor dome are necessary. The circuit board is thus compared to the prior art much more cost-effectively. In addition, costs are reduced in the electrical connection of the sensor dome compared to known printed circuit boards, since the embedded in the substrate tracks for electrical contacting of the sensor dome are used and separate
Stanzgitter, elektrische Leitungen und Abdichtelemente ent¬ fallen . Punched grid, electrical cables and sealing ent ¬ fall.
Eine Ausgestaltung der Erfindung sieht vor, dass das Substrat aus einem faserverstärkten Kunststoff, besonders bevorzugt glas¬ faserverstärktem Kunststoff, gebildet ist, so dass die Lei¬ terplatte kostengünstig herstellbar ist. Zudem eignet sich faserverstärkter Kunststoff besonders vorteilhaft als Material für den Trägerkörper, da dieses eine sehr gute mechanische Stabilität ermöglicht. An embodiment of the invention provides that the substrate consists of a fiber reinforced plastic, particularly preferably glass ¬ fiber reinforced plastic, is formed so that the Lei ¬ terplatte is inexpensive to manufacture. In addition, fiber-reinforced plastic is particularly advantageous as a material for the carrier body, since this allows a very good mechanical stability.
Die mechanische Stabilität ist insbesondere dann vorteilhaft, wenn der Trägerkörper mit dem Sensorkopf und damit der Sensordom senkrecht von einer Oberflächenseite des Substrats abragt. Die räumlich getrennte Anordnung des Sensorkopfes von der Lei¬ terplatte ist abhängig von einer Position und Lage einer Komponente, deren Parameter vom Sensorkopf erfasst werden sollen . Vorzugsweise ist der Sensorkopf mit wenigstens einer Leiterbahn mechanisch und elektrisch leitend verbunden. Die Anzahl von Leiterbahnen ist auf der Oberflächenseite sowie innerhalb des Substrats angeordnet. Beispielsweise ist dazu die Leiterplatte mehrlagig ausgebildet und weist mehrere Lagen mit Leiterbahnen auf. Dadurch, dass der Trägerkörper einteilig mit dem Substrat ausgebildet ist, können die im Substrat bereits vorhandenen Leiterbahnen zur elektrischen Kontaktierung des Sensorkopfes verwendet werden, so dass separate elektrische Zuleitungen, insbesondere Stanzgitter oder flexible Folienleiter, nicht erforderlich sind und damit Kosten gegenüber dem Stand der Technik verringerbar sind. Zum Schutz des Sensorkopfes vor äußeren Einflüssen, z. B. Getriebeöl, weist die Leiterplatte vorzugsweise eine den Sensordom einkapselnde Abdeckung auf. Die Abdeckung kann auf den Sensordom laminiert oder mit diesem verklebt werden. Es ist weiterhin ein erfindungsgemäßes Verfahren zur Herstellung der beschriebenen Leiterplatte vorgesehen, wobei der Trägerkörper des Sensordoms einteilig mit dem Substrat der Leiterplatte ausgebildet wird. Das Verfahren ermöglicht eine kosteneffiziente Herstellung der Leiterplatte mit einem gegenüber dem Stand der Technik verringerten Materialaufwand sowie verringerten Verfahrens¬ schritten, da eine separate Montage des Sensordoms auf der Leiterplatte nicht erforderlich ist. The mechanical stability is particularly advantageous when the carrier body with the sensor head and thus the sensor dome protrudes perpendicularly from a surface side of the substrate. The spatially separated arrangement of the sensor head of the Lei ¬ terplatte is dependent on a position and location of a component whose parameters are to be detected by the sensor head. Preferably, the sensor head is mechanically and electrically conductively connected to at least one conductor track. The number of tracks is arranged on the surface side as well as within the substrate. For example, to the circuit board multi-layered and has several layers with tracks. Characterized in that the carrier body is formed integrally with the substrate, the already existing in the substrate interconnects for electrical contacting of the sensor head can be used, so that separate electrical leads, in particular punched grid or flexible film conductors, are not required and thus costs compared to the prior art are reducible. To protect the sensor head from external influences, eg. B. gear oil, the circuit board preferably has a sensor encapsulating the sensor dome. The cover can be laminated to the sensor dome or glued to it. Furthermore, an inventive method for producing the printed circuit board described is provided, wherein the carrier body of the sensor dome is formed integrally with the substrate of the printed circuit board. The method enables a cost-efficient production of the printed circuit board with a reduced cost compared to the prior art and reduced process ¬ steps, since a separate mounting of the sensor dome on the circuit board is not required.
