EP3036760A4 - Ultra high void volume polishing pad with closed pore structure - Google Patents

Ultra high void volume polishing pad with closed pore structure Download PDF

Info

Publication number
EP3036760A4
EP3036760A4 EP14837394.7A EP14837394A EP3036760A4 EP 3036760 A4 EP3036760 A4 EP 3036760A4 EP 14837394 A EP14837394 A EP 14837394A EP 3036760 A4 EP3036760 A4 EP 3036760A4
Authority
EP
European Patent Office
Prior art keywords
polishing pad
ultra high
pore structure
void volume
closed pore
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP14837394.7A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP3036760A1 (en
Inventor
George Fotou
Achla Khanna
Robert Vacassy
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CMC Materials Inc
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Publication of EP3036760A1 publication Critical patent/EP3036760A1/en
Publication of EP3036760A4 publication Critical patent/EP3036760A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
EP14837394.7A 2013-08-22 2014-08-21 Ultra high void volume polishing pad with closed pore structure Withdrawn EP3036760A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/973,639 US20150056895A1 (en) 2013-08-22 2013-08-22 Ultra high void volume polishing pad with closed pore structure
PCT/US2014/052021 WO2015027026A1 (en) 2013-08-22 2014-08-21 Ultra high void volume polishing pad with closed pore structure

Publications (2)

Publication Number Publication Date
EP3036760A1 EP3036760A1 (en) 2016-06-29
EP3036760A4 true EP3036760A4 (en) 2017-05-03

Family

ID=52480787

Family Applications (1)

Application Number Title Priority Date Filing Date
EP14837394.7A Withdrawn EP3036760A4 (en) 2013-08-22 2014-08-21 Ultra high void volume polishing pad with closed pore structure

Country Status (8)

Country Link
US (1) US20150056895A1 (ja)
EP (1) EP3036760A4 (ja)
JP (2) JP6693875B2 (ja)
KR (1) KR20160045092A (ja)
CN (2) CN107520743A (ja)
SG (2) SG11201601177SA (ja)
TW (1) TWI600501B (ja)
WO (1) WO2015027026A1 (ja)

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GB201409248D0 (en) * 2014-05-23 2014-07-09 Zotefoams Plc Method for producing three dimensional foam articles
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
CN107078048B (zh) 2014-10-17 2021-08-13 应用材料公司 使用加成制造工艺的具复合材料特性的cmp衬垫建构
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
TWI769988B (zh) * 2015-10-07 2022-07-11 美商3M新設資產公司 拋光墊與系統及其製造與使用方法
TWI690388B (zh) * 2015-10-30 2020-04-11 日商古河電氣工業股份有限公司 硏磨墊、使用硏磨墊的硏磨方法及該硏磨墊的使用方法
WO2017074773A1 (en) 2015-10-30 2017-05-04 Applied Materials, Inc. An apparatus and method of forming a polishing article that has a desired zeta potential
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
CN117283450A (zh) 2016-01-19 2023-12-26 应用材料公司 多孔化学机械抛光垫
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
JP2019160996A (ja) * 2018-03-13 2019-09-19 東芝メモリ株式会社 研磨パッド、半導体製造装置、および半導体装置の製造方法
SG11202010448TA (en) 2018-05-07 2020-11-27 Applied Materials Inc Hydrophilic and zeta potential tunable chemical mechanical polishing pads
JP7299970B2 (ja) 2018-09-04 2023-06-28 アプライド マテリアルズ インコーポレイテッド 改良型研磨パッドのための配合物
US11851570B2 (en) 2019-04-12 2023-12-26 Applied Materials, Inc. Anionic polishing pads formed by printing processes
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
US20210323116A1 (en) * 2020-04-18 2021-10-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Offset pore poromeric polishing pad
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ

Citations (1)

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Publication number Priority date Publication date Assignee Title
US20050277371A1 (en) * 2002-10-28 2005-12-15 Cabot Microelectronics Corporation Transparent microporous materials for CMP

