EP2864133A1 - Procédé de transfert d'une partie décorative d'un film d'estampage - Google Patents
Procédé de transfert d'une partie décorative d'un film d'estampageInfo
- Publication number
- EP2864133A1 EP2864133A1 EP13732425.7A EP13732425A EP2864133A1 EP 2864133 A1 EP2864133 A1 EP 2864133A1 EP 13732425 A EP13732425 A EP 13732425A EP 2864133 A1 EP2864133 A1 EP 2864133A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- embossing
- transfer layer
- foil
- notches
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
- B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
- B44C1/16—Processes, not specifically provided for elsewhere, for producing decorative surface effects for applying transfer pictures or the like
- B44C1/165—Processes, not specifically provided for elsewhere, for producing decorative surface effects for applying transfer pictures or the like for decalcomanias; sheet material therefor
- B44C1/17—Dry transfer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
- B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
- B44C1/16—Processes, not specifically provided for elsewhere, for producing decorative surface effects for applying transfer pictures or the like
- B44C1/165—Processes, not specifically provided for elsewhere, for producing decorative surface effects for applying transfer pictures or the like for decalcomanias; sheet material therefor
- B44C1/17—Dry transfer
- B44C1/1712—Decalcomanias applied under heat and pressure, e.g. provided with a heat activable adhesive
- B44C1/1729—Hot stamping techniques
Definitions
- the invention relates to a method for transferring a decorative section of a stamping foil onto a substrate.
- Lacquer systems for example UV-crosslinking lacquer systems and / or
- a comparatively hard and brittle paint can break undefined during embossing, with paint flakes different size can arise as unwanted contamination.
- a comparatively soft and elastic lacquer can not or only incompletely break when embossing or tear undefined, so that in the worst case, no separation edge is formed.
- stray remnants of the transfer layer formed as a paint package normally form, the aforementioned so-called flakes, which in the further processing of the embossed substrate lead to contamination of the machines and thus to increased cleaning effort. In extreme cases, these flakes can significantly increase the production output.
- CH 678835 A5 describes a layer composite with diffraction structures from which marks can be removed that can be applied to security documents. The marks are punched out of the layer composite without violating the backing layer of the layer composite. The unneeded parts of the layer composite are applied to the
- stamping foils usual procedure can be transferred.
- the formation of the free spaces between the patches is provided by laser radiation, which removes the decorative layer of the stamping foil around the embossing area.
- DE 10 2007 005 416 A1 describes an embossing film and a security sticker formed therewith, wherein a diffractive first relief structure is formed by molding (embossing or replicating) in a replication layer. In this molding of the diffractive first relief structure at the same time a second relief structure is molded, outside of the area later
- the second relief structure is provided in the form of a line-shaped notch substantially following an outline of the security sticker and having a notch depth, which has more than half the layer thickness of the plastic and / or lacquer layer into which Molding or replicating takes place.
- Carrier film and arranged on the carrier film transfer layer wherein it is provided that the method comprises the steps of: a) providing the stamping foil; b) puncturing at least one notch spaced from the edge of the decorative section by more than 2 mm and formed as a line-shaped notch into the transfer layer;
- the methods according to the invention have the advantage that it is possible with little device complexity to provide at least one predetermined breaking point for detaching the decorative section from the transfer layer in the transfer layer of the stamping foil.
- This is the hot embossing of stamping foils with highly crosslinking paint systems and / or paint layers high layer thickness with the clean separation of the decorative sections of the carrier film allows. It is replaced the rest stamping foil, that is the
- Transfer layer are detached, which still adhere to the carrier film.
- embossing foils in which an adhesive layer is applied either to the substrate or to the outside of a transfer layer to be transferred to the substrate, in particular partially in the form of a desired decoration or decorative section and by means of suitable drying or curing, e.g. by means of UV curing, are advantageously processed for transferring the transfer layer from the carrier film to the substrate, wherein a clean separation of the predetermined by the adhesive decor sections and the rest embossing film is formed.
- Transfer layer neither thermally nor chemically stressed.