Eine Ausgestaltung des Verfahrens sieht vor, dass der Trä¬ gerkörper mit einer vorgegebenen Kontur aus dem Substrat herausgetrennt wird, indem eine Schicht in die Leiterplatte eingebracht wird, an dem die isolierenden Schichten der Lei- terplatte nicht haften, wobei zumindest ein Teil des Träger¬ körpers mit dem Substrat einteilig verbunden bleibt. Der herausgetrennte Trägerkörper wird anschließend mit dem Sen¬ sorkopf in Richtung einer Hochachse relativ zur Oberflächenseite des Substrats positioniert. Der verbundene Teil des Träger- körpers bildet den Boden oder Fuß des Sensordoms, wobei eine separate Verbindung des Sensordoms mit der Leiterplatte nicht erforderlich ist. Die Leiterplatte ist somit auf besonders einfache Art und Weise herstellbar. Eine weitere Ausgestaltung des Verfahrens sieht folgende Schritte vor: An embodiment of the method provides that the Trä ¬ gerkörper is separated out with a predetermined contour of the substrate by a layer is introduced into the circuit board to which the insulating layers of the circuit terplatte not adhere, wherein at least a portion of the support ¬ body remains integrally connected to the substrate. The severed carrier body is then positioned with the Sen ¬ sorkopf in the direction of a vertical axis relative to the surface side of the substrate. The connected part of the carrier body forms the bottom or foot of the sensor dome, whereby a separate connection of the sensor dome to the circuit board is not required. The circuit board is thus produced in a particularly simple manner. Another embodiment of the method provides the following steps:
- Bereitstellen einer unbestückten Leiterplatte,  Providing an unpopulated printed circuit board,
- Anordnen einer Folie mit einer Antihaftbeschichtung innerhalb des Substrats,  Arranging a film with a non-stick coating within the substrate,
- Anordnen des Sensorkopfes innerhalb des Substrats, wobei der Sensorkopf in Bezug auf die Hochachse oberhalb der Folie an¬ geordnet wird, - placing the sensor head within the substrate, wherein the sensor head is arranged in respect to the vertical axis above the film at ¬,
- Heraustrennen des Trägerkörpers mit der vorgegebenen Kontur, welche einen den Sensorkopf umgebenden Abschnitt umfasst, Separating out the carrier body with the predetermined contour, which comprises a section surrounding the sensor head,
- Positionieren des Sensordoms, wobei der herausgetrennte Trägerkörpers mit dem Sensorkopf in Richtung der Hochachse relativ zur Oberflächenseite bewegt wird, und Positioning the sensor dome, wherein the separated support body is moved with the sensor head in the direction of the vertical axis relative to the surface side, and
- Einkapseln des Sensordoms mit einer Abdeckung.  - Encapsulating the sensor dome with a cover.
Das Anordnen der Folie sowie des Sensorkopfes innerhalb des Substrats kann beispielsweise im flüssigen Zustand des Substrats erfolgen, wobei dieses anschließend aushärtet. Alternativ ist es auch möglich, die Leiterplatte aus mehreren bereits ausge- härteten Lagen zu fertigen, wobei die Lagen bestimmte Ausformungen zur Aufnahme des Sensorkopfes aufweisen. Die Folie kann auf einfache Art und Weise zwischen den Lagen positioniert werden. Anschließend werden die Lagen miteinander gefügt. Die Folie dient im Verfahren der einfachen Heraustrennung des Trägerkörpers aus dem Substrat, so dass senkrecht zur Hochachse kein Trennprozess erforderlich ist. Dazu wird eine Eintauchtiefe eines Trennwerkzeugs zum Heraustrennen des Trägerkörpers in Abhängigkeit einer Lage der Folie im Substrat eingestellt. The arrangement of the film and of the sensor head within the substrate can take place, for example, in the liquid state of the substrate, which subsequently hardens. Alternatively, it is also possible to manufacture the printed circuit board from a plurality of already hardened layers, wherein the layers have certain formations for receiving the sensor head. The film can be easily positioned between the layers. Then the layers are joined together. The film is used in the process of easy separation of the carrier body from the substrate, so that perpendicular to the vertical axis no separation process is required. For this purpose, an immersion depth of a separating tool for separating out the carrier body is set as a function of a position of the film in the substrate.
