EP2812657A1 - Capteur moulé à deux niveaux - Google Patents

Capteur moulé à deux niveaux

Info

Publication number
EP2812657A1
EP2812657A1 EP13707568.5A EP13707568A EP2812657A1 EP 2812657 A1 EP2812657 A1 EP 2812657A1 EP 13707568 A EP13707568 A EP 13707568A EP 2812657 A1 EP2812657 A1 EP 2812657A1
Authority
EP
European Patent Office
Prior art keywords
electronic component
housing
fixing
shielding
dambar
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP13707568.5A
Other languages
German (de)
English (en)
Inventor
Thomas Fischer
Stefan GÜNTHNER
Manfred Goll
Dietmar Huber
Jakob Schillinger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Continental Teves AG and Co OHG
Original Assignee
Continental Teves AG and Co OHG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Continental Teves AG and Co OHG filed Critical Continental Teves AG and Co OHG
Publication of EP2812657A1 publication Critical patent/EP2812657A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Definitions

  • the invention relates to an electronic component, in particular designed as a sensor and / or actuator assembly or sensor or actuator, a method for producing the electronic component and the use of the electronic component in power ⁇ vehicles.
  • thermosetting plastic as a first housing, molded magnetic sensors using egg ⁇ nes Carriers or pre-molded with a first housing, molded magnetic sensors using egg ⁇ nes Carriers or pre-molded with a first housing, molded magnetic sensors using egg ⁇ nes Carriers or pre-molded with a first housing, molded magnetic sensors using egg ⁇ nes Carriers or pre-molded with a first housing, molded magnetic sensors using egg ⁇ nes Carriers or pre-molded with a
  • Thermoplastic material encapsulated, as a second housing is encapsulated, as a second housing.
  • An additional circuit is either mounted in the carrier / preform or molded together with the Sensor Transfer.
  • Sensors for acceleration or yaw rate are fitted in a premold or transfer molded. These components are placed on an intermediate carrier, e.g. Printed circuit board, assembled and then mounted in a premold housing.
  • an intermediate carrier e.g. Printed circuit board
  • the invention is based on the object to propose an electronic component and a method for producing such an electronic component, which is relatively inexpensive and / or easy to manufacture and / or it allows in particular special, to dispense with a carrier or carrier element for the manufacture ⁇ ment of the second housing in an injection mold.
  • the electronic component is formed as a sensor from ⁇ and having at least one sensor element as an electric ⁇ nikelement.
  • the sensor ⁇ component is designed as an actuator or as a combined sensor actuator.
  • a circuit carrier is preferably understood to be a leadframe or leadframe.
  • the electronic component has a fixing / shielding element, in particular comprising a fixing surface or a fixing plate, wherein the fixing / shielding element for positioning or fixing in a tool or SPritzgusstechnikmaschine for producing the elec ⁇ ronikbauteils and / or Shielding of the at least one electronic element is formed before electromagnetic radiation.
  • the fixing / shield is particularly before Trains t ⁇ formed of metal or sheet metal.
  • the fixing / shielding element is expediently designed as a shield.
  • the fixing / shielding member is preferably connected to a dam bar radical structure with the Wenig ⁇ least, wherein said compound is in particular mechanically and optionally additionally electric.
  • the fixing / shielding element is used as a shielding element, it is particularly preferably electrically connected to a ground terminal.
  • At least one dambar residual structure is fastened to the first housing and in particular is not connected to the first circuit carrier, wherein this at least one dambar residual structure is particularly preferably anchored in the first housing and is electrically insulated within the first housing.
  • first housing and the fixing / shielding member at least partially formed by a second Ge ⁇ housing, in particular injection-molded, are embedded.
  • the electronic component preferably has, particularly in its first housing, at least a yaw-rate sensor element and at least one di- or multi-axial acceleration ⁇ sensor element or at least two uniaxial Accelerati ⁇ supply sensor elements, wherein the one or more acceleration sensor elements are designed such that they at least with respect to a first sensitive acceleration ⁇ measuring axis have a measuring range, the for a
  • Airbag sensor element is designed, and at least with respect to a second sensitive acceleration measuring a Have measuring range, which is designed for a vehicle dynamics control system sensor element.
  • the first and the second Be ⁇ admirungsmessachse are particularly preferred ortho ⁇ gonal aligned with each other.
