EP3221408A1 - Composition de silicone hautement transparente durcissable à mécanique améliorée pour des composants optiques - Google Patents
Composition de silicone hautement transparente durcissable à mécanique améliorée pour des composants optiquesInfo
- Publication number
- EP3221408A1 EP3221408A1 EP15804685.4A EP15804685A EP3221408A1 EP 3221408 A1 EP3221408 A1 EP 3221408A1 EP 15804685 A EP15804685 A EP 15804685A EP 3221408 A1 EP3221408 A1 EP 3221408A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- refractive index
- addition
- silicone composition
- radicals
- silica
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 94
- 229920001296 polysiloxane Polymers 0.000 title claims abstract description 74
- 230000003287 optical effect Effects 0.000 title claims abstract description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 74
- 239000000377 silicon dioxide Substances 0.000 claims description 32
- 150000001875 compounds Chemical class 0.000 claims description 22
- 238000004132 cross linking Methods 0.000 claims description 20
- 239000003795 chemical substances by application Substances 0.000 claims description 16
- 125000001931 aliphatic group Chemical group 0.000 claims description 14
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 13
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 claims description 10
- 239000011203 carbon fibre reinforced carbon Substances 0.000 claims description 10
- 238000012986 modification Methods 0.000 claims description 9
- 230000004048 modification Effects 0.000 claims description 9
- 239000000654 additive Substances 0.000 claims description 8
- 238000013329 compounding Methods 0.000 claims description 7
- 239000012763 reinforcing filler Substances 0.000 claims description 7
- 229920002050 silicone resin Polymers 0.000 claims description 7
- 239000003054 catalyst Substances 0.000 claims description 5
- 238000006459 hydrosilylation reaction Methods 0.000 claims description 5
- 239000003112 inhibitor Substances 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 5
- 238000000149 argon plasma sintering Methods 0.000 claims description 4
- 239000000470 constituent Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 238000002360 preparation method Methods 0.000 claims description 4
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- 239000000049 pigment Substances 0.000 claims description 2
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- 238000000034 method Methods 0.000 description 9
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- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
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- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
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- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- CIUQDSCDWFSTQR-UHFFFAOYSA-N [C]1=CC=CC=C1 Chemical compound [C]1=CC=CC=C1 CIUQDSCDWFSTQR-UHFFFAOYSA-N 0.000 description 2
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- 229920001400 block copolymer Polymers 0.000 description 2
- WBLIXGSTEMXDSM-UHFFFAOYSA-N chloromethane Chemical compound Cl[CH2] WBLIXGSTEMXDSM-UHFFFAOYSA-N 0.000 description 2
- IJOOHPMOJXWVHK-UHFFFAOYSA-N chlorotrimethylsilane Chemical compound C[Si](C)(C)Cl IJOOHPMOJXWVHK-UHFFFAOYSA-N 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910052906 cristobalite Inorganic materials 0.000 description 2
- AHUXYBVKTIBBJW-UHFFFAOYSA-N dimethoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](OC)(OC)C1=CC=CC=C1 AHUXYBVKTIBBJW-UHFFFAOYSA-N 0.000 description 2
- 239000008393 encapsulating agent Substances 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
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- 125000005843 halogen group Chemical group 0.000 description 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
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- 125000001181 organosilyl group Chemical group [SiH3]* 0.000 description 2
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- 125000005624 silicic acid group Chemical class 0.000 description 2
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- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 2
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- KLFRPGNCEJNEKU-FDGPNNRMSA-L (z)-4-oxopent-2-en-2-olate;platinum(2+) Chemical compound [Pt+2].C\C([O-])=C\C(C)=O.C\C([O-])=C\C(C)=O KLFRPGNCEJNEKU-FDGPNNRMSA-L 0.000 description 1
- FKTXDTWDCPTPHK-UHFFFAOYSA-N 1,1,1,2,3,3,3-heptafluoropropane Chemical compound FC(F)(F)[C](F)C(F)(F)F FKTXDTWDCPTPHK-UHFFFAOYSA-N 0.000 description 1
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- 238000000921 elemental analysis Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- ZSWFCLXCOIISFI-UHFFFAOYSA-N endo-cyclopentadiene Natural products C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- BITPLIXHRASDQB-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane Chemical class C=C[Si](C)(C)O[Si](C)(C)C=C BITPLIXHRASDQB-UHFFFAOYSA-N 0.000 description 1
- 125000001033 ether group Chemical group 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Chemical compound CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 1
- 239000003205 fragrance Substances 0.000 description 1
- 229920000578 graft copolymer Polymers 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- KAVFUGBZIDUJED-UHFFFAOYSA-N hexa-1,3-dien-3-ylbenzene Chemical compound CCC=C(C=C)C1=CC=CC=C1 KAVFUGBZIDUJED-UHFFFAOYSA-N 0.000 description 1
