MX2017003154A - Metodo para acortar el tiempo de proceso durante la soldadura de componentes eléctricos o electrónicos mediante calentamiento inductivo electromagnético. - Google Patents

Metodo para acortar el tiempo de proceso durante la soldadura de componentes eléctricos o electrónicos mediante calentamiento inductivo electromagnético.

Info

Publication number
MX2017003154A
MX2017003154A MX2017003154A MX2017003154A MX2017003154A MX 2017003154 A MX2017003154 A MX 2017003154A MX 2017003154 A MX2017003154 A MX 2017003154A MX 2017003154 A MX2017003154 A MX 2017003154A MX 2017003154 A MX2017003154 A MX 2017003154A
Authority
MX
Mexico
Prior art keywords
soldering
solder
electric
foot
shortening
Prior art date
Application number
MX2017003154A
Other languages
English (en)
Inventor
Jenrich André
Original Assignee
Few Fahrzeugelektrikwerk Gmbh & Co Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Few Fahrzeugelektrikwerk Gmbh & Co Kg filed Critical Few Fahrzeugelektrikwerk Gmbh & Co Kg
Publication of MX2017003154A publication Critical patent/MX2017003154A/es

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/002—Soldering by means of induction heating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/264—Bi as the principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0207—Ultrasonic-, H.F.-, cold- or impact welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/84—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/02—Iron or ferrous alloys
    • B23K2103/04—Steel or steel alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/02—Iron or ferrous alloys
    • B23K2103/04—Steel or steel alloys
    • B23K2103/05—Stainless steel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/016—Heaters using particular connecting means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • General Induction Heating (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)

Abstract

La invención se refiere a un método para acortar el tiempo de proceso durante la soldadura de componentes eléctricos o electrónicos por medio de calentamiento inductivo electromagnético, en particular la soldadura de elementos de contacto eléctricos para soldar superficies de conexión que se aplican a un sustrato no metálico, en particular una hoja de vidrio. De conformidad con la invención primero se produce un elemento de contacto eléctrico, diseñado como un pie de soldadura, hecho de un material con una base de aleación de hierro-níquel o hierro-cromo. Subsiguientemente al pie de soldadura se le aplica un material de conexión exento de plomo. Después de que el pie de soldadura se colocó sobre la respectiva superficie de conexión de soldadura, el pie de soldadura se calienta en forma inductiva mediante energía de alta frecuencia con mayor calentamiento del material de pie de soldadura y menor calentamiento del material que contiene plata de la respectiva superficie de conexión de soldadura. La etapa de soldadura se completa después de un tiempo de < 10 s, en particular dentro de un tiempo de < 4 a 6 s. La invención también se refiere a un elemento de contacto en la forma de un pie de soldadura especial.
MX2017003154A 2014-09-12 2015-09-10 Metodo para acortar el tiempo de proceso durante la soldadura de componentes eléctricos o electrónicos mediante calentamiento inductivo electromagnético. MX2017003154A (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102014013553 2014-09-12
DE102015003086.8A DE102015003086A1 (de) 2014-09-12 2015-03-11 Verfahren zur Prozesszeitverkürzung beim Löten elektrischer oder elektronischer Bauteile mittels elektromagnetischer Induktionserwärmung
PCT/EP2015/070730 WO2016038144A1 (de) 2014-09-12 2015-09-10 Verfahren zur prozesszeitverkürzung beim löten elektrischer oder elektronischer bauteile mittels elektromagnetischer induktionserwärmung

Publications (1)

Publication Number Publication Date
MX2017003154A true MX2017003154A (es) 2018-01-15

Family

ID=53185727

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2017003154A MX2017003154A (es) 2014-09-12 2015-09-10 Metodo para acortar el tiempo de proceso durante la soldadura de componentes eléctricos o electrónicos mediante calentamiento inductivo electromagnético.

Country Status (6)

