EP3138363A1 - Élément de connexion électrique servant à connecter une structure électriquement conductrice à un substrat - Google Patents

Élément de connexion électrique servant à connecter une structure électriquement conductrice à un substrat

Info

Publication number
EP3138363A1
EP3138363A1 EP15709891.4A EP15709891A EP3138363A1 EP 3138363 A1 EP3138363 A1 EP 3138363A1 EP 15709891 A EP15709891 A EP 15709891A EP 3138363 A1 EP3138363 A1 EP 3138363A1
Authority
EP
European Patent Office
Prior art keywords
sub
electrically conductive
conductive structure
substrate
disc according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP15709891.4A
Other languages
German (de)
English (en)
Inventor
Klaus SCHMALBUCH
Mitja Rateiczak
Bernhard Reul
Björn Schneider
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FEW Fahrzeugelektrikwerk GmbH and Co KG
Saint Gobain Glass France SAS
Original Assignee
FEW Fahrzeugelektrikwerk GmbH and Co KG
Saint Gobain Glass France SAS
Compagnie de Saint Gobain SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FEW Fahrzeugelektrikwerk GmbH and Co KG, Saint Gobain Glass France SAS, Compagnie de Saint Gobain SA filed Critical FEW Fahrzeugelektrikwerk GmbH and Co KG
Publication of EP3138363A1 publication Critical patent/EP3138363A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H01R12/718—Contact members provided on the PCB without an insulating housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/06—Riveted connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2442—Contacts for co-operating by abutting resilient; resiliently-mounted with a single cantilevered beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H01R43/205—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve with a panel or printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/84—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/02—Connectors or connections adapted for particular applications for antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/26—Connectors or connections adapted for particular applications for vehicles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
    • H01R4/62—Connections between conductors of different materials; Connections between or with aluminium or steel-core aluminium conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/016—Heaters using particular connecting means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/017—Manufacturing methods or apparatus for heaters

Definitions

  • the invention relates to an electrical connection element, a pane with the electrical connection element, a method for producing the connection element and its use.
  • the invention relates to an electrical connection element for contacting electrically conductive structures, for example heating conductors or antenna conductors, on panes for vehicles.
  • the electrically conductive structures are connected via the soldered connection elements with the on-board electrical system. Due to different thermal expansion coefficients of the materials used, mechanical stresses occur during manufacture and during operation, which can load the disks and cause the disks to break.
  • Lead-containing solders have a high ductility, which can compensate occurring mechanical stresses between the electrical connection element and the disc by plastic deformation.
  • the Directive is collectively referred to as the ELV (End of Life Vehicles).
  • the goal is to eliminate extremely problematic components from the products as a result of the massive expansion of disposable electronics.
  • the substances involved are lead, mercury and cadmium. This includes, among other things, the enforcement of lead-free solders in electrical applications on glass and the introduction of appropriate replacement products for this purpose.
  • Lead-free solders typically have a markedly low ductility and are therefore not able to compensate mechanical stresses to the same extent as lead-containing solders. It is therefore particularly in soldering with lead-free solder masses endeavors to avoid mechanical stresses, which is possible for example by a suitable choice of the material of the connection element. If the difference between the coefficients of thermal expansion of the substrate, usually soda-lime glass, and the connection element is small, only slight mechanical stresses occur.
  • chromium-containing (or stainless) steels have been proposed which, moreover, are advantageously inexpensive.
  • multi-piece connection elements are conceivable.
  • connection elements may for example consist of several solid sub-elements of different material, wherein a sub-element is provided for contacting with the disc and the other sub-element for contacting with the electrical connection cable.
  • the material of the partial element for contacting with the disc can then be selected primarily with regard to a suitable coefficient of thermal expansion.
  • the material of the sub-element for contacting with the connection cable can be selected with regard to other criteria, such as an optimal electrical conductivity or good formability.
  • the sub-elements must be permanently connected to each other stably.
  • the skilled person will first of all consider the welding of the sub-elements into consideration. However, if the partial elements have very different melting temperatures due to their different materials, welding is not easily possible. Occasionally, the temperature required to melt one sub-element may already be damaged, the other sub-element.
  • the object of the present invention is to provide a multi-part formed electrical connection element whose sub-elements are connected to each other in an improved manner, and a disc with this connection element.
  • the electrical connection element according to the invention for electrically contacting an electrically conductive structure on a substrate comprises at least two solid sub-elements of different material (or different
  • first sub-element is intended to be soldered to the electrically conductive structure and the second sub-element is intended to be connected to an electrical connection cable.
  • the first Sub-element and the second sub-element according to the invention are connected to each other by means of at least one rivet.
