EP3242853A1 - Reaktor zur abscheidung von polykristallinem silicium - Google Patents
Reaktor zur abscheidung von polykristallinem siliciumInfo
- Publication number
- EP3242853A1 EP3242853A1 EP15820841.3A EP15820841A EP3242853A1 EP 3242853 A1 EP3242853 A1 EP 3242853A1 EP 15820841 A EP15820841 A EP 15820841A EP 3242853 A1 EP3242853 A1 EP 3242853A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- coating
- reactor
- silver
- base plate
- reactor according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 229910021420 polycrystalline silicon Inorganic materials 0.000 title claims abstract description 28
- 230000008021 deposition Effects 0.000 title abstract description 14
- 238000000576 coating method Methods 0.000 claims abstract description 60
- 239000011248 coating agent Substances 0.000 claims abstract description 57
- 239000012495 reaction gas Substances 0.000 claims abstract description 11
- 239000007789 gas Substances 0.000 claims abstract description 8
- 229910052751 metal Inorganic materials 0.000 claims abstract description 7
- 239000002184 metal Substances 0.000 claims abstract description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 45
- 229910052709 silver Inorganic materials 0.000 claims description 45
- 239000004332 silver Substances 0.000 claims description 45
- 238000000034 method Methods 0.000 claims description 19
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 15
- 230000008569 process Effects 0.000 claims description 15
- 229910052710 silicon Inorganic materials 0.000 claims description 15
- 239000010703 silicon Substances 0.000 claims description 15
- 238000000151 deposition Methods 0.000 claims description 13
- 229910000831 Steel Inorganic materials 0.000 claims description 12
- 239000010959 steel Substances 0.000 claims description 12
- 239000010935 stainless steel Substances 0.000 claims description 9
- 229910001220 stainless steel Inorganic materials 0.000 claims description 9
- 238000007747 plating Methods 0.000 claims description 7
- 239000001257 hydrogen Substances 0.000 claims description 6
- 229910052739 hydrogen Inorganic materials 0.000 claims description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 5
- 239000010946 fine silver Substances 0.000 claims description 4
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 19
- 239000000463 material Substances 0.000 description 19
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 14
- 229920005591 polysilicon Polymers 0.000 description 13
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 12
- 229910052737 gold Inorganic materials 0.000 description 12
- 239000010931 gold Substances 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 11
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 9
- 239000001301 oxygen Substances 0.000 description 9
- 229910052760 oxygen Inorganic materials 0.000 description 9
- 229910052759 nickel Inorganic materials 0.000 description 7
- 239000005046 Chlorosilane Substances 0.000 description 5
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical group Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 description 5
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 238000005137 deposition process Methods 0.000 description 4
- 238000001953 recrystallisation Methods 0.000 description 4
- ZDHXKXAHOVTTAH-UHFFFAOYSA-N trichlorosilane Chemical compound Cl[SiH](Cl)Cl ZDHXKXAHOVTTAH-UHFFFAOYSA-N 0.000 description 4
- 239000005052 trichlorosilane Substances 0.000 description 4
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 3
- 238000005097 cold rolling Methods 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000005482 strain hardening Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 229910001316 Ag alloy Inorganic materials 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000008439 repair process Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000007086 side reaction Methods 0.000 description 2
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 229910017727 AgNi Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- YZCKVEUIGOORGS-UHFFFAOYSA-N Hydrogen atom Chemical compound [H] YZCKVEUIGOORGS-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910003286 Ni-Mn Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 239000012876 carrier material Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- SLLGVCUQYRMELA-UHFFFAOYSA-N chlorosilicon Chemical compound Cl[Si] SLLGVCUQYRMELA-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 229910000856 hastalloy Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910001026 inconel Inorganic materials 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- -1 metal oxide compounds Chemical class 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005480 shot peening Methods 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 229910001923 silver oxide Inorganic materials 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000004857 zone melting Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/02—Silicon
- C01B33/021—Preparation
- C01B33/027—Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material
