EP3075509A1 - Schneideanlage und verfahren für eine schneideanlage - Google Patents

Schneideanlage und verfahren für eine schneideanlage Download PDF

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Publication number
EP3075509A1
EP3075509A1 EP15161552.3A EP15161552A EP3075509A1 EP 3075509 A1 EP3075509 A1 EP 3075509A1 EP 15161552 A EP15161552 A EP 15161552A EP 3075509 A1 EP3075509 A1 EP 3075509A1
Authority
EP
European Patent Office
Prior art keywords
axis
blank
system axis
cutting
tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP15161552.3A
Other languages
German (de)
English (en)
French (fr)
Inventor
Johannes Schweigl
Hubert Schwabegger
Joachim Karger
Gerhard Lindenthaler
Andreas Mimm
Peter Schiffmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
D Swarovski KG
Original Assignee
D Swarovski KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by D Swarovski KG filed Critical D Swarovski KG
Priority to EP15161552.3A priority Critical patent/EP3075509A1/de
Priority to EP16714245.4A priority patent/EP3277471B1/de
Priority to RU2017133813A priority patent/RU2701757C2/ru
Priority to KR1020177029706A priority patent/KR20170136537A/ko
Priority to US15/561,308 priority patent/US10507593B2/en
Priority to CN201680018775.9A priority patent/CN107428030B/zh
Priority to PCT/EP2016/055386 priority patent/WO2016156019A1/de
Priority to JP2017550766A priority patent/JP6670848B2/ja
Priority to TW105108178A priority patent/TWI699266B/zh
Publication of EP3075509A1 publication Critical patent/EP3075509A1/de
Priority to IL254624A priority patent/IL254624B/en
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/024—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with the stock carried by a movable support for feeding stock into engagement with the cutting blade, e.g. stock carried by a pivoted arm or a carriage
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a plurality of cutting blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work

