EP3030494A1 - Procédé de fabrication d'un revêtement anti-adhésif par dépôt de plasma - Google Patents

Procédé de fabrication d'un revêtement anti-adhésif par dépôt de plasma

Info

Publication number
EP3030494A1
EP3030494A1 EP14749982.6A EP14749982A EP3030494A1 EP 3030494 A1 EP3030494 A1 EP 3030494A1 EP 14749982 A EP14749982 A EP 14749982A EP 3030494 A1 EP3030494 A1 EP 3030494A1
Authority
EP
European Patent Office
Prior art keywords
ppm
process according
release
release compound
precursor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP14749982.6A
Other languages
German (de)
English (en)
Inventor
Simon Read
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Innovia Films Ltd
Original Assignee
Innovia Films Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Innovia Films Ltd filed Critical Innovia Films Ltd
Publication of EP3030494A1 publication Critical patent/EP3030494A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/62—Plasma-deposition of organic layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/14—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by electrical means
    • B05D3/141—Plasma treatment
    • B05D3/142—Pretreatment
    • B05D3/144—Pretreatment of polymeric substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/08—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an anti-friction or anti-adhesive surface
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/201—Adhesives in the form of films or foils characterised by their carriers characterised by the release coating composition on the carrier layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C09J7/401—Adhesives in the form of films or foils characterised by release liners characterised by the release coating composition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
    • B05D1/265—Extrusion coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2518/00—Other type of polymers
    • B05D2518/10—Silicon-containing polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2518/00—Other type of polymers
    • B05D2518/10—Silicon-containing polymers
    • B05D2518/12—Ceramic precursors (polysiloxanes, polysilazanes)
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/04—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
    • B05D3/0486—Operating the coating or treatment in a controlled atmosphere
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/10—Presence of homo or copolymers of propene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/16—Presence of ethen-propene or ethene-propene-diene copolymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00—Presence of polysiloxane
    • C09J2483/005—Presence of polysiloxane in the release coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P20/00—Technologies relating to chemical industry
    • Y02P20/50—Improvements relating to the production of bulk chemicals
    • Y02P20/582—Recycling of unreacted starting or intermediate materials