  • connection by means of rivets is permanently stable and makes no further demands on the solid sub-elements.
  • the material of the sub-elements can thus be chosen without regard to their connection to each other.
  • a material can be selected whose coefficient of thermal expansion has as small a difference as possible from that of the substrate, while for the second sub-element a material is selected which has the highest possible electrical conductivity and / or good bendability.
  • Other criteria for example, a similar melting point, as occurs in a welded joint, need not be considered. This is a great advantage of the present invention.
  • connection element The sub-elements of the connection element are solid according to the invention. This means a rigid, although possibly well formable, but not pliable design.
  • the partial element remains after forming in the desired shape and position.
  • Non-massive, pliable shapes such as conventional cables or flat conductors, are not to be understood as part of the connecting element in the context of the invention.
  • the difference between the melting temperature of the material of the first partial element and the melting temperature of the material of the second partial element is in an advantageous embodiment greater than 200 ° C, preferably greater than 300 ° C, more preferably greater than 400 ° C.
  • the advantages according to the invention come into play in a special way, because the obvious connection can no longer be satisfied by welding at such differences in the melting temperature.
  • the invention further comprises a disk with at least one electrical connection element, comprising at least:
  • connection cable connects the electrically conductive structure on the substrate with an external functional element, for example a power supply or a receiving device.
  • connection cable starting from the connection element, is preferably led away from the pane over the side edges of the pane.
  • connection cable can be any connection cable which is known to the person skilled in the art for electrically contacting an electrically conductive structure, for example a flat conductor, a wire stranded conductor or a solid wire conductor.
  • connection between the second subelement of the connection element and the connecting cable can be made in any manner known to the person skilled in the art, for example by soldering, welding, screwing, via an electrically conductive adhesive or as a plug connection.
  • the substrate preferably contains glass, more preferably soda-lime glass.
  • the substrate is preferably a glass pane, in particular a window pane.
  • the substrate may in principle also contain other types of glass, for example quartz glass or borosilicate glass, or polymers, preferably polyethylene, polypropylene, polycarbonate, polymethyl methacrylate, polystyrene, polybutadiene, polynitriles, polyesters, polyurethane, polyvinyl chloride, polyacrylate, polyamide, polyethylene terephthalate and / or copolymers or mixtures from that.
  • the substrate is preferably transparent or translucent.
  • the substrate preferably has a thickness of 0.5 mm to 25 mm, more preferably of 1 mm to 10 mm and most preferably of 1, 5 mm to 5 mm.
  • the difference between the thermal expansion coefficient of the substrate and the coefficient of thermal expansion of the first subelement is less than 5 ⁇ 10 -6 / ° C., preferably less than 3 ⁇ 10 -6 / ° C. Tensions due to the soldering process are advantageously avoided and it is achieved better adhesion.
  • the thermal expansion coefficient of the substrate is preferably from 8 ⁇ 10 -6 / ° C to 9 ⁇ 10 -6 / ° C.
  • the substrate preferably contains glass, in particular soda lime glass, the preferably has a thermal expansion coefficient of 8.3 x 10 "6 / ° C to 9 x 10 " 6 / ° C in a temperature range of 0 ° C to 300 ° C.
  • the thermal expansion coefficient of the first partial element of the connecting element according to the invention is in an advantageous embodiment of 4 ⁇ 10 -6 / ° C to 15 ⁇ 10 -6 / ° C, preferably from 9 ⁇ 10 -6 / ° C to 13 ⁇ 10 -6 / ° C, more preferably from 10 x 10 "6 / ° C to 1 1, 5 x 10 " 6 / ° C, most preferably from 10 x 10 "6 / ° C to 1 1 x 10 " 6 / ° C and in particular from 10 ⁇ 10 -6 / ° C to 10.5 ⁇ 10 -6 / ° C in a temperature range from 0 ° C to 300 ° C.
  • the first subelement of the connecting element according to the invention preferably contains at least one iron-containing alloy.
  • the first sub-element particularly preferably contains at least 50% by weight to 89.5% by weight of iron, 0% by weight to 50% by weight of nickel, 0% by weight to 20% by weight of chromium, 0% by weight % by weight to 20% by weight of cobalt, 0% by weight to 1.5% by weight of magnesium, 0% by weight to 1% by weight of silicon, 0% by weight to 1% by weight Carbon, 0% to 2% by weight of manganese, 0% to 5% by weight of molybdenum, 0% to 1% by weight of titanium, 0% to 1% by weight of titanium.
  • niobium 0 wt .-% to 1 wt .-% vanadium
  • the first portion may contain, for example, an iron-nickel-cobalt alloy such as Kovar (FeCoNi) having a thermal expansion coefficient of usually about 5 x 10 "6 / ° C.
