EP3138695B1 - Dispositif et procédé de fabrication d'emblème avec puce ic intégrée - Google Patents

Dispositif et procédé de fabrication d'emblème avec puce ic intégrée Download PDF

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Publication number
EP3138695B1
EP3138695B1 EP14891113.4A EP14891113A EP3138695B1 EP 3138695 B1 EP3138695 B1 EP 3138695B1 EP 14891113 A EP14891113 A EP 14891113A EP 3138695 B1 EP3138695 B1 EP 3138695B1
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EP
European Patent Office
Prior art keywords
layer material
chip
metal mold
sheet
slide board
Prior art date
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Application number
EP14891113.4A
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German (de)
English (en)
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EP3138695A1 (fr
EP3138695A4 (fr
Inventor
Eiji Kuwahara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KURODA, TAKESHI
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Individual
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Publication of EP3138695A1 publication Critical patent/EP3138695A1/fr
Publication of EP3138695A4 publication Critical patent/EP3138695A4/fr
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/18—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
    • B29C65/24—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools characterised by the means for heating the tool
    • B29C65/30—Electrical means
    • B29C65/32—Induction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/12—Dielectric heating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C43/40—Moulds for making articles of definite length, i.e. discrete articles with means for cutting the article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C51/00—Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
    • B29C51/08—Deep drawing or matched-mould forming, i.e. using mechanical means only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/04—Dielectric heating, e.g. high-frequency welding, i.e. radio frequency welding of plastic materials having dielectric properties, e.g. PVC
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/74—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by welding and severing, or by joining and severing, the severing being performed in the area to be joined, next to the area to be joined, in the joint area or next to the joint area
    • B29C65/743—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by welding and severing, or by joining and severing, the severing being performed in the area to be joined, next to the area to be joined, in the joint area or next to the joint area using the same tool for both joining and severing, said tool being monobloc or formed by several parts mounted together and forming a monobloc
    • B29C65/7441—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by welding and severing, or by joining and severing, the severing being performed in the area to be joined, next to the area to be joined, in the joint area or next to the joint area using the same tool for both joining and severing, said tool being monobloc or formed by several parts mounted together and forming a monobloc for making welds and cuts of other than simple rectilinear form
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/004—Preventing sticking together, e.g. of some areas of the parts to be joined
    • B29C66/0046—Preventing sticking together, e.g. of some areas of the parts to be joined by the use of a lubricant, e.g. fluid, powder
    • B29C66/00463—Preventing sticking together, e.g. of some areas of the parts to be joined by the use of a lubricant, e.g. fluid, powder being solid, e.g. a powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/306—Applying a mark during joining
    • B29C66/3062—Applying a mark during joining in the form of letters or numbers
    • B29C66/30621—Applying a mark during joining in the form of letters or numbers in the form of letters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/43—Joining a relatively small portion of the surface of said articles
    • B29C66/433—Casing-in, i.e. enclosing an element between two sheets by an outlined seam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/7392—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic
    • B29C66/73921—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic characterised by the materials of both parts being thermoplastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
    • B29C66/814—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps
    • B29C66/8145—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps characterised by the constructional aspects of the pressing elements, e.g. of the welding jaws or clamps
    • B29C66/81457—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps characterised by the constructional aspects of the pressing elements, e.g. of the welding jaws or clamps comprising a block or layer of deformable material, e.g. sponge, foam, rubber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/832—Reciprocating joining or pressing tools
    • B29C66/8322—Joining or pressing tools reciprocating along one axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C3/00—Processes, not specifically provided for elsewhere, for producing ornamental structures
    • B44C3/02—Superimposing layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C3/00—Processes, not specifically provided for elsewhere, for producing ornamental structures
    • B44C3/08—Stamping or bending
    • B44C3/085—Stamping or bending stamping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/02—Induction heating
    • H05B6/10—Induction heating apparatus, other than furnaces, for specific applications
    • H05B6/14—Tools, e.g. nozzles, rollers, calenders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C2043/3602—Moulds for making articles of definite length, i.e. discrete articles with means for positioning, fastening or clamping the material to be formed or preforms inside the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2793/00—Shaping techniques involving a cutting or machining operation
    • B29C2793/009—Shaping techniques involving a cutting or machining operation after shaping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/04—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles using movable moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/14—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles in several steps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/34—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement"
    • B29C65/36—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction
    • B29C65/3604—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction characterised by the type of elements heated by induction which remain in the joint
    • B29C65/366—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction characterised by the type of elements heated by induction which remain in the joint being a coating or being printed, e.g. being applied as a paint or forming a printed circuit
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/34—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement"
    • B29C65/36—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction
    • B29C65/3672—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction characterised by the composition of the elements heated by induction which remain in the joint
    • B29C65/3676—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction characterised by the composition of the elements heated by induction which remain in the joint being metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
    • B29C66/812—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the composition, by the structure, by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps
    • B29C66/8122—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the composition, by the structure, by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps characterised by the composition of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2023/00—Use of polyalkenes or derivatives thereof as moulding material
    • B29K2023/10—Polymers of propylene
    • B29K2023/12—PP, i.e. polypropylene
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/06—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
    • B29K2105/20—Inserts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/25—Solid
    • B29K2105/253—Preform
    • B29K2105/256—Sheets, plates, blanks or films
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2017/00—Carriers for sound or information
    • B29L2017/006—Memory cards, chip cards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/722—Decorative or ornamental articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/744—Labels, badges, e.g. marker sleeves

Definitions

  • the present invention relates to a device and a method for manufacturing an emblem with an incorporated or embedded, IC chip by means of high frequency dielectric heating, using thermoplastic synthetic resin film as starting material.