- PYGSKMBEVAICCR-UHFFFAOYSA-N hexa-1,5-diene Chemical compound C=CCCC=C PYGSKMBEVAICCR-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 150000002430 hydrocarbons Chemical group 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- WPARTLUMZFXOIL-UHFFFAOYSA-N hydroxysilane silicic acid Chemical group O[SiH3].O[Si](O)(O)O WPARTLUMZFXOIL-UHFFFAOYSA-N 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 125000003454 indenyl group Chemical group C1(C=CC2=CC=CC=C12)* 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 239000002905 metal composite material Substances 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000005394 methallyl group Chemical group 0.000 description 1
- NFWSQSCIDYBUOU-UHFFFAOYSA-N methylcyclopentadiene Chemical compound CC1=CC=CC1 NFWSQSCIDYBUOU-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000003136 n-heptyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- DYUWTXWIYMHBQS-UHFFFAOYSA-N n-prop-2-enylprop-2-en-1-amine Chemical compound C=CCNCC=C DYUWTXWIYMHBQS-UHFFFAOYSA-N 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 230000006855 networking Effects 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- SJYNFBVQFBRSIB-UHFFFAOYSA-N norbornadiene Chemical compound C1=CC2C=CC1C2 SJYNFBVQFBRSIB-UHFFFAOYSA-N 0.000 description 1
- 125000003518 norbornenyl group Chemical group C12(C=CC(CC1)C2)* 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 229910052762 osmium Inorganic materials 0.000 description 1
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 150000002926 oxygen Chemical class 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 125000001037 p-tolyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1*)C([H])([H])[H] 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 125000005561 phenanthryl group Chemical group 0.000 description 1
- PKELYQZIUROQSI-UHFFFAOYSA-N phosphane;platinum Chemical class P.[Pt] PKELYQZIUROQSI-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 150000003057 platinum Chemical class 0.000 description 1
- CLSUSRZJUQMOHH-UHFFFAOYSA-L platinum dichloride Chemical compound Cl[Pt]Cl CLSUSRZJUQMOHH-UHFFFAOYSA-L 0.000 description 1
- 229920001921 poly-methyl-phenyl-siloxane Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920001709 polysilazane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 239000013615 primer Substances 0.000 description 1
- 239000002987 primer (paints) Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 230000002940 repellent Effects 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229920005573 silicon-containing polymer Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000001973 tert-pentyl group Chemical group [H]C([H])([H])C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- 150000003609 titanium compounds Chemical class 0.000 description 1
- VPYJNCGUESNPMV-UHFFFAOYSA-N triallylamine Chemical compound C=CCN(CC=C)CC=C VPYJNCGUESNPMV-UHFFFAOYSA-N 0.000 description 1
- ZSOVVFMGSCDMIF-UHFFFAOYSA-N trimethoxy(naphthalen-1-yl)silane Chemical compound C1=CC=C2C([Si](OC)(OC)OC)=CC=CC2=C1 ZSOVVFMGSCDMIF-UHFFFAOYSA-N 0.000 description 1
- TUQLLQQWSNWKCF-UHFFFAOYSA-N trimethoxymethylsilane Chemical class COC([SiH3])(OC)OC TUQLLQQWSNWKCF-UHFFFAOYSA-N 0.000 description 1
- UHUUYVZLXJHWDV-UHFFFAOYSA-N trimethyl(methylsilyloxy)silane Chemical compound C[SiH2]O[Si](C)(C)C UHUUYVZLXJHWDV-UHFFFAOYSA-N 0.000 description 1
- 239000005051 trimethylchlorosilane Substances 0.000 description 1
- 125000001834 xanthenyl group Chemical group C1=CC=CC=2OC3=CC=CC=C3C(C12)* 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/006—Additives being defined by their surface area
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
Definitions
- the invention relates to a highly transparent
- Silicone composition with improved mechanics and their use in optical components.
- Potting compounds for optical semiconductor devices such as LEDs (Light Emitting Diodes) or materials for compression molding or
- Injection molding e.g. for the production of lenses for
- Silicone encapsulants are preferred over the Epoxyvergussmassen.
- the silicone systems For use as primary or secondary optics in optical elements, the silicone systems must have high optical transparency in the visible and partly also in the UV range (UV-Vis) of the electromagnetic spectrum.
- Crosslinked polydiorganosiloxanes achieve high transmission values at wavelengths below 300 nm. Disadvantage of these systems is that the hardnesses are limited to the lower Shore A range and that the mechanical strength is very low.
- EP 1424363 B1 describes compositions containing alkenyl-functional silicone resins in combination with SiH components whose vulcanizates have hardnesses in the Shore D range. Silicone systems with alkyl substituents have refractive indices n D 2S of 1.41. By using aryl substituents such as phenyl, the refractive index can be increased to n D 25 > 1.50. The use of potting compounds with such increased
- compositions containing alkenyl- and aryl-functional silicone resins in combination with Si-H components which have high refractive indices Although vulcanizates with hardnesses in the Shore D range can be achieved by using silicone resin formulations. However, other mechanical properties such as e.g. the elongation at break is still very low. This is disadvantageous in potting compounds or components in secondary optics, since the high thermal stresses at low elongation at break in the cured material to an increased
- reinforcing fillers with specific surface areas between 50 and 400 m 2 / g are generally added.