- C01B33/035—Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material by decomposition or reduction of gaseous or vaporised silicon compounds in the presence of heated filaments of silicon, carbon or a refractory metal, e.g. tantalum or tungsten, or in the presence of heated silicon rods on which the formed silicon is deposited, a silicon rod being obtained, e.g. Siemens process
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J19/02—Apparatus characterised by being constructed of material selected for its chemically-resistant properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J4/00—Feed or outlet devices; Feed or outlet control devices
- B01J4/001—Feed or outlet devices as such, e.g. feeding tubes
- B01J4/002—Nozzle-type elements
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D7/00—Modifying the physical properties of iron or steel by deformation
- C21D7/02—Modifying the physical properties of iron or steel by deformation by cold working
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D7/00—Modifying the physical properties of iron or steel by deformation
- C21D7/13—Modifying the physical properties of iron or steel by deformation by hot working
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/14—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of noble metals or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/24—Deposition of silicon only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
- C23C16/4404—Coatings or surface treatment on the inside of the reaction chamber or on parts thereof
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4418—Methods for making free-standing articles
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/02—Coating starting from inorganic powder by application of pressure only
- C23C24/04—Impact or kinetic deposition of particles
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/00049—Controlling or regulating processes
- B01J2219/00051—Controlling the temperature
- B01J2219/00132—Controlling the temperature using electric heating or cooling elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/02—Apparatus characterised by their chemically-resistant properties
- B01J2219/0204—Apparatus characterised by their chemically-resistant properties comprising coatings on the surfaces in direct contact with the reactive components
- B01J2219/0236—Metal based
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D7/00—Modifying the physical properties of iron or steel by deformation
Definitions
- the invention relates to a reactor for the deposition of polycrystalline silicon.
- Polycrystalline silicon serves as a starting material in the production of monocrystalline silicon by means of crucible pulling (Czochralski or CZ process) or by zone melting (float zone or FZ process). This monocrystalline silicon is cut into slices (wafers) and after a variety of mechanical, chemical and chemo-mechanical processing in the
- polycrystalline silicon is increasingly required for the production of monocrystalline or multicrystalline silicon by means of drawing or casting processes, this monocrystalline or multicrystalline silicon being used to produce solar cells for photovoltaics.
- the polycrystalline silicon is usually produced by means of the Siemens process.
- a bell-shaped reactor (“Siemens reactor") thin filament rods ("thin rods") of silicon are heated by direct current passage and a reaction gas containing a silicon-containing component and hydrogen introduced.
- Chlorosilane more preferably trichlorosilane. Usually SiH 4 or SiHCl 3 (trichlorosilane, TCS) is used in admixture with hydrogen.
- a typical Siemens reactor consists essentially of a metallic base plate, a turned over, with the base plate gas-tight closed coolable bell, nozzles for gas supply and openings for the removal of reaction gas, as well as the holders for the filament rods and the required supply and
- Power is supplied by electrodes, with which the filament rods are held.
- Reactor inside are silver or gold, as these materials have the highest
- DD 156273 A1 discloses a reactor for the production of polysilicon with the peculiarity that the inside of the reactor of electrochemically polished
- EP 0 090 321 A2 describes a process for the production of polysilicon, wherein the walls of the reactor used consist of a corrosion-resistant alloy whose inner surface is mirror-polished.
- KR 10-1145014 B1 discloses a deposition reactor comprising a Ni-Mn alloy coated inner wall for reducing the specific one
- US 2013/115374 A1 discloses a deposition reactor whose inner surface is at least partially equipped with a so-called heat control layer.
- Characteristics of the thermal control layer are emission coefficients of less than 0.1, and hardness of the layer of at least 3.5 Mohs.
- the thickness of the Layer is at max. 100 pm.
- the materials tungsten, tantalum, nickel, platinum, chromium and molybdenum are particularly preferred.
- coatings with silver and gold have advantages compared to an electropolished surface.
- electropolished stainless steel involves the risk of iron contamination in the polysilicon.
