EP3102420B1 - Fabrication d'un élément de sécurité présentant des propriétés de changement de couleur - Google Patents

Fabrication d'un élément de sécurité présentant des propriétés de changement de couleur Download PDF

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Publication number
EP3102420B1
EP3102420B1 EP15704459.5A EP15704459A EP3102420B1 EP 3102420 B1 EP3102420 B1 EP 3102420B1 EP 15704459 A EP15704459 A EP 15704459A EP 3102420 B1 EP3102420 B1 EP 3102420B1
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EP
European Patent Office
Prior art keywords
layer
spacer layer
structured spacer
structured
reflective layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP15704459.5A
Other languages
German (de)
English (en)
Other versions
EP3102420A1 (fr
Inventor
Winfried HOFFMÜLLER
Theodor Burchard
Patrick ENGELMANN
Christian Fuhse
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Giesecke and Devrient Currency Technology GmbH
Original Assignee
Giesecke and Devrient Currency Technology GmbH
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Publication of EP3102420A1 publication Critical patent/EP3102420A1/fr
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
    • B41M3/14—Security printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/30—Identification or security features, e.g. for preventing forgery
    • B42D25/324—Reliefs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/30—Identification or security features, e.g. for preventing forgery
    • B42D25/328—Diffraction gratings; Holograms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/30—Identification or security features, e.g. for preventing forgery
    • B42D25/36—Identification or security features, e.g. for preventing forgery comprising special materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/30—Identification or security features, e.g. for preventing forgery
    • B42D25/36—Identification or security features, e.g. for preventing forgery comprising special materials
    • B42D25/364—Liquid crystals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/30—Identification or security features, e.g. for preventing forgery
    • B42D25/36—Identification or security features, e.g. for preventing forgery comprising special materials
    • B42D25/373—Metallic materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • B42D25/405—Marking
    • B42D25/43—Marking by removal of material
    • B42D25/435—Marking by removal of material using electromagnetic radiation, e.g. laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • B42D25/405—Marking
    • B42D25/43—Marking by removal of material
    • B42D25/445—Marking by removal of material using chemical means, e.g. etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • B42D25/45—Associating two or more layers

Definitions

  • the invention relates to a method for producing a security element.
  • Value documents within the meaning of the invention include banknotes, stocks, bonds, certificates, vouchers, checks, air tickets, high-quality entrance tickets, labels for product security, credit or debit cards, but also other forgery-prone documents, such as passports, ID cards or other identity documents.
  • Value documents, in particular banknotes are usually made of paper substrates, polymer substrates or combinations of paper and polymer which have special security features, such as a security thread at least partially incorporated into the paper or a watermark.
  • window films, security threads, tapes can be glued / laminated or introduced onto the document of value.
  • Security elements usually comprise as a base material a polymer or polymer compositions.
  • security features have optically variable security features such as holograms or certain color-shift effects to provide better anti-counterfeit security.
  • optically variable security elements such as holograms or certain color-shift effects to provide better anti-counterfeit security.
  • the particular advantage of optically variable security elements is that the security features on these security elements can not be mimicked by mere copying with copiers, since effects of an optically variable security feature are lost through copying or even appear only black.
  • introducing negative patterns into a color-shift-effect region requires that the layers of the thin-film element leading to the color-shift effect at least partially be removed at the locations where the negative patterns are to be introduced.
  • EP 0 328 086 A2 For example, a structured layer is applied to a reflection layer of a hologram so that the reflection layer is partially protected from being removed.
  • washing ink is used under thin-film elements applied over the entire area in order to remove the thin-film elements in areas. It is therefore an object of the present invention to provide a method which makes it possible to produce security elements with optically variable effects with less time and expense. It is also an object of the present invention to provide a method which makes it possible to produce security elements with optically variable effects and additional negative patterns in high quality.
  • the carrier material may have one or more areas to be coated.
  • a carrier material preferably comprises two major surfaces facing each other.
  • the carrier material is preferably a film-like material.
  • the at least one region to be coated is preferably arranged on a main surface of the carrier material. If the carrier material has a plurality of regions to be coated, these can be arranged only on one of the two main surfaces or on both main surfaces of the carrier material.
  • the area of the carrier material to be coated may have different surface shapes.
  • the area to be coated be rectangular, oval, star-shaped or serpentine.
  • the shape and size of the area to be coated is preferably defined or determined in one method step.
  • the area of the carrier material to be coated may have a surface structure and / or surface quality which differs from other areas of the carrier material.
  • the substrate has an area defined as an area to be coated.
  • the step "arranging a reflection layer in the area to be coated” preferably comprises that the reflection layer is arranged or applied to / on / above the area of the carrier material defined as being to be coated.
  • the reflective layer is arranged or applied over the whole area in the area to be coated.
  • the reflective layer can also be arranged in other than the area to be coated.
  • the reflection layer can be applied or vapor-deposited, for example, by means of physical vapor deposition. Further preferably, the reflective layer can also be applied by printing technology.
  • the thickness of the reflection layer is preferably in the range of 5 nm to 200 nm, preferably 5 nm to 100 nm, particularly preferably 5 nm to 50 nm.
  • the step of arranging a patterned spacer layer on the reflective layer, wherein the patterned spacer layer is adapted to protect the reflective layer from being removed, is such that the reflective layer, after disposing the patterned spacer layer, is substantially between the substrate and the patterned spacer is arranged.
  • a structured spacer layer is to be understood as meaning that the spacer layer is not arranged uniformly or over the whole area at / above the reflective layer.