- reinforcing fillers act e.g. highly dispersed pyrogenic or precipitated silicic acids or other pyrogenic metal oxides.
- Vulcanizates of such with e.g. fumed silica e.g. fumed silica
- reinforced silicone rubbers are but by optical
- Filler particles are smaller than the wavelength of the
- EP 0644914 Bl describes a "process for the preparation of optically homogeneous, highly transparent or light-scattering polymeric moldings or investment materials" of organic matrix materials and inorganic fillers such as
- Metal oxides wherein the refractive index of the filler particles is adapted to the refractive index of the organic matrix.
- Refractive index of 1.52 which corresponds to the refractive index of an epoxy resin system used for the embedding of optical components, so that highly transparent
- Fumed silica (n 1.46) but the light of the LED can be scattered, which can lead to turbidity of the potting compound and to reduce the light output.
- composite additives such as thixotropic additives.
- Metal composite oxides such as Si0 2 / Al 2 0 3 depending on
- the refractive index of the metal compound oxide may be the refractive index of phenyl often used in optical applications
- Polyorganosiloxanes correspond. These blends, matched in filler and polymer refractive index, exhibit higher transparency than blends where filler and polymer have different refractive indices.
- the author points out that an adjustment of the refractive index of fumed silica to the refractive index of the new methyl-phenyl-polysiloxane matrix is not possible. Therefore, such systems have a poor transparency, and thus a lower effectiveness by the increasingly occurring
- the filler differs in refractive index by a maximum of +/- 0.03 from the refractive index of the vulcanizate of the polymer composition.
- the object of the present invention was thus to
- Refractive index improved mechanical properties such as higher hardness at the same time better elongation at break and also have a high transparency at the same time to better meet all requirements for potting compounds or for components in optical systems.
- An addition-crosslinking silicone composition (X) according to the invention is dissolved.
- the refractive index n D 25 of (A) and (C) is at least 1.42
- the silica (E) has by surface modification a refractive index n D 25 which deviates by at most 0,03 from (A) or / and (C), and
- the refractive index n D 25 of (A) and (C) is determined as described below and is at least 1.42, preferably at least 1.46 and more preferably at least 1.48.
- the addition-crosslinking silicone compositions (X) may be one-part silicone compositions as well as two-component silicone compositions.
- Silicone compositions (X) contain all components in any combination, generally with the proviso that a component is not simultaneously siloxanes with aliphatic multiple bond siloxanes with Si-bonded hydrogen and catalyst, that is substantially not at the same time
- compound (A) has at least two aliphatically unsaturated radicals and (B) at least three Si-bonded hydrogen atoms, or compound
- (A) has at least three aliphatically unsaturated radicals and siloxane (B) at least two Si-bonded hydrogen atoms, or instead of compound (A) and (B) siloxane (C) is used, which aliphatically unsaturated radicals and Si-bonded hydrogen atoms in the above ratios. Also possible are mixtures of (A) and (B) and (C) with the abovementioned ratios of aliphatically unsaturated radicals and Si-bonded hydrogen atoms.
- Silicone composition (X) usually contains 30-95% by weight, preferably 50-90% by weight, and more preferably 60-90% by weight (A).
- Silicone composition (X) usually contains 0.1-60% by weight, preferably 0.5-50% by weight and more preferably 1-30% by weight (B). If the addition-crosslinking
- Silicone composition (X) containing component (C) are usually 30-95 wt.%, Preferably 50-90 wt.%, Particularly preferably 60-90 wt.% (C) contained in the formulation.
- the compound (A) used according to the invention may be silicon-free organic compounds having preferably at least two aliphatically unsaturated groups as well as organosilicon compounds having preferably at least two aliphatically unsaturated groups or mixtures thereof.
- silicon-free organic compounds (A) are, 1, 3, 5-trivinylcyclohexane, 2, 3-dimethyl-1, 3-butadiene, 7-methyl-3-methylene-l, 6-octadiene, 2-methyl-1, 3-butadiene, 1, 5-hexadiene, 1, 7-octadiene, 4, 7-methylene-4, 7, 8, 9-tetrahydroindene,
- Polyethylene glycol diacrylate polyethylene glycol dimethacrylate, poly (propylene glycol) methacrylate.