Definitions

  • the invention relates to a cutting system according to claim 1 and a method for a cutting system according to claim 10.
  • Cutting machines for producing geometric workpieces such as cubes, cuboids or prisms are known.
  • a plurality or a plurality of workpieces are produced from a blank.
  • the blank is usually cuboid-shaped or shapeless.
  • the blank is first dissected disc-shaped or cut. These discs are again broken down into bars or cut. Finally, the bars are cut into smaller element sections, i. the workpieces receive in this step their for further processing, eg. Polishing, corresponding length.
  • the production of the discs and rods is usually carried out by means of multi-blade saws, which have on their spindle shaft a plurality of saw blades.
  • the division of the individual bars is also done by means of the multi-blade saw.
  • these rods are usually applied individually on a holding device, which may also be designed as an adhesive tape, manually.
  • the rods are arranged perpendicular to a longitudinal direction of the holding device in its longitudinal extent.
  • the cutting system according to the invention which extends in the direction of a first plant axis extending horizontally along its width, a second plant axis extending vertically to the first plant axis and orthogonal along its depth has a third system axis extending extending to the first system axis and the second system axis, has a carrier.
  • On the support a tool is added the working direction takes place in the direction of the first system axis.
  • Another tool whose working direction also takes place in the direction of the first system axis, is also added to the carrier. Both tools are used to process a blank.
  • the tools are arranged serially in the direction of the first system axis.
  • the cutting device has a carrier element movably received on the carrier along the first system axis and the second system axis, wherein the carrier element is provided for holding the blank, and wherein the carrier element is rotatable or rotatable about the second system axis.
  • the basic processing steps for the production of the workpieces from the blank are divided into an introduction of a lattice-like incision in the blank and a cut transversely to the incision, a caps.
  • a lattice-like incision there is a plurality of rods, which, since the lattice-like incision does not completely penetrate the blank, are connected to one another via a core of the blank.
  • the caps sever the bars transversely to their direction of extent to bring the workpieces.
  • the cutting unit according to the invention has the advantage that the blank, which is positioned on the carrier element, can be transported from tool to tool with the aid of the movable carrier element.
  • the blank is fixed to the carrier element at the beginning of the processing process and is fed to the carrier for processing on the carrier element, possibly completely automated.
  • Supplying the blank or a semi-finished product to the tools is much easier to handle than supplying the tools to the blank or semi-finished product.
  • the carrier element is rotatable or rotatable about the second system axis, it is possible to bring about the lattice-like incision by turning the carrier element after a first incision with the same tool, which is usually designed as a multi-blade saw.
  • the support element can be rotated by any angle.
  • a further advantage is that the blank has an exact positioning relative to the working directions of the tools, since it is received on the carrier, which carries the tools, with the aid of the carrier element.
  • the positioning of the carrier element takes place along a first and second system axis fixed relative to the working directions.
  • mispositioning such as is excluded, for example, by manual removal and insertion of the blank after processing steps in the relevant for the next processing step tool.
  • a plurality of blanks can be arranged on the carrier element, whereby an efficient use of the tools can be brought about.
  • a first linear axis extending in the direction of the first system axis and the movement of the support element in the direction of the second axis system
  • a second linear axis extending in the direction of the second axis of the system formed on the support for movement of the support element in the direction of the first system axis.
  • an additional tool is added to the carrier.
  • a further processing step can be carried out with the aid of the additional tool.
  • this tool is designed, for example, in the form of a chop saw
  • first chop cuts are made with the additional tool designed as a chop saw and second chop cuts with the additional tool.
  • the blank having the bars is first arranged by means of the first linear axis for processing with the other tool accordingly. Thereafter, it is moved along the first linear axis for further processing with the additional tool on the carrier.
  • several cross cuts can be achieved in a line.
  • the additional tool has a working direction in the direction of the first system axis. If the additional tool is designed in the form of a multi-blade saw, the additional tool can be arranged directly upstream or downstream of the tool on the carrier.
  • the advantage is that the first incision or a first cut package is brought about by the tool and subsequently the support element with the blank containing the first cut package is rotated about the second abutment axis and positioned for machining on the additional tool.
  • a second cut or a second cut package which is transverse to the first cut package, brought about in the blank.
  • a significant advantage of the additional tool is the fact that a present between the individual saw blades of the multi-blade saw of the tool first distance deviates from a second distance between the saw blades of the Mehrblattsäge the additional tool and thus easily, without replacing the tool on the carrier , Dice deviating from a cube can be produced.
  • the support member is formed a support plate for fixed receiving the blank having.
  • a container is formed receiving the carrier plate, wherein downstream of the container a through-flow sieve is fixed to the carrier whose flow openings are smaller than produced from the blank workpieces.
  • an arrangement of a second container which is positioned in the outflow in series with the first container, as thus the cutting unit can be removed at a complete filling of the first container and the workpieces can fall into the second container.
  • the container can be coupled to the carrier. If, for example, the container is hung on the carrier, the workpieces accumulated in the container can be removed from the cutting system by simply removing the container.
  • the chop saw has at least two saw blades.
  • the inventive method has three processing steps, which lead to the production of a plurality of workpieces from a blank. Compared to a method of the prior art, the processing steps are reduced. Between The processing steps, which are characterized in that the tools work on the blank, are two positioning steps. Since the positioning takes place on the carrier along the first system axis and the second system axis due to the carrier element, an exact positioning with only two positioning steps relative to the tools is possible.