  • the electronic component is expediently so out ⁇ forms that the measuring range based on the first sensitive acceleration measuring axis is the same size 25g or the same size 8g designed and that the measuring range based on the second sensitive acceleration measuring axis Budapest Treating 10g or smaller 20g is designed.
  • the electronic component is alternatively preferably formed in such a way that the measuring range based on the first sen ⁇ sitive acceleration measurement axis less than or equal 8g or less equal to 20 g, or greater than or equal 8g is designed and that the measuring range based on the second sensitive Be ⁇ vanungsmessachse in each case less than or equal 8g out ⁇ lays ,
  • the second housing or common housing of the electronic ⁇ component is preferably formed of thermoset or elastomer or thermoplastic.
  • the electronic component expediently comprises at least one magnetic field sensor element, wherein the electronic component is designed in particular as a speed sensor, particularly preferably as a wheel speed sensor, or as a displacement sensor.
  • the electronic component preferably has no carrier element which is suitable for positioning in an injection molding tool and is designed to receive a raw electronic component.
  • a carrier element is referred to in particular as a carrier or carrier element.
  • the at least first housing is at ⁇ least partially surrounded by a decoupling sleeve or protective cover which is at least partially surrounded by the second Ge ⁇ housing.
  • the fixing / shielding least at ⁇ has a positioning aid, which is designed to Positionin ⁇ tion in an injection mold, insbeson ⁇ particular become fixed in the positioning as a recess and / or anchor ⁇ hole and / or flap, in particular by means of one or more positioning pins of the injection molding tool ⁇ formed.
  • the method for producing an electronic component is preferably based on the idea that at least one electronic element is connected to a first circuit carrier, wherein the first circuit carrier is designed as a leadframe comprising a dambar, after which the at least one electronic element and the first circuit ⁇ carrier at least is partially embedded in a first housing or cast or injected, after which the Dambar is partially removed and at least one Dambar residual structure is retained.
  • a fixing / shielding element is attached at least to a dambar residual structure.
  • the crude electronic component is positioned with ⁇ means of the fixing / shielding member in a Spritzgusstechnikzug and / or fixed, after which a second housing made of injection molding is formed which at least the first shawl ⁇ tung carrier, the first housing and the fixing / shield partially embedded.
  • Positionier Anlagen the fixing / shielding is positively connected and / or that the fixing / shielding of at least two positioning pins, in particular oppositely arranged and opposite each other to bewegli ⁇ chen positioning pins, the injection mold is clamped or fixed, after which during or after the injection ⁇ process for generating the second housing, the at least one positioning or all positioning pins are withdrawn to ⁇ and / or released from the fixing / shielding.
  • the electronic component preferably comprises, in particular in its first housing, at least one sensor element or sensor for yaw rate, acceleration, magnetic fields and in particular an ASIC, as signal processing circuit.
  • the electronic component appropriately to ⁇ additional electronic elements, particularly elements beautch- tung, such as R, C, L, Glienicke ⁇ the / components, varistors, diodes, suppressor on.
  • additional electronic elements are preferably mounted on the first circuit carrier or first leadframe or connected to this, in particular mechanically and electrically, and preferably arranged in a single or multi-membered housing as the first housing or in an additional third housing.
  • the first and the optional third housing are preferably made of duroplastic or "premold” or “transfermold”, so in ⁇ particular injection molded plastic, formed.
  • the second housing or overall housing is preferably formed of "overmold" as injection-molded plastic.
  • the first housing hereinafter also sometimes referred to as an IC body, is preferably used with / at the fixing
  • Shielding element or the fixing surface connected or mecha ⁇ nically and / or electrically connected / arranged.
  • the fixing / shielding member or the fixing surface serves be ⁇ vorzugt both as a shield against electromagnetic Fel ⁇ and the electrostatic fields, as well as
  • additional components such as a Perma nentmagnet ⁇ are fixed to fixing sheet, preferably on the side of the first leadframe, that is above the Wenig ⁇ least one electronic component "suspended", ie on the Inner side of the electronic component, or alternatively preference ⁇ on the other, the leadframe facing away, side of the fixing.
  • a substrate such as a printed circuit board or a ceramic carrier, is used as the circuit carrier. This is then molded in particular transfer to form the ers ⁇ th housing.
  • the electronic component preferably does not include a carrier, which is directly or indirectly buildin ⁇ saturated with the first lead frame and the molding and forming of the second housing according to the prior art is inserted into an injection mold.