- WO 2013/053495 A1 discloses a reactor for the deposition of silicon from the gas phase with a reactor vessel having an inner surface which at least partially defines a process space;
- a first layer which is applied at least in an upper region on the inner surface of the reactor vessel, which has a higher reflectance for
- Thermal radiation has as the uncoated inner surface of the reactor vessel; and a second layer disposed in a lower portion of the inner surface of
- Reactor vessel is applied, which has a higher reflectance for
- Thermal radiation has as the uncoated inner surface of the reactor vessel
- the second layer is substantially thicker than the first layer.
- the first layer can be applied, for example, by electroplating.
- gold can also be used as a coating material. The different thicknesses can save costs.
- silver is to be preferred over gold. Furthermore, silver is much less problematic compared to gold
- DD 64047 A discloses a deposition process for the production of low-phosphorus polysilicon. This is to be accomplished, inter alia, by the use of low-phosphorus materials (stainless steel, silver, etc.) on the reactor inner wall.
- US 4,73944 A claims a separation device in which the
- the silver layer is smoothed after solidification by planing, milling or other mechanical operations.
- DE 1 033 378 B describes a similar process in which the primer layer of silver is reinforced with molten silver to the desired thickness.
- DE 10 2010 017 238 A1 shows how silver can be applied to a steel surface.
- a thermal process e.g., welding
- the silver combines at the contact surface with the steel, resulting in a strong bond of silver and steel.
- the silver layer can then be ground or polished.
- Reactor wall is coated with silver, this can lead to damage of the silver layer due to the high hardness of silicon. This can cause the reflection behavior of the coating to deteriorate. This is associated with a higher power consumption during
- Another problem is that the damage to the reactor wall can also lead to a poorer quality of the polysilicon produced.
- Carrier wall may cause undesirable impurity entry (e.g., iron) into the polysilicon.
- undesirable impurity entry e.g., iron
- a fundamental problem with the use of coating materials such as nickel, gold, silver or other materials which improve reflectivity is that during the manufacturing process, e.g. In the course of the production process of the coating material (eg silver, gold or nickel), the materials to melting temperature (eg silver 961, 9 ° C, gold 1064 ° C, nickel 1455 ° C ) must be brought.
- the coating material eg silver, gold or nickel
- silver shows a relatively high solubility for oxygen, which increases with increasing temperature.
- the silver coatings can have a high oxygen content.
- Coating material dissolved oxygen can cause undesirable side reactions. For example, brown / black silver oxide, dark nickel oxide or other dark-colored metal oxides can form, which can have a negative influence both on the reflection properties of the reactor inner wall and on the quality of the polysilicon produced.
- hydrogen which is used during the deposition process as a carrier gas for chlorosilanes, diffuse through the coating layer and react with dissolved or trapped oxygen to form water. If necessary, this leads to corrosion of the carrier sheet (steel or stainless steel) or to blistering in the coating layer up to detachment of the coating from the carrier sheet.
- a reactor for the deposition of polycrystalline silicon comprising a metallic base plate, a slipped over the base plate and gas-tight with the base plate closed coolable bell, nozzles for gas supply and openings for removal of reaction gas, and brackets for filament rods and Zu - And derivatives for electrical power, wherein the inner walls of the bell with a metal or with a metal alloy
- the coating has been mechanically aftertreated by hot and / or cold deformation, that in the mechanical treatment, a plastic deformation of the coating
- the invention provides for a machining of the coating by a mechanical deformation, so that the coating either a smooth, planar structure or an irregular, non-smooth structure comprising troughs, dents or
- the coating preferably has a minimum thickness of 0.5 mm.
- the mechanical deformation can be a hot forming and / or a
- Cold forming preferably a cold forming, be.
- the surface is plasticized above the recrystallization temperature, such as forging or welding.
- the recrystallization temperature such as forging or welding.
- coating material preferably materials are to be used, which are the
- Reflection properties of the reactor inner wall in relation to the carrier material improve.