Die Erfindung wird im Folgenden anhand von Zeichnungen näher erläutert . The invention will be explained in more detail below with reference to drawings.
Dabei zeigen: Showing:
Figuren 1A bis 5B verschiedene schematische Ansichten eines erfindungsgemäßen Ausführungsbeispiels einer Leiterplatte während der Herstellung. Einander entsprechende Teile sind in allen Figuren mit den gleichen Bezugszeichen versehen. Figures 1A to 5B show various schematic views of an embodiment of a circuit board according to the invention during manufacture. Corresponding parts are provided in all figures with the same reference numerals.
Die Figuren 1A bis 5B zeigen verschiedene Ansichten einer Leiterplatte 1 während eines Herstellungsverfahrens. Figures 1A to 5B show various views of a printed circuit board 1 during a manufacturing process.
Die Figuren 1A und 1B zeigen die Leiterplatte 1 schematisch in einem ersten Verfahrensschritt Sl, wobei Figur 1A die Lei¬ terplatte 1 in einer semitransparenten Draufsicht und Figur 1B in einer Schnittdarstellung zeigt. Figures 1A and 1B show the circuit board 1 schematically in a first process step Sl, where figure Lei ¬ terplatte 1 shows a semi-transparent top view and Figure 1B a sectional view of Figure 1A.
Die gezeigte Leiterplatte 1 ist aus einem elektrisch isolie¬ renden Substrat 1.1 gebildet und weist eine Anzahl elektrisch leitender Leiterbahnen 1.2 auf, wobei eine Leiterbahn 1.2 beispielhaft in Figur 2B gezeigt ist. The printed circuit board 1 shown is formed from an electrically isolie ¬ leaders substrate 1.1, and has a number of electrically conductive conductor tracks 1.2, wherein a conductor is shown for example in Figure 2B 1.2.
Bei dem Substrat 1.1 handelt es sich beispielsweise um eine mehrlagige Trägerplatte, die aus einem faserverstärktem The substrate 1.1 is, for example, a multilayer carrier plate made of a fiber-reinforced
Kunststoff, z. B. Epoxidharz, gefertigt ist. Die Anzahl von Leiterbahnen 1.2 ist auf jeweils einer Lage im Substrat 1.1 aufgebracht. Figur 2B zeigt eine Leiterbahn 1.2 beispielhaft im Inneren des Substrats 1.1. Zusätzlich dazu weist die Leiter¬ platte 1 zumindest eine Anschlussfläche zur elektrisch Kon- taktierung auf (nicht dargestellt) . Plastic, z. B. epoxy resin is made. The number of printed conductors 1.2 is applied in each case to one layer in the substrate 1.1. FIG. 2B shows a conductor 1.2 by way of example in the interior of the substrate 1.1. In addition to this, the printed circuit board 1 ¬ at least one connecting surface for electrically con- clocking of (not shown).
Im ersten Verfahrensschritt Sl wird in das Substrat 1.1 der Leiterplatte 1 eine Folie F mit einer Antihaftbeschichtung, z. B. Polytetrafluorethylen, eingebracht. Die Antihaftbe- schichtung dient dazu, dass die Folie F keine oder zumindest nur eine vernachlässigbar geringe Verbindung mit dem Substrat 1.1 der Leiterplatte 1 eingeht. In the first step S1 is in the substrate 1.1 of the circuit board 1, a film F with a non-stick coating, for. As polytetrafluoroethylene introduced. The non-stick coating serves to ensure that the film F receives no or at least only a negligibly small connection with the substrate 1.1 of the printed circuit board 1.