  • the first cut package and the second cut package are filled with a replacement material.
  • a replacement material By loading and thus filling the cutting packages with a substitute material, possibly occurring breakouts of the workpieces can be reduced during capping. Thus, a possible rejects can be prevented or reduced, whereby manufacturing costs can be kept low.
  • the first positioning step additionally comprises a movement of the support element along the first linear axis.
  • the blank is positioned for the second and / or third working step along the first linear axis.
  • the blank is preferably made of cubic zirconia.
  • the advantage of cubic zirconia is its diamond-like properties. In particular, due to its refractive index, it is preferably used for gemstones, which can be produced by the method quickly and in large numbers.
  • a cutting system 1 according to the invention is gem. Fig. 1 educated.
  • the cutting device 1 comprises a carrier 2 for receiving a tool 3, hereinafter referred to as the first tool 3, with a first spindle shaft 13, and an additional tool 4, hereinafter referred to as the second tool 4, with a second spindle shaft 14 and another tool 5, hereinafter referred to as the third tool 5, with a third spindle shaft 15.
  • the first tool 3 and the second tool 4 are formed in this embodiment in the form of a multi-bladed saw. In other words, pointing the first tool 3 and the second tool 4 a plurality of parallel, equal-sized saw blades 6, s.
  • the third tool 5 is designed in the form of a chop saw.
  • the tools 3, 4, 5 are driven by means of their spindle shafts 13, 14, 15.
  • the third spindle shaft 15 and the first spindle shaft 13 and the second spindle shaft 14 are arranged orthogonally, wherein the first spindle shaft 13 and the second spindle shaft 14 are arranged parallel to each other.
  • the cutting installation 1 has a first installation axis 7, in the direction of which the cutting installation 1 is designed to extend in its width B. Furthermore, the cutting unit 1 is designed to extend in the direction of a second system axis 8 and third system axis 9 in their height H or depth T.
  • the first system axis 7, the second system axis 8, and the third system axis 9 are positioned orthogonal to one another.
  • the system axes 7, 8, 9 are represented symbolically in the form of a Cartesian coordinate system symbol.
  • a support member 10 is formed, which is rotatable about a pivot axis which corresponds to the second system axis 8.
  • the support member 10 is configured in the form of a turntable and in the direction of the first arrow 12 about the pivot axis 11 can be rotated or pivoted.
  • the carrier element 10 is movable in the direction of the first system axis 7 and second system axis 8, for which purpose the carrier 10 has a first linear axis 16 and a second linear axis 17.
  • the feed movement takes place along the first system axis 7 in the direction of the second arrow 20.
  • the feed movement is exerted in the direction of the second arrow 20 and third arrow 21 along the first system axis 7 and second system axis 8.
  • the tools 3, 4, 5 could be movably received on the carrier 2. This would mean that, for example, the carrier element 10, although its pivotal movement is executed executable, however, the tools 3, 4, 5 in addition to their cutting and capping functions associated with the feed and feed movements.
  • the cutting unit 1 is designed so that rotational speeds of the tools 3, 4, 5 can be realized well above 15,000 rpm.
  • the method according to the invention is characterized in that, in a first method step, a blank is fixed immovably on a carrier plate 18.
  • the support plate 18 is fastened to the carrier element 10, so that a relative movement is possible between the carrier plate 18 and the carrier element 10.
  • the carrier element 10 is positioned relative to the first tool 3 in a first positioning step by means of the first linear axis 16 and the second linear axis 17 designed to bring about the positioning or advancing movement, until a penetration depth to be achieved by the saw blades 6 is achieved in the blank. This penetration depth corresponds to a required depth of cut.
  • the first tool 3 is activated, whereby the saw blades 6 are brought into operation.
  • the carrier element 10 with the blank is formed along the first linear axis 16, which is designed for advancing movement, in the first processing step moved in and through the first tool 3. At the end of the first processing step, the blank has a first cut package in the form of several parallel incisions.
  • the cuts or incisions are not formed completely penetrating the blank.
  • the blank by means of the cuts or cuts on discs, which are interconnected via a core of the blank.
  • a core is formed which has the discs.
  • the discs formed on the core of the blank are also immovably fixed to the support plate 18. Further fixation for the next processing step is therefore not necessary.
  • the support plate 18 is rotated about the pivot axis 11 over a certain angle a, which is necessary for the further cut. If, for example, the finished workpiece is to be rectangular or cuboid, then the support plate 18 is to be rotated by the angle a at a value of 90 ° about the pivot axis 11.
  • the carrier element 10 is moved with the blank having a first cut package along the first linear axis 16 and the second linear axis 17 relative to the first tool 3 until a penetration depth to be achieved by the saw blades 6 is achieved in the blank.
  • the second tool 4 is activated, whereby the saw blades 6 are brought into operation.
  • the carrier element 10 with the blank is moved along the first linear axis 16, which is designed for advancing movement, in the second processing step into and through the second tool 4.
  • the blank has a second cut package.
  • the first cut package and the second cut package together represent a cross-hatch.
  • the blank is now cut lattice-like or has lattice-like incisions. Since the second cut package along the same axial direction is formed in the blank as the first cut package, rod-shaped workpiece elements are present, which are interconnected via the blank core.
  • the carrier element 10 is positioned in a next method step, the third positioning step, with the blank now having a rod package over the first linear axis 16 and second linear axis 17 for machining with the third tool 5, the chop saw , It is adjusted by means of the first linear axis 16, a corresponding feed and cut the bars in the third processing step to a certain length or cut.
  • the workpieces are in a trough-like container 19, which has a screen for discharging the coolant, collected and are taken with this the cutting unit 1.
  • the blank is filled prior to capping with a replacement material. That is, the lattice-like cuts are filled with a replacement material. This can prevent breakouts when caps
  • the blank can also be filled before the introduction of the second cutting package with the replacement material.
  • the third tool 5 is in the form of a two-bladed chop saw.
  • two cut or cap levels can be achieved. This shortens the duration of the production of the workpieces.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Sawing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
EP15161552.3A 2015-03-28 2015-03-28 Schneideanlage und verfahren für eine schneideanlage Withdrawn EP3075509A1 (de)

