EP2815700A1 - Ultraschallsonde und ultraschallvorrichtung damit - Google Patents

Ultraschallsonde und ultraschallvorrichtung damit Download PDF

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Publication number
EP2815700A1
EP2815700A1 EP20130748547 EP13748547A EP2815700A1 EP 2815700 A1 EP2815700 A1 EP 2815700A1 EP 20130748547 EP20130748547 EP 20130748547 EP 13748547 A EP13748547 A EP 13748547A EP 2815700 A1 EP2815700 A1 EP 2815700A1
Authority
EP
European Patent Office
Prior art keywords
film
ultrasound probe
substrate
stress
beam part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP20130748547
Other languages
English (en)
French (fr)
Other versions
EP2815700A4 (de
Inventor
Yasuhiro Yoshimura
Tatsuya Nagata
Akifumi Sako
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Aloka Medical Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Aloka Medical Ltd filed Critical Hitachi Aloka Medical Ltd
Publication of EP2815700A1 publication Critical patent/EP2815700A1/de
Publication of EP2815700A4 publication Critical patent/EP2815700A4/de
Withdrawn legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/24—Probes
    • G01N29/2406—Electrostatic or capacitive probes, e.g. electret or cMUT-probes
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
    • A61B8/4494—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer characterised by the arrangement of the transducer elements
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/13—Tomography
    • A61B8/14—Echo-tomography
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4444—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device related to the probe
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/46—Ultrasonic, sonic or infrasonic diagnostic devices with special arrangements for interfacing with the operator or the patient
    • A61B8/461—Displaying means of special interest
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0292—Electrostatic transducers, e.g. electret-type
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/028—Material parameters
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/04—Wave modes and trajectories
    • G01N2291/044—Internal reflections (echoes), e.g. on walls or defects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/10—Number of transducers
    • G01N2291/101—Number of transducers one transducer