Die Folie F ist entsprechend der Dimensionen eines herzu¬ stellenden Sensordoms S relativ zur Leiterplatte 1 ausgebildet. Die Anordnung der Folie F im Substrat 1.1 erfolgt dabei während der Fertigung der Leiterplatte 1 aus dem Substrat 1.1, welches beispielsweise als Gießharz in flüssiger Form bereitgestellt wird und aushärtet. Alternativ ist es auch möglich, die Lei- terplatte 1 aus mehreren bereits ausgehärteten Lagen zu fertigen . The film F is formed in accordance with the dimensions of a hither ¬ alternate end sensor dome S relative to the circuit board. 1 The arrangement of the film F in the substrate 1.1 takes place during the manufacture of the circuit board 1 from the substrate 1.1, which is provided, for example, as a casting resin in liquid form and cures. Alternatively, it is also possible to terplatte 1 to produce from several already cured layers.
Die Figuren 2A und 2B zeigen die Leiterplatte 1 in einem zweiten Verfahrensschritt S2, welcher sich zeitlich an den ersten Verfahrensschritt Sl anschließt. Dabei zeigt Figur 2A die Leiterplatte 1 in einer semitransparenten Draufsicht und Figur 2B in einer Schnittdarstellung. Hierbei wird die Leiterplatte 1 mit elektronischen Bauteilen bestückt, wobei in den gezeigten Ausführungsbeispielen als elektronisches Bauteil ein Sensorkopf 2 des Sensordoms S an¬ geordnet wird. Dabei ist der Sensor (Sensorkopf 2) ein her¬ kömmlicher Sensor, beispielsweise ein SOT23 oder SOT89 (SOT = Standard outline transistor) und als ein gehäustes Bauteil ausgebildet. Die Leiterplatte 1 kann mit weiteren nicht ge¬ zeigten elektronischen Bauteilen bestückt werden. Die Anordnung des Sensorkopfes 2 erfolgt ebenfalls während der Fertigung der Leiterplatte 1 aus dem Substrat 1.1, wobei der Sensorkopf 2 beispielsweise in das flüssige Gießharz eingetaucht wird.FIGS. 2A and 2B show the printed circuit board 1 in a second method step S2, which adjoins the first method step S1 in terms of time. FIG. 2A shows the circuit board 1 in a semitransparent plan view and FIG. 2B in a sectional view. In this case, the printed circuit board 1 is equipped with electronic components, wherein in the embodiments shown as an electronic component, a sensor head 2 of the sensor dome S is arranged on ¬ . The sensor (sensor head 2) is a forth ¬ kömmlicher sensor, such as a sot23 or SOT89 (SOT = Standard outline transistor) and formed as a packaged component. The circuit board 1 can be equipped with other not ge ¬ showed electronic components. The arrangement of the sensor head 2 also takes place during the production of the printed circuit board 1 from the substrate 1.1, wherein the sensor head 2 is immersed, for example, in the liquid casting resin.
Alternativ ist es auch möglich, die ausgehärteten Lagen mit entsprechenden Vertiefungen zur Aufnahme des Sensors und weiterer elektronischer Bauteile zu versehen, wobei die Lagen anschließend miteinander gefügt werden. Alternatively, it is also possible to provide the cured layers with corresponding recesses for receiving the sensor and other electronic components, wherein the layers are then joined together.
Das in Figur 2B gezeigte Ausführungsbeispiel zeigt den Sen¬ sorkopf 2, welcher mit einer Leiterbahn 1.2 im Inneren des Substrats 1.1 verbunden ist. In einem sich an den zweiten Verfahrensschritt S2 zeitlich anschließenden dritten Verfahrensschritt S3 wird eine Kontur K eines herzustellenden Sensordoms S aus dem Substrat 1.1 herausgetrennt. Insbesondere wird eine Kontur K eines in den Figuren 4A bis 5B näher dargestellten Trägerkörpers 2.1 des Sensordoms S herausgetrennt. The embodiment shown in Figure 2B shows the Sen ¬ sorkopf 2, which is connected to a conductor track 1.2 in the interior of the substrate 1.1. In a third method step S3 temporally subsequent to the second method step S2, a contour K of a sensor dome S to be produced is separated from the substrate 1.1. In particular, a contour K of a carrier body 2.1 of the sensor dome S shown in greater detail in FIGS. 4A to 5B is cut out.