  • the electronic component comprises a first and ei ⁇ NEN second interconnected lead frame.
  • at least one sensor element and an ASIC are arranged on the first leadframe as signal processing circuit, which are injected together into a first housing. Zussley ⁇ Lich, the electronic component to a fixing surface at which the electronic component is positioned in an injection molding tool for producing the second housing.
  • the electronic component suitably comprises a ⁇ sharmlichen to the second lead frame are formed of which in particular the contact pads or pins of a plug or connector ⁇ terminals.
  • the first and the second leadframe are connected to each other prior to the production of the second housing.
  • the first housing is formed and the fixing surface is constructed and arranged such that the first housing does not touch or the fixing / or the shielding member Fi ⁇ xier Structure not mutually berüh ⁇ ren.
  • the injection mold with at least two pins clamps the fixing ⁇ or engages, after which the overmolding process is initiated, at the end of Overmoldvorgangs this we ⁇ least two Retract pins and release the fixing plate.
  • the tool ⁇ pins particularly preferably engage the injection mold the fixing sheet at least one point, most preferably at two locations, where used ⁇ for at least 4 tool pins, two pairs.
  • Such a location of the fixing plate can also be designed as a tab, which is formed in particular together with ei ⁇ ner dambar residual structure.
  • the fixing / shield has a Fi ⁇ xier Chemistry, particularly as a plate-shaped body having at least a base surface formed with the fixing surface an electronic ⁇ rule component is arranged above the at least and wherein the Fixierflä ⁇ che opposite a mounting area the first lead frame is arranged, so that the at least one electronic Component / electronic element that is mounted on this Be Publishedungs ⁇ surface is disposed between this mounting surface and the fixing surface.
  • the fixing / shielding member or the fixing surface is preferably designed to be electrically conductive prior ⁇ and serves in particular as an EMC shielding ⁇ sondere. Characterized the at least one electronic device from one side by the Be ⁇ Deutschungs Formation of the first leadframes electromagnetically shielded from ⁇ and adequately shielded from the opposite side through the fixing surface.
  • the fixing / shielding member or the fixing surface is before Trains t ⁇ connected at at least one location with a residual structure of Dambars.
  • Dambars has the advantage that they do not electrically meet any scarf ⁇ technical task, as most parts of the first lead frame, which would be shorted by attaching the Fixierflä ⁇ che.
  • the Fi ⁇ xier Structure is connected to a residual structure of the Dambars or Dambar- residual structure, which is not electrically connected directly to the first or second leadframe, but is held by the first housing made of plastic.
  • a component or Bauele ⁇ ment is preferred understood that in the course of producing the electronic component, in particular prior to the formation of the first Ge ⁇ koruses, all legs or strands connects at least the first lead ⁇ frames and having a frame which From the ⁇ seal during the injection molding process, in particular a Transfer gold process, is used, in which the first housing is formed.
  • This frame of the dambar or the dambar itself is particularly preferably inserted as a sealing ring in the injection-molded housing / injection mold at least partially or at least partially embraced. Normally, is completely removed, so that the finished electronic component has no residual structures of the Dambars more on ⁇ , but only the first and / or second Leadfra- mes in the further manufacturing process according to the prior Tech ⁇ nik of the dam bar.
  • At least one dambar residual structure is and remains directly connected to the first and / or second leadframe or the first and / or second circuit carrier.
  • at least one dambar residual structure is not connected to any of the circuit carriers or leadframes, but only connected to the fixation shielding element and one or more housings, optionally also with a protective cover.
  • the electronic component preferably has an acceleration ⁇ sensor element, in particular 1-axis, for relatively low accelerations, to 5g, sorelement as Fahrwerksbeuggungssen- or element Fahrdynamikregelungsbevantungssensor- on and / or an acceleration sensor element, in particular 1-axis, for relatively large accelerations, at least up to 100 g, as an airbag acceleration sensor element.
  • connection between fixation - / shield fixing or ⁇ sheet and at least a remaining structure of the dam bar Dambars or residual structure is preferably carried out by welding.
  • the first leadframe arranged with the first housing and the fixing plate in a trough-shaped, prefabricated housing that is filled with a potting compound, whereby these potting compound and the trough-shaped hous ⁇ se together form the second housing, which then in the ⁇ sem embodiment not by injection molding or
  • the trough-shaped premold housing has, in particular, an integrated plug, which has its contact terminals or pins formed by the second leadframe, which is connected to the first leadframe.