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US5564965A (en) * 1993-12-14 1996-10-15 Shin-Etsu Handotai Co., Ltd. Polishing member and wafer polishing apparatus
US6126532A (en) * 1997-04-18 2000-10-03 Cabot Corporation Polishing pads for a semiconductor substrate
JP3956364B2 (ja) * 2001-04-09 2007-08-08 東洋ゴム工業株式会社 ポリウレタン組成物および研磨パッド
US20050276967A1 (en) * 2002-05-23 2005-12-15 Cabot Microelectronics Corporation Surface textured microporous polishing pads
US6913517B2 (en) * 2002-05-23 2005-07-05 Cabot Microelectronics Corporation Microporous polishing pads
US7311862B2 (en) * 2002-10-28 2007-12-25 Cabot Microelectronics Corporation Method for manufacturing microporous CMP materials having controlled pore size
US7066801B2 (en) * 2003-02-21 2006-06-27 Dow Global Technologies, Inc. Method of manufacturing a fixed abrasive material
US6998166B2 (en) * 2003-06-17 2006-02-14 Cabot Microelectronics Corporation Polishing pad with oriented pore structure
US20040259479A1 (en) * 2003-06-23 2004-12-23 Cabot Microelectronics Corporation Polishing pad for electrochemical-mechanical polishing
US8075372B2 (en) * 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
US7220167B2 (en) * 2005-01-11 2007-05-22 Hitachi Global Storage Technologies Netherlands B.V. Gentle chemical mechanical polishing (CMP) liftoff process
US20060277371A1 (en) * 2005-06-01 2006-12-07 Intel Corporation System and method to instrument references to shared memory
KR101276962B1 (ko) * 2006-07-28 2013-06-19 도레이 카부시키가이샤 상호 침입 고분자 그물형 구조체의 제조 방법 및 이를 이용한 연마 패드의 제조 방법
SG177963A1 (en) * 2007-01-15 2012-02-28 Toyo Tire & Rubber Co Polishing pad and method for producing the same
JP5078527B2 (ja) * 2007-09-28 2012-11-21 富士紡ホールディングス株式会社 研磨布
CN102046699B (zh) * 2008-05-26 2012-09-05 巴斯夫欧洲公司 制备多孔材料的方法和通过该方法制备的多孔材料
US8383003B2 (en) * 2008-06-20 2013-02-26 Nexplanar Corporation Polishing systems
US20100015895A1 (en) * 2008-07-15 2010-01-21 Hendron Jeffrey J Chemical mechanical polishing pad having electrospun polishing layer
WO2010009420A1 (en) * 2008-07-18 2010-01-21 3M Innovative Properties Company Polishing pad with floating elements and method of making and using the same
US8303375B2 (en) * 2009-01-12 2012-11-06 Novaplanar Technology, Inc. Polishing pads for chemical mechanical planarization and/or other polishing methods
JP5184448B2 (ja) * 2009-06-23 2013-04-17 富士紡ホールディングス株式会社 研磨パッド、その製造方法および研磨加工方法
US8162728B2 (en) * 2009-09-28 2012-04-24 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Dual-pore structure polishing pad
WO2012077592A1 (ja) * 2010-12-07 2012-06-14 Jsr株式会社 化学機械研磨パッドおよびそれを用いた化学機械研磨方法
US9211628B2 (en) * 2011-01-26 2015-12-15 Nexplanar Corporation Polishing pad with concentric or approximately concentric polygon groove pattern
JP5687118B2 (ja) * 2011-04-15 2015-03-18 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
CA2867350C (en) * 2012-03-16 2017-05-23 Saint-Gobain Abrasives, Inc. Abrasive products and methods for finishing surfaces

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050277371A1 (en) * 2002-10-28 2005-12-15 Cabot Microelectronics Corporation Transparent microporous materials for CMP

Also Published As

Publication number Publication date
SG11201601177SA (en) 2016-03-30
EP3036760A1 (en) 2016-06-29
KR20160045092A (ko) 2016-04-26
CN105474366A (zh) 2016-04-06
TW201519999A (zh) 2015-06-01
CN107520743A (zh) 2017-12-29
TWI600501B (zh) 2017-10-01
US20150056895A1 (en) 2015-02-26
JP6693875B2 (ja) 2020-05-13
SG10201801419XA (en) 2018-03-28
JP2019171567A (ja) 2019-10-10
JP2016528054A (ja) 2016-09-15
WO2015027026A1 (en) 2015-02-26

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