Country Link
US (1) US20170297130A1 (es)
EP (1) EP3191249A1 (es)
CN (1) CN107073617A (es)
DE (2) DE202015002764U1 (es)
MX (1) MX2017003154A (es)
WO (1) WO2016038144A1 (es)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD815042S1 (en) 2015-03-26 2018-04-10 Few Fahrzeugelektrikwerk Gmbh & Co. Kg Mounting device
GB201515010D0 (en) * 2015-08-24 2015-10-07 Pilkington Group Ltd Electrical connector
DE102015223778A1 (de) * 2015-11-30 2017-06-01 Continental Teves Ag & Co. Ohg Verfahren zum Ausbilden einer elektrischen Verbindung und elektrisches Verbindungselement
DE102016115364A1 (de) 2016-08-18 2018-02-22 Few Fahrzeugelektrik Werk Gmbh & Co. Kg Verfahren zur Ausbildung einer stoffschlüssigen Fügeverbindung
USD857420S1 (en) 2016-12-23 2019-08-27 Few Fahrzeugelektrikwerk Gmbh & Co. Kg Mounting device
DE202016008092U1 (de) 2016-12-28 2017-03-03 Few Fahrzeugelektrikwerk Gmbh & Co. Kg Elektrisches Anschlusselement
DE102017116936A1 (de) * 2017-07-26 2019-01-31 Ledvance Gmbh Verbindung eines elektrischen Leitelements mit einer Leiterplatte eines Leuchtmittels
KR102480461B1 (ko) * 2017-11-30 2022-12-21 쌩-고벵 글래스 프랑스 차량용 창유리의 터미널 솔더링 장치 및 방법
EP3823784A1 (de) 2018-07-20 2021-05-26 Saint-Gobain Glass France Vorrichtung und verfahren zum verlöten von kontaktelementen mit induktionswärme
GB201817357D0 (en) * 2018-10-25 2018-12-12 Strip Tinning Ltd Flexible connector
CN110012614B (zh) * 2019-04-19 2020-07-24 维沃移动通信有限公司 一种电路板、电路板组件、电子设备和焊接方法
DE102019209451B4 (de) * 2019-06-28 2021-04-01 Vitesco Technologies Germany Gmbh Elektrisches Kontaktelement, Leistungselektronikvorrichtung mit einem elektrischen Kontaktelement
DE102020208360B4 (de) 2020-07-03 2022-03-24 Vitesco Technologies Germany Gmbh Formdraht, Leiterplatte, Leistungselektronik und Verfahren zur Herstellung einer Leiterplatte
DE102020120473A1 (de) * 2020-08-04 2022-02-10 Eberspächer catem Hermsdorf GmbH & Co. KG Verfahren zur Herstellung eines PTC-Heizelements und PTC-Heizelement

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4304788C2 (de) * 1993-02-17 1996-05-15 Ver Glaswerke Gmbh Verfahren zur Herstellung einer Leiterstruktur mit sich kreuzenden elektrischen Leitern auf der Oberfläche einer Glasscheibe
DE20203202U1 (de) 2001-12-31 2002-06-06 Gilliam Jakob Elektrischer Anschluß
DE102004057630B3 (de) * 2004-11-30 2006-03-30 Saint-Gobain Sekurit Deutschland Gmbh & Co. Kg Verfahren und Vorrichtung zum Löten von Anschlüssen mit Induktionswärme
US7452800B2 (en) * 2005-11-09 2008-11-18 The Regents Of The University Of California Bonding a non-metal body to a metal surface using inductive heating
DE102006047764A1 (de) 2006-10-06 2008-04-10 W.C. Heraeus Gmbh Bleifreies Weichlot mit verbesserten Eigenschaften bei Temperaturen >150°C
US8299401B2 (en) * 2009-06-30 2012-10-30 Pilkington Group Limited Method and apparatus for forming a vehicle window assembly
EP2367399A1 (de) * 2010-03-02 2011-09-21 Saint-Gobain Glass France Scheibe mit einem elektrischen Anschlusselement
EP2408260A1 (de) * 2010-07-13 2012-01-18 Saint-Gobain Glass France Glasscheibe mit einem elektrischen Anschlusselement
DE202011100906U1 (de) 2011-05-03 2011-06-09 FEW Fahrzeugelektrikwerk GmbH & Co. KG, 04442 Elektrisches Anschlusselement
ES2837421T3 (es) * 2011-05-10 2021-06-30 Saint Gobain Placa con un elemento de conexión eléctrica
HUE047517T2 (hu) * 2011-05-10 2020-04-28 Saint Gobain Ablaküveg villamos csatlakozóelemmel
EA027655B1 (ru) * 2011-07-04 2017-08-31 Сэн-Гобэн Гласс Франс Способ изготовления оконного стекла с электрическим присоединительным элементом
DE102012007804B4 (de) * 2012-02-24 2022-06-02 Few Fahrzeugelektrikwerk Gmbh & Co. Kg Verfahren zum technologisch optimierten Ausführen von bleifreien Lötverbindungen
PL2923528T3 (pl) * 2012-11-21 2017-07-31 Saint-Gobain Glass France Szyba z elektrycznym elementem przyłączeniowym i mostkiem łączącym

Also Published As

Publication number Publication date
DE102015003086A1 (de) 2016-03-17
DE202015002764U1 (de) 2015-05-06
US20170297130A1 (en) 2017-10-19
CN107073617A (zh) 2017-08-18
WO2016038144A1 (de) 2016-03-17
EP3191249A1 (de) 2017-07-19

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