  • Kovar FeCoNi
  • the composition of Kovar for example, 54 wt .-% iron, 29% by weight of nickel and 17% by weight of cobalt.
  • the first sub-element of the connecting element contains a chromium-containing steel.
  • Chromium-containing in particular so-called stainless or stainless steel is available at low cost.
  • Connection elements made of chromium-containing steel also have a high rigidity in comparison to many conventional connection elements, for example made of copper, which leads to an advantageous stability of the connection element. For example, torsions can be avoided during a deformation of the second partial element.
  • chromium-containing steel has improved solderability compared to many conventional terminal elements, for example, titanium, resulting from a higher thermal conductivity.
  • the first sub-element preferably contains a chromium-containing steel with a chromium content of greater than or equal to 10.5 wt .-%.
  • Other alloying constituents such as molybdenum, manganese or niobium lead to improved corrosion resistance or altered mechanical properties, such as tensile strength or cold workability.
  • the first partial element of the connecting element particularly preferably contains at least 66.5% by weight to 89.5% by weight of iron, 10.5% by weight to 20% by weight of chromium, 0% by weight to 1% by weight. % Carbon, 0 wt% to 5 wt% nickel, 0 wt% to 2 wt% manganese, 0 wt% to 2.5 wt% molybdenum, 0 wt% to 2 wt .-% of niobium and 0 wt .-% to 1 wt% titanium.
  • the connection element may additionally contain admixtures of other elements, including vanadium, aluminum and nitrogen.
  • the first part element very particularly preferably contains at least 73% by weight to 89.5% by weight of iron, 10.5% by weight to 20% by weight of chromium, 0% by weight to 0.5% by weight.
  • % Carbon 0 wt% to 2.5 wt% nickel, 0 wt% to 1 wt% manganese,
  • connection element may additionally contain admixtures of other elements, including vanadium, aluminum and nitrogen.
  • the connecting element according to the invention contains in particular at least 77 wt .-% to 84 wt .-% iron, 16 wt .-% to 18.5 wt .-% chromium, 0 wt .-% to 0, 1 wt .-% carbon, 0 Wt .-% to 1 wt .-% manganese, 0 wt .-% to 1 wt .-% niobium, 0 wt .-% to 1, 5 wt .-% molybdenum and 0 wt .-% to 1 wt. % Titanium.
  • the connection element may additionally contain admixtures of other elements, including vanadium, aluminum and nitrogen.
  • Particularly suitable chromium-containing steels are steels of the material numbers 1 .4016, 1.41 13, 1 .4509 and 1 .4510 according to EN 10 088-2.
  • the second subelement of the connection element according to the invention contains copper, for example electrolytic copper.
  • a second sub-element has an advantageously high electrical conductivity.
  • such a sub-element is advantageously deformable, resulting in connection with the Connection cable may be desired or required.
  • the second sub-element can for example be provided with an angle, whereby the connection direction of the connection cable is adjustable.
  • the second sub-element can also contain a copper-containing alloy, such as brass or bronze alloys, for example nickel silver or Konstantan.
  • a copper-containing alloy such as brass or bronze alloys, for example nickel silver or Konstantan.
  • the second sub-element preferably has an electrical resistance of 0.5 ⁇ hnrcm to 20 ⁇ , more preferably from 1, 0 ⁇ hnrcm to 15 ⁇ hnrcm, most preferably from 1, 5 ⁇ hnrcm to 1 1 ⁇ - hnrcm.
  • the second sub-element contains particularly preferably 45.0 wt .-% to 100 wt .-% copper, 0 wt .-% to 45 wt .-% zinc, 0 wt .-% to 15 wt .-% tin, 0 wt. % to 30% by weight of nickel and 0% by weight to 5% by weight of silicon.
  • Particularly suitable as a material of the second sub-element is electrolytic copper with the material number CW004A (formerly 2.0065) and CuZn30 with the material number CW505L (formerly 2.0265).
  • the material of the rivet according to the invention can in principle be chosen freely by the person skilled in the art according to the requirements of the application.
  • the rivet may contain, for example, copper or copper-containing alloys such as brass or bronze, iron or iron-containing alloys such as steel, chromium-containing or stainless steel, aluminum or aluminum-containing alloys or titanium.
  • the rivet contains copper or a copper-containing alloy, in particular copper. This is particularly advantageous in terms of the electrical conductivity and the riveting of the rivet required for riveting.
  • the rivet can also be formed in one piece with the first or the second subelement of the connecting element.
  • the material of the rivet of course depends on the material of the corresponding sub-element.
  • the geometric dimensions of the rivet are expediently based on the dimensions of the connection element.