Definitions

  • the present invention relates to a process for manufacturing a release liner. More specifically, it relates to a process for manufacturing a release liner using plasma discharge treatment.
  • Release liners are used in a variety of applications.
  • release liners are used with adhesive labels, for example pressure sensitive adhesive labels, and with packaging films.
  • Release liners are generally made up of a substrate and a release coating. Typical release coatings are formed from waxes, silicones or fluoropolymers. The release coating aids the removal of the release liner from the adhesive surface to which it is attached.
  • release liners by applying a release coating to a substrate using wet-chemical coating processes, for example solvent-based wet- chemical coating or aqueous-based wet-chemical coating.
  • solvent-based wet-chemical coating involves the use of volatile organic compounds which are expensive and harmful to the environment.
  • release liners have been manufactured using plasma discharge treatment to deposit a release coating onto a substrate. This avoids the use of harmful volatile organic compounds and can be run as a continuous process.
  • Plasma discharge treatment tends to be carried out in the presence of an inert gas, for example a noble gas such as argon, or nitrogen.
  • EP 1 978 067 describes a release liner for use in a pressure-sensitive adhesive sheet comprising a release layer on a substrate, wherein the release liner is obtainable by a process comprising the steps of: providing a substrate; producing an atmospheric pressure plasma discharge in the presence of a gas; exposing the substrate to said atmospheric pressure plasma discharge; introducing a liquid aerosol comprising a precursor into said atmospheric pressure plasma discharge, thereby forming a release layer on the substrate; and curing the release layer on the substrate.
  • EP 1 816 231 describes a process for producing a fluorocarbon film chemically bonded to a substrate surface, comprising (a) applying a plasma to a substrate surface in a continuous or pulse manner to form active points on the substrate surface; and (b) applying plasma to the substrate surface in a continuous or pulse manner in the presence of a gas of a fluorocompound represented by the formula CxFy and/or CxFyOz under such a condition that active species impinge on the substrate surface at a relatively lower collision energy than in (a).
  • US 2008/0063811 describes a method of adjusting a surface characteristic of a substrate comprising: providing a substrate; and performing an atmosphere pressure plasma process on the surface of the substrate to form a film layer on the surface of the substrate, so as to adjust the surface energy of the substrate, wherein a process gas of the atmosphere pressure plasma process comprises a surface modifying precursor, a carrier gas and a plasma ignition gas, wherein the surface modifying
  • 2 precursor is selected from fluorosilane, potysiloxane and a combination thereof, and the ratio of fluorosilane to polysiloxane is between 0 and 1.
  • the release coating tends to be weakly bonded to the substrate.
  • the release coating includes low molecular weight species which migrate to the opposite surface of the substrate. This is particularly problematic when the release liner is wound into a roll since it can result in the contamination of the material attached to the release liner, for example a label facestock film, which may cause printing issues. Additionally, the release liner will tend to have a release force which is insufficient for most high speed applications.
  • a process for manufacturing a release liner comprising the steps of:
  • a 'Release liner is a well-known term of art in the pressure sensitive adhesive label industry.
  • a 'release liner * typically comprises a substrate and a coating of a release compound which provides a release effect against an adhesive surface to which it is attached, thus aiding the removal of the release liner from the adhesive surface.
  • the inventors of the present invention have surprisingly found that the process of the present invention results in the coating of release compound being more strongly bonded to the surface of the film web.
  • the first plasma treatment functionalises the surface of the film web to provide reactive functional groups thereon. These functional groups then covalently bond to the release compound and/or precursor thereof during the second plasma discharge treatment.
  • producing a release liner in which the coating of release compound is strongly bonded to the surface of the film web.
  • Step b. and step c. may be carried out within the same reactor.
  • step b. and step c. may be carried out in different reactors.
  • the first and second plasma discharge treatments may be atmospheric pressure plasma discharge treatments.
  • the atmospheric pressure plasma discharge treatment is a dielectric barrier discharge (DBD) treatment.
  • DBD dielectric barrier discharge
  • the first and second plasma discharge treatments may be carried out in the presence of an inert carrier gas, for example a noble gas such as argon, and/or nitrogen.
  • the gas in step b. may comprise at least one functional agent
  • the functional agent is selected from ammonia, 1 ,2-butadiene, 1 ,3-butadiene, 1 ,3- hexafluorobutadiene, 1-butene, 1-butyne, 2,2-dimethylpropane, c/s-2-butene, trans- 2-butene, acetylene, nitrous oxide, dimethylamine, ethylamine, methyl vinyl ether, methylamine, trimethylamine, carbon dioxide, carbon monoxide and hydrogen.
