Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K1/00—Soldering, e.g. brazing, or unsoldering
  • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
  • B23K1/0016—Brazing of electronic components
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K1/00—Soldering, e.g. brazing, or unsoldering
  • B23K1/002—Soldering by means of induction heating
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K1/00—Soldering, e.g. brazing, or unsoldering
  • B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
  • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
  • B23K35/24—Selection of soldering or welding materials proper
  • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
  • B23K35/262—Sn as the principal constituent
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
  • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
  • B23K35/24—Selection of soldering or welding materials proper
  • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
  • B23K35/264—Bi as the principal constituent
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
  • H01R4/02—Soldered or welded connections
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
  • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
  • H01R43/0207—Ultrasonic-, H.F.-, cold- or impact welding
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
  • H05B3/00—Ohmic-resistance heating
  • H05B3/84—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K2103/00—Materials to be soldered, welded or cut
  • B23K2103/02—Iron or ferrous alloys
  • B23K2103/04—Steel or steel alloys
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K2103/00—Materials to be soldered, welded or cut
  • B23K2103/02—Iron or ferrous alloys
  • B23K2103/04—Steel or steel alloys
  • B23K2103/05—Stainless steel
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K2103/00—Materials to be soldered, welded or cut
  • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
  • B23K2103/54—Glass
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
  • H01R12/50—Fixed connections
  • H01R12/51—Fixed connections for rigid printed circuits or like structures
  • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
  • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
  • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
  • H05B2203/016—Heaters using particular connecting means