Priority Applications (10)

Application Number Priority Date Filing Date Title
EP15161552.3A EP3075509A1 (de) 2015-03-28 2015-03-28 Schneideanlage und verfahren für eine schneideanlage
CN201680018775.9A CN107428030B (zh) 2015-03-28 2016-03-13 切割装置以及用于切割装置的方法
RU2017133813A RU2701757C2 (ru) 2015-03-28 2016-03-13 Резальное устройство и способ его эксплуатации
KR1020177029706A KR20170136537A (ko) 2015-03-28 2016-03-13 절단 시스템 및 절단 시스템을 위한 방법
US15/561,308 US10507593B2 (en) 2015-03-28 2016-03-13 Cutting system and method for a cutting system
EP16714245.4A EP3277471B1 (de) 2015-03-28 2016-03-13 Schneidanlage und verfahren zur deren verwendung
PCT/EP2016/055386 WO2016156019A1 (de) 2015-03-28 2016-03-13 Schneidanlage und verfahren für eine schneidanlage
JP2017550766A JP6670848B2 (ja) 2015-03-28 2016-03-13 切断システムおよび切断システムのための方法
TW105108178A TWI699266B (zh) 2015-03-28 2016-03-16 切割設備和用於切割設備之方法
IL254624A IL254624B (en) 2015-03-28 2017-09-24 Cutting system and method for cutting system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP15161552.3A EP3075509A1 (de) 2015-03-28 2015-03-28 Schneideanlage und verfahren für eine schneideanlage

Publications (1)

Publication Number Publication Date
EP3075509A1 true EP3075509A1 (de) 2016-10-05

Family

ID=52813938

Family Applications (2)

Application Number Title Priority Date Filing Date
EP15161552.3A Withdrawn EP3075509A1 (de) 2015-03-28 2015-03-28 Schneideanlage und verfahren für eine schneideanlage
EP16714245.4A Active EP3277471B1 (de) 2015-03-28 2016-03-13 Schneidanlage und verfahren zur deren verwendung

Family Applications After (1)

Application Number Title Priority Date Filing Date
EP16714245.4A Active EP3277471B1 (de) 2015-03-28 2016-03-13 Schneidanlage und verfahren zur deren verwendung