  • the functional agent may be present in an amount of from about 10 ppm to about 20000 ppm. Preferably, the functional agent is present in an amount of from about 200 ppm to about 5000 ppm.
  • the functional agent effectively functionallses the first surface of the film web to provide thereon functional groups which are capable of actively binding to a release compound and/or precursor thereof.
  • the functional groups may include ketones, aldehydes, glyoxyls, amides, amines, hydroxides, nitrides and/or vinyls.
  • the gas in step b. may comprise at least one oxidising agent such as oxygen, ozone, carbon dioxide, carbon monoxide, nitric and nitrous oxides or sulphur oxide, dioxide or trioxide.
  • the oxidising agent may be present in an amount of from about 10 ppm to about 20000 ppm. Preferably, the oxidising agent is present in an amount of from about 200 ppm to about 5000 ppm.
  • the gas in step b. may comprise at least one cross-linker, for example, an unsaturated hydrocarbon such as ethylene or propylene. This is particularly advantageous when the release compound comprises an organosilicone since the cross-linker stabilises the organosilicone release compound.
  • the cross-linker may be present in an amount of from about 10 ppm to about 1000 ppm. Preferably, the cross-linker is present in an amount of from about 50 ppm to 200 ppm.
  • step c a coating of a release compound is deposited onto the functionalised first surface of the film web by contacting a vapour comprising the release compound and/or a precursor thereof with the functionalised first surface during a second plasma discharge treatment.
  • the release compound precursor may comprise an organosilicone.
  • the organosilicone may comprise at least one of a silane, a silanol, a silicide and a siloxane.
  • the release compound precursor comprises hexamethyl disiloxane (HMDSO), tetramethyl disiloxane (T DSO) and/or 3-glycldyloxyethyl trimethoxysilane.
  • the release compound itself may comprise a polymer resulting from polymerisation of the release compound precursor.
  • the release compound may comprise poly(dimethyl siloxane), poly(dimethyl dichloro silane), poly(dh inyl silane), poly(diphenyl siloxane), poly(phenylmethyl siloxane), 1 ,3-tetraphenyl 1 ,3-dimethyl disiloxane, and/or 1,3-diphenyl 1 ,2-tetramethyl disiloxane.
  • the release compound comprises poly(dimethyl siloxane).
  • the release compound and/or the precursor thereof is substantially or entirely non-fluorinated.
  • the release compound and/or precursor thereof comprises a fluorinated component
  • this is present in the vapour in a low quantity, for example less than about 10000 ppm, less than about 5000 ppm, less than about 1000 ppm, less than about 100 ppm, less than about 50 ppm or less than about 10 ppm.
  • the inventors of the present invention have surprisingly found that it is beneficial to reduce or eliminate the amount of fluorinated components in the vapour, since fluorinated components tend to have poor release properties.
  • the release compound and/or the precursor thereof may be present in the vapour in an amount of from about 10 ppm to about 20000 ppm.
  • the release compound and/or the precursor thereof may be present in the vapour in an amount of from about 10 ppm, about 50 ppm, about 100 ppm, about 200 ppm, about 300 ppm, about 400 ppm, about 500 ppm, about 600 ppm, about 700 ppm, about 800 ppm, about 900 ppm or about 1000 ppm; to about 2000 ppm, about 3000 ppm, about 4000 ppm, about 5000 ppm, about 6000 ppm, about 7000 ppm, about 8000 ppm, about 9000 ppm, about 10000 ppm, about 15000 ppm or about 20000 ppm.
  • the release compound is present in the vapour in an amount of from about 200 ppm to about 5000 ppm.
  • the inventors of the present invention have found that it may be advantageous to use a vapour comprising the release compound and/or the precursor thereof in an amount of from about 10 ppm to about 20000 ppm, since in doing so, a nano-coating of the release compound may be deposited on the first surface of the film web. More specifically, it has been found that it may be possible to deposit a nano-coating of release compound with a thickness that is much less than that formed using prior art techniques, for example using a liquid aerosol.
  • the coating of release compound may be a nano-coating.
  • the term 'nano-coating' may mean a coating with a thickness up to about 100nm, for example up to about 75nm, about 50nm or about 25nm, or with a thickness of from about 1nm to about 100nm, for example from about 1nm to about 75nm, from about 1nm to about 50nm or from about 1nm to about 25nm.
  • the nano-coating may have a thickness of from about 1nm to about 20 nm, from about 1 nm to about 15 nm, from about 1 nm to about 10 nm, or from about 1 nm to about 5 nm.
  • the film web may be formed by any process known in the art, including, but not limited to, cast sheet, cast film, or blown film.
  • the film web may comprise a substrate layer.
  • the substrate layer may comprise a polyolefin, for example polyethylene, polypropylene, polybutylene, mixtures, blends or copolymers thereof; a polyester, for example polyethylene terephthalate; a polyamide, for example nylon; a polyurethane; a polyvinyl halkJe, for example polyvinyl chloride; an acetate and/or a biopolymer, for example cellulose and/or its derivatives, polylactic acid or potyhydroxyalkanoate.