  • a structured spacer layer does not have the same layer thickness or height at every point of the region to be coated. Rather, due to the structured spacer layer, there are sites / subregions in the region to be coated in which the layer thickness of the patterned spacer layer is zero.
  • the structured spacer layer is suitable for protecting the reflective layer from being removed.
  • the structuring of the structured spacer layer specifies in which (sub) regions of the region to be coated the reflective layer can be removed / detached / dissolved / removed.
  • the structured spacer layer thus serves as a mask to allow selective removal of the reflective layer.
  • the reflection layer can be removed only where the structured spacer layer has not been arranged or falls below a minimum layer thickness or height.
  • the reflective layer is protected from being removed in selected areas (sub-areas) in the area to be coated.
  • the patterned spacer layer forms a predetermined motif, such as a character, string, and / or image.
  • This motif or pattern determines the structure of the structured spacer layer.
  • the subject may be visible or recognizable to a viewer when the viewer is looking in the direction of the main surface normal or perpendicular to the main surface of the substrate having the area to be coated.
  • the step "arranging an absorber layer at least on the structured spacer layer” is to be understood such that the absorber layer is in any case arranged on / above the structured spacer layer.
  • the absorber layer may additionally be disposed on the regions of the reflective layer and / or the substrate that are not protected by the patterned spacer layer. In other words, in this case, the absorber layer is arranged over the whole area in the area to be coated.
  • the reflective layer is not removed where the patterned spacer layer acts as a mask.
  • the structure of the patterned spacer layer dictates in which (sub-) areas of the area defining the area to be coated, the reflective layer can be removed.
  • the reflective layer can be selectively removed although the agent used for removal is applied to the entire area or non-selectively in the area to be coated.
  • the means used for removal may be a laser beam of areal cross-section (eg 1 cm 2 ) with the entire area to be coated treated with the laser beam but only in the areas / (sub) areas not protected by the structure of the patterned spacing layer a removal of the reflection layer is possible.
  • the security element may be completely immersed in the etchant or contacted with the etchant, and due to the structure of the patterned spacer layer, removal of the reflective layer can take place only where the (predetermined) structure of the structured spacer layer does not prevent the removal.
  • the structured spacer layer serves as an etching mask or exposure mask.
  • the layer sequence forms the reflection layer, the structured spacer layer and the absorber layer, wherein the structured spacer layer is arranged between the reflection layer and the absorber layer, a color shift-thin-film structure or a color-shift thin-film element.
  • the structured spacer layer and the absorber layer see-through color effects may also be present instead of color-shift effects.
  • the step "arranging an absorber layer " (temporally) before the step “removing the reflective layer " is made.
  • the absorber layer is preferably arranged both on the structured spacer layer and on (sub) regions / partial regions of the reflection layer.
  • second regions / second regions are present, in which the absorber layer is arranged directly on the reflection layer. Consequently, in this case, by removing the reflective layer, the absorber layer is removed in the (sub) regions in which the patterned spacer layer has not been disposed.
  • Subregions containing a reflective layer, a spacer layer, and an absorber layer are thin film element regions.
  • the reflective layer can be removed where the absorber layer is disposed directly on the reflective layer when the absorber layer is permeable to the removal agent such as irradiation and / or etchant.
  • the absorber layer is porous or holy, so that the absorber layer does not form a barrier to the removal agent.
  • the simultaneous removal of the absorber layer and the reflection layer in only one process step is particularly advantageous, as this can drastically reduce the production time and the production cost of security elements with color shift effect or thin-film elements which additionally contain negative patterns.
  • the absorber layer has a thickness / height of 2 nm to 15 nm, since the permeability of the absorber layer for removing the reflection layer is influenced by the thickness of the absorber layer.
  • the entire area of an absorber layer is arranged in the region to be coated in such a way that the structured spacer layer is arranged between the absorber layer and the reflection layer, and in the regions in which the structured spacer layer is absent, the absorber layer is arranged directly on the reflection layer.
  • the reflection layer and the absorber layer can be applied / arranged over the entire surface in the area to be coated, and yet can be selectively removed in regions by a single process step of "removal". It is also advantageous that the reflective layer and the absorber layer in the areas in which the structured spacer layer is present, not in the Removing process step are removed.
  • the absorber layer for a corresponding removal agent is porous or permeable, so that the reflection layer is dissolved or dissolved in the areas in which the reflection layer is directly adjacent to the absorber layer. Due to the detachment or dissolution of the reflection layer, the absorber layer at the same time loses its adhesion and is removed together with the reflection layer.
  • the reflective layer is protected by the patterned spacer layer.
  • the absorber layer is also permeable to a corresponding removal agent in these areas, the structured absorber layer is not attacked by the corresponding removal agent.
  • a printing ink with a good flow for example on the basis of nitrocellulose can be selected, as a reflection layer, aluminum can be selected.
  • caustic soda or phosphoric acid for example, which penetrates the chromium and dissolves the aluminum, while the binder or the ink for the structured spacer layer is not impaired, can be used as etchant.
  • the absorber layer and / or the reflection layer can be applied by printing technology.
  • the absorber layer is preferably arranged only in the (sub) regions in which the structured spacer layer is present. In other words, the absorber layer is preferably arranged exclusively on the structured spacer layer.
  • such (sub) areas arise in which there is no reflection layer, no structured spacer layer and no absorber layer (negative pattern areas), which are arranged next to other (sub) areas in which the reflection layer, the structured spacer layer and the absorber layer are present (thin-film element areas).
  • the arrangement of the absorber layer is preferably carried out using a donor sheet.