- Component (A) at least one aliphatic unsaturated
- aliphatic unsaturated organosilicon compounds can be used, such as linear or branched
- organosilicon compounds (A) having SiC-bonded radicals having aliphatic carbon-carbon multiple bonds are preferably linear or branched
- R 4 are independently, the same or different, an organic or inorganic radical free of aliphatic carbon-carbon multiple bonds
- R 5 is independently, identically or differently a monovalent, substituted or unsubstituted, SiC-bonded hydrocarbon radical having at least one aliphatic carbon-carbon multiple bond, a is 0, 1, 2 or 3, and
- b 0, 1 or 2
- the radical R 4 may be monovalent or polyvalent radicals
- R are the monovalent radicals -F, -Cl, -Br, OR s , -CN, -SCN, -NCO and SiC-bonded, substituted or unsubstituted hydrocarbon radicals, which with
- Oxygen atoms or the group -C (O) - may be interrupted, as well as divalent, on both sides according to formula (I) Si-linked radicals. If it is 4 radical R is an SiC-bonded, substituted hydrocarbon groups, preferred substituents are halogen atoms, phosphorus-containing radicals, cyano radicals, -OR 6, -NR 6 -, -NR 2 S, -NR 6 -C (0) -NR 6 2 , -C (O) -NR s 2 , -C (O) R 6 , -C (O) OR 6 , -S0 2 -Ph and -C 6 F 5 .
- R 6 independently of one another, identical or different, denote a hydrogen atom or a
- radicals R 4 are alkyl radicals, such as the methyl, ethyl, n-propyl, iso-propyl, n-butyl, iso-bulyl, tert-butyl, n-pentyl, iso-pentyl , neo-pentyl, tert-pentyl, hexyl, such as the n-hexyl, heptyl, such as the n-heptyl,
- Octyl radicals such as the n-octyl radical and iso-octyl radicals, such as the 2, 2, 4-trimethylpentyl radical, nonyl radicals, such as the n-nonyl radical, decyl radicals, such as the n-decyl radical, dodecyl radicals, such as the n-dodecyl radical, and octadecyl radicals, such as the n-octadecyl radical, cycloalkyl radicals, such as cyclopentyl, cyclohexyl, cycloheptyl and methylcyclohexyl radicals, aryl radicals, such as the phenyl,
- Alkaryl radicals such as o-, m-, p-tolyl, xylyl and
- Ethylphenylreste, and aralkyl radicals such as the benzyl radical, the cumyl radical and the a- and the ß-phenylethyl radical.
- substituted radicals R 4 are haloalkyl radicals, such as the 3, 3, 3-trifluoro-n-propyl radical, the 2,2,2,2 ', 2 ⁇ , 2 , - Hexafluoroisopropyl radical, the heptafluoroisopropyl radical, haloaryl radicals, the chloromethyl radical, such as the o-, m- and p-chlorophenyl radical, the o-, m- and p-chloromethylphenyl radical,
- R 4 are divalent radicals which are Si-bonded on both sides according to formula (I) are those which are different from those of the formula
- radicals are - (CH 2 ) -, -CH (CH 3 ) -, -C (CH 3 ) 2 -, -CH (CH 3 ) -CH 2 -, -C 6 H 4 -, -CH (Ph) -CH 2 -, -C (CF 3 ) 2 -, - (CH 2 ) 0 -C 6 H 4 - (CH 2 ) D -, - (CH 2 ) Q - C 6 H 4 -C 6 H 4 - (CH 2) 0 -, - (CH 2 0) p, (CH 2 CH 2 0) o, - (CH 2) o -0 x -C 6 H 4 -S0 2 -C 6 H 4 -0 x - (CH 2 ) D -, where x is 0 or 1, and Ph, o and p are as defined above.
- Radical R 4 is preferably a monovalent, SiC-bonded, optionally substituted, aliphatic carbon-carbon multiple bond free
- Hydrocarbon radical having 1 to 18 carbon atoms, particularly preferably a monovalent, of Si-bonded, free of aliphatic carbon-carbon multiple bonds
- Hydrocarbon radical having 1 to 6 carbon atoms
- Chloromethyl radical The remainder of R 5 may be any, one
- R 5 is alkenyl
- Alkynyl groups having 2 to 16 carbon atoms such as vinyl, allyl, methallyl, 1-propenyl, 5-hexenyl, ethynyl,
- Allyl and hexenyl radicals are particularly preferably used.
- the molecular weight of the component (A) can vary widely
- constituent (A) may be a relatively low molecular weight alkenyl-functional oligosiloxane, such as 1,2-divinyltetramethyldisiloxane, but may also be a high-polymer polydimethylsiloxane having chain-link or terminal Si-bonded vinyl groups, for example having a molecular weight of 10 5 g / mol (determined by NMR
- the structure of the component (A) forming molecules is not specified;
- the structure of a relatively high molecular weight that is to say oligomeric or polymeric siloxane, can be linear, cyclic, branched or even resinous, network-like.
- Linear and cyclic polysiloxanes are preferably composed R R 4 2 SIOI / 2, R 5 R 4 Si0 2/2 and R 2 Si0 2/2 units of the formula 3 SIOI / 2, R 5, wherein R 4 and R 5 are have the meaning given above.