  • the rivet has in typical connection elements, for example, a length of 0.2 mm to 12 mm, preferably from 0.8 mm to 3 mm and a width of 0.5 mm to 5 mm, preferably from 1 mm to 3 mm.
  • connection element is not limited to a specific shape of the connection element. Rather, the invention can be applied to any connection elements, which are formed in several pieces from solid sub-elements. It is of course important to ensure that the soldering surface of the first sub-element, that is, the surface which is intended to act as a contact surface to the substrate is not affected by a protruding rivet.
  • the material thickness of the first partial element and of the second partial element is preferably from 0.1 mm to 4 mm, particularly preferably from 0.2 mm to 2 mm, very particularly preferably from 0.5 mm to 1 mm.
  • the material thickness is preferably constant, which is particularly advantageous with regard to a simple production of the sub-elements.
  • connection element can be freely selected by the person skilled in the art according to the requirements of the individual case.
  • the connection element has, for example, a length and a width of 1 mm to 50 mm.
  • the length of the connecting element is preferably from to, more preferably from to.
  • the width of the connecting element is preferably from 10 mm to 30 mm, more preferably from 2 mm to 10 mm. Connection elements with these dimensions are particularly easy to handle and are particularly suitable for electrically contacting conductive structures on disks.
  • the first sub-element is bridge-shaped.
  • Connection elements in the form of bridges are familiar to the person skilled in the art. They typically comprise two foot regions, on whose surfaces facing the substrate the contact surfaces are arranged, via which the connection element is connected to the substrate via the solder mass. Between the foot regions a bridging region is arranged, which typically includes a raised central portion which is parallel to the foot regions. The bridging region is not intended to be connected directly to the conductive structure via the solder mass.
  • the second sub-element is preferably on the surface facing away from the foot areas of the arranged bridging area. The shape of the second sub-element can also be chosen freely by the skilled person.
  • the second sub-element preferably has an elongated shape, in particular a cuboid shape, which has a flat surface for optimal attachment to the first sub-element.
  • Bridge-shaped connection elements have proven themselves for contacting electrically conductive structures on glass panes. In addition, they provide an advantageous possibility in the bridging section between the foot areas to be soldered, to fasten the second partial element.
  • the first and the second sub-element each have at least one, more preferably exactly one hole, which is tuned to the size of the proposed rivet.
  • the holes of the first and the second sub-element are arranged in cover to each other, so that the rivet can be passed through both holes and the sub-elements so permanently stable connect with each other.
  • a section of the rivet projecting over the surface of the first subelement in the direction of the substrate is unproblematic in this embodiment, since the bridging section of the first subelement is not connected directly to the substrate, but there is a gap between bridging section and substrate surface.
  • the second sub-element is dimensioned so that standardized automotive flat plugs are plugged with a height of 0.8 mm and a width of either 4.8 mm, 6.3 mm or 9.5 mm on the free end of the sub-element can.
  • the embodiment of the second sub-element with a width of 6.3 mm is particularly preferably used, since this corresponds to the automotive flat connectors according to DIN 46244 commonly used in this field.
  • the second sub-element of the connection element is bridge-shaped with the two foot areas and the interposed bridging area.
  • the first sub-element is formed as a flat plate with, for example, rectangular or round outline and arranged on the underside of the foot areas of the second sub-element.
  • the first subelement thus forms a compensator plate between the second subelement and the substrate.
  • a first subelement is preferably provided for each of the two foot regions, that is to say a total of two first subelements.
  • connection elements for example made of copper
  • first partial elements as compensator plates can be selected such that thermal stresses on the substrate are avoided.
  • the rivet is therefore formed integrally with the first subelement and arranged on the surface of the first subelement opposite the soldering surface. The rivet is then passed through a suitable hole in the second sub-element.
  • the first part element as Kompensatorplatte, preferably approximately in the middle, a depression on the soldering surface.
  • the first subelement has a hole through which the rivet is guided.
  • the electrically conductive structure according to the invention preferably has a layer thickness of from 5 ⁇ m to 40 ⁇ m, more preferably from 5 ⁇ m to 20 ⁇ m, very particularly preferably from 8 ⁇ m to 15 ⁇ m and in particular from 10 ⁇ m to 12 ⁇ m.
  • the electrically conductive structure according to the invention preferably contains silver, particularly preferably silver particles and glass frits.
  • solder mass according to the invention is lead-free in a preferred embodiment. This is particularly advantageous with regard to the environmental compatibility of the invention Washer with electrical connection element.
  • lead-free solder mass is a solder mass which, according to the EC directive "2002/95 / EC on the restriction of the use of certain hazardous substances in electrical and electronic equipment", has a content of less than or equal to 0.1% by weight. % Lead, preferably contains no lead.
  • the multi-piece connection elements according to the invention are particularly advantageous for lead-free soldering.