  • the donor sheet may be a metal donor sheet.
  • the absorber layer can from the donor sheet z. B. be arranged with a roll-to-roll method on the structured spacer layer or transferred to the structured spacer layer.
  • the method comprises the further step of "arranging a relief structure with raised and recessed areas in the area of the carrier material to be coated".
  • the relief structure is designed, for example, as a sine grid or a crossed sine grid
  • the raised areas are located where the underlying (normalized) sine function assumes the value 1 or a range of values from 1 to greater than 0.
  • the recessed areas are then, for example, at the value -1 or in the value range from -1 to less than 0.
  • a relief structure can be arranged after the arrangement of the reflection layer, so that both the reflection layer and the embossing layer and / or the substrate material are provided with a relief structure.
  • a relief structure can be arranged after arranging the structured spacer layer, so that the relief structure is introduced into the structured spacer layer.
  • a relief structure can be arranged after arranging the absorber layer, so that the absorber layer itself and / or a (protective) layer covering the absorber layer have the relief structure.
  • the method comprises the further step "leveling the relief structure by arranging the structured spacer layer on the reflective layer”.
  • the recessed areas of the relief structure are filled with material of the structured spacer layer, so that the material of the structured spacer layer reaches at least the level of the raised areas.
  • the material of the patterned spacer layer is a liquid.
  • the relief structure is scraped / wiped off after arranging / applying the material of the structured spacer layer so that the material of the structured spacer layer does not or only slightly exceeds the level of the raised areas.
  • the term "slightly exceeding" is to be understood in particular to mean a layer thickness / height which exceeds the layer thickness / height up to the level of the raised regions by up to 10%, preferably by up to 5%, of the layer thickness.
  • removal of / doctoring off or wiping off the relief structure after application of the material of the structured spacer layer removes excess material of the structured spacer layer. Consequently, material of the structured spacer layer can thus be saved in the course of the process / production process.
  • the structured spacer layer After being arranged on the relief structure, the structured spacer layer has (lower) regions with a higher layer thickness / height and adjacent (lower) regions with a lower layer thickness / height.
  • the area to be coated has subregions / subregions having a layer thickness of the patterned spacer layer of zero or slightly thicker than zero.
  • the structured spacer layer has a structure that substantially corresponds to a negative of the relief structure.
  • the method comprises the further step of "removing the reflection layer in the raised areas of the relief structure".
  • the structured spacer layer allows removal of the reflection layer only in the (sub) areas in which the raised areas are not or only slightly covered by the structured spacer layer or the level of the structured spacer layer does not or only slightly exceeds the level of the raised areas ,
  • the reflective layer is removed in the areas in which the reflective layer is not protected by the patterned spacer layer.
  • the reflective layer remains in the recessed areas of the relief structure after completion of the step of "removing the reflective structure in the raised areas of the relief structure" because the patterned spacer layer is not or not completely removed during the process step and therefore the reflective layer in the recessed areas remains protected.
  • the duration of a subsequent step "removing the reflective layer in the raised areas of the relief structure" is kept as short as possible by limiting the layer thickness of the structured spacer layer to a maximum dimension / maximum, since then the desired or fixed removal of the reflective layer in the raised areas of the relief structure is not delayed by a previously necessary removal of the structured spacer layer.
  • the filler or the filling material has a solids / solids content of 100%.
  • the structured spacer layer is preferably arranged / applied by printing in the form of a motif.
  • the structured spacer layer is preferably arranged by means of one or more rollers and / or cylinders.
  • the number of rolls may vary.
  • the rollers / cylinders can transport paint and / or paint to each other.
  • the arrangement of the motif or the motif print is preferably carried out by a high-pressure mold.
  • the structured spacer layer is applied by means of flexographic printing. Alternatively or additionally, the structured spacer layer is applied by gravure printing. Alternatively or additionally, the structured spacer layer is applied by means of inkjet printing process. Alternatively or additionally, the structured spacer layer is applied by means of offset printing. Alternatively or additionally, the structured spacer layer is applied by means of screen printing. Alternatively or additionally, the structured spacer layer is arranged by means of 3D printing methods.
  • the printing unit can be encapsulated or atmospherically sealed to arrange the structured spacer layer, so that there is a solvent-saturated atmosphere in the printing unit area.
  • the solvent-saturated atmosphere drying of the ink or the dielectric on rollers and / or cylinders prevented / avoided.
  • the desired layer thickness can be achieved very rapidly, for example, in comparison to application by means of physical vapor deposition.
  • the structure or structuring of the structured spacer layer can be achieved very easily during placement in a printing application, so that after an arrangement of a spacer layer no further / downstream process step for structuring such a spacer layer is required.
  • a spacer layer by means of physical vapor deposition for example, a full-surface / uniform or applied unstructured spacer layer, which is then removed, for example by means of an etching process regions, so as to obtain a structured spacer layer.
  • the step "removing the reflective layer " comprises etching.
  • the reflection layer is removed by means of an etching process or etchant as removal agent.
  • etchant etchant
  • caustic soda or phosphoric acid is used as etchant.
  • the etchant penetrates the absorber layer, so that contact between the etchant and the reflection layer is produced.
  • the reflection layer can thus be dissolved or detached.
  • the fixed bond / connection between the absorber layer and the carrier layer is also released by the detachment of the reflection layer, so that the absorber layer is removed by removing the reflection layer at the same time.
  • the etchant can advantageously not strike the reflective layer after penetrating the absorber layer, so that the reflective layer and the absorber layer remain in these regions.
  • the step "removing the reflective layer " comprises lasers.
