SG10201801419XA - Ultra high void volume polishing pad with closed pore structure - Google Patents

Ultra high void volume polishing pad with closed pore structure

Info

Publication number
SG10201801419XA
SG10201801419XA SG10201801419XA SG10201801419XA SG10201801419XA SG 10201801419X A SG10201801419X A SG 10201801419XA SG 10201801419X A SG10201801419X A SG 10201801419XA SG 10201801419X A SG10201801419X A SG 10201801419XA SG 10201801419X A SG10201801419X A SG 10201801419XA
Authority
SG
Singapore
Prior art keywords
polishing pad
ultra high
pore structure
void volume
closed pore
Prior art date
Application number
SG10201801419XA
Inventor
George Fotou
Achla Khanna
Robert Vacassy
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Publication of SG10201801419XA publication Critical patent/SG10201801419XA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
SG10201801419XA 2013-08-22 2014-08-21 Ultra high void volume polishing pad with closed pore structure SG10201801419XA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/973,639 US20150056895A1 (en) 2013-08-22 2013-08-22 Ultra high void volume polishing pad with closed pore structure

Publications (1)

Publication Number Publication Date
SG10201801419XA true SG10201801419XA (en) 2018-03-28

Family

ID=52480787

Family Applications (2)

Application Number Title Priority Date Filing Date
SG11201601177SA SG11201601177SA (en) 2013-08-22 2014-08-21 Ultra high void volume polishing pad with closed pore structure
SG10201801419XA SG10201801419XA (en) 2013-08-22 2014-08-21 Ultra high void volume polishing pad with closed pore structure

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG11201601177SA SG11201601177SA (en) 2013-08-22 2014-08-21 Ultra high void volume polishing pad with closed pore structure

Country Status (8)

Country Link
US (1) US20150056895A1 (en)
EP (1) EP3036760A4 (en)
JP (2) JP6693875B2 (en)
KR (1) KR20160045092A (en)
CN (2) CN107520743A (en)
SG (2) SG11201601177SA (en)
TW (1) TWI600501B (en)
WO (1) WO2015027026A1 (en)

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US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
KR102436416B1 (en) 2014-10-17 2022-08-26 어플라이드 머티어리얼스, 인코포레이티드 Cmp pad construction with composite material properties using additive manufacturing processes
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
TWI769988B (en) * 2015-10-07 2022-07-11 美商3M新設資產公司 Polishing pads and systems and methods of making and using the same
TWI690388B (en) * 2015-10-30 2020-04-11 日商古河電氣工業股份有限公司 Grinding pad, grinding method using the grinding pad, and method of using the grinding pad
CN113103145B (en) 2015-10-30 2023-04-11 应用材料公司 Apparatus and method for forming polishing article having desired zeta potential
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
KR102629800B1 (en) 2016-01-19 2024-01-29 어플라이드 머티어리얼스, 인코포레이티드 Porous Chemical Mechanical Polishing Pads
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. Abrasive delivery polishing pads and manufacturing methods thereof
JP2019160996A (en) 2018-03-13 2019-09-19 東芝メモリ株式会社 Polishing pad, semiconductor manufacturing device, and method for manufacturing semiconductor device
US11826876B2 (en) 2018-05-07 2023-11-28 Applied Materials, Inc. Hydrophilic and zeta potential tunable chemical mechanical polishing pads
KR20210042171A (en) 2018-09-04 2021-04-16 어플라이드 머티어리얼스, 인코포레이티드 Formulations for advanced polishing pads
US11851570B2 (en) 2019-04-12 2023-12-26 Applied Materials, Inc. Anionic polishing pads formed by printing processes
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
JP2021112808A (en) * 2020-01-21 2021-08-05 ニッタ・デュポン株式会社 Polishing pad
US20210323116A1 (en) * 2020-04-18 2021-10-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Offset pore poromeric polishing pad
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ

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US6126532A (en) * 1997-04-18 2000-10-03 Cabot Corporation Polishing pads for a semiconductor substrate
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US20050276967A1 (en) * 2002-05-23 2005-12-15 Cabot Microelectronics Corporation Surface textured microporous polishing pads
US6913517B2 (en) * 2002-05-23 2005-07-05 Cabot Microelectronics Corporation Microporous polishing pads
US7267607B2 (en) * 2002-10-28 2007-09-11 Cabot Microelectronics Corporation Transparent microporous materials for CMP
US7311862B2 (en) * 2002-10-28 2007-12-25 Cabot Microelectronics Corporation Method for manufacturing microporous CMP materials having controlled pore size
US7066801B2 (en) * 2003-02-21 2006-06-27 Dow Global Technologies, Inc. Method of manufacturing a fixed abrasive material
US6998166B2 (en) * 2003-06-17 2006-02-14 Cabot Microelectronics Corporation Polishing pad with oriented pore structure
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JP5184448B2 (en) * 2009-06-23 2013-04-17 富士紡ホールディングス株式会社 Polishing pad, method for producing the same, and polishing method
US8162728B2 (en) * 2009-09-28 2012-04-24 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Dual-pore structure polishing pad
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US9211628B2 (en) * 2011-01-26 2015-12-15 Nexplanar Corporation Polishing pad with concentric or approximately concentric polygon groove pattern
JP5687118B2 (en) * 2011-04-15 2015-03-18 富士紡ホールディングス株式会社 Polishing pad and manufacturing method thereof
RU2595788C2 (en) * 2012-03-16 2016-08-27 Сэнт-Гобэн Эбрейзивс, Инк. Abrasive products and methods of finishing surfaces

Also Published As

Publication number Publication date
US20150056895A1 (en) 2015-02-26
EP3036760A1 (en) 2016-06-29
TW201519999A (en) 2015-06-01
SG11201601177SA (en) 2016-03-30
EP3036760A4 (en) 2017-05-03
CN105474366A (en) 2016-04-06
JP2019171567A (en) 2019-10-10
TWI600501B (en) 2017-10-01
JP6693875B2 (en) 2020-05-13
JP2016528054A (en) 2016-09-15
KR20160045092A (en) 2016-04-26
WO2015027026A1 (en) 2015-02-26
CN107520743A (en) 2017-12-29

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