- These are in particular metals and metal alloys with a
- Emission coefficient less than 0.3, preferably less than 0.15 is stainless steel, nickel, nickel alloys, e.g. Hastelloy or Inconel, silver or gold.
- the invention provides a targeted after-treatment of the coating
- the base plate on its reactor-side, so directed into the reactor chamber surface, such a coating.
- the forming of the coating aims at a mechanical expulsion of the dissolved oxygen in the coating and oxygen inclusions by plastic deformation of the coating.
- the mechanically reworked coating shows a
- the surface may have a smooth appearance, e.g. after cold and hot rolling, or dents, depressions or other depressions, hereinafter generically called troughs have, as for example after hammering, wherein the surface treatment of the coating is not negative on the
- Possible troughs preferably have a diameter of 1 to 100 mm, more preferably 5 to 30 mm and a depth of preferably 0.1 to 2 mm, particularly preferably 0.1 to 1 mm.
- the hollows may be isolated. In one embodiment, at least partially contiguous wells are present.
- the coated surface is by falling over
- Silicon rods hardly or at least less damaged.
- the coating or plating in particular the silver layer or silver plating, is produced, for example, by the processes described in DE 956 369 C and DE 1 033 378 B.
- Plating is understood to mean the application and firm bonding of a layer having a layer thickness of greater than or equal to 0.5 mm, consisting of a metal or a metal alloy, to a support metal.
- the coating can be carried out by explosive plating, build-up welding, rolling, cold gas spraying or other known methods of the layer material on the support metal. These processes usually take place under high temperature and / or high pressure.
- the coating material In cold gas spraying, the coating material is accelerated in the form of small particles by means of a gas flow at very high speed onto the surface to be coated. When hitting a plastic deformation of spray material and the near-surface layers of the carrier sheet takes place. In the process, a firmly adhering layer builds up.
- the cold working of the coating can e.g. by cold rolling, deep drawing, bending, peening, hammering, shot peening or other cold working methods which cause dislocations in the structure and improve the hardness of the coating.
- the cold forming can take place both as the last processing step after assembly of the coated carrier plates to the deposition reactor as well as in an intermediate production step previously on individual coated carrier plates.
- Deforming, hammering and cold rolling have proven to be particularly suitable cold forming. Particularly preferred is hammering.
- the coating after cold or hot forming 0.5 - 5 mm thick, more preferably 0.5 to 3.5 mm.
- silver is selected as the coating material.
- silver as pure as possible silver (so-called fine silver) but also silver with alloy components (for example, with nickel or the like) can be used.
- Fine silver (Ag 4N) has a content of at least 99.99% by weight of silver.
- Silver with low alloy contents in particular fine grain silver (AgNi 0.15 with a nickel content of 0.15 wt .-%) is particularly preferred because fine grain silver has a higher hardness than silver and fine silver.
- the inner walls of the reactor bell are at
- the base plate or the reactor-side surface of the base plate made of silver-plated steel or stainless steel.
- all surfaces of the interior of the reactor, bounded by base plate and bell, are silver plated.
- the invention also relates to a process for producing polycrystalline silicon in such a reactor, comprising introducing a reaction gas containing a silicon-containing component and hydrogen in a CVD reactor containing at least one filament rod, which is supplied by means of electrodes and thus by direct passage of current to a Temperature is heated at which deposits polycrystalline silicon on the filament rod.
- a reaction gas containing a silicon-containing component and hydrogen in a CVD reactor containing at least one filament rod, which is supplied by means of electrodes and thus by direct passage of current to a Temperature is heated at which deposits polycrystalline silicon on the filament rod.
- each two filament rods are connected at their one ends via a bridge, so that forms a carrier body with an inverse U-shape.
- the filament rods are each connected to an electrode located on the reactor base plate.
- the two electrodes have different polarity.
- the inverse U-shaped support body must - if it consists of silicon - are first preheated to about at least 250 ° C in order to become electrically conductive and to be heated by direct passage of current can.
- reaction gas containing a silicon-containing component is fed.
- Monosilane and trichlorosilane are preferably used in admixture with hydrogen.