  • the reflection layer is removed by laser beam treatment as a removing means.
  • the absorber layer is not detached or impaired by the laser radiation.
  • the laser radiation can penetrate the absorber layer and remove the reflective layer.
  • the patterned spacer layer sufficiently protects the reflective layer from the laser radiation so that the reflective layer is not removed in the (sub) areas where the patterned spacer layer is disposed.
  • the laser used may emit infrared laser radiation and the patterned spacer layer may have infrared-blocking properties such that the laser radiation can not penetrate the patterned spacer layer.
  • the method comprises the further step of "arranging an adhesion-promoting layer".
  • the adhesion-promoting layer is arranged (temporally) before the step "arranging the reflection layer ".
  • the adhesion-promoting layer is arranged between the carrier material and the reflection layer.
  • the bond or connection between the reflection layer and the carrier material is improved by the adhesion-promoting layer. If an embossing lacquer / embossing lacquer layer is arranged between the carrier material and the reflection layer, the adhesion-promoting layer improves the binding of the carrier material and the reflection layer.
  • the adhesion-promoting layer may comprise metallic and / or non-metallic materials.
  • the method comprises the further step of "applying a protective layer".
  • the protective layer is arranged after "arranging the absorber layer " or “removing the reflective layer ", to protect the structures generated by the process.
  • the protective layer is arranged in the (entire) area to be coated.
  • the protective layer preferably comprises a protective lacquer.
  • the protective layer comprises a heat sealing lacquer and / or a primer.
  • the structured spacer layer preferably has at least partially deformation properties which lead to deformation-induced color changes of the security element.
  • the deformation of the structured spacer layer leads to a color change of the security element or region in the deformed sections, in which the structured spacer layer has the deformation properties which lead to deformation-induced color change properties of the security element.
  • such a color change of the security element or the deformation of the structured spacer layer is reversible.
  • the color change remains at least some time after the deformation, so that the color change is also recognizable for a while in a again no longer deformed state for a viewer.
  • the deformation-related color change characteristics can be set.
  • the deformation-related color change properties can be determined by thermal crosslinking and / or vulcanization and / or radiation curing.
  • the entire structured spacer layer has deformation properties which lead to deformation-induced color change properties of the security element.
  • only partial regions / sections of the structured spacer layer have deformation properties which lead to deformation-induced color change properties of the region to be coated or the security element. For example, by means of selective irradiation, the subregions / sections of the structured spacer layer which should have deformation properties for a color change can be defined or defined.
  • a mask By means of a mask, it is preferably possible to determine which sections of the security element or of the region to be coated are to have deformation-induced color change properties.
  • a mask is used to provide a patterned spacer layer with portions having deformation properties for deformation-related color changes of the security element.
  • the mask preferably protects the sections of the structured spacer layer from irradiation / vulcanization or thermal crosslinking which should or should not have deformation-induced color change properties.
  • such a mask is designed as a motif or pattern. Consequently, it is possible that upon (or after) deforming the area to be coated due to the color change in the portions of the area to be coated with deformation-related color changing characteristics, a (further) pattern / motif is recognizable to a viewer.
  • a structured spacer layer which has deformation properties that lead to deformation-related color changes of the security element, at least partially formed gel-like.
  • the patterned spacer layer is an elastomer. For example, by bending or folding a security element with an at least partially gel-like or jelly-like structured structured spacer layer, the layer thickness of the gel-like, structured spacer layer can be locally changed, so that this local layer thickness change in the thin-film element region when viewing the security element a color change / to detect a color change of this thin-film element area.
  • deformation properties of the structured spacer layer which lead to a detectable color change can be achieved by an at least partially different swelling behavior. For example, for a viewer when moistening the security element, this can make a color change in the sections of the structured spacer layer with a stronger swelling behavior more noticeable in comparison to the sections of the structured spacer layer with a lower swelling behavior.
  • the color change remains at least some time after swelling, so that the color change even after moistening - for example, by breathe, which leads to a swelling - is recognizable to a viewer.
  • the entire structured spacer layer has a strong swelling behavior, so that after moistening, a color change due to a swelling-induced increase in layer thickness of the structured spacer layer can be detected when viewing the security element.
  • the structured spacer layer preferably has direction-dependent refractive indices.
  • the patterned spacer layer is an anisotropic layer.
  • a viewer can recognize a different color shift effect due to the direction-dependent refractive indices. For example, when looking from an oblique direction to the area to be coated and turning / rotating the area to be coated around the main surface normal in the centroid of the area to be coated a (further) color shift effect can be seen.
  • this color-shift effect is different in color from the other color-shift effects in the area to be coated.
  • the structured spacer layer preferably has one or more dyes.
  • the structured spacer layer comprises pigments.
  • the pigment size or pigment dimensions / diameter preferably does not exceed the layer height or layer thickness of the structured spacer layer.
  • the dyes and / or pigments comprise fluorescence properties.
  • the structured spacer layer has a toning or slight coloring, so that the structured spacer layer at least does not appear to be completely transparent to a viewer.
  • fluorescing or toning or light staining of the structured spacer layer makes it possible for the structured spacer layer to be visible or made visible to the personnel when the security element is produced. For example, this allows a review of the manufacturing process or the process step "arranging the structured spacer layer" are facilitated.
  • the structured spacer layer preferably has a dry layer thickness of 30 nm to 1100 nm, preferably of 300 nm to 600 nm.
  • a motif formed by the patterned spacer layer can be seen in a (single) color.
  • a color shift effect / colorshift effect can be recognized by the viewer.