- the environment is not burdened by pollutant emissions, for example, in the
- Laser cutting can occur.
- this can be
- gases such as CO 2 , HCl, NO x .
- the line-shaped notches reduce locally the thickness of the
- Transfer layer and act as breaking notches or predetermined breaking points that form high mechanical stresses in the material of the transfer layer, so that the transfer layer breaks easily in the notch area.
- Advantageous may be the formation of the predetermined breaking point as a line-shaped point notch.
- the flank angle can be in the range of 20 ° to 90 °.
- a flank angle of about 60 ° is preferred.
- open notches are punched into the transfer layer, which are extending between opposite edges of the stamping foil and include the decorative portion.
- Open notches are here understood notches that are not self-contained, d. H. have one or more start and / or end points.
- more than one notch is punched in method step b), wherein the more than one notches form a punching area.
- adjacent notches are introduced within the punching area. It can further be provided that adjacent notches have a constant spacing. Alternatively, it may also be provided that adjacent notches have a varying distance. For example, the distance between two adjacent notches may increase outwardly from a central notch, ie, the notches directly adjacent the center notch have a certain distance therefrom, and further, subsequent notches have a greater separation from these notches.
- the spacing between adjacent notches has any desired values, that is to say that no symmetry is sufficient as previously described.
- the punching area may have a width of 0.5 to 2.5 mm, preferably a width of 2 mm. It is ensured with a register accuracy of ⁇ 1 mm, that the decor section is punched register accurate.
- the notches have a mean width of 0.05 mm to 0.5 mm. It can further be provided that the notches completely cut through the transfer layer, but terminate in front of the surface of the carrier film facing the transfer layer.
- the notches sever the transfer layer between 20% and 100%. This ensures that the carrier film is not damaged, so that the carrier film has its full strength even after punching. It has been shown that the intended residue-free separation occurs when the notches cut through the transfer layer in depth by at least 20%.
- Fig. 1 shows a first embodiment of the stamping foil in a schematic
- Fig. 2 shows a second embodiment of the stamping foil in a schematic
- FIG. 4a shows an embodiment of a pre-stamped embossing foil with a
- FIG. 4b is a sectional view of the stamping foil along the section line IVb-IVb in FIG. 4a;
- Fig. 5b an embodiment of a pre-stamped embossing foil with
- Fig. 6 shows a first embodiment of a punching
- Fig. 7 shows a second embodiment of a punching
- Embossing device for carrying out the method according to the invention.
- Fig. 8 shows a second embodiment of the stamping foil in a schematic
- Embossing device for carrying out the method according to the invention.
- an embossable film 1 which can be used in the roll-to-roll process, with a carrier film 11 and a transfer layer 13, between which a release layer 12 is arranged.
- an adhesive layer 14 is arranged, which is for example a hot-melt adhesive layer, which is thermally activated, or even to a
- Cold adhesive layer which is activated by means of high-energy radiation, can act.
- the transfer layer 13 is a paint package of one or more highly crosslinked paints, for example, a UV-crosslinked paint and optionally from other layers, such as more Lacquer layers and / or metallic layers and / or around a
- Hard and brittle transfer layers can form unclean and / or inaccurate separation edges during embossing. In imprints of this kind are often vagabond remnants of
- line-shaped pointed notches 15 with a V-shaped cross section are introduced into the embossing foil 1 from the side of the adhesive layer 14, the depth of which is selected so that the notches 15 on the surface facing the transfer layer 13 the carrier film 1 1 ends.
- the flank angle is in the embodiment shown in FIG. 1 about 60 °.
- the carrier film 1 1 is therefore by the
- Stamping process is not damaged and has full strength in all areas. These notches act as predetermined breaking points for the transfer layer, because in the notch area high voltages are formed in the notched material.
- two line-shaped notches 15 are arranged side by side, forming a punching area 15s.
- the punching area 15s may preferably have a width of 0.5 to 2.5 mm.
- the punching area 15s delimits a decorative section 16 formed in the transfer layer 13 and in the adhesive layer 14.