  • a polyolefin for example polyethylene, polypropylene, polybutylene, mixtures, blends or copolymers thereof
  • a polyester for example polyethylene terephthalate
  • a polyamide for example nylon
  • a polyurethane for example polyvinyl halkJe
  • a biopolymer for example cellulose and/or its derivatives, polylactic acid or potyhydroxyalkanoate.
  • the substrate layer comprises polypropylene, for example biaxially oriented polypropylene (BOPP).
  • BOPP biaxially oriented polypropylene
  • the BOPP may be prepared as a balanced film using substantially equal machine direction and transverse direction stretch ratios, or can be unbalanced, where the film is significantly more orientated in one direction (MD or TD).
  • Sequential stretching can be used, in which heated rollers effect stretching of the film in the machine direction and a stenter oven is thereafter used to effect stretching in the transverse direction.
  • simultaneous stretching for example, using the so-called bubble process, or simultaneous draw stenter stretching may be used.
  • the substrate layer may have a modulus in the range of from about 0.1 GPa to about 10 GPa. More specifically, the substrate layer may have a modulus in the range of from about 0.5 GPa to about 5 GPa. Even more specifically, the substrate layer may have a modulus in the range of from about 1 GPa to about 3 GPa.
  • Modulus is defined as the ratio of tensile stress to tensile strain as measured using a Tensometer. Young's modulus (E) describes tensile elasticity, or the tendency of an object to deform along an axis when opposing forces are applied along that axis. It is often referred to simply as elastic modulus.
  • the film web may comprise at least one skin layer.
  • the skin layer is preferably the outermost layer of the film web.
  • the skin layer may be coextruded or laminated onto the substrate layer. Alternatively, the skin layer may be applied by coating techniques, including extrusion coating.
  • the skin layer may comprise a polyolefln for example polyethylene, polypropylene, polybutylene, mixtures, blends or copolymers thereof; a polyester, for example polyethylene terephthalate; a polyamide, for example nylon; a polyurethane; a polyvinyl halide, for example polyvinyl chloride; an acetate and/or a biopolymer, for example cellulose and/or its derivatives, polylactic acid or polyhydroxyalkanoate.
  • the skin layer may comprise an ethylene-propylene copolymer (EPM), an ethylene propylene-diene monomer copolymer (EPD ), polybutadiene, polyisoprene, a styrene-butadiene copolymer, a styrene-isoprene copolymer, a urethane, a polyester and/or mixtures or blends thereof.
  • EPM ethylene-propylene copolymer
  • EPD ethylene propylene-diene monomer copolymer
  • polybutadiene polyisoprene
  • styrene-butadiene copolymer a styrene-isoprene copolymer
  • a urethane a polyester and/or mixtures or blends thereof.
  • the skin layer comprises an ethylene-propylene copolymer, an ethylene propylene diene monomer copolymer or amorphous polyester.
  • the substrate layer and/or the skin layer may be biodegradable and/or compostable. This is advantageous as the release liner will have a low carbon footprint.
  • the substrate layer and/or the skin layer may be recyclable.
  • the entire release liner may be recyclable.
  • Current release liners are often non- recyclable due to the presence of an unacceptably high amount of release compound in/on the liner.
  • the release liner formed from the process of the present invention may comprise a nano-coating of release compound which results in a low dilution factor of the release compound. This may allow the entire release liner to be recycled.
  • the substrate layer and/or the skin layer may have a radio carbon content i.e. the substrate layer and/or skin layer may be formed, at least in part, from a renewable material.
  • the substrate layer and/or the skin layer may have a radio carbon content of at least about 10pMC, or at least about 20pMC, or at least about 30pMC, or at least about 40pMC, or at least about 50pMC, or at least about 60pMC, or at least about 70pMC, or at least about 80pMC, or at least about 90p C, or at least about 100pMC.
  • the release liner may have a low carbon footprint.
  • the skin layer may have a thickness of from about 0.01 ⁇ m to about 10 ⁇ m.
  • the skin layer has a thickness of from about 0.1 ⁇ m, about 0.2 ⁇ m, about 0.3 ⁇ m, about 0.4 ⁇ m, about ⁇ .5 ⁇ m, about 0.55 ⁇ m, about ⁇ . ⁇ m, about 0.65 ⁇ , about 0.7 ⁇ m, about 0.75 ⁇ m, about 0.8 ⁇ m, about 0.85 ⁇ m, about 0.9 ⁇ m or about 0.95 ⁇ m; to about 1 ⁇ m, about 1.5 ⁇ m, about 2 ⁇ m, about 2.5 ⁇ m, about 3 ⁇ m, about 3.5 ⁇ m, about 4 ⁇ m, about 4.5 ⁇ m or about 5 ⁇ m.
  • the skin layer may have a thickness of from about 0.1 ⁇ m to about 5 ⁇ m, from about 0.5 ⁇ m to about 3 ⁇ m, from about 0.7 ⁇ m to about 2 ⁇ m or from about 0.8 ⁇ m to about 1.5 ⁇ m.
  • the skin layer may have a modulus of at least about 1% less than the modulus of the substrate layer. More preferably, the skin layer has a modulus of at least about 5% less than the modulus of the substrate layer. More preferably still, the skin layer has a modulus of at least about 10%, at least about 20%, at least about 30%, at least about 40%, at least about 50%, at least about 60%, at least about 70%, at least about 80% or at least about 90% less than the modulus of the substrate layer.