Definitions

• the invention relates to a process for shortening the process time when soldering electrical or electronic components by means of electromagnetic
• the frequency of the AC voltage applied to the loop or coil is adjusted to the connection geometry and is set to a maximum of 150 kHz. Specifically, the frequency of the magnetic field is between 5 and 150 kHz.
• the electrical connection comprises at least one essentially flat soldering pad to be soldered onto the pane and at least one crimping part, in particular crimp, which is in connection with the soldering pad by welding or soldering and which defines at least one electrical cable in the crimping connection.
• connection between the soldering pad and the crimping part is designed in the form of at least one connecting part, wherein the connecting part is designed such that the crimping part can be bent back into the area of the soldering pad and / or beyond the area of the soldering pad.
• DE 102006047764 AI discloses a lead-free solder with improved properties at temperatures of> 150 ° C.
• the lead-free solder is based on an Sn-In-Ag solder alloy containing between 88 to 98.5 wt% Sn, between 1 and 10 wt% In, between 0.5 to 3.5 wt% Ag, between 0 to 1% by weight of Cu and a doping with a crystallization modifier,
• connection element is as Lötfuß
• soldering foot of the known type consists of several, interlocking circular rings or circular ring segments.
• a glass pane are applied to specify, in which it succeeds with classic frequencies optimal heating of the
• non-metallic substrates especially when this substrate is a glass sheet, e.g. a vehicle window is.
• Indicate contact element for soldering by means of electromagnetic induction heating which helps to avoid local overheating during the soldering process, thus allowing a uniform heating of the soldering partners.
• induction soldering uses the knowledge that electrical conductors through which an alternating current flows create an electromagnetic field around them, which oscillates around the zero point with a phase shift analogous to the frequency of the alternating current. If an electrically conductive body is brought in the vicinity of this current-carrying conductor, then a voltage is induced therein, which also causes an alternating current, the so-called secondary alternating current.
• This induced alternating current is 180 ° out of phase with the
• the second conductor or workpiece in the present case the soldering foot, is heated by the heat generated by the current.
• the heat energy can be at non-ferromagnetic
• the current-carrying primary conductor is referred to as an inductor.
• the shape of the inductor is adapted to the shape of the workpiece section to be heated, in particular the soldering foot.
• Number of turns increases and reaches n times the value of the primary current.
• the induced currents predominantly flow only at the surface of the conductor.
• the heat energy generated in an inductively heated metallic body is thus accumulated in its surface layer, the thickness of which depends on the frequency and on the electrical and magnetic properties of the material.
• the relevant skin effect is due to the fact that an alternating current flowing in a conductor also generates eddy currents through self-induction in its interior, which are directed counter to the primary current. Through this resulting overlay arises inside the conductor a higher resistance, which causes a concentration of the current at the surface of the conductor. With increasing frequency, this effect increases, so that at high frequencies only a very thin
• solder pads which usually consist of a silver-containing thick-film material, represent a much better electrical conductor, the amount of energy converted there by induction is significantly lower, so that in the desired very short process time, a fast and sufficient heating of the solder pad materials, but only a slight warming of the respective solder pad occurs. Thus, only little energy is conducted to the substrate, in particular the glass used, so that thermal stresses caused by the soldering process can be avoided.
• a lead-free compound material in particular a lead-free solder, is used for the soldering process.
• the proposed process control and the application of high frequency energy in a range of around 900 kHz does not adversely affect or damage the silver layer material of the solder pads located on the disk.
• the process control can be configured such that a short-term first inductive
• Such a cycle can also be executed several times, within the very short total process time.
• Such process control significantly increases the shear strength of the achieved solder joint.
• the electrical contact element used according to the invention is used for
• the conductive structure is an electrically conductive structure, for example in the form of an antenna or heating conductor arrangement, which can be realized by screen printing.
• unleaded solder which is located on the side of the electrical connection element which is free of a wire end sleeve or a similar means for fastening a flexible conductor, is used as connection means.
• the contact element designed as a soldering foot, has one, at least
• the soldering foot is flat and consists of an iron-nickel or iron-chromium alloy.
• the soldering foot consists of a plurality of non-intermeshing or non-touching, i. spaced circular surfaces, circular rings or circular ring segments. Between the circular surfaces there is a connecting surface piece which is used to fix a connection means, e.g. a wire end sleeve is used.
• the connecting material may be preferred as Lötzinn-Ronde on the
• the contact element ie the soldering foot, consists of FeCr 2 8 or FeNi 29 Coi 7 .
• the lead-free solder comprises, at least as a component, the following alloys: Bi 57 Sn 42 Agi, Bi 57 Sn 40 AG 3, SnAg. 3 8 Cu 0 .7 or Sn 55 Bi 44 Agi.
• the soldering foot in the form of a quasi-elongated "eight" has a length of about 20 mm and one each end-side outer diameter of approx. 6 mm with a material thickness of approx. 0.8 mm. It is within the meaning of the embodiment of the invention to modify the mentioned form of Lötfußes also to an exploded double night, without leaving the theory of the invention.
• the connecting surface piece has a length of about 9 mm.
• stray electromagnetic fields at least one of the surface sides of the soldering foot has a circumferential radius of e.g. Has 0.2 mm.
• the inventive method is summarized by the steps of creating an electrical contact element, designed as Lötfuß
• the contact element material is based on an iron-nickel or iron-chromium alloy. Furthermore, a lead-free bonding material is applied to the contact element, i. applied the soldering foot. in the
• connection is carried out by positioning the soldering foot on the respective
• Lötan gleich Structure which preferably consists of a silver thick-layer material and which is located on a glass sheet.
• solder foot material and only reduced heating of the silver-containing material of the respective solder pad.
• the soldering step is completed after a very short time, in particular a time ⁇ 10 seconds, preferably in particular in a time of 4 to 6 seconds.
• the electrical connection element according to the invention ie the specially trained soldering foot, will be explained in more detail using an exemplary embodiment and with the aid of figures.
• Fig. 1 is a side view of the soldering foot with exemplary dimensioning in
• Fig. 2 is a plan view of the contact element of Fig. 1; 3 shows a detailed view A according to FIG. 1 and FIG. 4 shows a narrow side view of the soldering foot.
• the electrical connection element shown in the figures is designed as Lötfuß and consists of two circular surface segments 1; Second
• a conductor or a conductor end sleeve (not shown) is provided in the area of the joining surface piece 3, e.g. fixed by welding or soldering.
• protrusions 4 are formed on the underside of the soldering foot, which are for example embossed beads.
• projections 4 rest on the surface of the structure during the soldering process and form a defined one with an exemplary height of 0.3 mm
• solder In sleeve-like holes 5, the solder is cohesively fixed, so that a corresponding prefabrication of the soldering foot including solder can be done in a simple manner.
• at least one of the surface sides of the soldering foot is provided with a circumferential radius 6 of, for example, 0.2 mm.
• Figs. 1 and 2 are merely exemplary, i. Without limiting the teaching of the invention to understand.
• Decisive is a taper 8 such that the width of the connecting surface piece 3 is smaller than the diameter of the corresponding
• the width of the connecting surface piece 3 is 4 mm; however, the diameter of the

Landscapes

• Engineering & Computer Science (AREA)
• Mechanical Engineering (AREA)
• Chemical & Material Sciences (AREA)
• Materials Engineering (AREA)
• Manufacturing & Machinery (AREA)
• General Induction Heating (AREA)
• Joining Of Glass To Other Materials (AREA)
• Electric Connection Of Electric Components To Printed Circuits (AREA)
• Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)

Applications Claiming Priority (3)

Publications (1)

Family

ID=53185727

Family Applications (1)

Country Status (6)

Families Citing this family (14)

Family Cites Families (14)

• 2015
  • 2015-03-11 DE DE102015003086.8A patent/DE102015003086A1/de active Pending
  • 2015-03-11 DE DE202015002764.4U patent/DE202015002764U1/de active Active
  • 2015-09-10 EP EP15763876.8A patent/EP3191249A1/de not_active Withdrawn
  • 2015-09-10 CN CN201580055265.4A patent/CN107073617A/zh active Pending
  • 2015-09-10 US US15/509,534 patent/US20170297130A1/en not_active Abandoned
  • 2015-09-10 WO PCT/EP2015/070730 patent/WO2016038144A1/de active Application Filing
  • 2015-09-10 MX MX2017003154A patent/MX2017003154A/es unknown

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