Dazu zeigen die Figuren 3A und 3B die Leiterplatte 1 im dritten Verfahrensschritt S3, wobei Figur 3A die Leiterplatte 1 in einer semitransparenten Draufsicht und Figur 3B in einer Schnittdarstellung zeigt. For this purpose, Figures 3A and 3B, the circuit board 1 in the third step S3, wherein Figure 3A, the circuit board 1 in a Semi-transparent plan view and Figure 3B shows a sectional view.
Die herauszutrennende Kontur K wird durch die Dimensionen der Folie F bestimmt, die einem Trennwerkzeug, z. B. eine Fräs¬ maschine, bekannt sind. Das Trennwerkzeug trennt den Träger¬ körper 2.1 anschließend entsprechend der Kontur K aus dem Substrat 1.1 heraus, wobei eine Kante eines Bodens oder Fußes des Trägerkörpers 2.1 mit dem Substrat 1.1 verbunden bleibt. Dazu wird beispielsweise an einem in Betrachtungsrichtung des inThe herauszutrennende contour K is determined by the dimensions of the film F, which is a separating tool, for. B. a milling ¬ machine, are known. The separator separates the tool carrier body ¬ then 2.1 K corresponding to the contour of the substrate 1.1 out, one edge of a bottom or foot of the support body 2.1 is connected to the substrate 1.1. For this purpose, for example, at a viewing direction of the in
Figur 3A gezeigten Ausführungsbeispielspiels rechten Ende der Kontur K eine Eintauchtiefe des Trennwerkzeugs verringert. Figur 3A shown Ausführungsspiels right end of the contour K reduces a depth of immersion of the cutting tool.
Im Anschluss daran wird der Trägerkörper 2.1 in einem vierten Verfahrensschritt S4 mit dem Sensorkopf 2 in Richtung einer Hochachse z relativ zur Leiterplatte 1 positioniert. Following this, the carrier body 2.1 is positioned relative to the printed circuit board 1 in a fourth method step S4 with the sensor head 2 in the direction of a vertical axis z.
Dazu zeigen die Figuren 4A und 4B die Leiterplatte 1 im vierten Verfahrensschritt S4, wobei Figur 4A die Leiterplatte 1 in einer semitransparenten Draufsicht und Figur 4B in einer Schnittdarstellung zeigt. 4A and 4B show the printed circuit board 1 in the fourth method step S4, whereby FIG. 4A shows the printed circuit board 1 in a semitransparent plan view and FIG. 4B in a sectional view.
Der Trägerkörper 2.1, der Sensorkopf 2 sowie ein Abschnitt der Leiterbahn 1.2, welche gemeinsam den Sensordom S bilden, werden im vierten Verfahrensschritt S4 in Richtung der Hochachse z bewegt bis eine Längsausrichtung des Trägerkörpers 2.1 senkrecht zu einer Flachseite der Leiterplatte 1 ist. The carrier body 2.1, the sensor head 2 and a portion of the conductor 1.2, which together form the sensor dome S are moved in the fourth step S4 in the direction of the vertical axis z until a longitudinal orientation of the support body 2.1 is perpendicular to a flat side of the circuit board 1.
Abschließend wird der Sensordom S mit einer Abdeckung 2.2 versehen, wie es in den Figuren 5A und 5B dargestellt ist. Finally, the sensor dome S is provided with a cover 2.2, as shown in Figures 5A and 5B.
Dabei zeigen die Figuren 5A und 5B die Leiterplatte 1 in einem zeitlich an den vierten Verfahrensschritt S4 anschließenden fünften Verfahrensschritt S5, wobei Figur 5A die Leiterplatte 1 in einer semitransparenten Draufsicht und Figur 5B in einer Schnittdarstellung zeigt. Die Abdeckung 2.2 ist vorzugsweise aus einem elektrisch isolierenden Material gebildet und wird mediendicht auf dem Sensordom S aufgebracht, z. B. mittels Laminierung oder Verklebung. Mittels der Abdeckung 2.2 ist der Sensordom S vor äußeren Einflüssen, z. B. chemisch aggressive Medien wie Getriebeöle, geschützt. Zusätzlich dazu stabilisiert die Abde¬ ckung 2.2 den Sensordom S mechanisch. 5A and 5B show the printed circuit board 1 in a fifth method step S5 subsequent to the fourth method step S4, wherein FIG. 5A shows the printed circuit board 1 in a semitransparent plan view and FIG. 5B in a sectional view. The cover 2.2 is preferably formed of an electrically insulating material and is applied media-tight on the sensor dome S, z. B. by lamination or gluing. By means of the cover 2.2 is the sensor dome S from external influences, eg. As chemically aggressive media such as gear oils, protected. 2.2 In addition, stabilizes the Abde ¬ ckung the sensor dome S mechanical.