  • the ratio of the modulus of the substrate layer to the modulus of the skin layer may be from 10-30:1 ; from 10-29:1; from 12-28:1; from 13-27:1; from 14-26:1; from 15- 25:1 ; or from 10-25:1.
  • the release force required to remove the release liner from an adhesive surface to which it is attached may be from about 0.01 g/cm to about 50 g/cm.
  • the release force is from about 0.1 g/cm, about 0.2 g/cm, about 0.3 g/cm, about 0.4 g cm, about 0.5 g/cm, about 0.6 g/cm, about 0.7 g/cm, about 0.8 g/cm or about 0.9 g/cm; to about 1 g/cm, about 2 g/cm, about 3 g cm, about 4 g/cm, about 5 g/cm, about 6 g/cm, about 7 g/cm, about 8 g/cm, about 9 g/cm or about 10 g/cm.
  • the release force may be from about 0.1 g/cm to about 3 g/cm, from about 0.1 g/cm to about 2 g/cm or from about 0.1 g/cm to about 1 g/cm.
  • the release liner manufactured by the process of the present invention can be of a variety of thicknesses depending on the application requirements.
  • the release liner may be from about 5 ⁇ m, about 10 ⁇ m, about 15 ⁇ m, about 20 ⁇ m, about 25 ⁇ m, about 30 ⁇ m to about 40 ⁇ m, about 50 ⁇ m, about 75 ⁇ m, about 100 ⁇ m, about 125 ⁇ m, about 150 ⁇ m, about 200 ⁇ m or about 250 ⁇ m.
  • Release liners manufactured by the process of the present invention may be particularly useful in applications such as pressure sensitive adhesive labels/tapes/packaging/vehicle decal films.
  • a release liner obtained or obtainable by the process as hereinbefore described.
  • a release liner comprising a film functionalised at its surface by one or more functional groups selected from ketone, aldehyde, glyoxyl, amide, amine, hydroxide, nitride and vinyl, and a release compound bonded thereto by means of a chemical bond with the functional group.
  • FIG. 1 is a schematic representation of a web of film passing though two sequential plasma discharge treatments wherein the functional agent is injected prior to the electrode
  • Figure 2 is a schematic representation of a web of film passing through two sequential plasma discharge treatments wherein the functional agent is injected through the electrode
  • a web of film 11 is fed into a plasma discharge reactor with the aid of roller 12.
  • Fluid injector 13 injects a functional agent in liquid form.
  • the functional agent is vaporised and carried by an inert carrier gas to the first discharge gap 15.
  • the first discharge gap 15 is defined as the space between the electrode 14 and roller 12.
  • the surface of the web of film 11 positioned within the first discharge gap 15 is functionalised such that functional groups are grafted thereto.
  • Fluid injector 16 injects a vapour comprising a release compound precursor.
  • the vapour comprising the release compound precursor is carried by the inert carrier gas to second discharge gap 18.
  • the second discharge gap 18 is defined as the space between electrode 17 and roller 12.
  • the web of film 11 is fed from the first discharge gap 15 into the second discharge gap 18 where the release compound precursor is covalently bonded to the functional groups on the surface of the web of film 1 .
  • a coating of release compound is deposited and securely bonded to the surface of web of film 11.
  • a web of film 21 is fed into a plasma discharge reactor with the aid of roller 22.
  • An inert carrier is passed between the first discharge gap 25, which is defined as the space between the electrode 24 and roller 22.
  • Fluid injector 23 injects a functional agent in liquid form through electrode 24 and into the plasma discharge gap 25 where it is vaporised.
  • the surface of the web of film 21 positioned within the first discharge gap 25 is functionalised such that functional groups are grafted thereto.
  • Fluid injector 26 injects a vapour comprising a release compound precursor through electrode 27 and into the second plasma discharge gap 28.
  • the second discharge gap 28 is defined as the space between electrode 27 and roller 22.
  • the web of film 21 is fed from the first discharge gap 25 into the second discharge gap 28 where the release compound precursor is covalently bonded to the functional groups on the surface of the web of film 21.
  • a coating of release compound is deposited and securely bonded to the surface of the web of film 21.
  • a web of film having a substrate layer of propylene homopolymer and coextruded skin layers of ethylene propylene copolymer (EPM) each having a thickness of approximately 1 ⁇ m is manufactured by means of a bubble process.
  • the three-layer film web has an overall thickness of 30 ⁇ m.
  • the film web is subjected to a first dielectric barrier discharge treatment in the presence of 500 ppm ammonia in a nitrogen carrier gas.
  • the power used is 65 w.min/m 2 and the speed is 50m min.
  • the film web is then subjected to a second dielectric barrier discharge treatment in the presence of 500 ppm hexamethyl disiloxane in nitrogen. Again, the power used is 65 w.min/m 2 and the speed is 275m/min.
  • the first and second dielectric barrier discharge treatments are carried out in the same reactor.
  • a nano-coating of poiy(dimethyi siloxane) is deposited on the surface of the film web, having a thickness of 50nm as measured by cross-sectioning the film and putting it under a scanning electron microscope (SEM) in EDX mode.
  • SEM scanning electron microscope