  • the wan-shaped, prefabricated housing expediently comprises a plug collar, in which the contact terminals or pins protrude from the second housing.
  • the fixing / shielding element or the fixing plate has side skirts, these are used for shielding against electromagnetic radiation from the side and, if necessary, for heat dissipation when overmolding or when
  • the fixing / or the shielding member fixing sheet has be ⁇ vorzugt mechanical stiffening means, such as reinforcing ribs or ridges for stiffening. This design is particularly preferred for the arrangement with a plurality of electronic components which are connected by a common fixing / shielding element or fixing plate for the manufacturing ⁇ process.
  • the fixing / shielding element or the fixing plate comprises one or more tabs. These are in particular the transport of the manufacturing process and / or the heat dissipation during overmolding and, if necessary, the heat dissipation during operation of the finished electronic component, and are entspre ⁇ accordingly formed.
  • the electronic component comprises preferably alternatively or additionally preferably at least one actuator, ⁇ example, a piezo transducer or an ultrasonic transducer, as an electronic element.
  • the fixing / shielding element or the fixing surface is formed as part of the second leadframe.
  • the fixing / shielding element or the fixing surface expediently has one or more of the following features:
  • Fixing surface is located over at least one member of the mold body, covers / shields in particular at least the ASIC and the at least one sensor element.
  • the shaped surface of the fixing surface is particularly preferably trough-shaped.
  • Fixing surface can be provided with mounting plates. Electrically insulated or contactor
  • Fixing surface is part of the connector pins or the second leadframes, which has the connector pins of the electronic component ⁇ .
  • the first lead frame is mounted such that the lead frame mounted on the electronic components as in ⁇ game as an IC, sensor elements, physically between the first leadframe, in particular its Be Culture Structure, and the fixing come to rest. This serves to improve the EMC behavior.
  • -Fixier Structure may consist of metal or plastic, where ⁇ in the case of the plastic, if necessary, electrically conductive coated.
  • the fixing surface and the first leadframe are uniformly or another suitable gebo ⁇ gen.
  • Fixing surface serves as a mounting surface for other additional components, such as magnets.
  • the first housing before the Molden with Plas ⁇ ma is treated to remove contamination and to improve the adhesion of the Overmoldmaterials on the IC body / first housing
  • the first lead frame is preferably bent in the region of the DENpins An ⁇ at an arbitrary angle relative to the first housing and the orientation and so
  • the molding process in particular overmolding, is preferred as injection molding, transfermold, RIM, hotmelt,
  • the fixing / shielding member or the fixing surface will be ⁇ vorzugt in the injection mold via at least one moveable Positioning pin or hold down positioned.
  • the fixing / shielding element or shielding / fixing surface preferably contains holes and / or outbreaks and / or slots for transport, for adjustment and for fixing. This is advantageous for the overmold equipment or the alignment and / or attachment and / or positioning in the injection molding tool.
  • the fixing / shielding or the shielding ⁇ sheet / fixing is preferably carried out with side skirts for better EMC protection and as additional heat dissipation (Mold flow baffle).
  • the fixing / or the shield member shielding sheet ⁇ / fixation can also expediently for Fixed To ⁇ supply several sensors or serve / clusters of electronic components to a common power / bundle / module, having a common fixing / shielding element. This allows the sensors to be positioned very accurately to each other.
  • the fixing / shielding or shielding / ⁇ the fixation surface contains preferably acts as a mounting bracket formations.
  • the first housing or the IC is fixed such that it remains lying during subsequent Rothschrit ⁇ te on the fixing sheet or the fixing surface.
  • the clamp serves as a heat sink / réelleleitblech during Overmoldvorganges and during operation.
  • additional plastic clips are preferably applied, which serve for fixing the first housing or ICs.
  • the clips serve as thermal protection during the overmold process.
  • These clips can be molded, glued or mechanically fastened (e.g., riveted) to the fixation plate.
  • other sensor elements at least one other sensor element, for phy ⁇ sikalische measured variables, such as pressure, magnetic fields, temperature, sound, impact sound in the IC and the first housing may be used in addition to or alternatively to the sensor elements for the angular rate and the acceleration.
  • the decoupling cover or protective cover is expediently formed partially or over the entire surface.
  • This sleeve serves in particular ⁇ sondere said stress arises for stress isolation of the first housing and is correspondingly formed, at a tem ⁇ peraturcic between the first housing and the Overmold- material.