- Network-like polysiloxanes additionally contain
- component (A) More preferably as component (A), the use is more vinyl functional, substantially linear
- compositions have been used.
- organopolysiloxanes (B) having Si-bonded hydrogen atoms are preferably linear, cyclic or
- R 4 has the meaning given above
- c 0.1 2 or 3 and d is 0, 1 or 2,
- the molecular weight of component (B) may also vary within wide limits, such as between 10 2 and 10 6 g / mol.
- the constituent (B) may be, for example, a relatively low molecular weight SiH-functional oligosiloxane, such as tetramethyldisiloxane, but may also be a polyfunctional
- the structure of the component (B) forming molecules is not fixed;
- the structure of a relatively high molecular weight, that is to say oligomeric or polymeric SiH-containing siloxane can be linear, cyclic, branched or even resinous, network-like.
- Linear and cyclic polysiloxanes (B) are preferably selected from units of the formula R 4 3 SiO HR ⁇ SiOx ⁇ ,
- Polysiloxanes additionally contain trifunctional and / or tetrafunctional units, those of the formulas R 4 Si0 3/2, hsi0 are 3/2 and Si0 / 2 is preferred, wherein R 4 has the meaning given above.
- R 4 has the meaning given above.
- the refractive index n D 25 differs from (B) by at most 0.03 from (A) or / and (C). In particular, at most 0.02.
- Component (B) is preferably contained in such an amount in the crosslinkable silicone compositions (X) according to the invention that the molar ratio of SiH groups to
- aliphatic unsaturated groups of (A) is from 0.1 to 20, more preferably between 0.3 and 2.0.
- the components (A) and (B) used according to the invention are commercially available products or customary in chemistry
- Silicone Compositions According to the Invention Organopolysiloxanes (C) which simultaneously contain aliphatic carbon-carbon multiple bonds and Si-bonded hydrogen atoms. Also, the inventive Silicone compositions all three components (A), (B) and (C) included.
- siloxanes (C) are used, they are
- R 4 and R 5 have the meaning given above
- f 0, 1, 2 or 3
- g 0, 1 or 2 and
- h 0, 1 or 2
- organopolysiloxanes (C) are those of Si0 4/2 RSi0 3/2 -, R 4 2 Si0 2/2, R 4 R 5 Si0 2/2 -, R 4 hsi0 _ 2/2, R 4 3 Si0 1/2 , R 4 2 R 5 Si0 1/2 and R 2 HSiOi / 2 units, so for example so-called MQ, MDQ, MDT and MT resins, and linear organopolysiloxanes consisting essentially of R 2 R 5 SIOI / 2 -, R 4 2 Si0 2/2 - and RHSi0 2/2 units, and optionally R 4 2 hsi0!
- the organopolysiloxanes (C) preferably have an average viscosity of from 0.01 to 500,000 Pa.s, more preferably from 0.1 to 100,000 Pa.s, each at 25 ° C.
- Organopolysiloxanes (C) are common in chemistry
- hydrosilylation catalyst (D) any of the catalysts known in the art can be used.
- Component (D) may be a platinum group metal, for example platinum, rhodium, ruthenium, palladium, osmium or iridium, an organometallic compound or a combination thereof.
- component (D) examples are compounds such as
- organopolysiloxanes include 1, 3-diethenyl-1, 1, 3, 3-tetramethyldisiloxane complexes with platinum. Further examples are platinum phosphite complexes or
- compositions may include alkylplatinum complexes such as derivatives of cyclopentadienyltrimethylplatinum (IV),
- Cyclooctadienyldimethylplatinum (II) or diketonato complexes such as bisacetylacetonatoplatinum (II) can be used to initiate the addition reaction with the aid of light. These compounds may be encapsulated in a resin matrix.
- the concentration of component (D) should be sufficient to catalyze the hydrosilylation reaction of components (A) and (B) and (C).
- the amount of component (D) can be between
- the cure rate may be low when the platinum group metal component is below 1 ppm.
- the addition-crosslinking silicone compositions (X) contains at least one reinforcing agent as a further additive
- Filler (E) from the group of pyrogenic or precipitated silicas having a BET surface area of at least 50 m 2 / g, which has been surface-modified so that its
- Refractive index n D 25 differs from (A) or / and (C) by at most 0.03, preferably by at most 0.015.
- Silicone compositions (X) of active reinforcing filler (E) is in the range of 1 to 50% by weight, preferably 5 to 40% by weight, more preferably 10 to 35% by weight.
- Preferred as (E) are precipitated or pyrogenic silicic acids, in particular pyrogenic silicic acid. Particularly preferred is a silica having a BET specific surface area of 80-
- agents it is possible to use all surface modification agents known to the person skilled in the art, such as, for example, water repellents or
- Semi-metal compounds such as silicon compounds
- Polysilazanes can be used, with additional water can be used.
- Silylation agents having hydrolyzable or reactive groups known as hydrophobizing agents may also be used.