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)

Abstract

La présente invention concerne un procédé de fabrication d'un revêtement anti-adhésif, comprenant les étapes consistant à fournir une bande de film ; à soumettre au moins une première surface de la bande de film à un premier traitement par décharge de plasma en présence d'un gaz qui fonctionnalise de manière efficace la première surface de la bande de film, afin de fournir sur celle-ci des groupes fonctionnels qui peuvent se lier de manière active à un composé anti-adhésif et/ou à un précurseur associé ; et à déposer ensuite un revêtement d'un composé anti-adhésif sur la première surface fonctionnalisée de la bande de film en mettant en contact une vapeur comprenant le composé anti-adhésif et/ou un précurseur associé avec la première surface fonctionnalisée au cours d'un second traitement par décharge de plasma.
EP14749982.6A 2013-08-09 2014-07-31 Procédé de fabrication d'un revêtement anti-adhésif par dépôt de plasma Withdrawn EP3030494A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB1314334.2A GB2516978B (en) 2013-08-09 2013-08-09 Process for manufacturing a release liner
PCT/GB2014/052364 WO2015019063A1 (fr) 2013-08-09 2014-07-31 Procédé de fabrication d'un revêtement anti-adhésif par dépôt de plasma

Publications (1)

Publication Number Publication Date
EP3030494A1 true EP3030494A1 (fr) 2016-06-15

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EP (1) EP3030494A1 (fr)
GB (2) GB2516978B (fr)
WO (1) WO2015019063A1 (fr)

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Publication number Priority date Publication date Assignee Title
US10967399B2 (en) 2016-06-30 2021-04-06 3M Innovative Properties Company Fluorocarbon release coating
KR102148507B1 (ko) * 2017-07-26 2020-08-26 주식회사 엘지화학 리튬 전극 및 이의 제조방법
KR102148508B1 (ko) * 2017-07-26 2020-08-26 주식회사 엘지화학 리튬 전극 및 이의 제조방법
FR3077821B1 (fr) * 2018-02-09 2020-12-18 Coating Plasma Ind Film de protection a base de silicium pour adhesif, son procede de fabrication et ses utilisations

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JP2011012285A (ja) * 2009-06-30 2011-01-20 Dainippon Printing Co Ltd 撥水性離型薄膜形成方法及び撥水性離型積層フィルム

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US3443980A (en) * 1966-04-15 1969-05-13 Du Pont Process of producing laminar film structures
JPS57133058A (en) * 1981-02-13 1982-08-17 Teijin Ltd Mold releasing polyester film
FR2711556B1 (fr) * 1993-10-29 1995-12-15 Atohaas Holding Cv Procédé de dépôt d'une couche mince sur la surface d'un substrat en matière plastique.
DE19953667B4 (de) * 1999-11-08 2009-06-04 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Schicht mit selektiv funktionalisierter Oberfläche, Verfahren zur Herstellung sowie deren Verwendung
CN101031669A (zh) * 2004-09-27 2007-09-05 陶氏环球技术公司 由等离子体增强的化学气相沉积的多层涂层
WO2006049153A1 (fr) * 2004-11-02 2006-05-11 Asahi Glass Company, Limited Film de fluorocarbone et procédé servant à produire celui-ci
TW200814170A (en) * 2006-09-13 2008-03-16 Ind Tech Res Inst Method of adjusting surface characteristic of a substrate
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Non-Patent Citations (2)

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DATABASE WPI Week 201109, Derwent World Patents Index; AN 2011-A94164 *
See also references of WO2015019063A1 *

Also Published As

Publication number Publication date
WO2015019063A1 (fr) 2015-02-12
GB201314334D0 (en) 2013-09-25
GB2534080B (en) 2017-05-03
GB2534080A (en) 2016-07-13
GB2516978A (en) 2015-02-11
GB2516978B (en) 2016-06-08

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