Definitions

  • an ultrasound probe 1 includes a cMUT element 2, a backing 3, a flexible printed circuits 4, a connector 91, a wiring 92, a circuit board 97 and a connection terminal 98.
  • the ultrasound probe 1 is used for human body examinations (examination of circulatory organs such as a heart and blood vessels, abdominal examination, and the like) in a medical institution, for example.
  • the rim parts 101 are provided on an upper surface of the insulating film 18b so as to partially overlap with both ends of the upper electrode 11. More specifically, as shown in Fig. 3 , the rim parts 101 are provided distant from the beam part 100, and the rim parts 101 have a multilayer structure formed by laminating the insulating films 12, 13b, 14b and 15b (films made of materials different in stress). Each of the rim parts 101 protrudes toward the cavity 17 from a cavity edge 21 (edge of the cavity 17). The strength of the cMUT element 2 can be improved by providing the rim parts 101. Moreover, high rigidity of the rim parts 101 enables more favorable vibration of the membrane 102.
  • the lower electrode 7 and the upper electrode 11 are both parallel plate electrodes.
  • the membrane 102 is warped by application of a direct-current voltage or an alternating-current voltage to the electrodes by connecting an unillustrated power source thereto. In other words, the upper electrode 11 is pulled closer to the lower electrode 7. Note that the membrane 102 is where warpage occurs due to application of the direct-current voltage to the lower electrode 7 and the upper electrode 11. Meanwhile, during application of the alternating-current voltage, the membrane 102 is where vibration occurs.
  • the insulating film 16 covering the beam part 100 and the rim parts 101 is the film that applies the tensile stress as described above, and also has a function to protect the surface of the cMUT element 2 (e. g. , from mixing of foreign substances, moisture and the like).
  • a stress neutral surface 103 of the membrane 102 is positioned lower than a beam neutral surface 104 of the beam part 100. More specifically, when comparing the stress neutral surface 103 and the beam neutral surface 104, the stress neutral surface 103 is set closer to the upper electrode 11. Accordingly, heights of the membrane 102 and the beam part 100 are set such that the stress neutral surface 103 and the beam neutral surface 104 satisfy such a relationship.
  • a supporting point when the membrane 102 is driven (warped and vibrated) is an upper edge 105 of the cavity 17.
  • a vibration center when the membrane 102 is driven is the vicinity of an upper surface 106 of the cavity 17. Accordingly, a bending moment generated in the membrane 102 is increased with distance of the stress neutral surface 103 from the upper surface 106. As a result, the warpage of the membrane 102 is increased and an influence rate of a stress variation in the insulating films is also increased.
  • tungsten W
  • tungsten carbide WC
  • tungsten boride W 2 B 5
  • titanium nitride TiN
  • titanium carbide TiC
  • molybdenum Mo
  • molybdenum boride Mo 2 B 5
  • molybdenum carbide Mo 2 C
  • titanium boride TiB 2
  • silicon carbide SiC
  • tungsten is particularly preferable. Any one of the above may be used individually, or two or more of the above may be used in combination.
  • Table 1 shows Young's moduli of the materials described above. Table 1 also shows Young's moduli of silicon dioxide (the first insulating film) and silicon nitride (the second insulating film).
  • the cMUT element 2 shown in Fig. 3 the cMUT element 2a shown in Fig. 5 and a cMUT element (not shown) of a comparative example, membrane distance variations are examined.
  • a beam part is provided and insulating films below an uppermost film in the beam part have a two-layer structure including a silicon dioxide film and a silicon nitride film.
  • the cMUT element of the comparative example is one including a beam part 100 and rim parts 101, from which the insulating films 12, 13a and 13b in the cMUT element 2 shown in Fig. 3 are omitted.
  • the ultrasound probe 1 transmits ultrasonic waves to the subject 95 and receives reflected echoes.
  • a cMUT element mounted on the ultrasound probe 1 the cMUT element 2 shown in Fig. 3 or the cMUT element 2a shown in Fig. 5 is applied. Since the specific configuration of the ultrasound probe 1 is described above with reference to Fig. 1 and the like, description thereof is omitted.
  • the control unit 207 controls the respective units based on control information inputted by the control panel 208 to be described later.
  • the control unit 207 is formed using a CPU and the like, for example.

Landscapes

  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Pathology (AREA)
  • General Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Molecular Biology (AREA)
  • Veterinary Medicine (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Biomedical Technology (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Medical Informatics (AREA)
  • Biophysics (AREA)
  • Surgery (AREA)
  • Animal Behavior & Ethology (AREA)
  • Radiology & Medical Imaging (AREA)
  • Public Health (AREA)
  • Gynecology & Obstetrics (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
EP13748547.0A 2012-02-14 2013-02-13 Ultraschallsonde und ultraschallvorrichtung damit Withdrawn EP2815700A4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012029259A JP5852461B2 (ja) 2012-02-14 2012-02-14 超音波探触子及びそれを用いた超音波診断装置
PCT/JP2013/053335 WO2013122075A1 (ja) 2012-02-14 2013-02-13 超音波探触子及びそれを用いた超音波診断装置

Publications (2)

Publication Number Publication Date
EP2815700A1 true EP2815700A1 (de) 2014-12-24
EP2815700A4 EP2815700A4 (de) 2015-11-04

Family

ID=48984185

Family Applications (1)

Application Number Title Priority Date Filing Date
EP13748547.0A Withdrawn EP2815700A4 (de) 2012-02-14 2013-02-13 Ultraschallsonde und ultraschallvorrichtung damit

Country Status (5)

Country Link
US (1) US9846145B2 (de)
EP (1) EP2815700A4 (de)
JP (1) JP5852461B2 (de)
CN (1) CN104114097B (de)
WO (1) WO2013122075A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2855035B1 (de) * 2012-05-31 2017-03-01 Koninklijke Philips N.V. Wafer und verfahren zur dessen herstellung