- reactive groups e.g. the SiOH, SiCl and / or SiOR groups in
- cyclic, linear or branched non-functional organosiloxanes such as
- Octaorganocyclotetrasiloxan or polydiorganosiloxane can be used.
- the surface treatment agents may be used alone or as a mixture or sequentially as silylating agents.
- the functional silanes or the linear or branched organosiloxanes preferably contain organic radicals R 4 which have a Increase the refractive index, where R 4 is the above
- the surface modification can be done in one step using one or more agents, but also using one or more agents in several steps.
- organofunctional silanes are silazanes such as hexamethyldisilazane, 1, 3-divinyl-1, 1,3, 3-tetramethyldisilazane, alkoxysilanes such as trimethoxymethyl-silanes, dimethoxymethylsilane, trimethoxyphenylsilane, dimethoxydiphenylsilane, trimethoxynaphthylsilane , Chlorosilanes like
- Trimethylchlorosilane dimethyl-dichlorosilane, triphenylchlorosilane, diphenyl-dichlorosilane, naphthyltrichlorosilane.
- siloxanes examples include OH- or chlorine- or alkoxy-terminated poly-dimethylsiloxanes, poly-dimethyl-methylphenylsiloxanes, poly-methylphenyl-siloxanes, poly-dimethyl-diphenylsiloxanes and poly-diphenylsiloxanes.
- the silica is atomized under a nitrogen atmosphere and treated with deionized water.
- an organofunctional silane or siloxane is added under nitrogen atmosphere by atomization and the reaction mixture is homogenized with stirring at room temperature (25 ° C) and then 0.5 to 10 hours at
- organofunctional silane or siloxane submitted and under
- Nitrogen atmosphere heated at least 150 ° C for 0.5 to 10 hours.
- At least 20%, preferably at least 50%, of the originally free OH groups of the silica (X) must be occupied by the desired higher one
- Phosphors non-reinforcing fillers, fungicides, fragrances, rheological additives, corrosion inhibitors, oxidation inhibitors, light stabilizers, flame retardants and agents for influencing the electrical and thermal properties, dispersing aids,
- silicone compositions (X) according to the invention are prepared by mixing components (A), (B) and / or (C) with (D) and (E) and, if desired, with additional components (F).
- the silicone compositions (X) according to the invention can be used as potting compounds for, for example, LEDs and for the production of optical components, such as, for example, lenses, primary or secondary optics. Components made from the
- Silicone compositions (X) according to the invention can be used, for example, in applications of lighting, vehicle lighting, optics or Fresnel optics.
- the silicone compositions (X) according to the invention can be processed by all processing methods known to those skilled in the art, such as
- the residual silanol content in% (% SiOH) can therefore be calculated according to the following formula:
- SiOH (phil) Titration volume from the titration of the
- SiOH (silyl) titration volume from the titration of the
- Viscosities are analogous to DIN EN ISO 3219
- the refractive indices are determined using a refractometer from A. Krüss Optronics, Hamburg, Germany in the wavelength range of visible light. Unless otherwise stated, it is the refractive index n D 25 , which was thus determined at 589 nm and 25 ° C under atmospheric pressure of 1013 mbar according to the standard DIN 51423.
- the determination of the refractive index of (E) is indirect. In this case, 5% by weight of the silica (E) in a
- liquid diorganopolysiloxane having a defined refractive index.
- Diorganopolysiloxanes having different refractive indices are used if the refractive index of the silica is
- Refractive index of the Dlorganopolysiloxans deviates, it comes to the refraction of the light at the interface between silica and polymer and the mixture appears cloudy. If, however, the
- the refractive index of the diorganopolysiloxane can be adjusted by the choice (e.g., phenyl groups) and the proportion in mole percent of the organic groups in the diorganopolysiloxane. For example, a higher proportion of phenyl groups causes a higher refractive index.
- phenyl groups e.g., phenyl groups
- the proportion in mole percent of the organic groups in the diorganopolysiloxane e.g., phenyl groups
- a higher proportion of phenyl groups causes a higher refractive index.
- the transparency is determined by the measurement of the
- the transmission of the filled samples is measured in quartz cuvettes with a layer thickness of 10 mm at 25 ° C. and a normal pressure of 1013 mbar.
- Filled samples are considered to be transparent if the measurement gives a transmission of at least 70%, preferably at least 80%.
- the value of the refractive index of the silica (E) corresponds to the value of the diorganopolysiloxane used.
- the transmission of vulcanized samples is measured on test plates with a layer thickness of 2 mm at 25 ° C and normal pressure of 1013 mbar.
- Vulcanized samples are considered to be transparent if the measurement gives a transmission of at least 80%, preferably at least 85%.
- Shore A hardness is determined according to DIN (German Industrial Standard) 53505 (March 2000 edition).