- Fig. 1 is a decorative section 16 delimiting
- the boundary line 16s may be an outer edge of a decoration, for example an OVD, as shown for example below in FIG. 4a.
- the boundary line 16s delimits the decor section 16 from the remainder of the transfer layer 13, wherein this remaining, adjacent to the decor section 16 transfer layer 13 may be formed, for example, transparent or translucent. Rejects that
- Embossing foil 1 however, alternatively and as shown for example below in Fig. 5b, an endless design without a defined outer edge or outer boundary of a decor or decoration section 16, then a borderline 16s is not or only partially present.
- the punching area 15s can lie within the decor sections 16 which are not precisely demarcated prior to punching and / or the decorative sections 16 within the endless design can only be formed by inserting the notches 15 in one
- Fig. 2 shows the stamping foil 1 of Fig. 1 with a modified formation of the notches 15.
- six line-shaped notches 15 are provided, which only about 20% in the
- the line-shaped notches 15 form the punching area 15s, as in the exemplary embodiment described above in FIG.
- the two outer notches 15a are exemplarily spaced apart
- the four inner notches 15b are formed without spacing between adjacent notches.
- the two outer notches and the four inner notches each form a group with the same arrangement.
- the number of notches 15 in the punching area 15s can also be varied.
- between 2 and 40 adjacent notches 15 are provided, wherein the width of the punching portion 15s may preferably be about 2 mm.
- Transfer layer occurring high voltages completely breaks the transfer layer under bending load.
- Fig. 3 shows embodiments of closed dies, d. H. of dies that form closed line-shaped notches 15. As the examples show, very different shapes can be formed, so that the design of the decorative sections 16 to be transferred is subject to almost no restrictions.
- FIGS. 4a and 4b show the formation of the line-shaped notches 15 and the punching area 15s using the example of a star-shaped decor section 16.
- the punching area 15s surrounds the decorative portion 16 at a constant distance. There are provided around the decor portion 16, three evenly spaced line-shaped notches 15 with increasing from the inside to the outside circumference. To a common center, which is the center of the star-shaped
- Decor section 16 matches, so three punches are provided with increasing extent, the distances of the punches as shown in Fig. 4a and 4b may be constant or vary.
- the punched holes are in the register, d. H. Positioned to the decor section 16.
- FIG. 4 a shows an example for applying a decorative section 16 of a transfer layer 13 and an adhesive layer 14 in the form of a so-called patch or label to a substrate.
- Fig. 5a shows embodiments of open punching dies, wherein the
- Decor section is bounded in each case by at least two spaced-apart line-shaped notches or punching areas. Assuming that the decorative portion to be embossed occupies the entire width of the embossing foil, two line-shaped notches or punching areas are necessary in order to emboss the decorative portion. For example, each of the punch areas may include 2 to 40 line notches.
- FIG. 5b shows the formation of the line-shaped notches 15 and of the punching area 15s using the example of a strip-shaped, endless embossing foil 1 for roll-to-roll processing. In this case, extends to the embossing foil 1, a transfer layer 13, the sections, d. H. split into separate
- Embodiment 3 each line-shaped notches 15 are provided.
- the punching areas 15s are each in the register, i. H. In a precise position relative to a decorative region 16 formed by the transfer layer 13 and the adhesive layer 14.
- Fig. 6 shows a first embodiment of a punching
- Embossing device 2 for carrying out the method according to the invention, comprising the following steps: a) providing the stamping foil;
- the stamping foil 1 is provided on an unwinding roll 21 and is then in a punching station, formed from a round punch 22 and a
- stamping foil 1 is now guided by an embossing station comprising a heated embossing cylinder 24 and two second guide rollers 27, which at the same time for the necessary pressure of the substrate 23 on the embossing cylinder
- the stamped on the substrate 23 stamping 1 is the
- the second deflection rollers 27 are arranged so that the embossing cylinder 24 is approximately half looped by the embossing foil 1 and the substrate 23.
- the pre-cut decorative sections 16 are transferred to the substrate 23 by registered, ie position-controlled action of the embossing area of the embossing cylinder 24 with the aid of pressure and heat.