  • a dry layer thickness of 30 nm to 80 nm of the structured spacer layer no color shift effect, but a deep black is discernible.
  • the security element preferably has at least one relief structure such as a hologram and / or moth eyes and / or microlenses and / or micromirrors.
  • the relief structure may be provided with the step of "placing a relief structure with raised and recessed areas in the area of the substrate to be coated".
  • other / further relief structures can be provided, which are arranged in other layers such as the embossing layer, the structured spacer layer, the absorber layer and / or the protective layer.
  • the carrier material comprises a carrier film.
  • the carrier material comprises polyethylene terephthalate (PET) and / or polypropylene (PP), particularly preferably the carrier material is PET or PP.
  • the substrate may be removed prior to applying the security element to a value document substrate.
  • the security element comprises at least one adhesive layer or at least one release layer, which is applied between the carrier material and the reflective layer.
  • the reflective layer includes aluminum and / or silver.
  • the reflective layer is an aluminum layer or a silver layer.
  • the absorber layer includes an etchant permeable material.
  • the absorber layer preferably contains a material that is transparent or semi-transparent for laser radiation.
  • the absorber layer contains a material which is at least semitransparent for laser radiation.
  • the absorber layer includes chromium.
  • the absorber layer is a chromium layer.
  • the patterned spacer layer is a dielectric.
  • the dielectric has resist coating properties.
  • the patterned spacer layer is based on vinyl chloride copolymers having acid groups.
  • vinyl chloride copolymers having acid groups it may be the product H15 / 45M from Wacker Chemie AG, which is marketed under the trademark VINNOL®.
  • H 15/45 M is a carboxyl-containing terpolymer of about 84% by weight of vinyl chloride (VC) and about 15% by weight of vinyl acetate (VAc) and about 1% by weight of dicarboxylic acid. It is preferably used according to the manufacturer as a binder for paints and printing inks.
  • the structured spacer layer is based on nitrocellulose.
  • a good course of the structured spacer layer is achieved.
  • the patterned spacer layer is based on acrylate (s).
  • the structured spacer layer contains an acrylate leveling additive, such as Byk 361. This may advantageously favor a uniform surface structure of the structured spacer layer, so that the absorber layer can be arranged on such a planar surface structure.
  • the patterned spacer layer is based on acrylic acid ester.
  • the patterned spacer layer is based on epoxide (s).
  • the structured spacer layer is based on polyurethane (s).
  • the structured spacer layer also based on combinations of the above substances.
  • the structured spacer layer is based on a water-soluble substance.
  • the patterned spacer layer may be based on vinyl chloride copolymer having acid groups (eg, VMCH which is a product name of a vinyl chloride copolymer having acidic groups and manufactured by the Dow Chemical Company).
  • a sample formulation could be: 20% vinyl chloride copolymer with acid groups (VMCH), 20% methyl ethyl ketone (MEK), 20% ethyl acetate, 20% toluene, 20% butyl acetate.
  • VMCH has a very good adhesion to metals.
  • the contained solvent mixture is well suited for preventing drying artifacts.
  • Polyvinyl butyral is also suitable.
  • UV reactive coatings can also be used.
  • an etchable layer eg aluminum
  • a photoresist can even be applied over the entire surface.
  • washable / etchable and non-washable / non-etchable areas can be created. This exposure can be done before or after the application of the absorber. If the areas of the resist which have the corresponding sensitivity are removed by washing / etching, the reflection layer can be structured either simultaneously or in a subsequent step with a further etching medium.
  • the absorber layer is, without having to be self-etched, structured in this procedure with.
  • the structured spacer layer comprises nematic liquid crystals.
  • a structured spacer layer with direction-dependent refractive indices can be provided by means of nematic liquid crystals.
  • nematic liquid crystals can be printed as a (structured) spacer layer.
  • these nematic liquid crystals are aligned by suitable alignment / alignment techniques, such as embossing, photoaging, shear or compression, or arrangement based on the choice of substrate to be printed.
  • suitable alignment / alignment techniques such as embossing, photoaging, shear or compression, or arrangement based on the choice of substrate to be printed.
  • the liquid crystals of the structured spacer layer are aligned differently in certain regions, the liquid crystals, which are oriented differently in some areas, give rise to a (separate) motif. This makes it possible to perceive a uniform color when the main surface of the security element is viewed almost perpendicularly, while the tilting of the security element / oblique viewing of the main surface of the security element identifies the (separate) motif due to the differently aligned liquid crystals.
  • the patterned spacer layer is not SiO 2 .
  • a further aspect relates to a security element, wherein the security element has been produced by one or more of the previously described method steps and / or under the described aspects.
  • a security element according to this invention may in particular comprise a film or a multilayer substrate, wherein the multilayer substrate may also comprise a combination of fabric substrates and films.
  • the security element may comprise a window area which serves to fill or bridge a hole in a value document or in the paper substrate of the value document.
  • a security window in a value document can be inserted / applied with the security element.
  • the area to be coated is arranged in the window area of the security element.
  • the security element may be applied to a value document, for example laminated or glued.
  • the security element may be a security thread or ribbon, window thread, patch or the like.
  • a further aspect relates to a value document, in particular a banknote, having a value document substrate and at least one security element which has been produced by means of one or more of the previously described method steps and / or under the described aspects.
  • a security element is preferably placed on or in a value document substrate.
  • a value document substrate may comprise paper, polymer or a paper-polymer combination.
  • the carrier material of the security element may be a subarea of the value-document substrate.
  • the value document substrate may be a polymer film and the support material of the security element is a portion of this polymer film.