- Two-fluid nozzle (hollow cone nozzle, model 121, the company nozzles Schlick GmbH, D-96253 Untersiemau / Coburg, 30 ° spray angle, 0.1 mm bore, operated with 5 bar nitrogen) 6.6 g of demineralized water added. Then, in an analogous manner, 30.0 g
- the carbon content of the product was determined to be 9.6%.
- the residual silanol content of the material was 22%.
- the indirectly determined refractive index is 1,495 +/- 0.01.
- Two-fluid nozzle (hollow cone nozzle, model 121, the company nozzles Schlick GmbH, D-96253 Untersiemau / Coburg, 30 ° spray angle, 0.1 mm bore, operated with 5 bar nitrogen) 10.0 g of demineralized water added. Then, in an analogous manner, 24.4 g
- Phenyltrimethoxysilane purchased from Sigma-Aldrich Chemie GmbH, D-89555 Steinheim
- Hohlkegeldüse, model 121 the company Düsen-Schlick GmbH, D-96253 Untersiemau / Coburg, 30 °
- the carbon content of the product was determined to be 6.6%.
- the residual silanol content of the material was 42%.
- the indirectly determined refractive index is 1,495 +/- 0.01.
- Two-fluid nozzle (hollow cone nozzle, model 121, the company Düsen-Schlick GmbH, D-96253 Untersiemau / Coburg, 30 ° spray angle, 0.2 mm bore, operated with 5 bar nitrogen) 30.0 g of a hydroxy-terminated oligo-phenyl-methyl Siloxane with a determined by 29 Si NMR spectroscopy average chain length of seven siloxy units and a silanol content of 4 wt.% Added.
- the reaction mixture was homogenized for 30 minutes by stirring at room temperature and then heated at 300 ° C. for two hours.
- the carbon content of the product was determined to be 10.4%.
- the residual silanol content of the material was 16%.
- the indirectly determined refractive index is 1,500 +/- 0.01.
- Naphthyltrimethoxysilane available from ABCR GmbH, D-76187
- the carbon content of the product was determined to be 8.9%.
- the residual silanol content of the material was 46%.
- the indirectly determined refractive index is 1.53 +/- 0.02.
- the vulcanizate has a hardness Shore A of 55, a tensile strength of 4 N / mm 2 and an elongation at break of 300%.
- the sample shows Wavelengths ⁇ between 400 and 800 nm in a layer thickness of 2 mm transmission of> 85%.
- Viscosity ⁇ 80 mPas) and 0.001 part (based on platinum) of a platinum-1, 3-divinyl-1, 1,3,3-tetramethyldisiloxa complex.
- the mixture is vulcanized under pressure for 15 minutes at 165 ° C.
- the vulcanizate is translucent and has a hardness Shore A of 52, a tensile strength of 3 N / mm 2 and an elongation at break of 190%.
- the sample shows at wavelengths ⁇ between 500 and 800 nm in a layer thickness of 2 mm
- the sample is degassed in a desiccator with a vacuum pump.
- the mixture is cloudy and shows at wavelengths ⁇ between 500 and 800 nm in a layer thickness of 10 mm transmission of ⁇ 80%, at wavelengths ⁇ 500 nm transmission of ⁇ 60%.
- the sample is degassed in a desiccator with a vacuum pump.
- the mixture is cloudy and shows at wavelengths ⁇ between 500 and 800 nm in a layer thickness of 10 mm transmission of ⁇ 70%, at wavelengths ⁇ 500 nm transmission of ⁇ 50%.
- Example 6 (not according to the invention):
- the mixture is vulcanized under pressure for 15 minutes at 165 ° C.
- the vulcanizate has a hardness Shore A of 60, a tensile strength of 2.8 N / mm 2 and an elongation at break of 190%.
- the sample shows at wavelengths ⁇ between 400 and 800 nm in a layer thickness of 2 mm transmission of> 85%.
- the mixture is vulcanized under pressure for 15 minutes at 165 ° C.
- the vulcanizate is transparent and has a hardness Shore A of 55, a breaking strength of 2.1 N / mm 2 and an elongation at break of 150%.
- the mixture is
- n D 25 1.50. 100 parts of this mixture are mixed with 1.45 parts of a SiH-containing poly-dimethyl-phenylmethyl-siloxane copolymer
- the sample shows at wavelengths ⁇ between 400 and 800 nm in a layer thickness of 2 mm transmission of> 85%.