Country Status (9)

Country Link
US (1) US10507593B2 (ko)
EP (2) EP3075509A1 (ko)
JP (1) JP6670848B2 (ko)
KR (1) KR20170136537A (ko)
CN (1) CN107428030B (ko)
IL (1) IL254624B (ko)
RU (1) RU2701757C2 (ko)
TW (1) TWI699266B (ko)
WO (1) WO2016156019A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111761133A (zh) * 2020-05-22 2020-10-13 贵州海澄科技有限公司 一种管道切割装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09207124A (ja) * 1996-01-31 1997-08-12 Deisuko Eng Service:Kk デュアルマルチブレードカッティングソー
JPH11198131A (ja) * 1998-01-09 1999-07-27 Meidensha Corp 水晶の切断装置
US20020184982A1 (en) * 2001-05-05 2002-12-12 Smith David Walter Bidrectional singulation saw and mehtod
CN1727166A (zh) * 2005-07-24 2006-02-01 翦凝刚 用小圆锯片切割大规格超薄石材的方法及专用水平切割机
KR101395303B1 (ko) * 2013-12-27 2014-05-16 황의안 볼륨석 제조장치 및 이를 이용하는 볼륨석 제조방법과 그 제조방법에 의해 제조되는 볼륨석

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU814770A1 (ru) * 1978-03-14 1981-03-23 Научно-Исследовательский Институткамня И Силикатов Минпромстрой Материаловармянской Ccp Многодисковый распиловочный станокдл ОбРАбОТКи КАМН
JP2002237472A (ja) * 2001-02-07 2002-08-23 Disco Abrasive Syst Ltd 被加工物の切削方法
JP4532895B2 (ja) * 2003-12-18 2010-08-25 株式会社ディスコ 板状物の切削装置
RU2310559C1 (ru) * 2006-02-26 2007-11-20 Геннадий Кузьмич Микрюков Камнеобрабатывающий станок
RU2348522C1 (ru) * 2007-06-04 2009-03-10 Геннадий Кузьмич Микрюков Камнеобрабатывающий многодисковый станок с двойным модулем вращения и рабочей подачи заготовок
KR20120090437A (ko) * 2011-02-08 2012-08-17 이대원 프레임 절단기

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09207124A (ja) * 1996-01-31 1997-08-12 Deisuko Eng Service:Kk デュアルマルチブレードカッティングソー
JPH11198131A (ja) * 1998-01-09 1999-07-27 Meidensha Corp 水晶の切断装置
US20020184982A1 (en) * 2001-05-05 2002-12-12 Smith David Walter Bidrectional singulation saw and mehtod
CN1727166A (zh) * 2005-07-24 2006-02-01 翦凝刚 用小圆锯片切割大规格超薄石材的方法及专用水平切割机
KR101395303B1 (ko) * 2013-12-27 2014-05-16 황의안 볼륨석 제조장치 및 이를 이용하는 볼륨석 제조방법과 그 제조방법에 의해 제조되는 볼륨석

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111761133A (zh) * 2020-05-22 2020-10-13 贵州海澄科技有限公司 一种管道切割装置

Also Published As

Publication number Publication date
CN107428030B (zh) 2020-09-15
EP3277471A1 (de) 2018-02-07
WO2016156019A1 (de) 2016-10-06
JP2018510082A (ja) 2018-04-12
US10507593B2 (en) 2019-12-17
TWI699266B (zh) 2020-07-21
TW201641243A (zh) 2016-12-01
EP3277471B1 (de) 2023-02-08
US20180104852A1 (en) 2018-04-19
IL254624B (en) 2021-02-28
KR20170136537A (ko) 2017-12-11
IL254624A0 (en) 2017-11-30
RU2701757C2 (ru) 2019-10-01
RU2017133813A3 (ko) 2019-07-25
JP6670848B2 (ja) 2020-03-25
RU2017133813A (ru) 2019-05-06
CN107428030A (zh) 2017-12-01

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