  • the material of the first sub-element, which is soldered directly to the conductive structure on the substrate, can be tuned to the material of the substrate to avoid thermal stresses that may be critical due to the low ductility of typical lead-free solder materials.
  • the solder mass preferably contains tin and bismuth, indium, zinc, copper, silver or compositions thereof.
  • the proportion of tin in the solder composition according to the invention is from 3 wt .-% to 99.5 wt .-%, preferably from 10 wt .-% to 95.5 wt .-%, particularly preferably from 15 wt .-% to 60 wt .-%.
  • the proportion of bismuth, indium, zinc, copper, silver or compositions thereof in the solder composition according to the invention from 0.5 wt .-% to 97 wt .-%, preferably 10 wt .-% to 67 wt .-%, wherein the May be amount of bismuth, indium, zinc, copper or silver 0 wt .-%.
  • the solder composition may contain nickel, germanium, aluminum or phosphorus at a level of from 0% to 5% by weight.
  • the solder composition according to the invention most preferably contains Bi40Sn57Ag3, Sn40Bi57Ag3, Bi59Sn40Ag1, Bi57Sn42Ag1, ln97Ag3, Sn95.5Ag3.8Cu0.7, Bi67ln33, Bi33ln50Sn17, Sn77,2ln20Ag2,8, Sn95Ag4Cu1, Sn99Cu1, Sn96,5Ag3,5, Sn96,5Ag3CuO, 5 , Sn97Ag3 or mixtures thereof.
  • the solder mass contains bismuth. It has been found that a bismuth-containing solder composition leads to a particularly good adhesion of the connecting element according to the invention to the disk, wherein damage to the disk can be avoided.
  • the proportion of bismuth in the solder composition is preferably from 0.5% by weight to 97% by weight, more preferably from 10% by weight to 67% by weight and most preferably from 33% by weight to 67% Wt .-%, in particular from 50 wt .-% to 60 wt .-%.
  • the solder mass preferably contains tin and silver or tin, silver and copper.
  • the Lot mass at least 35 wt .-% to 69 wt .-% bismuth, 30 wt .-% to 50 wt .-% tin, 1 wt .-% to 10 wt .-% silver and 0 wt .-% to 5 wt. -% copper.
  • the solder mass contains at least 49 wt .-% to 60 wt .-% bismuth, 39 wt .-% to 42 wt .-% tin, 1 wt .-% to 4 wt .-% silver and 0 Wt .-% to 3 wt .-% copper.
  • the solder mass of 90 wt .-% to 99.5 wt .-% tin preferably from 95 wt .-% to 99 wt .-%, particularly preferably from 93 wt .-% to 98 wt. -%.
  • the solder mass preferably contains from 0.5% by weight to 5% by weight of silver and from 0% by weight to 5% by weight of copper.
  • the layer thickness of the solder mass is preferably less than or equal to 6.0 x 10 4 m, particularly preferably less than 3.0 x 10 "4 m.
  • the solder mass emerges with an exit width of preferably less than 1 mm from the intermediate space between the soldering region of the connection element and the electrically conductive structure.
  • the maximum exit width is less than 0.5 mm and in particular about 0 mm. This is particularly advantageous with regard to the reduction of mechanical stresses in the disc, the adhesion of the connecting element and the saving of the solder.
  • the maximum exit width is defined as the distance between the outer edges of the soldering area and the point of Lotmasseübertritts, at which the solder mass falls below a layer thickness of 50 ⁇ . The maximum exit width is measured after the soldering process on the solidified solder mass.
  • a desired maximum exit width is achieved by a suitable choice of Lotmassenvolumen and perpendicular distance between the connection element and electrically conductive structure, which can be determined by simple experiments.
  • the vertical distance between the connection element and the electrically conductive structure can be predetermined by a corresponding process tool, for example a tool with an integrated spacer.
  • the maximum exit width can also be negative, that is to say retracted into the intermediate space formed by the soldering area of the electrical connection element and the electrically conductive structure.
  • the maximum exit width in the intermediate space formed by the soldering area of the electrical connection element and the electrically conductive structure is withdrawn in a concave meniscus.
  • a concave meniscus For example, by increasing the perpendicular distance between the spacer and the conductive structure during the soldering process, the solder is still liquid.
  • the advantage lies in the reduction of the mechanical stresses in the disc, in particular in the critical range, which is present at a large Lotmasseübertritt.
  • the soldering surface of the first subelement has spacers.
  • the spacers are preferably integrally formed with the first sub-element, for example by embossing or deep drawing.
  • the spacers preferably have a width of 0.5 x 10 "4 m to 10 x 10" 4 m and a height of 0.5 x 10 "4 m to 5 x 10" 4 m, more preferably from 1 x 10 "4 m to 3 x 10 "4 m.