  • an emblem can suitably be attached to a military uniform, a police uniform, a fire fighter uniform or an official uniform of any other public office or a private company.
  • Patent literatures that disclose a method for manufacturing a decorative piece such as an emblem, an applique or a sticker by hi gh frequency di el ectri c heati ng, using thermopl asti c synthetic resin film as starting material and a decorative piece manufactured by the method include among others Patent Literatures 1, 2 and 3 listed hereinafter.
  • a decorative piece as disclosed in Patent Literature 1 includes a lower layer (formed by using vinyl chloride film 11) and an upper layer made of thermoplastic synthetic resin (a polyester sheet 1). A sheet of thermoplastic synthetic resin film may be used as the material of the upper layer.
  • the lower layer may be made of any appropriate material such as woven fabric, knitted fabric, synthetic resin (vinyl chloride 11 in Patent Literature 1) or synthetic leather.
  • thermal bonding film can be used for the lower layer of the decorative piece.
  • a decorative piece having an upper layer that is made of thermoplastic synthetic resin and a lower layer can be manufactured by means of high frequency dielectric heating.
  • a metal mold table that operates as one of the electrodes for high frequency dielectric heating (which corresponds to the lower el ectrode 16' in Patent L iterature 1) and a carving metal mold that operates as the other electrode for high frequency dielectric heating (which corresponds to the upper electrode 16 in Patent Literature 1) are employed.
  • a carving metal mold as described above has a fusion cutting blade (which corresponds to the blade section 17 in Patent Document 1) and a pressing blade (which corresponds to the protruding section 14' in Patent Literature 1).
  • the fusion cutting blade has a sharp edge runni ng along the outer contour line of the pattern to be produced and is employed to cut the thermoplastic synthetic resin film that is the material of the patterned piece to be manufactured by fusion cutting.
  • the edge of the pressing blade is placed in a plane located above the horizontal plane where the sharp edge is found and not as sharp as the above described sharp edge of the fusion cutting blade.
  • the pressing blade is designed to produce a given three-dimensional shape out of the thermoplastic synthetic resin film.
  • thermoplastic synthetic resin film which is the material of the upper layer.
  • the lower film material is laid on the metal mold table and subsequently a sheet of thermoplastic synthetic resin film, which is the material of the upper layer, is laid thereon.
  • the thermoplastic synthetic resin film and the lower layer material are pressed down from above by means of the carving metal mold and a high frequency dielectric heating operation is executed on them.
  • the upper layer material is fused and a three-dimensional pattern is formed on the thermoplastic synthetic resin film by the carving operation of the carving metal mold and the pressure applied by the pressing blade.
  • thermoplastic synthetic resin film is fused and cut by the fusion cutting blade to define the outer contour line of the patterned piece. Furthermore, as a result of the high frequency dielectric heating operation, the thermoplastic synthetic resin film is molten to consequently bond together and unify the upper layer and the lower layer to form a decorative piece. Then, all unnecessary parts are removed to complete the operation of producing a finished decorative piece.
  • the decorative piece to be manufactured is a thermal bonding film type one (in which the lower layer is made of a material having a property like that of thermal adhesives and can thermally be bonded to a jacket or some other outer wear to which it is to be bonded by ironing)
  • a sheet of release paper may be arranged on the lower surface of the formed lower layer.
  • transparent carrier film may be arranged on the upper surface of the patterned piece.