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016002206A1 (ja) * 2014-06-30 2016-01-07 セイコーエプソン株式会社 超音波センサー及びその製造方法
DE202015007010U1 (de) * 2015-10-07 2015-10-22 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Verbinder
JP6724502B2 (ja) * 2016-04-06 2020-07-15 セイコーエプソン株式会社 超音波装置
CN109414244B (zh) * 2016-06-30 2022-04-12 皇家飞利浦有限公司 用于医学装备的密封控制面板
JP6606034B2 (ja) * 2016-08-24 2019-11-13 株式会社日立製作所 容量検出型超音波トランスデューサおよびそれを備えた超音波撮像装置
JP7141934B2 (ja) * 2018-12-03 2022-09-26 株式会社日立製作所 超音波トランスデューサ、その製造方法および超音波撮像装置
JP7224190B2 (ja) * 2019-01-15 2023-02-17 株式会社日立製作所 超音波トランスデューサ、その製造方法および超音波撮像装置
JP7236320B2 (ja) * 2019-05-08 2023-03-09 富士フイルムヘルスケア株式会社 超音波探触子及びそれを用いた超音波送受信装置
WO2022210851A1 (ja) * 2021-03-30 2022-10-06 国立大学法人山形大学 可撓性超音波プローブヘッド、超音波プローブ、及び超音波診断装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7612483B2 (en) 2004-02-27 2009-11-03 Georgia Tech Research Corporation Harmonic cMUT devices and fabrication methods
JP2005252056A (ja) * 2004-03-05 2005-09-15 Sony Corp 集積回路装置およびその製造方法
US7888709B2 (en) 2004-09-15 2011-02-15 Sonetics Ultrasound, Inc. Capacitive micromachined ultrasonic transducer and manufacturing method
JP4735117B2 (ja) 2005-08-08 2011-07-27 栗田工業株式会社 製紙方法
JP4434109B2 (ja) * 2005-09-05 2010-03-17 株式会社日立製作所 電気・音響変換素子
JP4909279B2 (ja) 2005-10-18 2012-04-04 株式会社日立製作所 超音波探触子
WO2007046180A1 (ja) * 2005-10-18 2007-04-26 Hitachi, Ltd. 超音波トランスデューサ、超音波探触子および超音波撮像装置
US20070180916A1 (en) 2006-02-09 2007-08-09 General Electric Company Capacitive micromachined ultrasound transducer and methods of making the same
GB0605576D0 (en) 2006-03-20 2006-04-26 Oligon Ltd MEMS device
JP4730162B2 (ja) * 2006-03-24 2011-07-20 株式会社日立製作所 超音波送受信デバイス，超音波探触子およびその製造方法
JP4958631B2 (ja) 2007-05-14 2012-06-20 株式会社日立製作所 超音波送受信デバイス及びそれを用いた超音波探触子
JP2010004199A (ja) * 2008-06-19 2010-01-07 Hitachi Ltd 超音波トランスデューサおよびその製造方法
EP2145696A1 (de) * 2008-07-15 2010-01-20 UAB Minatech Kapazitiver mikrogefertigter Ultraschallwandler und Verfahren zu seiner Herstellung
JP2011259186A (ja) * 2010-06-09 2011-12-22 Canon Inc 静電容量型電気機械変換装置及びその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2855035B1 (de) * 2012-05-31 2017-03-01 Koninklijke Philips N.V. Wafer und verfahren zur dessen herstellung
US9917535B2 (en) 2012-05-31 2018-03-13 Koninklujke Philips N.V. Wafer and method of manufacturing the same

Also Published As

Publication number Publication date
CN104114097B (zh) 2016-04-13
JP5852461B2 (ja) 2016-02-03
US20150011890A1 (en) 2015-01-08
EP2815700A4 (de) 2015-11-04
CN104114097A (zh) 2014-10-22
WO2013122075A1 (ja) 2013-08-22
US9846145B2 (en) 2017-12-19
JP2013165753A (ja) 2013-08-29

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