- High-purity polysilicon separates out on the heated filament rods and the horizontal bridges, causing their diameter to increase over time.
- the polycrystalline silicon rods obtained by deposition become
- Fig. 1 shows a schematic representation of a reactor.
- the reactor comprises a bell 2 standing on a base plate 1.
- the inside of the reactor facing surface of the reactor wall 3 of the bell is silver plated and hammered.
- the surface of the base plate 1 facing the inside of the reactor is silver-plated and hammered in one embodiment.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Silicon Compounds (AREA)
- Chemical Vapour Deposition (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102015200070.2A DE102015200070A1 (de) | 2015-01-07 | 2015-01-07 | Reaktor zur Abscheidung von polykristallinem Silicium |
| PCT/EP2015/080602 WO2016110402A1 (de) | 2015-01-07 | 2015-12-18 | Reaktor zur abscheidung von polykristallinem silicium |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP3242853A1 true EP3242853A1 (de) | 2017-11-15 |
Family
ID=55072623
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP15820841.3A Withdrawn EP3242853A1 (de) | 2015-01-07 | 2015-12-18 | Reaktor zur abscheidung von polykristallinem silicium |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US20170349443A1 (de) |
| EP (1) | EP3242853A1 (de) |
| JP (1) | JP2018510107A (de) |
| KR (2) | KR20190047121A (de) |
| CN (1) | CN107735361A (de) |
| CA (1) | CA2968292C (de) |
| DE (1) | DE102015200070A1 (de) |
| TW (1) | TWI662164B (de) |
| WO (1) | WO2016110402A1 (de) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102015219925A1 (de) | 2015-10-14 | 2017-04-20 | Wacker Chemie Ag | Reaktor zur Abscheidung von polykristallinem Silicium |
| CN107904658A (zh) * | 2017-11-27 | 2018-04-13 | 亚洲硅业(青海)有限公司 | 一种还原炉内壁复合涂层制备方法 |
| CN107986285B (zh) * | 2017-12-05 | 2018-11-20 | 亚洲硅业(青海)有限公司 | 一种还原炉底盘及其涂层制备方法 |
| KR102340294B1 (ko) * | 2018-01-17 | 2021-12-15 | 한화솔루션 주식회사 | 폴리실리콘 제조용 cvd 반응기의 벨자 코팅 장비 및 이를 이용한 코팅 방법 |
| CN112663005B (zh) * | 2020-12-16 | 2021-11-05 | 亚洲硅业(青海)股份有限公司 | 多晶硅还原炉内壁镀膜装置及方法 |
| JP7843825B1 (ja) * | 2024-12-12 | 2026-04-10 | 株式会社トクヤマ | 多結晶シリコンの製造装置 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE956369C (de) | 1952-11-30 | 1957-01-17 | Degussa | Verfahren zur Herstellung von silberplattierten Formstuecken aus Stahl |
| DE1033378B (de) | 1953-11-17 | 1958-07-03 | Fr Kammerer Ag | Verfahren zur Herstellung von silberplattierten Formstuecken aus Stahl |
| DD64047A1 (de) | 1967-09-25 | 1968-10-05 | Erich Dr Wolf | Verfahren zur herstellung von hochreinem, insbesondere phosphorarmem silicium |
| US4173944A (en) | 1977-05-20 | 1979-11-13 | Wacker-Chemitronic Gesellschaft Fur Elektronik-Grundstoffe Mbh | Silverplated vapor deposition chamber |
| DE2854707C2 (de) * | 1978-12-18 | 1985-08-14 | Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH, 8263 Burghausen | Vorrichtung zur thermischen Zersetzung gasförmiger Verbindungen und ihre Verwendung |