  • it serves as a heat shield currency ⁇ end of the overmold Prozeses by preventing direct contact of the first housing with the Overmoldmaterial.
  • the wrapping material particularly preferably consists of a soft elastic material, eg silicone or PU material, in particular silicone gel.
  • the invention preferably relates to an arrangement in which a common fixing / shielding element or egg ⁇ ne common fixing surface ver ⁇ binds several electronic components.
  • the fixing surface in particular Halteele ⁇ elements, such as holes / index holes or slots, with which the entire assembly can be moved or transported in the course of production, in particular on ei ⁇ nem common conveyor belt .
  • the fixing surface particularly preferably ensures defined relative positions between the electronic components of the arrangement and / or serves for the adjustment. For the exemplary embodiment of such an arrangement, see FIG. 6.
  • the invention also relates to the use of the electronic component in motor vehicles.
  • FIG. 1 shows an embodiment of the electronic component oh ⁇ ne second encapsulation / Overmold from the Soan ⁇ view and top view; the dam bar residual structures that remain standing and continue to be used in the electronic component, for example for Fixed To ⁇ supply the fixing are gray in FIG. 2 shows an exemplary electronic component with a second housing made of overmold from the side view and top view, wherein in the plan view tabs of the fixing surface are shown for attachment, which are connected to the dambar residual structures. These tabs are shown in the leftmost plan view and one at the top and one at the bottom in the region of the first housing,
  • Fig. 3 shows an embodiment in which the first housing with a decoupling sheath or protective sheath is converted ⁇ ben, which is then embedded by the second housing in the overmold
  • Fig. 4 in which instead of a OvermoldgePFuses as a second housing, a premold housing is used, in which the Anord ⁇ voltage from the first lead frame, the first housing with too ⁇ sharmaji protective sheath, for example of silicone ⁇ gel and fixation inside is arranged an exemplary embodiment, and shed with potting compound.
  • the second lead frame ⁇ or Connector lead frame is in the
  • Fig. 5 an electronic component exemplified as a pressure sensor, as well Fig. 6 shows an arrangement of a plurality of pressure sensors according to
  • Fig. 5 which are connected by means of a common fixing surface and positioned to each other and form a cluster or array.
  • the embodiment of the electronic component of Fig. 1 comprises a first lead frame 1 on which a Sensorele ⁇ element 7 and a signal processing circuit / ASIC 8, are arranged on a not shown mounting island and are embedded in first housing 3 of thermosetting plastic.
  • the electronic component comprises a dambar 13 of the first leadframe 1 or associated therewith.
  • the gray gekennzeichne ⁇ th surfaces are or after removal of the other Dambarmaschine as Dambar residual structures 6 remain.
  • connection points 16 are identified as small squares, where the dambar residual structures are connected by means of connecting webs to a fixing / shielding element 5 or a fixing plate.
  • the electronic component also includes an additional drit ⁇ tes housing 4 from thermoset to which is also connected to the first lead frame 1, and in which additional circuit elements or ⁇ protective circuit elements 14 are inte grated ⁇ .
  • the ends 15 of the first lead frame 1 are madebil ⁇ det as contact terminals or pins of the electronic component.
  • FIG. 2 an embodiment of the electronic component is shown in Fig. 2, having a second Ge ⁇ housing 10 as the overall housing from overmold, in which the first lead frame 1 except for the ends thereof as Maisan- Conclusions, the first and second housings 3, 4 and the fi xier- / shielding element 5 are embedded.
  • the Dambar residual structures are also embedded in the second housing 10 ⁇ .
  • a magnet or permanent magnet 17 is exemplarily arranged on the inside of the electronic component.
  • first housing 3 of a decoupling sleeve 11 and protective cover of globe-top or a silicone gel is surrounded.
  • Decoupling sleeve 11 and fixing / shielding element 5 are surrounded by the second housing 10 of overmold together.
  • First leadframe 1 is ver ⁇ connected with a second lead frame 2 at a junction 18, such as by welding.
  • Second leadframe 2 projects partially out of the second housing 10, which forms a plug collar 21, in which contact terminals or connecting pins are formed by the second leadframe ⁇ the.
  • Fig. 4 shows an embodiment of a Elektronikbau ⁇ part, in which the second housing 10 by a pre ⁇ crafted trough-shaped body 19, by way of example
  • First leadframe 1 with the first housing 3, which is embedded, for example, in a decoupling sleeve 11, and the fixing ⁇ sheet 5 are arranged in trough-shaped, prefabricated housing 19 that is filled with potting compound 20.