Die derart hergestellte Leiterplatte 1 ist zur Anordnung in einer elektronischen Komponente in einem Kraftfahrzeug, z. B. ein Getriebesteuergerät, geeignet. Der Sensordom S ist dabei - wie bereits eingangs erwähnt - beispielsweise zur Drehzahlerfassung und/oder zur Erfassung von Positionen von Gangstellern vorgesehen . The printed circuit board 1 produced in this way is for arrangement in an electronic component in a motor vehicle, for. B. a transmission control unit, suitable. The sensor dome S is - as already mentioned - provided for example for speed detection and / or for detecting positions of gear actuators.
Die Leiterplatte 1 kann alternativ zu den gezeigten Ausführungsbeispielen auch mehrere Sensordome S aufweisen. As an alternative to the exemplary embodiments shown, the printed circuit board 1 can also have a plurality of sensor diodes S.
_ _
y  y
Bezugs zeichenliste Reference sign list
1 Leiterplatte 1 circuit board
1.1 Substrat  1.1 substrate
1.2 Leiterbahn  1.2 trace
2 Sensorkopf  2 sensor head
2.1 Trägerkörper 2.1 carrier body
2.2 Abdeckung 2.2 cover
F Folie F slide
K Kontur  K contour
S Sensordom  S sensor dome
Sl bis S5 Verfahrensschritte z Hochachse  Sl to S5 process steps z vertical axis

Claims

Patentansprüche claims
1. Leiterplatte (1) für eine elektronische Komponente, um¬ fassend : 1. printed circuit board (1) for an electronic component to collectively ¬:
- ein elektrisch isolierendes Substrat (1.1), an electrically insulating substrate (1.1),
- eine Anzahl elektrisch leitender Leiterbahnen (1.2), und - A number of electrically conductive tracks (1.2), and
- mindestens einen Sensordom (S) mit einem Sensorkopf (2) und einem Trägerkörper (2.1) zur Aufnahme des Sensorkopfes (2), dadurch gekennzeichnet, dass der Trägerkörper (2.1) einteilig mit dem Substrat (1.1) ausgebildet ist. - At least one sensor dome (S) with a sensor head (2) and a support body (2.1) for receiving the sensor head (2), characterized in that the carrier body (2.1) is formed integrally with the substrate (1.1).
2. Leiterplatte (1) nach Anspruch 1, 2. Printed circuit board (1) according to claim 1,
dadurch gekennzeichnet, dass das Substrat (1.1) aus einem faserverstärkten Kunststoff gebildet ist. characterized in that the substrate (1.1) is formed of a fiber-reinforced plastic.
3. Leiterplatte (1) nach Anspruch 1 oder 2, 3. printed circuit board (1) according to claim 1 or 2,
dadurch gekennzeichnet, dass der Trägerkörper (2.1) senkrecht von einer Oberflächenseite des Substrats (1.1) abragt. characterized in that the carrier body (2.1) protrudes perpendicularly from a surface side of the substrate (1.1).
4. Leiterplatte (1) nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass der Sensorkopf (2) mit wenigstens einer Leiterbahn (1.2) mechanisch und elektrisch leitend verbunden ist. 4. printed circuit board (1) according to one of the preceding claims, characterized in that the sensor head (2) with at least one conductor track (1.2) is mechanically and electrically conductively connected.
5. Leiterplatte (1) nach einem der vorhergehenden Ansprüche, gekennzeichnet durch eine den Sensordom (S) einkapselnde Ab¬ deckung (2.2) . 5. Printed circuit board (1) according to one of the preceding claims, characterized by a sensor dome (S) encapsulating Ab ¬ cover (2.2).