| JPS5595319A (en) * | 1979-01-12 | 1980-07-19 | Wacker Chemitronic | Pure semiconductor material* specially silicon precipitating device and method |
| DD156273A1 (de) | 1981-02-11 | 1982-08-11 | Hans Kraemer | Verfahren zur herstellung von polykristallinem silizium |
| IT1147832B (it) | 1982-03-29 | 1986-11-26 | Dynamit Nobel Ag | Apparecchio e procedimento per la produzione di materiali semiconduttori iperpuri |
| JP2959872B2 (ja) * | 1991-06-18 | 1999-10-06 | 古河電気工業株式会社 | 電気接点材料とその製造方法 |
| JP3437125B2 (ja) * | 1999-06-28 | 2003-08-18 | 七生工業株式会社 | 金属上への貴金属または貴金属合金の被覆方法 |
| JP2004079877A (ja) * | 2002-08-21 | 2004-03-11 | Sumitomo Electric Ind Ltd | 電子部品用リード線の製造方法 |
| RU2010143546A (ru) | 2008-03-26 | 2012-05-10 | ДжиТи СОЛАР, ИНКОРПОРЕЙТЕД (US) | Реакторная система с золотым покрытием для осаждения поликристаллического кремния и способ |
| DE102010017238A1 (de) | 2010-06-04 | 2011-12-08 | G+R Technology Group Ag | Auftragsverfahren zum Auftragen einer Silberschicht auf eine Oberfläche eines Substrats aus Stahl und Reaktor |
| DE112011102417T5 (de) | 2010-07-19 | 2013-05-16 | Rec Silicon Inc. | Herstellung von polykristallinem Silizium |
| KR101145014B1 (ko) | 2011-09-15 | 2012-05-11 | 웅진폴리실리콘주식회사 | 내벽에 복사열 반사 및 불순물 확산 방지용 니켈-망간 합금층을 구비한 화학기상증착 반응기와 그 제조방법 |
| DE102011115782B4 (de) | 2011-10-12 | 2013-04-25 | Centrotherm Sitec Gmbh | Reaktor mit beschichtetem Reaktorgefäß und Beschichtungsverfahren |
| DE202012100839U1 (de) * | 2012-03-08 | 2012-06-22 | Silcontec Gmbh | Laborreaktor |
| DE102013204926A1 (de) * | 2013-03-20 | 2014-09-25 | Wacker Chemie Ag | Vorrichtung zum Schutz einer Elektrodendichtung in einem Reaktor zur Abscheidung von polykristallinem Silicium |
-
2015
- 2015-01-07 DE DE102015200070.2A patent/DE102015200070A1/de not_active Withdrawn
- 2015-12-18 KR KR1020197012002A patent/KR20190047121A/ko not_active Withdrawn
- 2015-12-18 KR KR1020177021430A patent/KR20170102509A/ko not_active Abandoned
- 2015-12-18 WO PCT/EP2015/080602 patent/WO2016110402A1/de not_active Ceased
- 2015-12-18 CN CN201580068577.9A patent/CN107735361A/zh not_active Withdrawn
- 2015-12-18 EP EP15820841.3A patent/EP3242853A1/de not_active Withdrawn
- 2015-12-18 US US15/537,206 patent/US20170349443A1/en not_active Abandoned
- 2015-12-18 JP JP2017536000A patent/JP2018510107A/ja not_active Ceased
- 2015-12-18 CA CA2968292A patent/CA2968292C/en not_active Expired - Fee Related
-
2016
- 2016-01-06 TW TW105100246A patent/TWI662164B/zh not_active IP Right Cessation
Non-Patent Citations (2)
| Title |
|---|
| None * |
| See also references of WO2016110402A1 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CA2968292A1 (en) | 2016-07-14 |
| KR20190047121A (ko) | 2019-05-07 |
| KR20170102509A (ko) | 2017-09-11 |
| TWI662164B (zh) | 2019-06-11 |
| JP2018510107A (ja) | 2018-04-12 |
| CA2968292C (en) | 2019-04-30 |
| US20170349443A1 (en) | 2017-12-07 |
| TW201625827A (zh) | 2016-07-16 |
| WO2016110402A1 (de) | 2016-07-14 |
| CN107735361A (zh) | 2018-02-23 |
| DE102015200070A1 (de) | 2016-07-07 |
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