  • the lower layer material is fabric or the like, the lower layer material may be cut by an appropriate known means instead of fusion cutting by high frequency di el ectri c heati ng.
  • emblems made of thermoplastic synthetic resin can be manufactured at low cost on a mass production basis by means of pressure applied from above and high frequency dielectric heating.
  • a device according to the preamble of claim 1 can further be found in the patent application EP 2 578 382 A1 .
  • emblems made of thermoplastic synthetic resin can be manufactured at low cost on a mass production basis, and also soft and lightweight emblems can be manufactured by using soft resin film.
  • soft resin film if such an emblem is attached to the breast pocket of a shirt or a uniform jacket, it would not hang down from the pocket due to its weight and, if such an emblem is attached to one of the sleeves of a shirt or a uniform jacket, it can accommodate any move of the arm and would not give any uncomfortable feeling to the wearer of the shirt or the jacket, whichever appropriate, because of its softness and flexibility.
  • all the emblems manufactured in lots show a same shape, a same pattern and same colors and hence they cannot be used to identify the individuals wearing them.
  • emblems and other decorative pieces that can be used to identify individuals who are wearing them.
  • emblems made of thermoplastic synthetic resin each having an IC chip embedded therein and containing information input therein that is necessary to identify the wearer of the emblem. More specifically, such an emblem is required to have an IC chip incorporated, or embedded, between the upper layer (and the intermediate layer if exists) and the lower layer of the emblem.
  • emblems made of thermoplastic synthetic resin can be manufactured at low cost on a mass production basis and also soft and lightweight emblems can be manufactured by using soft resin film.
  • a device for manufacturing an emblem of thermoplastic synthetic resin with an incorporated IC chip by high frequency dielectric heating comprising:
  • thermoplastic synthetic resin material with an incorporated IC chip by high frequency dielectric heating, the method comprising:
  • the IC chip is free from the pressing force applied to the upper layer and lower layer materials by the upper metal mold because it is located in the recessed section. If it receives the pressing force applied by the upper metal mold, the IC chip is prevented from being damaged by the pressing force because the pressing force is absorbed by the cushion member.
  • a given shaped is imparted to the upper layer materi al (i ncl udi ng the i ntermedi ate layer materi al) simply by drivi ng the slide board to make it axially slide and, at the same time, the upper layer material and the lower layer material can be bonded together by fusion bonding without causing the IC chip to be damaged by the pressing force applied to the upper layer and lower layer materials by the upper metal mold.
  • the present invention provides a device having a simple and compact structure for manufacturing an emblem of a thermoplastic synthetic resin material with incorporated IC chi p that does not need to use tabl es of two different types.
  • a ccordi ng to the present invention a given shaped is imparted to the upper layer material (including the intermediate layer material) simply by driving the slide board to make it axially slide and, at the same time, the upper layer material and the lower layer material can be bonded together by fusion bonding without causing the IC chip to be damaged by the pressing force applied to the upper layer and lower layer materi al s by the upper metal mold.
  • the present invention provides a device having a simple and compact structure for manufacturing an emblem of a thermoplastic synthetic resin material with incorporated IC chip that does not need to use tables of two different types.
  • an emblem manufactured by a manufacturing device and a manufacturing method according to the present invention comprises an upper layer 2 that is made of thermoplastic synthetic resin and a lower layer 3.
  • a sheet of release paper 9 is attached to the lower surface of the lower layer 3.
  • the upper layer 2 is formed by using a surface layer material 4a and an intermediate layer material 5a and the surface layer material 4a and, the intermediate layer material 5a are integrally bonded to each other by fusion bonding using high frequency dielectric heating.
  • An IC chip 6 is arranged between the upper layer 2 and the lower layer 3 of the embodiment 1 accordi ng to the present invention.
  • the upper layer 2 is formed by using a surface layer material 4a and an intermediate layer material 5a. A three-dimensional shape is imparted to the surface layer material 4a.
  • the upper surface of the surface layer is subjected to a printing operation.
  • Thermoplastic synthetic resin film can be used for the surface layer material 4a, while any known material that can be used for synthetic resin-made decorative piece may be used as the surface layer material 4a. Examples of such known materials include polyvinyl chloride film, polyurethane film, polyester film and polyolefin film.
  • the thermoplastic synthetic resin film to be used as the surface layer material 4a may be laminated film.
  • Metal may be deposited on the thermoplastic synthetic resin film to be used as the surface layer material 4a by means of a known vapor deposition technique so as to give a metallic appearance to the decorative piece to be produced.