  • the top side and the bottom side of the security element preferably run (substantially) parallel to the top side and bottom side of the value document substrate.
  • the top and bottom of the value document as well as the security element may also be referred to as major surfaces. These main surfaces represent relevant information to a viewer. Consequently, the main surfaces are visible to a viewer who views a value document with a security element.
  • a major surface of a bill may represent the value of the bill as well as its serial number.
  • an upper and lower side of a security element as well as a value document can also be regarded as the first and second main areas.
  • FIGS. 1a and 1b each show a schematic plan view of a main surface of a value document 100 with a value document substrate 102 and a security element 104, wherein the security element 104 is fixedly connected to the value document substrate 102, for. B. embedded in the value document substrate 102 or applied to the value document substrate.
  • the security element 104 may also be a subarea of the value document substrate 102.
  • the security element 104 has an area defined as area to be coated 106, which comprises a negative pattern area 108 and a color shift or thin-film area 110.
  • FIG. 1a shows the number 45 as the negative pattern area 108a.
  • FIG. 1b shows three stripes as the negative pattern area 108b.
  • a negative pattern area may further have any shape or configuration.
  • a negative pattern area could be in the shape of a church or an animal.
  • a negative pattern area allows a viewer to see the negative pattern area in plan view and / or in review.
  • the security element in the negative pattern area transparent or at least semitransparent, so that at least a part of the incident on the security element light is transmitted in the negative pattern area.
  • the negative pattern area in supervision may have a different color appearance than in transparency (so-called see-through color effects).
  • the security element 104 comprises a carrier material which preferably consists of polyethylene terephthalate (PET) and has a region 106 to be coated.
  • the thin-film element region 110 which is a subregion or partial region of the region 106 to be coated, comprises at least one reflection layer, a structured spacer layer and at least one absorber layer.
  • the negative pattern region 108 has at least no reflection layer and no structured spacer layer in comparison with the thin-film element region 110.
  • the structured spacer layer is not present over the entire surface or evenly in the region 106 to be coated, but only / exclusively in the thin-film element region 110.
  • Fig. 2a to 2f show various (process) steps for producing a security element having a thin-film element region and a negative-pattern region.
  • Fig. 2a shows the sectional view of a region 202 to be coated of a carrier material 200.
  • the region 202 to be coated is arranged on the main surface HF of the carrier material.
  • a reflective layer 204 is disposed in the region 202 to be coated.
  • Fig. 2b shows in this context a reflection layer 204 which has been arranged in / on the region 202 to be coated. How out Fig. 2b As can be seen, the reflection layer 204 was arranged on the main surface HF of the carrier material. How out Fig.
  • a patterned spacer layer 206 is disposed on the reflective layer 204. Due to the structure of the patterned spacer layer 206, in the region 202 to be coated, a thin film element region 210 consisting of a plurality of subregions 210a to 210c and a negative pattern region 208 consisting of the subregions 208a and 208b are formed.
  • the patterned spacer layer 210 corresponds to the thin film element region 110a or 110b according to FIG FIGS.
  • the negative pattern area 208 may have a shape like the negative pattern areas 108a or 108b of FIG FIGS. 1a and 1b exhibit. In other words, it is determined by the structure of the patterned spacer layer which regions or subregions of the region 202 to be coated are formed as thin-film element regions 210 and negative-pattern regions 208, respectively.
  • the patterned spacer layer 206 is a dielectric. Further advantageously, the patterned spacer layer 206 may be disposed on the reflective layer 204 by one or more rollers or printing methods. This is particularly advantageous since in this way a very wide variety of structures or motifs which the structured spacer layer 206 is intended to have can be produced in a simple manner.
  • an absorber layer 212 disposed in the region 202 to be coated is arranged over the entire surface in the region 202 to be coated.
  • the absorber layer 212 is arranged over the entire surface in the region 202 to be coated.
  • the reflective layer 204 is removed in the areas where the reflective layer 204 is not protected by the patterned spacer layer 210.
  • the structured spacer layer 206 serves as a mask or protective layer, thereby enabling a selective removal of the reflective layer 204.
  • the removal of the reflective layer, as in Fig. 2e be achieved by means of homogeneous irradiation or use of an etchant 214.
  • the absorber layer 212 is removed by removing the reflection layer 204 at the same time.
  • only the thin-film element region 210 or the thin-film element subregions 210a, 210b, 210c has a reflection layer 204.
  • a patterned reflective layer and a patterned absorber layer are formed.
  • This structured reflection layer as well as these
  • the structured absorber layer preferably has the same structure / structuring as the structured spacer layer 206.
  • Fig. 2f shown sectional view of a region to be coated 202 a section along the line II according to Fig. 1a or the line II-II according to Fig. 1b correspond.
  • FIGS. 3a to 3e show the various process steps for producing a security element according to another variant.
  • Fig. 3a shows the provision of a substrate 300 having a major surface HF and a region 302 to be coated in a sectional view. This sectional view may be, for example, a sectional view taken along the line II as in FIG Fig. 1a shown, or along the section line II-II according to Fig. 1b correspond.
  • Fig. 3b shows the process step "arranging a reflection layer 304" in the area to be coated 302. As already in Fig. 2b As is also shown, the reflection layer 304 is arranged uniformly or unstructured on the main surface HF in the region 302 to be coated.
  • the structured spacer layer 306 is arranged on the reflection layer 304. Due to the structure of the structured spacer layer 306, regions or subregions 310a-310c which have a structured spacer layer 306 and regions 308a, 308b in the region 302 to be coated, which do not form a structured spacer layer 306, result in the region 302 to be coated exhibit.