  • At least one contact elevation can be arranged on the surface of the connection element facing away from the substrate, which contacts the connection element with the soldering tool during the soldering process.
  • the contact elevation is preferably convexly curved, at least in the area of the contacting with the soldering tool.
  • the contact elevation preferably has a height of 0, 1 mm to 2 mm, more preferably from 0.2 mm to 1 mm.
  • the length and width of the contact elevation is preferably between 0, 1 and 5 mm, most preferably between 0.4 mm and 3 mm.
  • the contact elevations are preferably formed integrally with the connection element, for example by embossing or deep-drawing. For soldering electrodes can be used, the contact side is formed flat.
  • the electrode surface is brought into contact with the contact elevation.
  • the electrode surface is arranged parallel to the surface of the substrate.
  • the contact area between the electrode surface and contact elevation forms the solder joint.
  • the position of the solder joint is determined by the point on the convex surface of the contact elevation, which has the greatest perpendicular distance from the surface of the substrate.
  • the position of the solder joint is independent of the position of the soldering electrode on the connecting element. This is particularly advantageous in terms of a reproducible, uniform Heat distribution during the soldering process.
  • the heat distribution during the soldering process is determined by the position, the size, the arrangement and the geometry of the contact elevation.
  • the contact elevation can also be formed by the portion of the rivet according to the invention projecting beyond the connecting element, in particular if the rivet head is designed as a spherical segment, for example a hemisphere. The contact elevation is then advantageously produced during riveting without further effort.
  • the first sub-element and / or the second sub-element of the electrical connection element may have a coating (wetting layer) containing, for example, nickel, copper, zinc, tin, silver, gold or alloys or layers thereof, preferably silver.
  • a coating containing, for example, nickel, copper, zinc, tin, silver, gold or alloys or layers thereof, preferably silver.
  • the first sub-element and / or the second sub-element with an adhesion-promoting layer, preferably made of nickel and / or copper, and additionally provided with a layer containing silver.
  • the connecting element according to the invention is most preferably coated with 0, 1 ⁇ to 0.3 ⁇ nickel and then 3 ⁇ to 20 ⁇ silver.
  • the shape of the electrical connection element can form one or more solder deposits in the intermediate space of connection element and electrically conductive structure.
  • the solder deposits and wetting properties of the solder on the connecting element prevent the escape of the solder mass from the intermediate space.
  • Lotdepots can be rectangular, rounded or polygonal configured.
  • the object of the invention is further achieved by a method for producing an electrical connection element for electrically contacting an electrically conductive structure on a substrate, wherein
  • a first solid sub-element and a second solid sub-element are provided, wherein the sub-elements are made of different materials and wherein the first sub-element is provided, soldered to the electrically conductive structure and wherein the second sub-element is intended to be connected to an electrical connection cable,
  • the object of the invention is further achieved by a method for producing a disk with at least one connecting element, wherein
  • solder mass is applied to the contact surfaces of the first subelement of a connection element according to the invention
  • connection element with the solder mass is arranged on a region of an electrically conductive structure which is applied to a region of a substrate, and d) the connection element is connected to the electrically conductive structure with introduction of energy.
  • the solder mass is preferably applied as platelets or flattened drops with a defined layer thickness, volume, shape and arrangement on the connection element.
  • the layer thickness of the Lotmasseplättchens is preferably less than or equal to 0.6 mm.
  • the shape of the Lotmasseplättchens depends preferably on the shape of the contact surface of the connection element and is for example rectangular, circular, oval or rectangular with rounded corners or rectangular with two opposite sides attached semicircles.
  • the introduction of energy in the electrical connection of electrical connection element and electrically conductive structure is preferably carried out with stamp soldering, thermode soldering, bulb soldering, laser soldering, hot air soldering, induction soldering, resistance soldering and / or with ultrasound.
  • the electrically conductive structure can be applied to the substrate by methods known per se, for example by screen printing methods.
  • the invention further comprises the use of an electrical connection element according to the invention for electrically contacting an electrically conductive structure on a substrate, wherein the substrate (6) is preferably a vehicle window, in particular Windshield, rear window, side window and / or roof glass of a motor vehicle.
  • the substrate (6) is preferably a vehicle window, in particular Windshield, rear window, side window and / or roof glass of a motor vehicle.
  • the pane according to the invention with the connection element according to the invention is preferably used in buildings or in means of transportation for traffic on land, in the air or on water, in particular in rail vehicles or motor vehicles, preferably as windscreen, rear window, side window and / or roof window, in particular as heatable Disc or as a disc with antenna function.