- the embossing cylinder 24 can on his circumference completely or only partially heated and / or not shown in detail embossing zones, with which the decorative portions 16 are transferred by means of pressure and heat to the substrate 23. In this case, the embossing zones can approximately coincide in size and / or contour with the decorative sections 16.
- a substrate 25 is formed with applied decorative portions 16, wherein the decorative portions 16, as described above, are surrounded by punching areas in which the transfer layer 13 and / or the adhesive layer 14 breaks easily. Breakage of the pinched transfer layer may take place at the moment of detachment or shortly after or before.
- the residual embossing film 1 r has at least the carrier film 1 1 and the areas of the transfer layer 13 with the adhesive layer 14, which were not transferred to the substrate 23.
- the round punch 22 is replaced by a movable knife or by a lifting punch.
- the knife or the lifting punch are controlled by a register mark on the embossing foil detecting sensor, which is preferably arranged immediately after the unwinding roller 21 and in front of the knife or the lifting punch, so that the knife or the lifting punch according to this register mark on the film register-accurate punches one on the stamping foil
- the register mark on the film detecting sensor can also control the embossing cylinder 24 in register, to register the cylinder 24 in register, that is precise position or position-controlled to the
- Fig. 7 shows a second embodiment of a punching and embossing device 2 for carrying out the method according to the invention, wherein the
- Embossing device as the punching and embossing device shown in Fig. 6 is constructed, with the difference that a linearly movable die 24 'is provided so that the substrate 23 in the punching and embossing device 2 is not deflected.
- the punching and embossing device 2 shown in FIG. 7 is therefore particularly suitable for embossing relatively rigid substrates, for example for embossing credit or identity cards.
- Punching and embossing device are arranged in a continuous roll-to-roll process immediately after one another, it is also possible to decouple the embossing device and the punching device procedurally and operate offline. It is thus possible, for example, for a separate punching device, which is locally separate from the embossing device, to insert punching areas 15s into the stamping foil by means of the above-described round punching, lifting punch or knife, and then to stamp this embossed foil 1 in a separate operation of an embossing device for embossing the decorative sections 16 is supplied to a substrate 23. Between the two
- the stamping foil rolled up, made up, d. H. be cut and transported in length and / or width, as the
- Registration accuracy between embossing foil and substrate during embossing again can be adjusted by the provided on the stamping foil register marks.
- Fig. 9 shows a punching and embossing device 3 for performing a
- a cold stamping method comprising the steps of: a) providing the stamping foil;
- the stamping foil 1 is provided on an unwinding roll 21 and is then in a punching station, formed from a round punch 22 and a
- Decor sections 16 are surrounded by the line-shaped notches 15 in register.
- An adhesive 23 is applied to a substrate 23 in an adhesive applicator 31, in particular partially in the form of decor sections, for example printed or sprayed on. Alternatively and not shown, the adhesive can also be applied to the substrate-facing outside of the transfer layer of the stamping foil 1.
- the transfer film 1 is now guided over a first deflection roller 27, which is also operated as a pressure roller and the Transfer sheet 1 presses on the substrate to be embossed 23.
- Substrate 23 merged and resting on the adhesive embossing film 1 is now passed through a drying station 32. There, a partial or complete drying and / or curing of the adhesive is provided, for example by means of heat and / or UV exposure.
- a substrate 25 is formed with applied and fixed by means of the cured adhesive on the substrate 23 decor sections, wherein the decorative sections, as described above, are surrounded by punching areas in which the transfer layer breaks easily. Breaking the cuddled
- Transfer position can take place at the moment of detachment or shortly after or before.
- a residual embossing film 1 r is removed from the substrate 25 with the decorative sections applied and wound on a take-up reel 26.
- the rest embossing film 1 r has at least the carrier film 1 1 and the areas of the transfer layer 13, which were not transferred to the substrate 23.
- the round punch 22 is replaced by a movable knife or by a lifting punch.