  • the trough-shaped premold housing 19 has an integrated plug or plug collar 21, whose contact terminals or pins are formed by the second leadframe 2, the is connected to the first leadframe 1 in the connection area 18.
  • FIG. 5 shows an exemplary electronic component with the first leadframe 1, on which a pressure sensor element 7 and an electronic signal processing circuit 8, jointly embedded in the first housing 3, and Rajbescharisele- elements 14, embedded in the third housing 4, are arranged.
  • the electronic component has Dambar radical structure 6 with ⁇ means of which buildin ⁇ is Untitled among other fixing / shielding element. 5
  • a second leadframe 2 for contacting to the outside or for contacting other electronic components is connected to the first leadframe.
  • the elec ⁇ ronikbauteil has a Membrame 24, which is arranged in a Ka ⁇ channel, which leads to pressure sensor element 7.
  • the electronic component comprises a common overmold housing, as a second housing 10.
  • the electronics manufacturing parts ⁇ have a common fixing / shielding element 5 on which positioning aids 12a and 12b comprises, for positio ⁇ discrimination and fixation in an injection mold.
  • First lead frame 1 are connected to the second leadframe 2 to Verbin ⁇ binding sites eighteenth
  • the two electronic components each comprise a first and second housings 3, 4 from Du ⁇ ROPLAST, dam bar radical structures 6, is fixed to which the fixing / shielding element 5 as well as a common two ⁇ tes housing 10.
  • Second, common housing 10 of overmold comprises Plug collar 21, in which the contact terminals of the second leadframe 2 open, which are supported by an assembly aid 23.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

Composant électronique comprenant un premier porte-circuit (1), au moins un élément électronique (7, 8, 9), qui est relié au premier porte-circuit (1), et au moins un premier boîtier (3), le composant électronique comportant au moins une structure résiduelle de cadre (6) pour la fixation.
EP13707568.5A 2012-02-10 2013-02-11 Capteur moulé à deux niveaux Withdrawn EP2812657A1 (fr)

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PCT/EP2013/052712 WO2013117772A1 (fr) 2012-02-10 2013-02-11 Capteur moulé à deux niveaux

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DE102013224645A1 (de) * 2013-11-29 2015-06-03 Continental Teves Ag & Co. Ohg Verfahren zum Herstellen einer elektronischen Baugruppe
WO2015162010A1 (fr) * 2014-04-24 2015-10-29 Continental Teves Ag & Co. Ohg Circuit de détection connecté sur une grille de connexion par l'intermédiaire d'une carte de circuits imprimés
DE102014213217A1 (de) * 2014-07-08 2016-01-14 Continental Teves Ag & Co. Ohg Körperschallentkopplung an mit Geberfeldern arbeitenden Sensoren
DE102014213588A1 (de) * 2014-07-11 2016-02-18 Continental Teves Ag & Co. Ohg Kundenspezifischer Sensor hergestellt durch Dreifach-Molden
EP3167249B1 (fr) * 2015-07-15 2023-03-15 Continental Automotive Technologies GmbH Partie neutre d'un détecteur adaptable spécifiquement au client
DE102016205240B3 (de) 2016-03-30 2017-07-13 Continental Automotive Gmbh Verfahren zum Herstellen eines Ultraschallsensors und Ultraschallensor
DE102016207664A1 (de) * 2016-05-03 2017-11-09 Continental Teves Ag & Co. Ohg Sensorelement für ein kraftfahrzeug
DE102016209841A1 (de) * 2016-06-03 2017-12-07 Continental Teves Ag & Co. Ohg Sensor und Sensoranordnung
DE102019210375A1 (de) * 2019-07-12 2021-01-14 Continental Teves Ag & Co. Ohg Verfahren zur Herstellung eines robusten Sensors

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US6911718B1 (en) * 2003-07-03 2005-06-28 Amkor Technology, Inc. Double downset double dambar suspended leadframe
DE102006030133A1 (de) * 2005-06-29 2007-02-08 Ab Elektronik Gmbh Sensor mit Leadframe und Herstellungsverfahren hierfür
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WO2013117772A1 (fr) 2013-08-15
DE102013202212A1 (de) 2013-08-14
CN204807109U (zh) 2015-11-25

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