  • FIG. 1 is a perspective view of an embodiment of the electrical connection element according to the invention.
  • Fig. 3 is a perspective view of a disc according to the invention with the
  • FIG. 5 shows a cross section through the first subelement of the connecting element from FIG. 4
  • FIG. 6 shows a cross section through an alternative embodiment of the first subelement
  • FIG. 7 shows a flow chart of an embodiment of the method according to the invention
  • FIGS. 1 and 2 each show a detail of an electrical connection element 1 according to the invention.
  • the connecting element 1 is formed in several pieces and consists of a first sub-element 2 and a second sub-element 3.
  • the first sub-element 2 is provided with an electrically conductive structure on a substrate, in particular to be soldered to a vehicle glass pane.
  • the second sub-element 3 is intended to be contacted with a connection cable, whereby the electrical conductive structure can be connected via the connection element 1 with an external power supply.
  • the thermal expansion coefficient of the first sub-element 2 is tuned to the thermal expansion coefficient of the second sub-element 3.
  • the first part consists of chromium-containing steel member 2, the material number 1.4509 according to EN 10 088-2 (Thyssen Krupp Nirosta® 4509) having a thermal expansion coefficient of 10.5 x 10 "6 / ° C in the temperature range from 20 ° C to 300 ° C .
  • vehicle windows are typically made of soda-lime glass, which has a thermal expansion coefficient of approximately 9- 10 -6 / ° C. Due to the small difference in expansion coefficient critical thermal stresses can be avoided.
  • the first sub-element 2 has a bridge shape.
  • the sub-element 2 comprises planar foot areas, each with a flat contact surface on its underside. Between the foot areas a bridging area is arranged.
  • the contact surfaces are intended to be connected via a solder mass with a conductive structure, while the bridging region is not to be acted upon with the solder mass.
  • the partial element 2 has a length of 24 mm and a width of 4 mm in the bridging region and a width of 8 mm in the foot regions.
  • the material thickness of the partial element 2 is 0.8 mm.
  • the second sub-element 3 should not be soldered directly to the electrically conductive structure, so that no consideration must be taken to its thermal expansion coefficient.
  • the second sub-element 3 should have a high electrical conductivity and good formability, which is advantageous for contacting with the connection cable.
  • the second sub-element 3 is therefore made of copper of the material number CW004A (Cu-ETP) with an electrical resistance of 1, 8 ⁇ hnrcm.
  • the subelement 3 is provided with a wetting layer of silver in order to further improve the conductivity.
  • the second subelement 3 is arranged on the upper side of the first subelement 2 in the bridging region.
  • the second sub-element 3 is aligned flush with an outer edge of the first sub-element 2 and has over the opposite outer edge in the direction of the widened foot areas out.
  • the second sub-element 3 has a material thickness of 0.8 mm, a width of 6.3 mm and a length of 27 mm.
  • connection element 1 must be heated to a very high temperature in order to melt the first partial element 2.
  • the second sub-element 3 take damage.
  • the silver-containing wetting layer may be damaged.
  • the first sub-element 2 and the second sub-element 3 are connected to each other according to the invention by means of a rivet 4.
  • the rivet 4 By the rivet 4, the sub-elements 2, 3 can be permanently connected stable regardless of the materials used.
  • the rivet is also made of Cu-ETP.
  • the first sub-element 2 and the second sub-element 3 are each provided with a suitable hole, which are arranged in coincidence with each other, so that the rivet 4 can be passed through both holes.
  • the rivet 4 can be passed through both holes.
  • the positive connection of the sub-elements 2, 3 is produced, wherein a thickened part of the rivet protrudes respectively at the top and the bottom. Since the bridging portion of the first portion 2 in the illustrated embodiment has a sufficient distance from the surface of the substrate, the projection of the rivet 4 at the bottom is unproblematic.
  • the pane is a rear window of a passenger vehicle and comprises a substrate 6, which is a 3 mm thick thermally toughened safety glass made of soda lime glass.
  • the substrate 6 has a width of 150 cm and a height of 80 cm.
  • On the substrate 6 is an electrically conductive structure 5 in the form of a Heat conductor structure printed.
  • the electrically conductive structure 5 contains silver particles and glass frits.
  • the electrically conductive structure 5 is widened to a width of approximately 10 mm and forms a contact surface for the electrical connection element 1.
  • the connection element 1 is used for electrical contacting of the electrically conductive structure 5 with an external power supply via a connecting cable, not shown. The electrical contact is hidden for a viewer outside of the car by a Abdecksiebdruck 8 between electrically conductive structure 5 and substrate 6.
  • the contact surfaces of the first sub-element 2 of the connection element 1 are permanently electrically and mechanically connected via a solder mass 7 with the electrically conductive structure 5.