  • the structured spacer layer 306 is adapted to protect the reflective layer 304 from being removed.
  • the reflection layer 304 in the areas 308a, 308b is removed.
  • the structured spacer layer 306 serves as a mask or enabled selectively removing the reflective layer 304.
  • the removal may advantageously be done because of the function of the structured spacer layer 306 as a mask by means of homogeneously applied removal means, such as radiation or etchant.
  • a substantially homogeneous action of a removal agent or an irradiation or an etchant 314 is in Fig. 3d shown schematically.
  • an absorber layer 312 is arranged in the region 310 or the subregions 310a, 310b, 310c.
  • a negative pattern region 308 or negative pattern regions 308a, 308b results, in which no reflection layer 304 and no absorber layer 312 are arranged.
  • the absorber layer 312 is selectively patterned according to the structure of the patterned spacer layer 306. In other words, a structured absorber layer 312 is formed.
  • the manufacturing processes as described in relation to Figures 2 and 3 include additional or additional process steps.
  • further or additional method steps can also be carried out between one or more of the explained method steps.
  • FIG. 4a 11 shows the sectional view of a carrier material 400 with a main surface HF and a region 402 to be coated.
  • the carrier material 400 with the region 402 to be coated is produced in the course of a method step as in FIG Fig. 4a shown, provided.
  • a relief structure 404 with raised regions 408 and recessed regions 406 is arranged in the region 402 of the carrier material 400 to be coated.
  • the relief structure can be formed or embossed by embossing the carrier material 400.
  • the relief structure 404 can be arranged or shaped in that a relief / embossing layer, such as an embossing lacquer, is applied or arranged on the main surface HF of the carrier material and this embossing layer is given a relief structure 404 by means of an embossing tool.
  • a relief structure 404 can be arranged or formed in that a relief structure 404 is introduced into a relief layer, for example by means of etching or lasing.
  • a reflection layer 410 is arranged in the region 402 to be coated.
  • a structured spacer layer 412 are arranged.
  • the structured spacer layer is arranged on the reflection layer 410 at least in the recessed areas 406a-e.
  • the relief structure 404 is planarized by arranging the patterned spacer layer 412 on the reflective layer 410.
  • material of the structured spacer layer 412 is not or only slightly present on the reflective layer 410 in the raised regions 408a-d. This can be achieved, for example, by performing a doctoring or wiping off of excess material of the structured spacer layer 412.
  • the patterned spacer layer 412 forms a mask so that the reflective layer in the recessed areas 406 is protected from being removed during the process step of "removing the reflective layer 410 in the raised areas 408 of the relief structure 404". If a slight or thin material layer of the structured spacer layer 412 is also present on the reflection layer 410 in the raised regions 408, material of the structured spacer layer 412 is first removed during the process step "removal of the reflection layer in the raised regions of the relief structure" and then the Reflection layer 410 in the recessed areas 408.
  • the reflective layer 410 in the recessed areas 406 remains protected by the (remaining) patterned spacer layer 412 since the step of "removing the reflective layer in the raised areas" is terminated after the reflective layer 410 is elevated Areas 408 was removed.
  • This is for example with reference to Fig. 4e in which, by means of uniform or homogeneous action of radiation or an etchant 414, the reflection layer 410 in the raised regions 408 has been removed.
  • the spacer layer in the regions 406 has been partially removed, resulting in a surface structure in the region 402 to be coated, as in FIG FIG. 4f shown.
  • this surface structure can be smoothed again by leveling.
  • the leveling can take place.
  • This process step may preferably also include a removal or scraping of superfluous or excess material.
  • an absorber layer 416 is arranged at least on the structured spacer layer 412. As in Fig. 4g shown, the absorber layer 416 can also be arranged in the entire area 402 to be coated.
  • FIGS. 5a to 5c each show a schematic sectional view of a security element with a protective layer 514a, 514b or 514c.
  • the protective layer is preferably used to protect the absorber layer or the area to be coated from external influences.
  • the protective layer 514a, 514b or 514c is preferably transparent.
  • the protective layer or resist that forms structures to be coated 502a may be planar.
  • this also protects the flanks of thin-film element regions 510a from external influences, such as during the circulation of a banknote.
  • the protective layer 514b may be applied as a thin film so that there is no planarization of the structures in the region 502b to be coated.
  • the absorber layer 512b can be protected from external influences by the protective layer 514b.
  • a uniformly distributed protective layer 514c covers the absorber layer 512 in the region 502c to be coated.
  • Fig. 6a shows a section of a value document 600 with a value document substrate 602 and a security element 604, which is formed for example as a patch.
  • the security element 604 comprises a region 606 to be coated, which comprises a thin-film element region 610 and a negative-pattern region 608.
  • the thin-film element region 610 has (regionally) deformation-related color change properties.
  • the deformation-induced color change properties are preferably achieved by deformation properties of the patterned spacer layer present in the thin-film element region 610.
  • the deformation-induced color change properties are achieved by deforming the structured spacer layer by external action, such as moisture penetration by breathing, irradiation or buckling of the security element, so that the thickness of the spacer layer is reduced or increased locally.
  • Fig. 6a shows a thin film element region 610 having a patterned spacer layer having deformation properties in subregions.
  • these subregions with deformation properties are not recognizable to a viewer because the patterned spacer layer is in a non-deformed state.
  • the security element 604 or the thin-layer element region 610 is deformed, namely by deforming the structured spacer layer, the subarea or subarea of the structured spacer layer with deformation properties that lead to a deformation-related color change becomes recognizable for a viewer.