  • metallized film selected from metallized polyvinyl chloride film, metallized polyurethane film, metallized polyester film, metallized polyolefin film etc. may be used as the surface layer material 4a.
  • Any appropriate known metal may be used for the metal vapor deposition. Examples of appropriate metals include aluminum, chromium, silver and tin.
  • Carrier film 7 may additionally be arranged on the upper surface of the surface layer 4 and furthermore polypropylene film 8 may additionally be laid on the upper surface of the carrier film 7.
  • the lower surface of the carrier film 7 has a function of operating as adhesive. Therefore, when a pattern is produced by a set of a plurality of patterned pieces that are arranged separately relative to each other, the relative positions of the patterned pieces do not change.
  • Any known carrier film can be used for the carrier film 7.
  • the carrier film 7 is required to be transparent so that the pattern printed on the surface layer 4 may be visible from outside. While the carrier film 7 may appropriately have a thickness between 30 and 60 micron, there are no particular limitations to the thickness of the carrier film 7 for the purpose of the present invention.
  • any known polypropylene film may be used as the polypropylene 8 on the carrier film 7 provided that it is translucent or transparent. After the completion of the operation of preparing the emblem, the polypropylene film 8 is held in position until the emblem is transferred onto a garment. When a plurality of graphics and/or characters is formed by using only the carrier film 7, they may easily be displaced and/or some of them may wholly or partly come off at the time of transferring the emblem, because the retention force of carrier film is weak. Thus, the use of polypropylene film 8 is desirable because of the reinforcement effect it can provide to the carrier film 7.
  • polypropylene film 8 is not cut by fusion cutti ng, it is drawn to the lateral surface of the emblem so that the polypropylene film, which is the surface material of the emblem, gets to the lower layer to make the lateral surface of the emblem show a neatly and attractively finished appearance. Furthermore, the polypropylene film 8 is employed because the carrier film 7 can more often than not be cut along the fusion cutting blade when carri er film 7 is used without polypropylene film 8. Then, the surface layer material can clearly be cut along the fusion cutti ng blade.
  • the intermediate layer material 5a is employed to make the emblem show a certain thickness and prevent voids from being formed in the emblem because, if such voids are formed, the emblem can become depressed above the voids.
  • Thermoplastic synthetic resin film can be used as the intermediate layer materi al 5a.
  • thermoplastic synthetic resin film examples include polyvinyl chloride sheets, polyurethane sheets and polyolefin sheets.
  • the intermediate layer material 5a is employed only when the embodiment is required to show a certain thickness and hence it is not an indispensable material.
  • the intermediate layer 5 and the surface layer 4 are integrally bonded to each other by fusion bonding using high frequency dielectric heating to become a unified layer, which is referred to as "the upper layer 2".
  • the lower layer 3 is a layer to be used to attach the upper layer 2 to the part of a garment for receiving the upper layer 2.
  • a lower layer 3 having an adhesive or bonding function is employed for the emblem.
  • the lower layer 3 of an emblem according to the present invention is by no means limited to one having an adhesive or bonding function.
  • the lower layer 3 is formed by using a lower layer material 3a. Any material known in this technical field may be used as the lower layer material 3a.
  • hot melt film 9a that comes to show adhesivity when heated and thermoplastic synthetic resin film 9b that is to be laid on the upper surface of the hot melt film 9a are used as the lower layer material 3b, although it may be needless to say that only the use of hot melt film 9a is sufficient for the purpose of the present invention.
  • the lower layer materi al may be used as the lower layer materi al.
  • a sheet of release paper 9c may be arranged under the hot melt film 9a.
  • the lower layer material 3a may appropriately be selected by considering the performance that the emblem to be manufactured is required to exhibit.
  • An IC chip 6 is arranged between the upper layer 2 and the lower layer 3.
  • An ID number is input into the IC chip in advance and then stored in a computer.
  • the ID number can be read out by an appropriate reader and verified by the computer that is connected to the reader.
  • Various data such as photographic data on the wearer of the emblem where the IC chip is embedded can be input and stored in the computer in advance.
  • any forgery of emblems and uses of forged emblems can effectively be prevented from taking place and also the ability of controlling the use of emblems can be improved.
  • a TFU-TL741B ID tag; available from Fujitsu Frontech
  • the present invention is by no means limited to the use of such a tag.
  • the device comprises an upper metal mold 11 that also operates as an anode and a jig 21 that also operates as a cathode.
  • a three-dimensional shape is carved in the lower surface of the upper metal mold 11, which is provided with a fusion cutti ng blade and a pressing blade.