  • the solder mass 7 is lead-free and contains 57 wt .-% bismuth, 40 wt .-% tin and
  • the solder mass 4 has a thickness of 250 ⁇ .
  • FIG. 4 shows a further embodiment of the connection element 1 according to the invention.
  • the second part element 3 is in this case bridge-shaped and consists of copper.
  • a first partial element 2 made of chromium-containing steel of the material number 1.4509 is arranged.
  • the first sub-elements 2 form Kompensatorplatten, whereby the copper-containing bridge and the glass substrate are not in direct contact, which would be disadvantageous due to the high difference in the thermal expansion coefficient.
  • the first sub-elements already carry prefabricated the solder mass. 7
  • FIG. 5 shows a cross section through a first subelement 2 according to FIG. 4.
  • the rivet 4 is formed in one piece with the subelement 2 in this embodiment and is arranged on the side of the subelement 2 opposite the soldering surface. This provides a flat soldering surface.
  • FIG. 6 shows a further alternative embodiment of the first subelement 2.
  • the subelement 2 is substantially planar, wherein a depression is made in the soldering surface approximately in the middle. In the region of this depression, a hole provided for carrying out a rivet is arranged. The protruding part of the rivet can be received in the recess so that it does not protrude beyond the soldering surface and disturbs the connection between the connection element and the substrate.
  • the depression also facilitates the attachment of the solder mass on the connection element before soldering.
  • excess solder mass may be received in the recess during soldering, so that the exit width of the solder mass may be reduced beyond the side edges of the solder pads. Mechanical stresses are thus further reduced.
  • the shape of the recess can be optimized for other functionalities such as the attachment of the solder mass.
  • the profile of the recess has a slight pruning, which leads to a more stable connection during Kalteinpressung the solder mass.
  • the section of the rivet 4 projecting beyond the surface facing away from the substrate can be used as a contact elevation.
  • the contact bump determines the location of the contact with the solder electrode, thus resulting in a reproducible introduction of the energy during soldering.
  • the protruding part of the rivet has approximately the shape of a spherical segment.
  • FIG. 7 shows an exemplary embodiment of a method according to the invention for producing an electrical connection element 1.
  • FIG. 8 shows an exemplary embodiment of a method according to the invention for producing a pane according to the invention with a connection element 1 according to the invention.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Multi-Conductor Connections (AREA)
  • Surface Heating Bodies (AREA)
  • Resistance Heating (AREA)

Abstract

La présente invention concerne un élément de connexion électrique (1), servant à connecter une structure (5) électriquement conductrice à un substrat (6), qui comprend au moins deux éléments (2, 3) massifs faits de matériaux différents. Le premier élément (2) est adapté pour être soudé à la structure (5) électriquement conductrice et le deuxième élément (3) est adapté pour être relié à un câble d'alimentation électrique. Le premier élément (2) et le deuxième élément (3) sont assemblés à l'aide d'au moins un rivet (4).
EP15709891.4A 2014-04-29 2015-03-11 Élément de connexion électrique servant à connecter une structure électriquement conductrice à un substrat Withdrawn EP3138363A1 (fr)

Applications Claiming Priority (2)

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EP14166290 2014-04-29
PCT/EP2015/055007 WO2015165632A1 (fr) 2014-04-29 2015-03-11 Élément de connexion électrique servant à connecter une structure électriquement conductrice à un substrat

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EP3138363A1 true EP3138363A1 (fr) 2017-03-08

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US (2) US10374343B2 (fr)
EP (1) EP3138363A1 (fr)
JP (1) JP6483241B2 (fr)
KR (1) KR101868258B1 (fr)
CN (1) CN106507693B (fr)
BR (1) BR112016025167A2 (fr)
CA (1) CA2944365A1 (fr)
EA (1) EA034080B1 (fr)
MX (1) MX361114B (fr)
WO (1) WO2015165632A1 (fr)

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US10873143B2 (en) 2020-12-22
US10374343B2 (en) 2019-08-06
BR112016025167A2 (pt) 2017-08-15
US20190326691A1 (en) 2019-10-24
KR20170017872A (ko) 2017-02-15
JP6483241B2 (ja) 2019-03-13
US20170033481A1 (en) 2017-02-02
CN106507693B (zh) 2020-03-17
MX2016014063A (es) 2017-06-19
EA034080B1 (ru) 2019-12-25
EA201692178A1 (ru) 2017-02-28
JP2017520899A (ja) 2017-07-27
WO2015165632A1 (fr) 2015-11-05
KR101868258B1 (ko) 2018-06-15
CN106507693A (zh) 2017-03-15
MX361114B (es) 2018-11-28
CA2944365A1 (fr) 2015-11-05

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