  • Fig. 6b the state is shown by the observer of the deformation-induced color change - after deformation of the structured spacer layer - is recognizable. According to Fig.
  • the sub-area 612 having the deformation characteristics leading to a deformation-induced color change represents the character "A".
  • these deformation-related color changes are reversible, so that some time after deformation, the sub-area 612 fades for a viewer is more recognizable, and thus again a state according to FIG. 6a is present.

Claims (14)

  1. Procédé de fabrication d'un élément de sécurité (100, 600), comprenant les étapes :
    - mise à disposition d'un matériau support (200, 300, 400, 500) ayant au moins une zone à revêtir (106, 202, 302, 402, 502, 606) ;
    - agencement d'une couche réfléchissante (204, 304, 410) dans la zone à revêtir ;
    - agencement d'une couche d'espacement structurée (206, 306, 412) à la couche réfléchissante, cependant que la couche d'espacement structurée est adaptée à protéger la couche réfléchissante contre un enlèvement ;
    - agencement d'une couche absorbante (212, 312, 416, 512) au moins à la couche d'espacement structurée ; et
    - enlèvement de la couche réfléchissante dans les zones dans lesquelles l'enlèvement de la couche réfléchissante n'est pas empêché par la protection de la couche d'espacement structurée.
  2. Procédé selon la revendication 1, cependant que l'étape de l'agencement d'une couche absorbante est effectuée avant l'étape de l'enlèvement de la couche réfléchissante.
  3. Procédé selon la revendication 1, cependant que l'étape de l'enlèvement de la couche réfléchissante est effectuée avant l'étape de l'agencement d'une couche absorbante, et que, de préférence, l'agencement de la couche absorbante est effectuée en utilisant un film débiteur.
  4. Procédé selon au moins une des revendications de 1 à 3, comprenant l'étape additionnelle :
    - agencement d'une structure en relief (404) ayant des zones surélevées et renfoncées (408; 406) dans la zone à revêtir du matériau support.
  5. Procédé selon la revendication 4, comprenant les étapes additionnelles :
    - aplanissement de la structure en relief (404) par agencement de la couche d'espacement structurée à la couche réfléchissante ; et
    - enlèvement de la couche réfléchissante dans les zones surélevées (408) de la structure en relief.
  6. Procédé selon une des revendications de 1 à 5, cependant que la couche d'espacement structurée et/ou la couche réfléchissante et/ou la couche absorbante est agencée par impression sous forme d'un motif, de préférence par flexographie, impression en creux, à jet d'encre, offset, sérigraphie ou impression 3D.
  7. Procédé selon une des revendications de 1 à 6, cependant que l'étape de l'enlèvement de la couche réfléchissante comprend un décapage et/ou un traitement laser (214, 314, 414).
  8. Procédé selon une des revendications de 1 à 7, comprenant l'étape additionnelle :
    - agencement d'une couche promotrice d'adhérence ; et/ou
    - application d'une couche de protection.
  9. Procédé selon une des revendications de 1 à 8, cependant que la couche d'espacement structurée présente au moins partiellement des propriétés de déformation qui entraînent (612) des changements de couleur de l'élément de sécurité dus à la déformation.
  10. Procédé selon une des revendications de 1 à 9, cependant que la couche d'espacement structurée présente des indices de réfraction dépendant de la direction et/ou des colorants et/ou des pigments.
  11. Procédé selon une des revendications de 1 à 10, cependant que la couche d'espacement structurée présente une épaisseur de ouche sèche comprise entre 30nm et 1100nm, de préférence entre 300nm et 600nm.
  12. Procédé selon une des revendications de 1 à 11, cependant que l'élément de sécurité comprend au moins une structure en relief telle qu'un hologramme, des yeux de mite, des microlentilles ou des micro-miroirs.
  13. Procédé selon une des revendications de 1 à 12, cependant que le matériau support comprend un film support, de préférence en polyéthylène téréphtalate (PET) ; et/ou
    la couche réfléchissante contient de l'aluminium ; et/ou
    la couche absorbante contient un matériau perméable à un agent décapant, de préférence du chrome ; et/ou
    la couche absorbante contient un matériau au moins semi-transparent au rayonnement laser ; et/ou
    la couche d'espacement structurée est un diélectrique et est de préférence à base de copolymères chlorure de vinyle avec groupes acides, nitrocellulose, acrylate(s), esters d'acide acrylique, époxides ou polyuréthanes; et/ou
    la couche d'espacement structurée comprend des cristaux liquides nématiques.
  14. Procédé de fabrication d'un document de valeur, en particulier un billet de banque, comportant un substrat pour document de valeur, comprenant les étapes d'une des revendications de 1 à 13 du procédé ; et l'étape consistant en ce que l'élément de sécurité est inséré dans ou appliqué sur le document de valeur.
EP15704459.5A 2014-02-07 2015-02-06 Fabrication d'un élément de sécurité présentant des propriétés de changement de couleur Active EP3102420B1 (fr)

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DE102014001688.9A DE102014001688A1 (de) 2014-02-07 2014-02-07 Herstellung eines Sicherheitselements mit Farbänderungseigenschaften
PCT/EP2015/000265 WO2015117765A1 (fr) 2014-02-07 2015-02-06 Fabrication d'un élément de sécurité présentant des propriétés de changement de couleur

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CA2935427A1 (fr) 2015-08-13
CN105916697B (zh) 2018-09-11
EP3102420A1 (fr) 2016-12-14
CN105916697A (zh) 2016-08-31

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