  • a metal mold can be prepared by usi ng an appropriate technique that is well known to those who are skilled in the art. Note that a pressing blade is employed only if necessary. In other words, it is not essential.
  • the upper metal mold 11 is also provided with a temporary holding means 13. The temporary holding means 13 is only required to temporarily take up an intermediate 23 that is formed by using a surface layer material 4 a and an intermediate layer material 5a with the upper metal mold 11.
  • the temporary holding means 13 may be adhesive tapes arranged at the front side and the rear side of the upper metal mold 11 as in the case of the illustrated embodiment, although the temporary holding means 13 accordi ng to the present invention is by no means limited to such an arrangement.
  • the position of the upper metal mold 11 is fixed.
  • the slide board 51 and a metal plate 61 on the table 31, which will be described hereinafter, will be moved in axial directions relative to the upper metal mold 11.
  • the expression of "an axial direction” refers to a direction running in the direction of the long sides of the table 31, which is the direction running from left to right or vice versa in FIG. 4 .
  • the directions running along the short sides of the table 31 will be referred to as "the transversal directions" hereinafter.
  • the jib 21 includes a table 31 that also operates as cathode, a support frame 41 arranged along a periphery and on the upper surface of the table 31, a slide board 51 arranged on an upper surface of the table 31 so as to be movable in the axi al di recti ons and a metal plate 61 arranged on the upper surface of the slide board 51 so as to be slidable with the slide board 51, the metal plate 61 also operating as cathode.
  • the table 31 is an oblong rectangular object having long sides and short sides. It has a flat upper surface and a flat lower surface.
  • a solid lubricating agent 33 is arranged on an upper surface of the table 31 so as to allow the slide board 51 to easily slide thereon.
  • a solid lubricating agent 33 may be arranged on the entire upper surface of the table 11 or as a plurality of spots on the upper surface of the table 11 as in the case of the illustrated embodiment. From the view point of manufacturing cost, it is preferably arranged as a number of spots.
  • the upper surfaces of the spots of the solid lubricating oil 33 may be substantially flush with the upper surface of the table as in the case of the illustrated embodiment or slightly upwardly protruding from the upper surface of the table 31. Any known lubricating agent 33 that is solid and having a lubricating effect may be used as the solid lubricating agent 33.
  • the support frame 41 includes long side support frame members 43 extending to the entire length of the long sides of the table 31 so as to partly cover the upper surface of the table 31 along the long sides thereof and short side support frame members 45 arranged so as to extend between the long side support frame members 43 and partly cover the upper surface of the table 31 along the short sides thereof.
  • the support frame 41 is arranged along the outer periphery of the upper surface of the table 1 and rigidly secured to the upper surface of the table 31.
  • the support frame 41 is rigidly secured by screws, although the present invention is by no means limited to the use of screws for rigidly securing the support frame 41 to the table 31.
  • Stepped sections 47 are formed respectively on lower surfaces of the long side support frame members 43 at the transversally inner sides of the long side support frame members 43, so as to allow the guide section of the slide board, which will be described in greater detail hereinafter, to be inserted between them.
  • the short side support frame members 45 are respectively provided with finger receiving grooves 49 so as to allow the slid board 51 to be axial ly moved with ease as will be descri bed in greater detail hereinafter.
  • the slide board 51 is an oblong rectangular plate-like object whose axial length (the length of the long sides thereof) is smaller than the axial length (the length of the long sides) of the table 31, and has a flat upper surface and also a flat lower surface. It is axially slidable on the upper surface of the table 31.
  • the slide board 51 is provided with outwardly projecting stepped sections 53 at lower parts of the long side lateral surfaces thereof. As the stepped sections of the slide board 51 are engaged with the corresponding stepped section 47 of the long side frame support members 43, the slide board 51 becomes axi ally slidable.
  • the solid lubricating agent 33 is arranged on the upper surface of the table 31 so as to allow the slide board 51 to axially slide with ease.
  • the slide board 51 is preferably made of metal, although the material of the slide board 51 is not limited to metal.
  • the axial length F between the inside surfaces of the oppositely disposed short side support frame members and the axial length G of the slide board preferably show a ratio of 3:2.
  • one of the magnets 69 and the correspondi ng one of the magnets 49 attract each other so as to be rigidly caught by each other.
  • the center of the flat area of the upper surface 63 of the metal plate 61 is found right below the upper metal mold 11.
  • the center of the recessed section 65 comes right below the upper metal mold 11. Therefore, the axial length G of the slide board is equal to two thirds of the length F between the inside surfaces of the oppositely disposed short side support frame members.