- the knife or the lifting punch are controlled by a register mark on the transfer sheet detecting sensor, which is preferably arranged immediately after the unwinding roller 21 and in front of the knife or the lifting punch, so that the Knife or the lifting punch according to this register mark on the slide can produce register-accurate punches.
- the register mark on the film detecting sensor can also control the Kleberarguesswerk 31 register accurate.
Landscapes
- Decoration By Transfer Pictures (AREA)
- Laminated Bodies (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
Abstract
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102012105342A DE102012105342A1 (de) | 2012-06-20 | 2012-06-20 | Verfahren zum Übertragen eines Dekorabschnitts einer Prägefolie |
PCT/EP2013/062899 WO2013190048A1 (fr) | 2012-06-20 | 2013-06-20 | Procédé de transfert d'une partie décorative d'un film d'estampage |
Publications (3)
Publication Number | Publication Date |
---|---|
EP2864133A1 true EP2864133A1 (fr) | 2015-04-29 |
EP2864133B1 EP2864133B1 (fr) | 2018-08-22 |
EP2864133B2 EP2864133B2 (fr) | 2021-12-29 |
Family
ID=48703456
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP13732425.7A Active EP2864133B2 (fr) | 2012-06-20 | 2013-06-20 | Procédé de transfert d'une partie décorative d'un film d'estampage |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP2864133B2 (fr) |
JP (1) | JP6439202B2 (fr) |
CN (1) | CN104520119B (fr) |
DE (1) | DE102012105342A1 (fr) |
WO (1) | WO2013190048A1 (fr) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10870311B2 (en) | 2015-06-23 | 2020-12-22 | Hinderer + Muhlich Gmbh & Co. Kg | Method and device for transferring a decorating segment of an embossing film |
US20170057275A1 (en) | 2015-08-27 | 2017-03-02 | Crane Security Technologies, Inc. | Single or dual transfer process for preparing and transferring sharply defined single elements to objects to be protected |
EP3165365A1 (fr) | 2015-11-05 | 2017-05-10 | KBA-NotaSys SA | Presse d'estampage alimentée en feuilles comprenant une unité de laminage d'une feuille |
EP3165366A1 (fr) | 2015-11-05 | 2017-05-10 | KBA-NotaSys SA | Presse d'estampage alimentée en feuilles avec unité de laminage d'une feuille |
PL3173232T3 (pl) * | 2015-11-30 | 2019-02-28 | Kba-Notasys Sa | Prasa do wytłaczania na gorąco i sposób wytłaczania na gorąco |
DE102018000920A1 (de) | 2018-02-05 | 2019-08-08 | Giesecke+Devrient Currency Technology Gmbh | Verfahren zum Herstellen eines Sicherheitselement-Transfermaterials und Sicherheitselement-Transfermaterial |
DE102018001379A1 (de) * | 2018-02-21 | 2019-08-22 | Giesecke+Devrient Currency Technology Gmbh | Transferträger |
WO2023078582A1 (fr) * | 2021-11-04 | 2023-05-11 | Giesecke+Devrient Currency Technology Gmbh | Matériau d'élément de sécurité de transfert et document de valeur comprenant un élément de sécurité |
Family Cites Families (20)
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DE3941424A1 (de) * | 1989-12-15 | 1991-06-20 | Kurz Leonhard Fa | Verfahren zum uebertragen eines dekors von einer praegefolie auf ein ebenflaechiges substrat und vorrichtung zur durchfuehrung des verfahrens |