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Abstract
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DE102014223785.8A DE102014223785A1 (de) | 2014-11-21 | 2014-11-21 | Härtbare hochtransparente Siliconzusammensetzung mit verbesserter Mechanik für optische Bauteile |
PCT/EP2015/075111 WO2016078890A1 (fr) | 2014-11-21 | 2015-10-29 | Composition de silicone hautement transparente durcissable à mécanique améliorée pour des composants optiques |
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EP15804685.4A Withdrawn EP3221408A1 (fr) | 2014-11-21 | 2015-10-29 | Composition de silicone hautement transparente durcissable à mécanique améliorée pour des composants optiques |
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US (1) | US10294352B2 (fr) |
EP (1) | EP3221408A1 (fr) |
KR (1) | KR101939140B1 (fr) |
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WO (1) | WO2016078890A1 (fr) |
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US11434372B2 (en) * | 2015-07-07 | 2022-09-06 | Henkel Ag & Co. Kgaa | High temperature resistant, two component, low viscosity silicone composition |
CN107915999A (zh) * | 2016-10-11 | 2018-04-17 | 华成新材料(惠州)有限公司 | 一种加成型导热阻燃绝缘硅橡胶及其制作方法 |
DE102018101289B4 (de) | 2018-01-22 | 2019-10-17 | Imos Gubela Gmbh | Retroreflektor mit einer gekrümmten Oberfläche, Abformwerkzeug zur Herstellung des Retroreflektors und Verfahren zur Herstellung des Abformwerkzeugs |
DE102018101292B4 (de) | 2018-01-22 | 2020-10-29 | Hans-Erich Gubela | Retroreflektorelement zur Verwendung im Straßenverkehr und Spritzgussform |
DE102018101291B4 (de) | 2018-01-22 | 2020-10-29 | Hans-Erich Gubela | Verwendung und Verfahren zur Herstellung eines elastischen Retroreflektors |
CN110669472A (zh) * | 2019-11-01 | 2020-01-10 | 重庆天旗实业有限公司 | 一种透明阻燃硅酮密封胶 |
KR20230033466A (ko) * | 2021-09-01 | 2023-03-08 | 주식회사 한솔케미칼 | 돔 형상이 가능한 경화성 실리콘 조성물 및 그 경화물 |
KR102691936B1 (ko) * | 2022-01-25 | 2024-08-06 | 주식회사 한솔케미칼 | 고휘도 실리콘수지 조성물 및 그 경화물 |
KR20240053901A (ko) * | 2022-10-18 | 2024-04-25 | 주식회사 한솔케미칼 | 안정적인 돔 형성 및 유지가 가능한 경화성 실리콘 조성물 및 그 경화물 |
TW202426570A (zh) * | 2022-12-28 | 2024-07-01 | 美商陶氏有機矽公司 | 可固化聚矽氧組成物 |
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US3996189A (en) | 1975-04-29 | 1976-12-07 | American Optical Corporation | Optically clear filled silicone elastomers |
DE4219287A1 (de) | 1992-06-12 | 1993-12-16 | Merck Patent Gmbh | Anorganische Füllstoffe und organische Matrixmaterialien mit Brechungsindex-Anpassung |
US5661210A (en) * | 1996-09-25 | 1997-08-26 | Dow Corning Corporation | Optically clear liquid silicone rubber |
JP4409160B2 (ja) | 2002-10-28 | 2010-02-03 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物および半導体装置 |
JP2004186168A (ja) | 2002-11-29 | 2004-07-02 | Shin Etsu Chem Co Ltd | 発光ダイオード素子用シリコーン樹脂組成物 |
US7160972B2 (en) * | 2003-02-19 | 2007-01-09 | Nusil Technology Llc | Optically clear high temperature resistant silicone polymers of high refractive index |
US7066955B2 (en) | 2003-09-30 | 2006-06-27 | Advanced Medical Optics, Inc. | High refractive index compositions useful for intraocular lenses and methods for making same |
JP5000566B2 (ja) | 2008-03-27 | 2012-08-15 | 信越化学工業株式会社 | 硬化性シリコーンゴム組成物、およびそれを封止材料として用いた光半導体装置 |
JP5549568B2 (ja) | 2009-12-15 | 2014-07-16 | 信越化学工業株式会社 | 光半導体素子封止用樹脂組成物及び当該組成物で封止した光半導体装置 |
US10147853B2 (en) | 2011-03-18 | 2018-12-04 | Cree, Inc. | Encapsulant with index matched thixotropic agent |
JP5907262B2 (ja) | 2011-07-22 | 2016-04-26 | エルジー・ケム・リミテッド | 硬化性組成物 |
EP2784124B1 (fr) * | 2011-11-25 | 2016-06-29 | LG Chem, Ltd. | Composition durcissable |
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2014
- 2014-11-21 DE DE102014223785.8A patent/DE102014223785A1/de not_active Withdrawn
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- 2015-10-29 KR KR1020177013416A patent/KR101939140B1/ko active IP Right Grant
- 2015-10-29 WO PCT/EP2015/075111 patent/WO2016078890A1/fr active Application Filing
- 2015-10-29 EP EP15804685.4A patent/EP3221408A1/fr not_active Withdrawn
- 2015-10-29 US US15/526,492 patent/US10294352B2/en not_active Expired - Fee Related
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US20170321039A1 (en) | 2017-11-09 |
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KR101939140B1 (ko) | 2019-01-16 |
US10294352B2 (en) | 2019-05-21 |
WO2016078890A1 (fr) | 2016-05-26 |
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