  • a metal-made plate 61 is arranged on an upper surface of the slide board 51.
  • the metal plate 61 has an axial length that is equal to the axial length of the slide board 51 and a transversal length smaller than the transversal length of the slide board 51 by the sum of the widths of the stepped sections 53 of the slide board 51.
  • the metal-made plate 61 has an upper surface 63 and a lower surface.
  • the upper surface 63 of the metal-made plate is flat.
  • the metal-made plate 61 is provided at the transversal center of the upper surface 63 thereof with a recessed section 65 for protecting the IC chip and making it free from pressure.
  • the IC chip is di mensioned so as to snugly abut to the recessed section 65.
  • the IC chip is placed on the upper surface of the recessed section 65.
  • the upper surface 63 of the metal - made plate 61 includes a fl at part (part A) and a recessed part (part B) .
  • a cushion member 67 is arranged in the recessed section 65 so as to absorb the pressure applied to the recessed section 65 from above and make the IC chip disposed therein to be free from pressure. Additional ly, the arrangement of the cushion member 67 prevents a dead air space from appeari ng in the inside of the emblem (between the upper layer and the lower layer). While sponge or rubber may be used as the material of the cushion member 67, the present invention is by no means limited to the use of sponge or rubber as the material of the cushion member.
  • any well-known appropriate material may be used for the cushion member so long as it absorbs the pressure applied to it from above.
  • the metal-made plate 61 is provided with positioning magnets 69 that are arranged at respective transversally center positions on the axially opposite surfaces thereof, whereas the short side support frames 45 are respectively provided with positioning magnets 49 that are arranged at positions that correspond to the respective positioning magnets 69.
  • the jig 21 has the above described components, and the slide board 51 thereof is axially slidable relative to the metal plate 31. Additionally, a cushion member 67 is arranged in the recessed section 65 which is formed on the upper surface of the metal plate 61 that is placed on the slide board 51 as described above so that the IC chip is made free from pressure and prevented from being damaged. Note that a piece of insulation fabric (not shown in the drawings) is arranged on the metal plate 61.
  • a sheet of release paper 9 is put on the flat part (block A) of the upper surface of the metal plate 61 and, if necessary, the intermediate layer material 5a is placed on the sheet of release paper. Subsequently, the surface layer material 4a is placed on the intermediate layer material 51. If necessary, a sheet of carrier film 7a may be put on the surface layer material 41, and additionally a sheet of polypropylene film 8a may be placed on the carrier film 7a.
  • the reason why a sheet of release paper 9 is placed is to prevent the molten material from sticking to the metal-made plate 61 due to the high frequency dielectric heating operation executed in the first step (of shaping the surface layer material 4a and the intermediate layer material 5a by high frequency dielectric heating and bonding the surface layer material 4a and the intermediate layer material 5a together by fusion bonding) because otherwise the molten material sticks to the metal-made plate 61.
  • the upper metal mold 11 is located above the above listed materi al s.
  • the upper metal mold 11 is lowered to downwardly press the above listed materials and produce a three-di mensi onal pattern (the first step) .
  • the upper layer materi al and the i ntermedi ate layer materi al are bonded together by fusion bonding to produce an intermediate 23.
  • An appropriate known technique is employed for the operati on of forming a three-di mensi onal pattern and that of fusion bondi ng. Since the above listed materials are placed on the flat area of the upper surface of the metal plate 61, a three-dimensional pattern can accurately be produced.
  • the produced intermediate 23 (as a result of bonding the surface layer material and the i ntermedi ate layer materi al together by fusion bondi ng) is temporarily held to the upper metal mold 11 by the temporary holding means 13.
  • the upper metal mold is moved upward.
  • the intermediate 23 is also moved upward with the upper metal mold because the intermediate 23 is temporarily held to the upper metal mold by the temporary holding means 13 as described above. Since release paper is arranged on the lower surface of the intermediate 23, the upper layer material and the intermediate layer material do not adhere to the metal-made plate 61 even if they are molten by heat so that only the intermediate 23 is brought upward by the upper metal mold.
  • the slide board is driven to axially slide until the recessed section 65 at the center of the block B is found right below the upper metal mold. At this time, the slide board would not be transversal ly displaced because of the provision of the positioning magnets 69 and 49.
  • the lower layer material is placed on the metal plate 61.
  • a necessary material may appropriately be selected for the lower layer material.
  • a thermal adhesive type emblem is to be manufactured, firstly a sheet of release paper is placed in position, then a sheet of hot melt film is placed thereon and subsequently a sheet of synthetic resin film to which the IC chip (storing an ID number in it) has temporarily been held is placed on the hot melt film.