DE4021908C2 (de) | 1990-07-10 | 2002-04-25 | Gao Ges Automation Org | Verfahren zur Herstellung eines Substrats mit einem optisch variablen Element und Verwendung des Substrats |
CH678835A5 (fr) | 1991-01-18 | 1991-11-15 | Landis & Gyr Betriebs Ag | |
DE19813314A1 (de) † | 1998-03-26 | 1999-09-30 | Kurz Leonhard Fa | Prägefolie, insbesondere Heissprägefolie |
DE19940790B4 (de) | 1999-08-27 | 2004-12-09 | Leonhard Kurz Gmbh & Co | Übertragungsfolie zur Aufbringung einer Dekorschichtanordnung auf ein Substrat sowie Verfahren zu deren Herstellung |
JP2001150884A (ja) * | 1999-11-24 | 2001-06-05 | Dainippon Printing Co Ltd | 転写方法 |
EP1188570B1 (fr) † | 2000-09-14 | 2007-05-09 | Dai Nippon Printing Co., Ltd. | Medium intermédiaire pour le marquage par transfert, et procédé de formation d'image |
WO2007048563A2 (fr) | 2005-10-27 | 2007-05-03 | Ovd Kinegram Ag | Procede de transfert d'un corps multicouche et feuille de transfert |
US20080258457A1 (en) | 2006-09-08 | 2008-10-23 | De La Rue International Limited | Method of manufacturing a security device |
GB0617729D0 (en) * | 2006-09-08 | 2006-10-18 | Rue De Int Ltd | Security device based on customised microprism device |
DE102007005416B4 (de) | 2007-01-30 | 2016-03-31 | Leonhard Kurz Gmbh & Co. Kg | Prägefolie und damit gebildeter Sicherheitsaufkleber |
JP5045542B2 (ja) † | 2007-05-25 | 2012-10-10 | 大日本印刷株式会社 | 長尺体積ホログラム層転写箔、これを用いた体積ホログラム積層体の製造方法、および体積ホログラム積層体 |
DE102008013279A1 (de) * | 2008-03-08 | 2009-09-10 | Leonhard Kurz Stiftung & Co. Kg | Verfahren und Vorrichtung zum Beprägen von Werkstücken |
DE102008047095A1 (de) * | 2008-09-12 | 2010-03-18 | Leonhard Kurz Stiftung & Co. Kg | Transferfolie zur Verwendung in einem Kaltfolientransferverfahren |
DE102008047641A1 (de) | 2008-09-17 | 2010-04-15 | Giesecke & Devrient Gmbh | Sicherheitselement-Transfermaterial mit mehrschichtigem Träger |
JP5262615B2 (ja) | 2008-11-21 | 2013-08-14 | 大日本印刷株式会社 | 長尺体積ホログラム層転写箔、および、これを用いた体積ホログラム積層体の製造方法 |
JP5024267B2 (ja) * | 2008-11-21 | 2012-09-12 | 大日本印刷株式会社 | 体積ホログラム積層体の製造方法 |
DE102008062149B3 (de) | 2008-12-16 | 2010-04-29 | Ovd Kinegram Ag | Verfahren zur Herstellung eines Sicherheitselements sowie Transferfolie |
JP5103457B2 (ja) * | 2009-05-08 | 2012-12-19 | 株式会社トーツヤ・エコー | シートへの転写方法、転写装置、及びシート製品 |
ES2665041T3 (es) * | 2010-06-28 | 2018-04-24 | Leonhard Kurz Stiftung & Co. Kg | Procedimiento para la decoración de superficies |
-
2012
- 2012-06-20 DE DE102012105342A patent/DE102012105342A1/de active Pending
-
2013
- 2013-06-20 CN CN201380032700.2A patent/CN104520119B/zh active Active
- 2013-06-20 WO PCT/EP2013/062899 patent/WO2013190048A1/fr unknown
- 2013-06-20 EP EP13732425.7A patent/EP2864133B2/fr active Active
- 2013-06-20 JP JP2015517768A patent/JP6439202B2/ja active Active
Non-Patent Citations (1)
Title |
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See references of WO2013190048A1 * |
Also Published As
Publication number | Publication date |
---|---|
EP2864133B2 (fr) | 2021-12-29 |
CN104520119A (zh) | 2015-04-15 |
JP6439202B2 (ja) | 2018-12-19 |
JP2015528754A (ja) | 2015-10-01 |
EP2864133B1 (fr) | 2018-08-22 |
CN104520119B (zh) | 2018-09-21 |
WO2013190048A1 (fr) | 2013-12-27 |
DE102012105342A1 (de) | 2013-12-24 |
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