6. Verfahren zur Herstellung einer Leiterplatte (1) nach einem der vorhergehenden Ansprüche, wobei der Trägerkörper (2.1) des6. A method for producing a printed circuit board (1) according to any one of the preceding claims, wherein the carrier body (2.1) of the
Sensordoms (S) einteilig mit dem Substrat (1.1) der Leiter¬ platte (1) ausgebildet wird. Sensor dome (S) in one piece with the substrate (1.1) of the conductor ¬ plate (1) is formed.
7. Verfahren nach Anspruch 6, 7. The method according to claim 6,
dadurch gekennzeichnet, dass der Trägerkörper (2.1) mit einer vorgegebenen Kontur (K) aus dem Substrat (1.1) herausgetrennt wird, wobei zumindest ein Teil des Trägerkörpers (2.1) mit dem Substrat (1.1) einteilig verbunden bleibt. characterized in that the carrier body (2.1) with a predetermined contour (K) is separated out of the substrate (1.1), wherein at least a part of the carrier body (2.1) remains integrally connected to the substrate (1.1).
8. Verfahren nach Anspruch 7, 8. The method according to claim 7,
dadurch gekennzeichnet, dass der herausgetrennte Trägerkör¬ per (2.1) mit dem Sensorkopf (2) in Richtung einer Hochachse (z) relativ zur Oberflächenseite des Substrats (1.1) positioniert wird. characterized in that the herausgetrennte Trägerkör ¬ by (2.1) with the sensor head (2) in the direction of a vertical axis (z) relative to the surface side of the substrate (1.1) is positioned.
9. Verfahren nach einem der Anspruch 8, 9. The method according to any one of claim 8,
gekennzeichnet durch folgende Schritte: characterized by the following steps:
- Bereitstellen einer unbestückten Leiterplatte (1),  Providing an unpopulated printed circuit board (1),
- Anordnen einer Folie (F) mit einer Antihaftbeschichtung innerhalb des Substrats (1.1), Arranging a film (F) with a non-stick coating within the substrate (1.1),
- Anordnen des Sensorkopfes (2) innerhalb des Substrats (1.1), wobei der Sensorkopf (2) in Bezug auf die Hochachse (z) oberhalb der Folie (F) angeordnet wird,  Arranging the sensor head (2) within the substrate (1.1), the sensor head (2) being arranged above the film (F) with respect to the vertical axis (z),
- Heraustrennen des Trägerkörpers (2.1) mit der vorgegebenen Kontur (K) , welche einen den Sensorkopf (2) umgebenden Abschnitt umfasst , - Separating the carrier body (2.1) with the predetermined contour (K), which comprises a sensor head (2) surrounding portion,
- Positionieren des Sensordoms (S) , wobei der herausgetrennte Trägerkörpers (2.1) mit dem Sensorkopf (2.1) in Richtung der Hochachse (z) relativ zur Oberflächenseite bewegt wird, und - Positioning of the sensor dome (S), wherein the separated out support body (2.1) with the sensor head (2.1) in the direction of the vertical axis (z) is moved relative to the surface side, and
- Einkapseln des Sensordoms (S) mit einer Abdeckung (2.2) . - Encapsulation of the sensor dome (S) with a cover (2.2).
10. Verfahren nach einem der Ansprüche 7 bis 9, 10. The method according to any one of claims 7 to 9,
dadurch gekennzeichnet, dass eine Eintauchtiefe eines Trenn- Werkzeugs zum Heraustrennen des Trägerkörpers (2.1) in Ab¬ hängigkeit einer Lage der Folie (F) im Substrat (1.1) einge¬ stellt wird. characterized in that an immersion depth of a separating tool for separating out the carrier body (2.1) in dependence ¬ a position of the film (F) in the substrate (1.1) is ¬ sets.
EP16722569.7A 2015-05-07 2016-04-28 Printed circuit board and a method for producing a printed circuit board Pending EP3292743A1 (en)

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US5257718A (en) * 1993-03-26 1993-11-02 Chiu Ming T Method of bending and soldering corners of a folding printed-circuit board
JP2790122B2 (en) * 1996-05-31 1998-08-27 日本電気株式会社 Laminated circuit board
JP2003298239A (en) * 2002-03-28 2003-10-17 Taiyo Yuden Co Ltd Three-dimensional laminated module and electronic component used for the same
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