  • a well-known appropriate material may be used for the lower layer material.
  • the sheet of release paper 9c is placed on the upper surface of the metal plate 61, then the sheet of hot melt film 9a is placed on the upper surface of the sheet of release paper 9c and subsequently a sheet of thermoplastic synthetic resin film 9b is placed on the upper surface of the sheet of hot melt film 9a.
  • the temporarily holding means may be used by well known art, such as double sided tape, adhesive tape.
  • the IC chip may be placed so as to accurately be located in the recessed section 65 of the metal plate 61 on the slide board 51.
  • FIG. 12 schematically illustrates the state of the sheet of release paper before it is peeled off.
  • the upper metal mold 11 is lowered to press down the lower layer materi al (which includes the sheet of release paper, the hot melt film 9a and the thermoplastic synthetic resin film 9b in the case of the illustrated embodi ment) and the i ntermedi ate 23 and a high frequency wave is transmitted to them to bond the intermediate 23 and the lower layer materi al together by fusion bondi ng before the above listed materials are cut by fusion cutti ng. Then, all the unnecessary parts are removed by means of a well-known technique to produce a finished emblem.
  • the lower layer materi al which includes the sheet of release paper, the hot melt film 9a and the thermoplastic synthetic resin film 9b in the case of the illustrated embodi ment
  • the IC chip Since the IC chip is located in the recessed section 45 and a cushion member is arranged on the bottom surface of the recessed section 45, the IC chip is not damaged if it is pressed by the upper metal mol d and the three-di mensi onal pattern formed on the surface of the embl em would not be deformed by the IC chip.

Claims (4)

  1. Dispositif pour fabriquer un emblème de résine synthétique thermoplastique avec une puce de CI incorporée (6) par chauffage diélectrique haute-fréquence, le dispositif comprenant :
    un moule en métal supérieur (11) ayant au moins une lame de coupe par fusion ;
    une table (31) ;
    un châssis de support (41) disposé le long d'un périmètre et sur une surface supérieure de la table (31) ;
    une plaque coulissante (51) disposée sur une surface supérieure de la table de manière à pouvoir coulisser dans les directions axiales par rapport à la table ; et
    une plaque métallique (61) agencée sur la surface supérieure de la plaque coulissante (51) ;
    le dispositif étant caractérisé en ce que
    un agent de lubrification solide (33) est prévu sur la surface supérieure de la table (31);
    le châssis de support (41) inclut des éléments de châssis de support côté long (43) agencés le long des longs côtés de la table et des éléments de châssis de support côté court (45) agencés le long des côtés courts de la table, dans lequel des crans (47) sont formés sur les surfaces inférieures respectives des éléments de châssis de support côté long (43) le long des côtés intérieurs transversaux de ceux-ci et des crans (53) sont formés sur la surface supérieure de la plaque coulissante (51) le long des côtés extérieurs transversaux de celle-ci de manière à être mis en prise avec les crans (47) respectifs des éléments de châssis de support côté long (43) afin que la plaque coulissante (51) puisse coulisser axialement par rapport à la table ;
    la plaque métallique (61) est pourvue, sur la surface supérieure de celle-ci, d'une zone de surface plate (63) et d'une section évidée (65) dimensionnée pour recevoir parfaitement une puce de CI (6) de manière à ce que la puce de CI (6) soit contiguë aux surfaces intérieures de la section évidée (65),
    un élément d'amortissement (67) est agencé dans la section évidée ; et
    la plaque coulissante (51) peut être entraînée pour coulisser de manière axiale de manière à être située sous le moule en métal supérieur (61).
  2. Procédé de fabrication d'un emblème d'un matériau en résine synthétique thermoplastique avec une puce de CI incorporée (6) par chauffage diélectrique haute-fréquence, le procédé comprenant les étapes consistant à :
    agencer une feuille de papier antiadhésif (9) sur la surface supérieure plate d'une table (31), la table (31) servant de cathode, et un matériau de couche supérieure sur la surface supérieure de la feuille de papier antiadhésif (9) ;
    presser le matériau de couche supérieure (2a) à l'aide d'un moule en métal supérieur (11) par au-dessus et soumettre le matériau de couche supérieure à un chauffage diélectrique haute-fréquence de manière à conférer une forme donnée au matériau de couche supérieure et produire un intermédiaire (23) ;
    amener le moule en métal supérieur (11) à maintenir temporairement l'intermédiaire et soulever le moule en métal supérieur (11) avec l'intermédiaire (23) ;
    entraîner une plaque coulissante (51) disposée sur la table pour qu'elle coulisse axialement de manière à placer une section évidée (65) ayant un élément d'amortissement (67) formé dans celle-ci sur la surface supérieure d'une plaque métallique (61) sur la plaque coulissante (51) juste sous le moule en métal supérieur (11) ;
    placer une feuille de papier antiadhésif (9), un matériau de couche inférieure (3a) et la puce de CI (6) sur l'élément d'amortissement (67) dans la section évidée (65) ; et
    abaisser le moule en métal supérieur (11) pour presser l'intermédiaire (23), la puce de Cl (6) et le matériau de couche inférieure (3a), les soumettre à un chauffage diélectrique haute-fréquence de manière à lier l'intermédiaire (23) et le matériau de couche inférieure (3a) ensemble par liaison par fusion.
  3. Procédé selon la revendication 2, caractérisé en ce que la feuille de papier antiadhésif (9) est agencée sur la surface inférieure du matériau de couche supérieure (2a).
  4. Procédé selon la revendication 2, caractérisé en ce qu'une feuille de film porteur (7a) est agencée sur la surface supérieure du matériau de couche supérieure et une feuille de film polypropylène (8) est agencée sur la surface supérieure de la feuille de film porteur (7a).
EP14891113.4A 2014-05-02 2014-05-02 Dispositif et procédé de fabrication d'emblème avec puce ic intégrée Active EP3138695B1 (fr)

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JP6496884B1 (ja) * 2018-04-27 2019-04-10 黒田 暢夫 熱可塑性合成樹脂製立体装飾片の製造方法及びその製造装置
JP6695472B1 (ja) * 2019-04-15 2020-05-20 株式会社日本製鋼所 金型スライド装置の摩耗検知方法
MX2019013865A (es) * 2019-04-22 2021-02-18 Takeshi Kuroda Metodo y aparato para producir emblema tridimensional hecho de resina sintetica termoplastica.

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5763213A (en) * 1980-10-03 1982-04-16 Tomotaka Hida Molding of thermoplastic hard resin plate
JPS5998814A (ja) 1982-11-29 1984-06-07 Katsuhiko Shibayama 飾り体の製造方法
JPH0633040B2 (ja) 1987-12-28 1994-05-02 英二 桑原 熱可塑性合成樹脂フィルムによるエンブレム等の成形方法
JP2542551B2 (ja) 1992-09-07 1996-10-09 黒田 暢夫 熱可塑性合成樹脂製の熱転写装飾片とその製造方法
JP2694682B2 (ja) * 1994-01-25 1997-12-24 アートウエルド株式会社 エンブレム、ワッペン等の装飾体の製造方法
WO1998021036A1 (fr) * 1996-11-12 1998-05-22 Droz Francois Procede de fabrication de cartes et cartes fabriquees selon ce procede
JP4509313B2 (ja) * 2000-06-28 2010-07-21 北川精機株式会社 プレス装置システム
US20040136175A1 (en) * 2003-01-13 2004-07-15 Lewis Edward D. Ultraviolet illuminated fluorescent badge
JP4227587B2 (ja) * 2004-11-11 2009-02-18 黒田 暢夫 合成樹脂製立体装飾片とその製造方法
JP4440963B2 (ja) 2007-12-07 2010-03-24 ヤマウチ株式会社 熱プレス用クッション材および積層板の製造方法
JP2010214867A (ja) 2009-03-18 2010-09-30 Horaisha:Kk 熱転写型アップリケ材、並びに熱転写型アップリケ
JP5208854B2 (ja) 2009-05-26 2013-06-12 凸版印刷株式会社 ワッペン
WO2011125173A1 (fr) 2010-04-06 2011-10-13 黒田 暢夫 Pièce de décoration résistant à la migration constituée d'une résine synthétique thermoplastique
WO2011151904A1 (fr) * 2010-06-02 2011-12-08 黒田 暢夫 Procédé de production et dispositif de production de pièce de décoration stéréoscopique composée de résine synthétique thermoplastique
KR101204393B1 (ko) 2011-06-22 2012-12-14 주식회사 코리아 이앤씨 뱃지 ｕｈｆ ｒｆｉｄ 태그

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
None *

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US10384398B2 (en) 2019-08-20
US20170217084A1 (en) 2017-08-03
JP6359092B2 (ja) 2018-07-18
WO2015166584A1 (fr) 2015-11-05
EP3138695A1 (fr) 2017-03-08
EP3138695A4 (fr) 2017-11-08
JPWO2015166584A1 (ja) 2017-09-07

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